JP6306312B2 - Drawing apparatus and drawing method - Google Patents

Description

  The present invention relates to a drawing apparatus and a drawing method used in a photolithography process such as a liquid crystal display or a printed wiring board, and particularly to an inclined drawing area (drawing surface) of a drawing object (drawing object). The present invention relates to a direct drawing apparatus and a direct drawing method for drawing a pattern.

  A photolithography process is included in the production process of a liquid crystal display, a printed wiring board, and the like, which are components constituting an electronic device, and a drawing apparatus and a drawing method are used in the photolithography process.

  Conventionally, a drawing object by a drawing apparatus and a drawing method is a plate-like flat member, and a drawing area thereof is a horizontal plane. For this reason, it was possible to perform suitable drawing only by scanning according to the focal length of the pattern light to be irradiated in accordance with the plate-like plane of the drawing object (the horizontal plane as the drawing region).

  However, in recent years, for example, with the development of mobile electronic devices, the components such as the liquid crystal display and the printed wiring board described above are three-dimensionally shaped (for example, an inclined surface instead of a single plane) in order to improve portability or from the viewpoint of design. The demand to make a shape with) is increasing. That is, the drawing area of the drawing object is shifted from a conventional single plate-like plane (horizontal plane) to a three-dimensional shape such as an inclined plane inclined with respect to the horizontal plane (including a curved plane curved with respect to the horizontal plane). Have been doing.

When a pattern is drawn in such a three-dimensional drawing area, there are the following three problems.
The first problem is that, since the drawing area includes an inclined surface, there is a place where the focus of the pattern light is out of focus and in the out-of-focus state (front pin state, rear pin state) during scanning, and the resolution of the pattern is reduced. It is to do.
The second problem is that the pattern is deformed (mainly stretched) when drawing on the inclined surface of the drawing area.
The third problem is that the resolution of the pattern is lowered when light is incident obliquely on the resist film in the inclined drawing region.

  Patent Documents 1 and 2 disclose techniques that have been devised in view of the above three technical problems.

In Patent Document 1, when performing scanning exposure on a plate (object to be drawn) placed on a chuck (holding means), scanning is performed by adjusting the chuck in the Z direction (vertical direction) along the inclination of the plate. This prevents blurring of exposure.
However, it is impossible to prevent a difference in focal position in the exposure area (pattern light area irradiated by the exposure unit), and it is also impossible to prevent deformation of the pattern in the exposure area.

In Patent Document 2, before performing exposure on a wafer (object to be drawn) fixed on a sample stage, the amount of deformation of the pattern due to the tilt of the wafer is calculated in advance and the pattern data drawn by the electron beam is corrected. Thus, deformation of the pattern in the exposure area is prevented.
However, when exposing the inclined surface of the wafer, there is a place where the focus of the pattern light is out of focus and in a defocused state (front pin state, rear pin state), and the resolution of the pattern is lowered.

JP 2001-313241 A JP-A-10-106928

  The present invention has been made on the basis of the above problem awareness. When a pattern is drawn on the inclined drawing area of the drawing object, the pattern resolution is adjusted by focusing the pattern light on the inclined drawing area. It is an object of the present invention to provide a drawing apparatus and a drawing method that can improve pattern resolution by preventing pattern deformation and allowing pattern light to vertically enter a resist film in an inclined drawing region.

The drawing apparatus of the present invention is a drawing apparatus that draws a drawing light on a drawing object by a light modulation element and draws a pattern on the drawing object while continuously scanning the drawing object with respect to the drawing light. there are, said a stage for holding remain having a three-dimensional shape including a drawing area of the curved surface which is inclined or curved inclined to be drawn body with respect to the plane, the object drawing held by said stage Measuring means for measuring the inclination of the drawing surface of the body, inclination adjusting means for inclining the entire drawing object by adjusting the inclination of the entire stage , and the drawing light depending on the measurement result of the measuring means said to be incident substantially perpendicular to the object drawing surface of the drawing member, it is characterized by and a tilt control means for controlling the inclination adjustment means.

