TW201802609A - Mask manufacturing apparatus and method for controlling mask manufacturing apparatus - Google Patents

Abstract

The present invention improves pattern position accuracy. According to the present invention, a measurement value in the case where a measurement unit is assumed to be located at the positon of a light irradiation unit is calculated on the basis of the weighted average value of values acquired by position measurement units provided to both sides of a first movement unit in a second direction and on the basis of the weighted average value of values acquired by position measurement units provided to both sides, in a first direction, of a second movement unit having a second driving unit. The positional relation between the light irradiation unit and a stage is measured by laser interferometers through measurement of the position of a bar mirror provided to the stage with the position of two mirrors provided to the light irradiation unit set as the reference. Then, correction is made for the position measurement units by comparing the measurements, and drawing is performed on a mask M by using measurements from the position measurement units after correction.

Description

Mask manufacturing device and control method for mask manufacturing device

The invention relates to a mask manufacturing apparatus and a control method of the mask manufacturing apparatus.

Patent Document 1 discloses a substrate holding device that holds a substrate via a movable contact portion that is moved or deformed by a common fluid. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-79917

When the problem to be solved by the invention is to produce a semiconductor substrate, a liquid crystal panel, etc., in order to produce a product with no display unevenness, generally, it is necessary to correct the error within 10 nm (preferably 2 nm) or less. The substrate is processed. Moreover, in general, such high-precision processing is performed using laser light that has been scanned and modulated (or biased and modulated).

However, if it is desired to process a substrate such as a semiconductor substrate or a liquid crystal panel with high precision by scanning and modulating laser light, it takes a long time (about several days) to process one substrate. Therefore, laser light is used to generate a highly accurate mask for generating a semiconductor substrate or a liquid crystal panel, and the pattern of the mask is transferred to a substrate such as a semiconductor substrate or a liquid crystal panel.

In such a mask generating device, a photosensitive substrate (such as a glass substrate) is held on a platform in a horizontal direction, and the photosensitive substrate is moved in the horizontal direction to irradiate scanned and modulated laser light, thereby generating a mask. .

The invention described in Patent Document 1 discloses that a photosensitive substrate (hereinafter referred to as a mask) is held in a horizontal direction without being deflected by its own weight. However, merely maintaining the cover in a manner free from deflection caused by its own weight does not improve the positional accuracy of the pattern.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a mask manufacturing apparatus and a method for controlling a mask manufacturing apparatus capable of improving the positional accuracy of a pattern. [Means for solving problems]

In order to solve the above-mentioned problem, the mask manufacturing apparatus of the present invention includes a platform such as a plate-shaped platform on which a mask is placed on a substantially horizontal upper surface, and the adjacent 2 A bar mirror is provided on the side; a substantially rectangular parallelepiped pressure plate; a first moving portion is placed on the pressure plate, has a plate-shaped portion, and a first drive moves the plate-shaped portion in the first direction; A second moving part, which is placed on the upper surface of the plate-shaped part, and the platform is placed on the second moving part, and has a second drive for moving the platform in the second direction A light irradiating part, which irradiates light to the surface of the cover, and is provided with two reflecting mirrors parallel to the rod mirror; a frame is provided on the pressure plate, and holds the light above the platform An irradiation unit and a position measuring unit including a first position measuring unit and a second position measuring unit, which are provided on both sides in the second direction of the first moving unit and obtain the first portion of the plate-like portion; The position in the first direction, and the third position measuring unit and the fourth position measuring unit are provided in the second moving unit. The two sides in the first direction and the positions in the second direction of the platform are obtained; the laser interferometer measures the positions of the rod mirrors based on the positions of the two mirrors, To measure the positional relationship between the light irradiation unit and the platform; and the control unit to obtain information related to the position and shape of the pattern drawn on the mask, that is, drawing information, based on the information obtained by the position measuring unit The first driving unit and the second driving unit are driven to move the stage in a horizontal direction while performing a drawing process of irradiating light from the light irradiation unit to the mask based on the drawing information. The control unit is based on irradiating the light obtained by the first position measurement unit and the value obtained by the second position measurement unit with the light based on the first position measurement unit and the second position measurement unit and the light. A weighted average value obtained by weighting the distance between the parts, and a value obtained by the third position measuring unit and a value obtained by the fourth position measuring unit, based on the third position measuring unit and the fourth position The measurement unit and the light irradiation unit The weighted average value obtained by weighting is used to obtain a measurement value assuming that the position measurement section is located at the position of the light irradiation section, and the obtained measurement value and the measurement result of the laser interferometer are calculated. The position measurement unit is corrected by comparison, and the drawing processing is performed based on a value obtained by the corrected position measurement unit.

