JP6336692B1 - バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法 - Google Patents

バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法 Download PDF

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JP6336692B1
JP6336692B1 JP2018513389A JP2018513389A JP6336692B1 JP 6336692 B1 JP6336692 B1 JP 6336692B1 JP 2018513389 A JP2018513389 A JP 2018513389A JP 2018513389 A JP2018513389 A JP 2018513389A JP 6336692 B1 JP6336692 B1 JP 6336692B1
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actuator
valve
valve device
valve body
operation member
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JP2018513389A
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Japanese (ja)
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JPWO2018088326A1 (ja
Inventor
俊英 吉田
俊英 吉田
中田　知宏
知宏 中田
篠原　努
努 篠原
敏之 稲田
敏之 稲田
高志 船越
高志 船越
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Fujikin Inc
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Fujikin Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K7/00—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves
    • F16K7/12—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm
    • F16K7/14—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat
    • F16K7/17—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat the diaphragm being actuated by fluid pressure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
    • F16K31/007—Piezoelectric stacks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
    • F16K31/122—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
    • F16K31/122—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
    • F16K31/1221—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston one side of the piston being spring-loaded
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
    • F16K31/122—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
    • F16K31/1225—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston with a plurality of pistons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H10P14/6339—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Electrically Driven Valve-Operating Means (AREA)
  • Automation & Control Theory (AREA)
  • Fluid-Driven Valves (AREA)
  • Chemical Vapour Deposition (AREA)
  • Lift Valve (AREA)
JP2018513389A 2016-11-08 2017-11-02 バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法 Active JP6336692B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016218093 2016-11-08
JP2016218093 2016-11-08
PCT/JP2017/039729 WO2018088326A1 (ja) 2016-11-08 2017-11-02 バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法

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JP2018088543A Division JP2018132195A (ja) 2016-11-08 2018-05-02 バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法

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JP6336692B1 true JP6336692B1 (ja) 2018-06-06
JPWO2018088326A1 JPWO2018088326A1 (ja) 2018-11-15

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JP2018088543A Pending JP2018132195A (ja) 2016-11-08 2018-05-02 バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法

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US (1) US11098819B2 (https=)
EP (1) EP3540280A4 (https=)
JP (2) JP6336692B1 (https=)
KR (2) KR102312480B1 (https=)
CN (1) CN109952459B (https=)
TW (1) TWI671483B (https=)
WO (1) WO2018088326A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018100968A1 (ja) * 2016-11-30 2019-10-17 株式会社フジキン バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法
JP2021032391A (ja) * 2019-08-29 2021-03-01 株式会社フジキン バルブ装置および流量制御装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018235900A1 (ja) 2017-06-22 2018-12-27 株式会社フジキン 流量制御装置および流量制御装置の流量制御方法
JP7113529B2 (ja) * 2017-09-25 2022-08-05 株式会社フジキン バルブ装置、流量調整方法、流体制御装置、流量制御方法、半導体製造装置および半導体製造方法
US11536386B2 (en) * 2018-08-30 2022-12-27 Fujikin Incorporated Fluid control device
WO2020158459A1 (ja) * 2019-01-31 2020-08-06 株式会社フジキン バルブ装置、このバルブ装置を用いた流量制御方法、流体制御装置、半導体製造方法、および半導体製造装置
JP7308506B2 (ja) * 2019-01-31 2023-07-14 株式会社フジキン バルブ装置、このバルブ装置を用いた流量制御方法、半導体製造方法、および半導体製造装置
CN113423987A (zh) * 2019-01-31 2021-09-21 株式会社富士金 阀装置、流量控制方法、流体控制装置、半导体制造方法以及半导体制造装置
CN110307351A (zh) * 2019-07-10 2019-10-08 广东工业大学 一种压电陶瓷限流阀
US11079035B2 (en) * 2019-07-12 2021-08-03 Pivotal Systems Corporation Preloaded piezo actuator and gas valve employing the actuator
IL268254B2 (en) * 2019-07-24 2024-10-01 Ham Let Israel Canada Ltd Fluid-flow control device
WO2021106472A1 (ja) 2019-11-25 2021-06-03 株式会社エム・システム技研 アクチュエータ、及び、流体制御機器
KR20230131613A (ko) 2022-03-07 2023-09-14 주식회사 코일넷 미생물 분뇨처리조가 구비된 변기
DE102022003518A1 (de) * 2022-09-23 2024-03-28 Vat Holding Ag Pneumatisches gaseinlassventil mit verstellbarem anschlag
JP2024158856A (ja) * 2023-04-28 2024-11-08 株式会社堀場エステック 流体制御弁、流体制御装置、及び、材料供給システム

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JPH08170755A (ja) * 1994-12-20 1996-07-02 Koganei Corp 流体圧作動弁装置
WO2004079243A1 (ja) * 2003-03-07 2004-09-16 Ckd Corporation 流量制御弁

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IT1320475B1 (it) * 2000-06-30 2003-11-26 Fiat Ricerche Attuatore piezoelettrico autocompensato per una valvola di controllo.
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WO2018235900A1 (ja) 2017-06-22 2018-12-27 株式会社フジキン 流量制御装置および流量制御装置の流量制御方法
JP7113529B2 (ja) 2017-09-25 2022-08-05 株式会社フジキン バルブ装置、流量調整方法、流体制御装置、流量制御方法、半導体製造装置および半導体製造方法
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JPH08170755A (ja) * 1994-12-20 1996-07-02 Koganei Corp 流体圧作動弁装置
WO2004079243A1 (ja) * 2003-03-07 2004-09-16 Ckd Corporation 流量制御弁

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018100968A1 (ja) * 2016-11-30 2019-10-17 株式会社フジキン バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法
JP2021032391A (ja) * 2019-08-29 2021-03-01 株式会社フジキン バルブ装置および流量制御装置
JP7382054B2 (ja) 2019-08-29 2023-11-16 株式会社フジキン バルブ装置および流量制御装置

Also Published As

Publication number Publication date
JP2018132195A (ja) 2018-08-23
US11098819B2 (en) 2021-08-24
TWI671483B (zh) 2019-09-11
EP3540280A4 (en) 2019-11-27
JPWO2018088326A1 (ja) 2018-11-15
US20190285176A1 (en) 2019-09-19
CN109952459A (zh) 2019-06-28
WO2018088326A1 (ja) 2018-05-17
TW201825817A (zh) 2018-07-16
EP3540280A1 (en) 2019-09-18
CN109952459B (zh) 2021-02-26
KR102312480B1 (ko) 2021-10-14
KR20190077477A (ko) 2019-07-03
KR20210079403A (ko) 2021-06-29

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