The drawing object has the drawing surface on one surface and an adsorption holding surface on the other surface, and the stage can adsorb and hold the adsorption holding surface.

The measuring means has at least three sensors for measuring a distance between the drawing surface and a reference position at a predetermined position of the drawing surface of the drawing object, and each of the predetermined positions is more than the drawing light. The scanning direction direction side, and at least one of the sensors has a predetermined position at a position inside the region of the drawing surface irradiated with the drawing light by the scanning, and the other sensors The position near the boundary in the direction orthogonal to the scanning direction of the region irradiated with the drawing light by scanning can be set as the predetermined position.

  The measuring unit includes an approximate plane calculating unit that calculates an approximate plane corresponding to a predetermined region of the drawing surface based on a distance measured by the plurality of sensors, and the tilt control unit includes the drawing light and the drawing light. The tilt adjusting means can be controlled so that the approximate plane is substantially perpendicular.

The drawing method of the present invention is a drawing method in which drawing light is irradiated to a drawing object by a light modulation element, and a pattern is drawn on the drawing object while continuously scanning the drawing object with respect to the drawing light. In the drawing period, the inclination of the drawing surface of the drawing object held in a state having a three-dimensional shape including a drawing area of an inclined surface or a curved surface that is inclined with respect to the plane by the stage a measuring step of measuring, in accordance with the measurement result in the measuring step, the so drawing light is incident substantially perpendicular to the object drawing surface of the object to be drawn body, by adjusting the inclination of the entire stage The tilt adjustment control step of tilting the entire drawing object is repeated a plurality of times.

  According to the present invention, when a pattern is drawn on an inclined drawing area of an object to be drawn, the pattern light is focused on the inclined drawing area to increase the resolution of the pattern, to prevent the pattern from being deformed. It is possible to obtain a drawing apparatus and a drawing method in which pattern light can be vertically incident on a resist film in a drawing region to increase the resolution of the pattern.

FIGS. 1A and 1B are perspective views showing a structure (three-dimensional shape) of a substrate that is a drawing object by a drawing apparatus. It is a conceptual diagram which shows the state which divided the inclination drawing area | region of the board | substrate into the some division area. 1 is a conceptual diagram illustrating an overall configuration of a drawing apparatus according to an embodiment of the present invention. It is a functional block diagram of the drawing apparatus which concerns on one Embodiment of this invention. It is a perspective view which shows the external appearance of the drawing apparatus which concerns on one Embodiment of this invention. 6A and 6B are diagrams showing the detailed structure and principle of the tilt sensor unit (tilt measuring means, approximate plane calculating means). It is a flowchart which shows drawing operation | movement by a drawing apparatus. FIG. 8A is a diagram showing a state in which pattern light is applied to the plane (horizontal plane) of the drawing region of the substrate in FIG. 1A, and FIG. ) Shows a state in which pattern light is irradiated to the inclined drawing region of the substrate.

  With reference to FIGS. 1-8, the drawing apparatus 1 which concerns on one Embodiment of this invention is demonstrated.

<Configuration of Substrate W as Drawing Object>
First, with reference to FIGS. 1A and 1B, the structure (three-dimensional shape) of the substrate W that is a drawing object by the drawing apparatus 1 will be described. The board | substrate W is a liquid crystal display, a printed wiring board, etc. which are components which comprise an electronic device, for example.

1A and 1B, a substrate W has an inclined drawing area (surface to be drawn) extending in the scanning direction (perpendicular to the paper surface in the drawing) (hereinafter referred to as an “inclined drawing area”). 110. In FIG. 1A, the switching portion from the drawing region extending in the left-right direction in FIG. 1 to the inclined drawing region 110 has a relatively acute angle, and in FIG. 1B, it extends in the left-right direction in FIG. A switching portion from the drawing area to the inclined drawing area 110 is a relatively gentle R surface.
In this specification, the “inclined drawing region (surface to be drawn) 110” means a three-dimensional shape including an inclined surface inclined with respect to a horizontal plane and a curved surface curved with respect to the horizontal plane.

The inclined drawing region 110 of the substrate W may have an inclined surface or a curved surface whose cross-sectional shape changes depending on the position in the scanning direction. For example, in FIGS. 1A and 1B, the inclined drawing area 110 of the substrate W has a shape in which the scanning direction (perpendicular to the paper surface in the figure) and the sub-scanning direction (the left-right direction in the figure) are interchanged. Also good.
In other words, the shape of the inclined drawing area 110 of the substrate W shown in FIGS. 1A and 1B is merely an example, and the inclined drawing area 110 can have an arbitrary shape.

<Configuration of the drawing apparatus 1>
Next, the configuration of the drawing apparatus 1 will be described with reference to FIGS. The drawing apparatus 1 irradiates the substrate W with drawing light by a light modulation element, and draws a pattern on the substrate W while continuously scanning the substrate W with respect to the drawing light. In the figure, as an object to be drawn by the drawing apparatus 1, a substrate W having the inclined drawing region 110 shown in FIG.

As shown in FIG. 2, the drawing apparatus 1 includes a plurality of divided inclined drawing areas (hereinafter referred to as “divided areas”) A1 in which the inclined drawing area 110 of the substrate W that is the drawing object is arranged in the scanning direction and the sub-scanning direction. -A7, B1-B7, C1-C7, D1-D7, and E1-E7, and is a scanning type drawing apparatus that irradiates each divided area A1-E7 continuously with pattern light.
The inclined drawing area 110 of the substrate W is actually divided into a large number of divided areas, for example, 8 (divided) × 25 (columns) = 200 (divided areas). In order to increase the resolution of pattern drawing, it is better that the number of divisions is larger.
However, in this embodiment, in order to facilitate the understanding of the invention (it is practically impossible to show all the above-mentioned many divided areas), the inclined drawing area 110 of the substrate W is divided by 7 × 5 = 35. The case where it divides into area | region A1-E7 is illustrated and demonstrated.

  The drawing device 1 has a housing 1X, and each component of the drawing device 1 is supported on a mounting table 1Y in the housing 1X.

  The drawing apparatus 1 includes a stage (holding means) 10 that holds a substrate W that is a drawing target. The stage 10 has a vacuum suction holding mechanism (not shown) that vacuum-sucks and holds the lower surface (stage contact surface) of the substrate W. When the lower surface (stage contact surface) of the substrate W has a special shape that is not a flat surface, a substrate holding mechanism corresponding to the special shape is mounted on the stage 10.

  The drawing apparatus 1 includes a stage moving mechanism 20 that continuously moves the stage 10 holding the substrate W in the X direction (scanning direction). The stage moving mechanism 20 includes two guide rails 21 (FIG. 5) formed side by side in the X direction (scanning direction) on the mounting table 1Y, and a guide member on the stage 10 side (FIG. 5) guided by the guide rails 21. And a driving means (not shown) for continuously driving the guide member with respect to the guide rail 21. Further, the stage moving mechanism 20 may include a structure capable of moving the stage 10 in the Y direction (sub-scanning direction), the Z direction (height direction), and the θ direction (rotation direction).

  Between the stage 10 and the stage moving mechanism 20, the stage 10 is moved three-dimensionally in synchronism with the continuous movement of the stage 10 holding the substrate W in the X direction (scanning direction). 10 and an attitude adjusting device (inclination adjusting means) 30 for changing the attitude (inclination) of the inclined drawing area 110 (divided areas A1 to E7) of the substrate W held on the stage 10 continuously or stepwise. ing.

