JP6320490B2 - 回路基板の製造方法及び回路基板 - Google Patents

回路基板の製造方法及び回路基板 Download PDF

Info

Publication number
JP6320490B2
JP6320490B2 JP2016222422A JP2016222422A JP6320490B2 JP 6320490 B2 JP6320490 B2 JP 6320490B2 JP 2016222422 A JP2016222422 A JP 2016222422A JP 2016222422 A JP2016222422 A JP 2016222422A JP 6320490 B2 JP6320490 B2 JP 6320490B2
Authority
JP
Japan
Prior art keywords
fuse
film
substrate
circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016222422A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017041651A (ja
JP2017041651A5 (OSRAM
Inventor
俊孝 小川
俊孝 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SOC Corp
Original Assignee
SOC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SOC Corp filed Critical SOC Corp
Priority to JP2016222422A priority Critical patent/JP6320490B2/ja
Publication of JP2017041651A publication Critical patent/JP2017041651A/ja
Publication of JP2017041651A5 publication Critical patent/JP2017041651A5/ja
Application granted granted Critical
Publication of JP6320490B2 publication Critical patent/JP6320490B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Fuses (AREA)
JP2016222422A 2016-11-15 2016-11-15 回路基板の製造方法及び回路基板 Expired - Fee Related JP6320490B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016222422A JP6320490B2 (ja) 2016-11-15 2016-11-15 回路基板の製造方法及び回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016222422A JP6320490B2 (ja) 2016-11-15 2016-11-15 回路基板の製造方法及び回路基板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2015542097A Division JP6045714B1 (ja) 2015-04-07 2015-04-07 ヒューズの製造方法、ヒューズ、回路基板の製造方法及び回路基板

Publications (3)

Publication Number Publication Date
JP2017041651A JP2017041651A (ja) 2017-02-23
JP2017041651A5 JP2017041651A5 (OSRAM) 2017-09-07
JP6320490B2 true JP6320490B2 (ja) 2018-05-09

Family

ID=58206715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016222422A Expired - Fee Related JP6320490B2 (ja) 2016-11-15 2016-11-15 回路基板の製造方法及び回路基板

Country Status (1)

Country Link
JP (1) JP6320490B2 (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7155663B2 (ja) * 2018-06-27 2022-10-19 昭和電工マテリアルズ株式会社 物品の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3758887B2 (ja) * 1999-03-31 2006-03-22 Ｎｔｎ株式会社 パターン修正装置
JP2008235388A (ja) * 2007-03-19 2008-10-02 V Technology Co Ltd 金属微粒子分散液およびそれを用いた配線断線部の修正方法
JP2015111492A (ja) * 2012-03-28 2015-06-18 旭硝子株式会社 導体膜の製造方法
CN104823248B (zh) * 2012-12-07 2017-05-17 富士胶片株式会社 导电膜的制造方法
JP2014192465A (ja) * 2013-03-28 2014-10-06 Fujifilm Corp 電気回路配線基板の製造方法

Also Published As

Publication number Publication date
JP2017041651A (ja) 2017-02-23

Similar Documents

Publication Publication Date Title
JP6045714B1 (ja) ヒューズの製造方法、ヒューズ、回路基板の製造方法及び回路基板
US9131610B2 (en) Buffer layer for sintering
KR101079946B1 (ko) 전자 부품 실장 구조체와 그 제조 방법
CA1212426A (en) Method of laser soldering
KR20100101560A (ko) 레이저 공정을 이용한 에스엠디 및 관통-홀 퓨즈의 제조능력
JP6491032B2 (ja) 抵抗器の製造方法、および、抵抗器
KR20100132017A (ko) 직접 저항 가열을 이용한 프릿 밀봉
JP6630053B2 (ja) 電子デバイスの製造方法
TWI330876B (en) Method for forming multi-layer bumps on a substrate
JP2017041651A (ja) 回路基板の製造方法及び回路基板
US10283298B2 (en) Chip fuse
JP5511501B2 (ja) 抵抗温度ヒューズ、ならびに抵抗温度ヒューズパッケージ
CN107004454B (zh) 用于制造电加热装置的层的接触区的方法及用于机动车的电加热装置的设备
JP6149126B1 (ja) 低電圧ヒューズの製造方法及び低電圧ヒューズ
Amend et al. Fast and flexible generation of conductive circuits
Soltani et al. Inkjet printed nano-particle Cu process for fabrication of re-distribution layers on silicon wafer
WO1984002867A1 (en) Method of laser soldering
JP7575775B2 (ja) 導電部の製造方法、導電部を含む電子部品の製造方法、導電部を含む電子部品を組み立てた製品の製造方法、導電部、導電部を有する電子部品、導電部を含む電子部品を組み込んだ製品
JP2000332373A (ja) 電子部品実装体およびその製造方法
Glynn et al. Reflow Soldering of Fine-pitch devices using a Nd: Yag laser
Albert et al. Laser Soldering and Laser Droplet Joining for Mechanical and Electrical Contacting of LTCC/PZT Laminates.
KR102206052B1 (ko) 나노 입자층의 소결 방법
JP4290244B2 (ja) 基板型温度ヒュ−ズの製造方法
Wentlent et al. Applicability of selective laser reflow for thin die stacking
JP6656555B2 (ja) 金属皮膜形成品の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170124

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170725

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20171026

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171205

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180119

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180403

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180403

R150 Certificate of patent or registration of utility model

Ref document number: 6320490

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees