TWI616325B - 用於眼用裝置之堆疊集成構件媒介植入物以及形成用於眼用裝置的堆疊集成構件媒介植入物之方法 - Google Patents

用於眼用裝置之堆疊集成構件媒介植入物以及形成用於眼用裝置的堆疊集成構件媒介植入物之方法 Download PDF

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Publication number
TWI616325B
TWI616325B TW102103007A TW102103007A TWI616325B TW I616325 B TWI616325 B TW I616325B TW 102103007 A TW102103007 A TW 102103007A TW 102103007 A TW102103007 A TW 102103007A TW I616325 B TWI616325 B TW I616325B
Authority
TW
Taiwan
Prior art keywords
integrated component
implant
stacked integrated
lens
substrate layers
Prior art date
Application number
TW102103007A
Other languages
English (en)
Chinese (zh)
Other versions
TW201341165A (zh
Inventor
蘭德爾 普格
弗德雷克 費利奇
丹尼爾 奧提斯
詹姆士 萊爾
亞當 東尼爾
Original Assignee
壯生和壯生視覺關懷公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/358,575 external-priority patent/US9889615B2/en
Application filed by 壯生和壯生視覺關懷公司 filed Critical 壯生和壯生視覺關懷公司
Publication of TW201341165A publication Critical patent/TW201341165A/zh
Application granted granted Critical
Publication of TWI616325B publication Critical patent/TWI616325B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/04—Contact lenses for the eyes
    • G—PHYSICS
    • G02—OPTICS
    • G02C—SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES
    • G02C7/00—Optical parts
    • G02C7/02—Lenses; Lens systems ; Methods of designing lenses
    • G02C7/08—Auxiliary lenses; Arrangements for varying focal length
    • G02C7/081—Ophthalmic lenses with variable focal length
    • G02C7/083—Electrooptic lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Eyeglasses (AREA)
  • Prostheses (AREA)
TW102103007A 2012-01-26 2013-01-25 用於眼用裝置之堆疊集成構件媒介植入物以及形成用於眼用裝置的堆疊集成構件媒介植入物之方法 TWI616325B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US13/358,575 2012-01-26
US13/358,577 2012-01-26
US13/358,571 2012-01-26
US13/358,575 US9889615B2 (en) 2011-03-18 2012-01-26 Stacked integrated component media insert for an ophthalmic device
US13/358,571 US9233513B2 (en) 2011-03-18 2012-01-26 Apparatus for manufacturing stacked integrated component media inserts for ophthalmic devices
US13/358,577 US9914273B2 (en) 2011-03-18 2012-01-26 Method for using a stacked integrated component media insert in an ophthalmic device

Publications (2)

Publication Number Publication Date
TW201341165A TW201341165A (zh) 2013-10-16
TWI616325B true TWI616325B (zh) 2018-03-01

Family

ID=47741261

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102103007A TWI616325B (zh) 2012-01-26 2013-01-25 用於眼用裝置之堆疊集成構件媒介植入物以及形成用於眼用裝置的堆疊集成構件媒介植入物之方法

Country Status (12)

Country Link
EP (1) EP2807518A1 (ko)
JP (1) JP6312605B2 (ko)
KR (1) KR20140117618A (ko)
CN (1) CN104204914B (ko)
AU (1) AU2013211968B2 (ko)
BR (1) BR112014018456A8 (ko)
CA (1) CA2862666A1 (ko)
HK (1) HK1204680A1 (ko)
RU (1) RU2629902C2 (ko)
SG (1) SG11201404174SA (ko)
TW (1) TWI616325B (ko)
WO (1) WO2013112862A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102248847B1 (ko) * 2015-06-01 2021-05-06 삼성전자주식회사 에너지 수확부를 구비한 콘택트 렌즈
US20170086676A1 (en) * 2015-09-24 2017-03-30 Johnson & Johnson Vision Care, Inc. Quantum-dot spectrometers for use in biomedical devices and methods of use
CN108205207A (zh) * 2016-12-16 2018-06-26 江苏海伦隐形眼镜有限公司 一种智能隐形眼镜的制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1760515A2 (en) * 2003-10-03 2007-03-07 Invisia Ltd. Multifocal ophthalmic lens
CN102159382A (zh) * 2008-09-22 2011-08-17 庄臣及庄臣视力保护公司 眼科镜片中的通电组件的粘合剂

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JPH0837190A (ja) * 1994-07-22 1996-02-06 Nec Corp 半導体装置
US6217171B1 (en) * 1998-05-26 2001-04-17 Novartis Ag Composite ophthamic lens
JP4172566B2 (ja) * 2000-09-21 2008-10-29 Ｔｄｋ株式会社 セラミック多層基板の表面電極構造及び表面電極の製造方法
JP2005535942A (ja) * 2002-08-09 2005-11-24 イー・ビジョン・エルエルシー 電気駆動のコンタクトレンズ系
US20070090869A1 (en) * 2005-10-26 2007-04-26 Motorola, Inc. Combined power source and printed transistor circuit apparatus and method
CN101395520A (zh) * 2006-01-10 2009-03-25 E-视觉有限公司 包含可机械弯曲集成插件的电激活眼镜镜片的改进制造装置和方法
JP5011820B2 (ja) * 2006-05-24 2012-08-29 オムロン株式会社 積層デバイス、およびその製造方法
AR064985A1 (es) * 2007-01-22 2009-05-06 E Vision Llc Lente electroactivo flexible
WO2008103906A2 (en) * 2007-02-23 2008-08-28 Pixeloptics, Inc. Ophthalmic dynamic aperture
US20100076553A1 (en) * 2008-09-22 2010-03-25 Pugh Randall B Energized ophthalmic lens
US9427920B2 (en) * 2008-09-30 2016-08-30 Johnson & Johnson Vision Care, Inc. Energized media for an ophthalmic device
US8348424B2 (en) * 2008-09-30 2013-01-08 Johnson & Johnson Vision Care, Inc. Variable focus ophthalmic device
US9375886B2 (en) * 2008-10-31 2016-06-28 Johnson & Johnson Vision Care Inc. Ophthalmic device with embedded microcontroller
WO2010082993A2 (en) * 2008-12-11 2010-07-22 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8137148B2 (en) * 2009-09-30 2012-03-20 General Electric Company Method of manufacturing monolithic parallel interconnect structure
AU2011271278B2 (en) * 2010-06-20 2016-05-19 Elenza, Inc. Ophthalmic devices and methods with application specific integrated circuits

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1760515A2 (en) * 2003-10-03 2007-03-07 Invisia Ltd. Multifocal ophthalmic lens
CN102159382A (zh) * 2008-09-22 2011-08-17 庄臣及庄臣视力保护公司 眼科镜片中的通电组件的粘合剂

Also Published As

Publication number Publication date
BR112014018456A2 (ko) 2017-06-20
CA2862666A1 (en) 2013-08-01
WO2013112862A1 (en) 2013-08-01
JP6312605B2 (ja) 2018-04-18
AU2013211968B2 (en) 2016-09-29
RU2014134722A (ru) 2016-03-20
TW201341165A (zh) 2013-10-16
HK1204680A1 (en) 2015-11-27
EP2807518A1 (en) 2014-12-03
CN104204914B (zh) 2018-06-15
AU2013211968A1 (en) 2014-09-11
SG11201404174SA (en) 2014-10-30
RU2629902C2 (ru) 2017-09-04
JP2015510143A (ja) 2015-04-02
CN104204914A (zh) 2014-12-10
BR112014018456A8 (pt) 2017-07-11
KR20140117618A (ko) 2014-10-07

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