As shown in FIG. 5, the attitude adjustment device 30 is positioned above the bottom plate portion 31 and the bottom plate portion 31 guided by the guide rail 21 of the stage moving mechanism 20 via a guide member (not shown). The stage 10 is positioned further above the middle plate 32 (the stage 10 constitutes the top plate of the posture adjusting device 30).
The upper surface of the bottom plate portion 31 and the lower surface of the middle plate portion 32 are provided with four guide members 31A and 32A each having a guide surface that forms part of a virtual arc drawn on the XZ plane and extends in the Y direction. ing. The guide surfaces of the guide member 31A and the guide member 32A are guided along a virtual arc drawn on the XZ plane, so that the stage 10 and the inclined drawing area 110 of the substrate W held on the stage 10 (in the XZ plane) ( The posture (inclination) of the divided areas A1 to E7) can be changed. The guide member 31A and the guide member 32A are formed with an engaging portion 31B and an engaging portion 32B for preventing the guide surfaces of both guide members from being detached.
On the upper surface of the intermediate plate portion 32 and the lower surface of the stage 10, four guide members 32C and guide members 10A each having a guide surface that forms part of a virtual arc drawn on the YZ plane and extends in the X direction are provided. Yes. The guide surfaces of the guide member 32C and the guide member 10A are guided along a virtual arc drawn on the YZ plane, whereby the stage 10 and the inclined drawing region 110 of the substrate W held on the stage 10 (in the YZ plane) ( The posture (inclination) of the divided areas A1 to E7) can be changed. The guide member 32C and the guide member 10A are formed with an engaging portion 32D and an engaging portion 10B for preventing the guide surfaces of both guide members from coming off.
The drawing apparatus 1 includes a driving means (not shown) for driving the guide member 31A of the bottom plate portion 31 and the guide member 32A of the middle plate portion 32, and the guide member 32C of the middle plate portion 32 and the guide of the stage 10. Driving means (not shown) for driving the member 10A so as to guide the member 10A is provided.
Thus, the stage is adjusted by combining the posture adjustment mechanism in the XZ plane provided between the bottom plate portion 31 and the middle plate portion 32 and the posture adjustment mechanism in the YZ plane provided between the middle plate portion 32 and the stage 10. 10 is moved three-dimensionally to change the posture (tilt) of the stage 10 and the inclined drawing area 110 (divided areas A1 to E7) of the substrate W held on the stage 10 continuously or stepwise. it can.
The specific mode of the posture adjustment device (tilt adjustment device) is not limited to that described here, and a known mechanism such as one using a linear motion linear slide or one using a wedge structure is employed. can do.

  The drawing apparatus 1 includes a gate-type exposure unit base (drawing unit base) 40 that straddles the stage 10, the stage moving mechanism 20, and the attitude adjustment device 30 in the Y direction (sub-scanning direction) on the mounting table 1Y. The exposure unit base 40 supports an exposure unit (drawing unit) 60 movably stepwise in the Y direction (sub-scanning direction) by an exposure unit moving mechanism (drawing unit moving mechanism) 50.

The exposure unit 60 exposes (draws) a pattern by irradiating the inclined drawing area 110 of the substrate W held on the stage 10 with pattern light.
More specifically, the exposure unit 60 moves the substrate W while continuously moving the stage 10 in the X direction (scanning direction) by the stage moving mechanism 20 from the initial state where the irradiation position of the pattern light is adjusted to the divided area A1. The pattern light is continuously applied to the divided areas A1 to A7. Thereafter, the stage moving mechanism 20 and the exposure unit moving mechanism 50 align the irradiation position of the pattern light by the exposure unit 60 with the divided region B1. Then, the exposure unit 60 continuously irradiates the divided regions B1 to B7 of the substrate W with the pattern light while continuously moving the stage 10 in the X direction (scanning direction) by the stage moving mechanism 20. . By repeating the above operation, the exposure unit 60 continuously radiates pattern light onto the divided regions A1 to E7 of the substrate W.