According to the mask manufacturing apparatus of the present invention, based on the values obtained by the first position measuring section and the second position measuring section provided on both sides of the first moving section in the second direction, the first position measuring section and A weighted average value obtained by weighting the distance between the second position measuring unit and the light irradiation unit, and a third position measuring unit and a fourth position measuring unit in which the second moving unit is provided on both sides in the first direction. The value obtained by the weighting unit is a weighted average value obtained by weighting the distance between the third position measuring unit and the fourth position measuring unit and the light irradiation unit, and assuming that the measurement unit is located on the light irradiating the cover. The measured value at the position of the irradiation unit, wherein the first moving unit moves the stage in the first direction, and the second moving unit moves the stage in the second direction. Then, the position of the rod mirror installed on the stage is measured based on the positions of the two mirrors provided on the light irradiation unit, and the positional relationship between the light irradiation unit and the stage is measured by a laser interferometer. Then, the measured value obtained is compared with the measurement result of the laser interferometer to correct the position measurement unit, and the mask is drawn using the measurement of the corrected position measurement unit. In this way, by correcting the position measurement unit using a laser interferometer, it is possible to accurately move the stage (cover) in the horizontal direction. Therefore, the positional accuracy of the pattern drawn on the mask M can be improved.

Here, the mask manufacturing apparatus of the present invention may include a reading unit, the reading unit being adjacent to or provided in the light irradiation unit, and the control unit acquiring and including the arrangement in two dimensions The information related to the correction substrate pattern of the position of the plurality of crosses is the correction substrate drawing information, while controlling the first driving section and the second driving section so that the platform moves in the first direction and direction. The second direction movement is based on the correction substrate drawing information, irradiating light to the mask from the light irradiating unit, and drawing the correction substrate pattern on the mask to generate a correction substrate. The reading unit is used to read the initial state, that is, the initial state, and the state in which the correcting substrate is rotated from the initial state by approximately 90 degrees, approximately 180 degrees, and approximately 270 degrees. The correction substrate corrects the drawing information based on a result of the reading, and performs the drawing processing based on the corrected drawing information. Thereby, self-calibration can be performed by the light irradiation section alone, thereby improving the positional accuracy of the pattern. In addition, since a correction substrate pattern including positions of a plurality of crosses is used, the drawing information can be corrected in the first direction and the second direction, respectively.

Here, a correction value may be generated for the control unit, and the drawing information may be corrected using the generated correction value. The correction value is a result of reading the correction substrate in the initial state, and The result of reading the correction substrate while rotating the correction substrate is approximately 180 degrees, and the result of reading the correction substrate while rotating the correction substrate is approximately 90 degrees. This is consistent with the result of reading the correction substrate while rotating the correction substrate by approximately 270 degrees. Thereby, the pattern drawn on a board | substrate can be made to match completely with the pattern shown by drawing information.

Here, the light irradiation unit may include an auto-focusing unit, the auto-focusing unit aligns a focus of light irradiated on the mask, and the control unit controls the auto-focusing unit, Acquiring distance information related to the distance between the light irradiation unit and the mask, correcting the drawing information based on the acquired distance information, and performing the drawing processing based on the corrected drawing information. Accordingly, even if a change in the height direction of the mask M (for example, the deflection of the mask M caused by the adhesion of dust between the mask and the platform, or the thickness distribution of the mask is the cause), it is possible to accurately depict the mask M. pattern.

Here, the light irradiation unit may have a surface irradiation unit in which pixels are arranged two-dimensionally, and the drawing information may include: a position of the surface irradiation unit and each pixel of the surface irradiation unit. The position information obtained by correlating the presence or absence of light irradiation, and the irradiation timing information obtained by correlating the position of the surface irradiation unit with the irradiation timing of light in each pixel of the surface irradiation unit, the control unit uses After staggering the irradiation timing information in the first direction, staggering the position information in the second direction to correct the drawing information, and moving the platform in the first direction for one line of drawing, The drawing process is performed by moving the platform in the second direction. Accordingly, when the laser light is irradiated on the surface, the drawing information can be corrected to irradiate the light.

Here, the light irradiation section may include an optical member, and the control section may correct the drawing information by moving the optical member. Accordingly, when the laser light is irradiated on the surface, the drawing information can be corrected to irradiate the light.

此處，亦可為所述平台使用熱膨脹係數大致為1×10^-7 /K以下的材料而形成，所述控制部以所述平台不自所述板狀部伸出的方式控制所述第2驅動部。由此，可防止罩幕M的撓曲等，而提高圖案的位置精度。

Here, the platform may be formed by using a material having a thermal expansion coefficient of approximately 1 × 10 ^-7 / K or less, and the control unit controls the first platform so that the platform does not protrude from the plate-like portion. 2Drive unit. This can prevent the deflection of the mask M and the like, and improve the positional accuracy of the pattern.

In order to solve the above-mentioned problem, the mask manufacturing apparatus of the present invention is characterized by including a step based on a first position measuring unit and a second position measuring unit provided on both sides of the second direction by the first moving unit. The obtained value is a weighted average value obtained by weighting the first position measuring unit and the distance between the second position measuring unit and the light irradiation unit, and setting the second moving unit in the first direction. The values obtained by the third position measuring unit and the fourth position measuring unit on both sides of the upper side are weighted averages obtained by weighting based on the distance between the third position measuring unit and the fourth position measuring unit and the light irradiation unit. The first moving part is placed on a platen of a substantially rectangular parallelepiped and has a plate-like portion, and a measurement value is obtained when the measurement portion is assumed to be at a position of a light irradiation portion that irradiates light to the cover. A first driving portion that moves the plate-like portion in a first direction, the second moving portion is placed on an upper surface of the plate-like portion, and a second screen is mounted on the second moving portion. A plate-like platform having a second stage for moving the stage in a second direction A drive unit that corrects the first position measurement unit, the second position measurement unit, the third position measurement unit, and the first measurement unit based on the obtained measurement value and a measurement result of the laser interferometer; 4 position measuring section, wherein the measurement result of the laser interferometer measures the position of the rod mirror provided on the platform based on the positions of the two mirrors provided on the light irradiating section as a reference. It is obtained by the positional relationship between the light irradiating portion and the platform; and based on the first position measuring portion, the second position measuring portion, the third position measuring portion, and the first position measuring portion corrected by the correction step. The value obtained by the fourth position measurement unit drives the first drive unit and the second drive unit to move the platform in a horizontal direction based on the position and shape of the pattern drawn on the mask. The drawing information is drawing information, and the cover is irradiated with light from the light irradiating unit to the cover. Thereby, the position measurement unit can be corrected using a laser interferometer, and the position accuracy of the pattern drawn on the mask M can be improved. [Effect of the invention]

According to the present invention, the positional accuracy of the pattern can be improved.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each drawing, the same elements are assigned the same symbols, and descriptions of the duplicated parts are omitted.

玻璃基板）上照射雷射等光而生成光罩（photo mask）的裝置。關於感光性基板，例如使用熱膨脹率非常小的（例如約為5.5×10^-7 /K左右）石英玻璃。The mask manufacturing apparatus in the present invention is a photosensitive substrate (for example,

A device that generates a photo mask by irradiating light such as a laser on a glass substrate. For the photosensitive substrate, for example, quartz glass having a very small thermal expansion coefficient (for example, about 5.5 × 10 ^-7 / K) is used.

The photomask produced by the mask manufacturing apparatus is, for example, an exposure mask used for manufacturing a substrate for a liquid crystal display device. The photomask is one in which, for example, one or more image device transfer patterns are formed on a large, substantially rectangular substrate having a length of more than 1 m (for example, 1400 mm × 1220 mm). Hereinafter, as a concept including a photosensitive substrate before processing and a photosensitive substrate (photomask) after processing, a term such as a mask M is used.

