JP6312605B2 - 眼科用装置向け積層型統合コンポーネント媒体挿入物 - Google Patents
眼科用装置向け積層型統合コンポーネント媒体挿入物 Download PDFInfo
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- JP6312605B2 JP6312605B2 JP2014554864A JP2014554864A JP6312605B2 JP 6312605 B2 JP6312605 B2 JP 6312605B2 JP 2014554864 A JP2014554864 A JP 2014554864A JP 2014554864 A JP2014554864 A JP 2014554864A JP 6312605 B2 JP6312605 B2 JP 6312605B2
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- media insert
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- integrated component
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- ophthalmic lens
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Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
- G02C7/00—Optical parts
- G02C7/02—Lenses; Lens systems ; Methods of designing lenses
- G02C7/04—Contact lenses for the eyes
-
- G—PHYSICS
- G02—OPTICS
- G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
- G02C7/00—Optical parts
- G02C7/02—Lenses; Lens systems ; Methods of designing lenses
- G02C7/08—Auxiliary lenses; Arrangements for varying focal length
- G02C7/081—Ophthalmic lenses with variable focal length
- G02C7/083—Electrooptic lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Eyeglasses (AREA)
- Prostheses (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/358,575 US9889615B2 (en) | 2011-03-18 | 2012-01-26 | Stacked integrated component media insert for an ophthalmic device |
US13/358,577 | 2012-01-26 | ||
US13/358,571 | 2012-01-26 | ||
US13/358,571 US9233513B2 (en) | 2011-03-18 | 2012-01-26 | Apparatus for manufacturing stacked integrated component media inserts for ophthalmic devices |
US13/358,575 | 2012-01-26 | ||
US13/358,577 US9914273B2 (en) | 2011-03-18 | 2012-01-26 | Method for using a stacked integrated component media insert in an ophthalmic device |
PCT/US2013/023182 WO2013112862A1 (en) | 2012-01-26 | 2013-01-25 | Stacked integrated component media insert for an ophthalmic device |
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JP2015510143A JP2015510143A (ja) | 2015-04-02 |
JP6312605B2 true JP6312605B2 (ja) | 2018-04-18 |
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JP (1) | JP6312605B2 (ko) |
KR (1) | KR20140117618A (ko) |
CN (1) | CN104204914B (ko) |
AU (1) | AU2013211968B2 (ko) |
BR (1) | BR112014018456A8 (ko) |
CA (1) | CA2862666A1 (ko) |
HK (1) | HK1204680A1 (ko) |
RU (1) | RU2629902C2 (ko) |
SG (1) | SG11201404174SA (ko) |
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KR102248847B1 (ko) * | 2015-06-01 | 2021-05-06 | 삼성전자주식회사 | 에너지 수확부를 구비한 콘택트 렌즈 |
US20170086676A1 (en) * | 2015-09-24 | 2017-03-30 | Johnson & Johnson Vision Care, Inc. | Quantum-dot spectrometers for use in biomedical devices and methods of use |
CN108205207A (zh) * | 2016-12-16 | 2018-06-26 | 江苏海伦隐形眼镜有限公司 | 一种智能隐形眼镜的制作方法 |
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JPH0837190A (ja) * | 1994-07-22 | 1996-02-06 | Nec Corp | 半導体装置 |
US6217171B1 (en) * | 1998-05-26 | 2001-04-17 | Novartis Ag | Composite ophthamic lens |
JP4172566B2 (ja) * | 2000-09-21 | 2008-10-29 | Tdk株式会社 | セラミック多層基板の表面電極構造及び表面電極の製造方法 |
KR20050025624A (ko) * | 2002-08-09 | 2005-03-14 | 이-비젼 엘엘씨 | 전기-활성 콘택트 렌즈 시스템 |
EP1760515A3 (en) * | 2003-10-03 | 2011-08-31 | Invisia Ltd. | Multifocal ophthalmic lens |
US20070090869A1 (en) * | 2005-10-26 | 2007-04-26 | Motorola, Inc. | Combined power source and printed transistor circuit apparatus and method |
CN101395520A (zh) * | 2006-01-10 | 2009-03-25 | E-视觉有限公司 | 包含可机械弯曲集成插件的电激活眼镜镜片的改进制造装置和方法 |
JP5011820B2 (ja) * | 2006-05-24 | 2012-08-29 | オムロン株式会社 | 積層デバイス、およびその製造方法 |
AR064985A1 (es) * | 2007-01-22 | 2009-05-06 | E Vision Llc | Lente electroactivo flexible |
US8215770B2 (en) * | 2007-02-23 | 2012-07-10 | E-A Ophthalmics | Ophthalmic dynamic aperture |
US20100076553A1 (en) * | 2008-09-22 | 2010-03-25 | Pugh Randall B | Energized ophthalmic lens |
US9296158B2 (en) * | 2008-09-22 | 2016-03-29 | Johnson & Johnson Vision Care, Inc. | Binder of energized components in an ophthalmic lens |
US8348424B2 (en) * | 2008-09-30 | 2013-01-08 | Johnson & Johnson Vision Care, Inc. | Variable focus ophthalmic device |
US9427920B2 (en) * | 2008-09-30 | 2016-08-30 | Johnson & Johnson Vision Care, Inc. | Energized media for an ophthalmic device |
US9375886B2 (en) * | 2008-10-31 | 2016-06-28 | Johnson & Johnson Vision Care Inc. | Ophthalmic device with embedded microcontroller |
JP5694947B2 (ja) * | 2008-12-11 | 2015-04-01 | エムシー10 インコーポレイテッドMc10,Inc. | 医療用途のための伸張性電子部品を使用する装置 |
US8137148B2 (en) * | 2009-09-30 | 2012-03-20 | General Electric Company | Method of manufacturing monolithic parallel interconnect structure |
JP2013534847A (ja) * | 2010-06-20 | 2013-09-09 | エレンザ, インコーポレイテッド | 特定用途向け集積回路を備える眼科デバイスおよび方法 |
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CN104204914A (zh) | 2014-12-10 |
BR112014018456A8 (pt) | 2017-07-11 |
AU2013211968B2 (en) | 2016-09-29 |
RU2629902C2 (ru) | 2017-09-04 |
SG11201404174SA (en) | 2014-10-30 |
WO2013112862A1 (en) | 2013-08-01 |
RU2014134722A (ru) | 2016-03-20 |
JP2015510143A (ja) | 2015-04-02 |
AU2013211968A1 (en) | 2014-09-11 |
KR20140117618A (ko) | 2014-10-07 |
TWI616325B (zh) | 2018-03-01 |
CN104204914B (zh) | 2018-06-15 |
TW201341165A (zh) | 2013-10-16 |
BR112014018456A2 (ko) | 2017-06-20 |
EP2807518A1 (en) | 2014-12-03 |
CA2862666A1 (en) | 2013-08-01 |
HK1204680A1 (en) | 2015-11-27 |
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