  The exposure unit 60 has a light source 61 that emits light (FIG. 3). Although not shown in the drawing, the exposure unit 60 makes the light quantity emitted from the light source 61 uniform and adjusts the light so that it becomes a parallel light beam, and the light adjusted by the illumination optical system is used as pattern light. And a projection optical system and a focus adjustment optical system for guiding the pattern light reflected by the DMD to the inclined drawing area 110 (divided areas A1 to E7) of the substrate W to form an image. A method of continuously drawing a pattern using DMD is described in detail in, for example, Japanese Patent Application Laid-Open No. 2003-057837, and drawing (exposure) is performed in the same manner in this embodiment.

The exposure unit 60 measures an inclination of the inclined drawing area 110 (each divided area A1 to E7) of the substrate W held on the stage 10 and calculates an approximate plane based on the inclination (an inclination measuring unit). , Approximate plane calculating means) 70 is provided.
The tilt sensor unit 70 is provided at a position offset so as to precede the exposure unit 60 in the X direction (scanning direction). For this reason, the inclination sensor unit 70 is after the irradiation position of the current pattern light by the exposure unit 60 when the exposure unit 60 continuously irradiates the divided light of the same scanning line. An approximate plane of another divided region scheduled to be irradiated with the pattern light is calculated.
In the present embodiment, when the exposure unit 60 irradiates the divided area A1 with pattern light, the inclination sensor unit 70 calculates an approximate plane of the divided area A2 scheduled to be irradiated with the pattern light immediately after that. To do. On the other hand, when the exposure unit 60 irradiates the divided region A7 with the pattern light, since there is no divided region on the scanning line that is scheduled to be irradiated with the pattern light thereafter, the inclination sensor unit 70 is The approximate plane of any divided area is not calculated (cannot be calculated).

The tilt sensor unit 70 obtains the tilts of the divided areas A1 to E7 of the substrate W. Specifically, the tilt sensor unit 70 calculates approximate planes of the divided areas A1 to E7 of the substrate W.
As shown in FIGS. 6A and 6B, the tilt sensor unit 70 is formed by unitizing three sensors, a first sensor 71, a second sensor 72, and a third sensor 73. These three sensors 71 to 73 are sensors that measure distance, for example, and are preferably sensors that can measure without contact with the substrate W. For example, a laser displacement meter, an ultrasonic displacement meter, an air micrometer, or the like may be used. it can.
As the three sensors 71 to 73 are scanned with the substrate W, each of the divided regions A1 to E7 of the substrate W has a plurality of reference positions (when the divided regions have no inclination and coincide with the focal plane of the exposure unit 60). Position) and the measurement position on the drawing surface are obtained, and approximate planes of the divided areas A1 to E7 of the substrate W are calculated based on the plurality of distances.
At this time, the plurality of distances are not acquired at once, and measurement is performed at least twice according to the scanning of the substrate W. By doing so, it is possible to measure the distance at a position that is appropriately separated in two directions, ie, the scanning direction and the direction orthogonal to the scanning direction.
For the geodetic position (predetermined position) of the tilt data, at least one of the sensors measures the distance in the region (irradiated region) where the drawing light is continuously irradiated by scanning in the tilted drawing region, and other tilt sensors. For, measure the distance near the boundary of the irradiated area. Note that the vicinity of the irradiated region may be on either the inner side of the irradiated region or the outer side of the irradiated region.
The first sensor 71, the second sensor 72, and the third sensor 73 use commercially available displacement meters made of a known technique. The known technique is described in detail in, for example, Japanese Patent Application Laid-Open No. 2001-159516.
In addition, when the inclination direction of the board | substrate W is only one direction, the measurement by the three sensors 71-73 may be only one time instead of multiple times, and the three measurement points in that case are on a straight line. Be placed.