FIG. 1 is a perspective view showing an outline of a mask manufacturing apparatus 1 according to the first embodiment. The mask manufacturing apparatus 1 mainly includes a platen 11, a vibration damping table 12, a vibration damping table 13, a first moving part 20, a second moving part 30, a platform 41, a frame 42, a light irradiation part 43, and a pattern reading. Department 47. In addition, a part of the configuration is omitted in FIG. 1. In addition, the screen manufacturing apparatus 1 is maintained at a fixed temperature by a temperature adjustment unit (not shown) that covers the entire apparatus.

The platen 11 is a member having a substantially rectangular parallelepiped shape (thick plate shape), and is formed of, for example, a stone (for example, granite) or a low expansion coefficient casting (for example, a nickel-based alloy). The pressure plate 11 is placed on a plurality of vibration damping tables 12 and 13, and the plurality of vibration damping tables 12 and 13 are placed on a setting surface (for example, a floor). Accordingly, the pressure plate 11 is placed on the installation surface via the vibration damping table 12 and the vibration damping table 13. The platen 11 has an upper surface (a surface on the + z side) 11 a that is substantially horizontal (substantially parallel to the xy plane).

The vibration reduction platform 12 is an active vibration reduction platform, and the vibration reduction platform 13 is a load-bearing passive vibration reduction platform. The vibration damping table 13 includes a passive spring element capable of moving in the z direction. The vibration damping table 12 adds an actuator (not shown) capable of moving in the x direction and the y direction, a sensor (not shown) for controlling the actuator, and A signal from the sensor controls a control circuit (not shown) of the actuator in such a manner as to suppress vibration from an external input. Since the vibration damping table 12 and the vibration damping table 13 are well known, detailed description is omitted.

The first moving part 20 is placed on the upper surface 11 a of the platen 11, the second moving part 30 is placed on the first moving part 20 (+ z side), and the platform 41 is placed on the second moving part 30. The first moving section 20 moves the platform 41 in the x direction, and the second moving section 30 moves the platform 41 in the y direction.

FIG. 2 is a perspective view showing the outline of the first moving section 20 and the second moving section 30. Although not shown in FIG. 2, air is supplied to the first moving section 20 and the second moving section 30 by a self-pump or the like.

The first moving portion 20 mainly includes four rails 21, one guide rail 22, a plate-shaped portion 23 placed on the rail 21 and the guide rail 22, and a convex portion 24 provided so as to interpose the guide rail 22 along the rail. A driving portion 25 for moving the plate-shaped portion 23 on the upper surface of 21, a rod-shaped member 26, a magnet 27, and a position measuring portion 29.

The four rails 21 and the guide rails 22 are elongated plate-shaped members made of ceramics, and are fixed to the upper surface 11 a of the platen 11 so as to extend along the x direction in the longitudinal direction. The heights (positions in the z direction) of the four rails 21 and the guide rails 22 are substantially the same. The upper surfaces of the rail 21 and the guide rail 22 and the side surfaces of the guide rail 22 are formed with high accuracy and high flatness.

The guide rail 22 is provided substantially at the center in the y-direction of the pressure plate 11. The surface including the guide rail 22 substantially parallel to the xz plane includes the position of the center of gravity of the mask manufacturing apparatus 1.

The four rails 21 are provided at positions symmetrical to each other across the rail 22. In this embodiment, two rails 21 are provided on the −y side of the guide rail 22, and two rails 21 are provided on the + y side of the guide rail 22. Further, among the four rails 21, the rail 21 a at the end on the -y side places a region near the end face 23 e of the plate-shaped portion 23 as the end on the -y side, and the four rails 21 at the end on the + y side The rail 21 b places a region near the end surface 23 f of the plate-shaped portion 23 as an end portion on the + y side.

The plate-like portion 23 is a plate-like member made of ceramics and has a substantially rectangular shape as a whole. The plate-like portion 23 has an upper surface 23 a and a lower surface 23 b that are substantially horizontal (see FIG. 3). A second moving portion 30 is placed on the upper surface 23a. On the lower surface 23b, a rod-shaped convex portion 24 is provided so as to extend along the x direction in the longitudinal direction.