As shown in FIG. 4, the drawing apparatus 1 includes an arithmetic device 80 to which an approximate plane of the inclined drawing area 110 (each divided area A1 to E7) of the substrate W calculated by the inclination sensor unit 70 is input.
Based on the input information from the tilt sensor unit 70, the arithmetic device 80 causes the pattern light irradiated by the exposure unit 60 to enter the tilt drawing region 110 (divided regions A1 to E7) of the substrate W substantially perpendicularly. The posture (tilt) of the correct stage 10 is calculated.
In other words, the arithmetic device 80 is based on the input information from the tilt sensor unit 70, and the pattern light irradiated by the exposure unit 60 is approximately with respect to the approximate plane of the tilt drawing area 110 of the substrate W calculated by the tilt sensor unit 70. The posture (tilt) of the stage 10 that enters perpendicularly is calculated.
More specifically, the arithmetic device 80 inputs the pattern light continuously irradiated by the exposure unit 60 substantially perpendicularly to the approximate planes of the divided areas A1 to E7 of the substrate W calculated by the tilt sensor unit 70. Such a posture of the stage 10 is calculated.

As shown in FIG. 4, the drawing apparatus 1 includes a control device (tilt control means, posture control means) 90.
Based on the calculation result of the calculation device 80, the control device 90 causes the posture adjustment device 30 to apply the stage 10 and the stage 10 to the stage 10 during the scanning exposure to the inclined drawing area 110 (each divided area A1 to E7) of the substrate W. The posture (inclination) of the inclined drawing area 110 (divided areas A1 to E7) of the held substrate W is changed in real time.
The control device 90 causes the posture adjustment device 30 and the stage 10 and the pattern light so that the pattern light irradiated by the exposure unit 60 is incident on the inclined drawing region 110 (divided regions A1 to E7) of the substrate W substantially perpendicularly. The posture (inclination) of the inclined drawing area 110 of the substrate W held on the stage 10 is changed.
That is, the control device 90 uses the posture adjustment device 30 so that the pattern light irradiated by the exposure unit 60 is incident substantially perpendicular to the approximate plane of the tilt drawing area 110 of the substrate W calculated by the tilt sensor unit 70. Then, the posture (tilt) of the stage 10 and the tilted drawing area 110 of the substrate W held on the stage 10 is changed.
More specifically, the control device 90 inputs the pattern light continuously irradiated by the exposure unit 60 substantially perpendicularly to the approximate planes of the divided areas A1 to E7 of the substrate W calculated by the tilt sensor unit 70. As described above, the posture adjustment device 30 changes the posture (tilt) of the stage 10 and the inclined drawing region 110 of the substrate W held on the stage 10 stepwise.

<Drawing (exposure) method on the substrate W by the drawing apparatus 1>
Next, a drawing (exposure) operation by the drawing apparatus 1 will be described mainly with reference to FIGS.

  FIG. 7 is a flowchart showing on-the-fly measurement processing by the drawing apparatus 1. In the on-the-fly method, the tilt sensor unit 70 is staged by the control device 90 and the attitude adjustment device 30 in parallel with the exposure unit 60 irradiating the pattern light continuously onto the divided areas A1 to E7 of the substrate W. When the 10 postures are changed stepwise for each divided region (A1 to E7), the inclination and approximate plane for each divided region of the substrate W are calculated for each posture of the stage 10.

In step S1, the inclination sensor unit 70 measures the inclination of the divided area A1 of the substrate W, and calculates an approximate plane based on this inclination. At this time, the exposure unit 60 does not perform pattern light irradiation.
In step S2, the tilt sensor unit 70 calculates the tilt and approximate plane of the divided area A2 of the substrate W at the timing when the stage 10 is moved by one step in the X direction (scanning direction) by the stage moving mechanism 20. At the same time, the exposure unit 60 irradiates the divided area A1 with pattern light. At this time, the pattern light irradiated by the exposure unit 60 under the control of the controller 90 by the attitude adjustment device 30 is incident substantially perpendicular to the approximate plane of the divided area A1 of the substrate W calculated by the tilt sensor unit 70. As described above, the posture (tilt) of the stage 10 and the tilted drawing area 110 of the substrate W held on the stage 10 is changed.
In step S3, the inclination sensor unit 70 moves the stage 10 continuously in the X direction (scanning direction) by the stage moving mechanism 20 by the same method as in steps S1 and S2. And the exposure unit 60 continuously irradiates the divided areas A2 to A7 with pattern light. At this time, the pattern light irradiated by the exposure unit 60 under the control of the control device 90 is substantially perpendicular to the approximate plane of the divided areas A2 to A7 of the substrate W calculated by the tilt sensor unit 70. The posture (inclination) of the stage 10 and the inclined drawing area 110 of the substrate W held on the stage 10 is changed stepwise so as to be incident on the stage 10.
In step S4, the tilt sensor unit 70 calculates the inclination and approximate plane of the divided areas B1 to E7 of the substrate W stepwise by the same method as in steps S1 to S3, and the exposure unit 60 performs the divided areas B1 to E7. Is continuously irradiated with pattern light. At this time, the pattern light irradiated by the exposure unit 60 under the control of the control device 90 is substantially perpendicular to the approximate plane of the divided regions B1 to E7 of the substrate W calculated by the tilt sensor unit 70. The posture (inclination) of the stage 10 and the inclined drawing area 110 of the substrate W held on the stage 10 is continuously changed so as to be incident on the stage 10.