FIG. 3 is an enlarged view of a portion of the first moving section 20. When the convex portion 24 is provided on the lower surface 23 b, a groove 23 d is formed on the lower surface 23 b of the plate-like portion 23. The guide rail 22 is inserted into the groove 23d. Thereby, the moving direction of the plate-shaped part 23 is restricted so that the position of the plate-shaped part 23 in the y direction, that is, the plate-shaped part 23 does not move beyond the x-direction.

The convex portion 24 is provided with an air ejection portion 24 a that ejects air toward the side surface of the guide rail 22. The air ejection portion 24 a has an air hole opened on the side of the convex portion 24. In addition, the air ejection part 24a has an orifice with a narrowed inner diameter. Therefore, air supplied from a pump (not shown) or the like is ejected from the opening at high pressure and high speed. Thereby, an air layer is formed between the air ejection part 24a and the guide rail 22.

A convex portion 23c is formed on the lower surface 23b of the plate-like portion 23 at a position facing the rail 21 and the guide rail 22. The front end of the convex portion 23 c (a surface facing the rail 21 or the guide rail 22) is a flat surface. The convex portion 23 c is provided with an air ejection portion 28. In addition, in FIG. 3, illustration of the convex portion 23 c formed at a position facing the guide rail 22 is omitted.

FIG. 4 is a perspective view of the plate-like portion 23 as viewed from the back side. The plurality of convex portions 23c are arranged two-dimensionally on the lower surface 23b. The convex portion 23 c is provided with a plurality of (for example, five) air ejection portions 28. The air ejection part 28 has an air hole opened in the front end surface of the convex part 23c. In addition, the air ejection portion 28 has an orifice having a narrowed inner diameter. Therefore, the air supplied from a pump (not shown) or the like is ejected from the air ejection portion 28 toward the rail 21 and the guide rail 22 at a high pressure and high speed. Thereby, an air layer is formed between the air ejection part 28 and the rail 21 and the guide rail 22. Further, by providing a plurality of air ejection portions 28 in the convex portion 23c, the pressure of the air layer increases.

In this embodiment, the adjacent convex portions 23c are spaced apart in the x direction and the y direction, but the shape of the convex portions 23c is not limited to this. For example, the convex portion may have a rib shape that is long in the x direction, and a plurality of rib-shaped convex portions may be arranged in the y direction. Among them, in order to set the thickness of the air layer formed between the air ejection part 28 and the rail 21 and the guide rail 22 as shown in FIG. Arrange like.

Returning to the description of FIG. 3. An iron rod-shaped member 26 is provided on the upper surface 11a of the platen 11 so as to extend in the x direction in the longitudinal direction. A magnet 27 is provided on the lower surface 23 b of the plate-like portion 23. The rod-shaped member 26 and the magnet 27 are provided at positions facing each other.

The driving section 25 is a linear motor including a fixed member 25a having a permanent magnet and a movable member 25b having an electromagnetic coil. Each of the fixed member 25a and the movable member 25b is provided two.

The fixture 25 a is a rod-shaped member having a substantially U-shaped cross section, and is provided so that the longitudinal direction is along the x direction. The fixture 25 a is provided at a position that is linearly symmetrical with the guide rail 22 as a center. A pipe 25d through which a cooling liquid (for example, a fluorine-based inert liquid) flows is provided inside the fixture 25a. For example, in the piping 25d on the -z side, the coolant flows from the deep side of the paper surface to the near side, and in the piping 25d on the + z side, the coolant flows from the near side of the paper surface to the deep side.

The movable member 25b is provided on the lower surface 23b of the plate-like portion 23 so that the electromagnetic coil is inserted into the fixed member 25a. The movable member 25b sequentially arranges U-phase, V-phase, and W-phase coils (not shown), and moves along the fixed member 25a. A piping 25c through which the cooling liquid flows is provided inside the movable member 25b so as to pass between the coils.