  FIG. 8A shows a state in which pattern light is irradiated (shot) to the plane (horizontal plane) of the drawing region of the substrate W in FIG. 1A, and FIG. A state in which pattern light is irradiated (shot) to the inclined drawing region 110 of the substrate W of 1 (B) is shown. In FIG. 8B, the posture adjustment device 30 adjusts the inclined drawing region 110 of the substrate W so as to be substantially coincident with the horizontal plane so that the pattern light is incident substantially perpendicularly to these approximate planes.

  In the above-described embodiment, the posture control device 30 performs the operation stepwise. However, the approximate plane of the second divided area and the approximate plane of the first divided area are measured, and the two approximate planes are measured. Therefore, it is possible to continuously change the posture (tilt) of the stage 10 by performing the posture change for the supplementary operation. In that case, the interval between the inclination sensor unit 70 and the exposure unit 60 is determined so that the inclination data of the two divided areas can be measured.

  In the above-described embodiment, the measurement of the inclination data and the drawing process are performed at the same time. However, the measurement method of the mapping method in which the measurement of the inclination data for all the divided regions is measured in advance and then the drawing process is performed is adopted. It is also possible to do. In the mapping method, by obtaining all the inclination data prior to the drawing process, the attitude control device 30 can perform an interpolation operation between the divided areas and continuously change the attitude of the stage 10. It is also possible to average the approximate planes of one row of divided areas and perform the drawing process while maintaining the posture of the stage 10 constant.

  As described above, in the drawing apparatus 1 of the present embodiment, the tilt sensor unit 70 calculates the approximate plane of the tilt drawing area 110 (each divided area A1 to E7) of the substrate W held on the stage 10, and the control apparatus ( (Tilt control means, attitude control means) 90 is approximately the approximate plane of the inclined drawing area 110 (each divided area A1 to E7) of the substrate W calculated by the inclination sensor unit 70 by the pattern light irradiated by the exposure unit 60. The posture (tilt) of the stage 10 is changed so that the light enters perpendicularly.

  Thereby, when drawing (exposure) is performed on the inclined drawing area 110 (each divided area A1 to E7) of the substrate W, the pattern light is focused to increase the resolution of the pattern, and the pattern is prevented from being deformed. Pattern light can be vertically incident on the resist film in the drawing region to increase the resolution of the pattern.

  In the above embodiment, the case where the inclination sensor unit 70 is formed by unitizing the first sensor 71, the second sensor 72, and the third sensor 73 has been described. However, from the viewpoint of increasing the accuracy of the approximate plane to be calculated, the larger the number of sensors, the better. In consideration of the arrangement space and cost, a mode in which four or more sensors are unitized is also possible. It is.

  In the above embodiment, the case where the inclination sensor unit 70 is provided in the exposure unit 60 and the both are integrated has been described as an example. However, the inclination sensor unit 70 is not necessarily provided in the exposure unit 60, and the exposure unit is not necessarily provided. It is possible to adopt a mode separate from 60. However, it is advantageous that the inclination sensor unit 70 is provided in the exposure unit 60 and integrated with each other in that the positional relationship between the inclination sensor unit 70 and the pattern light irradiated by the exposure unit 60 can be clearly defined.

  In the above embodiment, the case where one substrate W is held on the stage 10 is illustrated, but a plurality of small substrates W may be arranged and held on the stage 10. In that case, the posture of the stage 10 is controlled each time so that the exposure light is perpendicular to the plurality of inclined drawing regions 110 corresponding to the number of substrates W.

1 Drawing device (scanning drawing device)
1X housing 1Y mounting table 10 stage (holding means)
10A Guide member 10B Engagement part 20 Stage moving mechanism 21 Guide rail 30 Posture adjustment device (tilt adjustment means)
31 Bottom plate portion 31A Guide member 31B Engagement portion 32 Middle plate portion 32A Guide member 32B Engagement portion 32C Guide member 32D Engagement portion 40 Exposure unit base (drawing unit base)
50 Exposure unit moving mechanism (drawing unit moving mechanism)
60 Exposure unit (drawing unit)
61 Light source 70 Tilt sensor unit (tilt measuring means, approximate plane calculating means)
71 first sensor 72 second sensor 73 third sensor 80 arithmetic device 90 control device (tilt control means, posture control means)
110 Inclined drawing area (surface to be drawn)
A1 to A7 B1 to B7 C1 to C7 D1 to D7 E1 to E7 Divided inclined drawing area (divided area)
W substrate (object to be drawn)

Claims (5)

A drawing apparatus that irradiates a drawing object with a light modulation element by a light modulation element and draws a pattern on the drawing object while continuously scanning the drawing object with respect to the drawing light,
A stage for holding the drawing object in a state having a three-dimensional shape including a drawing area of an inclined surface or a curved surface that is inclined with respect to a plane ;
Measuring means for measuring an inclination of a drawing surface of the drawing object held by the stage ;
Tilt adjusting means for tilting the entire drawing object by adjusting the tilt of the entire stage ;
Depending on the measurement result of the measuring means, and the tilt control means and the drawing light said to be incident substantially perpendicular to the object drawing surface of the drawing member, for controlling the inclination adjustment means,
A drawing apparatus comprising: The drawing apparatus according to claim 1,
The drawing object has the drawing surface on one surface and an adsorption holding surface on the other surface;
The drawing apparatus , wherein the stage holds the suction holding surface by suction . The drawing apparatus according to claim 1 or 2,
The measuring means has at least three sensors for measuring a distance between the drawing surface and a reference position at a predetermined position of the drawing surface of the drawing object,
Each of the predetermined positions is on the scanning direction side of the drawing light,
At least one of the sensors has a predetermined position at a position that is inside the region irradiated with the drawing light on the drawing surface by the scanning,
The other sensor sets a position near a boundary in a direction orthogonal to a scanning direction of a region irradiated with the drawing light by the scanning as a predetermined position. The drawing apparatus according to claim 3 , wherein
The measuring unit includes an approximate plane calculating unit that calculates an approximate plane corresponding to a predetermined region of the drawing surface based on distances measured by the plurality of sensors.
The inclination control means controls the inclination adjustment means so that the drawing light and the approximate plane are substantially perpendicular to each other. A drawing method in which drawing light is irradiated to a drawing object by a light modulation element, and a pattern is drawn on the drawing object while continuously scanning the drawing object with respect to the drawing light,
During the drawing period,
A measuring step for measuring the inclination of the drawing surface of the drawing object held in a state having a three-dimensional shape including a drawing area of an inclined surface or a curved surface curved with respect to a plane by a stage ;
Depending on the measurement result in the measuring step, such that the draw beam is incident substantially perpendicular to the object drawing surface of the object to be drawn body, tilting the entire image-rendering body by adjusting the inclination of the entire stage A tilt adjustment control step;
A drawing method characterized by repeating a plurality of times.

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