Returning to the description of FIG. 2. The position measurement unit 29 is, for example, a linear encoder, and measures the positional relationship between the platen 11 and the plate-shaped portion 23, that is, the position in the x direction of the plate-shaped portion 23 relative to the origin position of the position measurement unit 29 (described later in detail). The position measuring section 29 is provided at both ends in the y direction (the end on the + y side and the end on the -y side) of the first moving section 20. The position measurement unit 29 includes a scale 29 a provided on the + y-side end surface of the track 21 a and the −y-side end surface of the track 21 b, and a detection head 29 b provided on the end surface 23 e and the end surface 23 f of the plate-shaped portion 23. In addition, in FIG. 2, the scale 29 a and the detection head 29 b located on the + y side of the first moving section 20 are not shown.

The scale 29a is, for example, a laser hologram scale, and is configured to have a resolution of about 0.1 nm to 1 nm. The detection head 29b irradiates light (for example, laser light), and obtains light reflected by the scale 29a. By forming a hologram on the scale 29a, the position measurement unit 29 can obtain a beautiful sine wave (cosine wave), thereby performing highly accurate interpolation and improving the analysis ability. Since the position measurement unit 29 is well known, detailed description is omitted.

The second moving part 30 mainly includes two rails 31, one guide rail 32, a convex part 33 provided so as to interpose the guide rail 32, a driving part 34 for moving the platform 41 along the upper surface of the rail 21, and position measurement.部 39。 39.

The two rails 31 and the guide rails 32 are elongated plate-shaped members made of ceramic, and are fixed to the upper surface 23 a of the plate-shaped portion 23 along the y-direction. The heights of the two rails 31 and the guide rails 32 are substantially the same. The upper surfaces of the rails 31 and 32 and the side surfaces of the rails 32 are formed with high accuracy and high flatness.

The guide rail 32 is provided substantially at the center in the x-direction of the plate-like portion 23. The two rails 31 are provided at positions symmetrical to each other across the guide rail 32. Of the two rails 31, the rail 31a at the end on the -x side places the area near the end face 41h of the platform 41 as the end on the -x side, and the rail 31b on the end of the + x side on the + x side is placed The area near the end surface 41i of the platform 41 which is the end portion on the + x side.

FIG. 5 is a partially enlarged view of the second moving section 30. On the lower surface 41b of the stage 41, a rod-shaped convex portion 33 is provided so as to extend in the x direction in the longitudinal direction. When the convex portion 33 is provided on the lower surface 41 b, a groove 41 g is formed on the lower surface 41 b of the platform 41. The guide rail 32 is inserted into this groove 41g. Thereby, the movement direction of the stage 41 is restricted so that the position of the stage 41 in the x direction, that is, the plate-shaped portion 23 does not move beyond the y direction.

The convex portion 33 is provided with an air ejection portion 33 a that ejects air toward the side surface of the guide rail 32. The opening of the air ejection portion 33 a is exposed on the side of the convex portion 33. The air ejection part 33a has a throttle opening with a narrowed inner diameter. Therefore, air supplied from a pump (not shown) or the like is ejected from the opening at high pressure and high speed. Thereby, an air layer is formed between the air ejection part 33a and the guide rail 32.

A convex portion 41c is formed on the lower surface 41b of the platform 41 at a position facing the rail 31 and the guide rail 32. The front end of the convex portion 41c (a surface facing the rail 31 or the guide rail 32) is a flat surface. The convex portion 41 c is provided with an air ejection portion 38. The convex portion 41c and the air ejection portion 38 will be described in detail later.

An iron rod-shaped member 36 is provided on the upper surface 23 a of the plate-shaped portion 23 so as to extend in the x direction in the longitudinal direction. A magnet 37 is provided on the lower surface 41 b of the platform 41. The rod-like member 36 and the magnet 37 are provided at positions facing each other.

The driving section 34 is a linear motor including a fixed member 34a having a permanent magnet and a movable member 34b having an electromagnetic coil. Each of the fixed member 34a and the movable member 34b is provided. The fixture 34 a is provided at a position symmetrical to the line with the guide rail 32 as a center. The fixed member 34a has a pipe 34d through which a cooling liquid flows, and the movable member 34b has a pipe 34c through which a cooling liquid flows. The fixed member 34a has the same configuration as the fixed member 25a, and the movable member 34b has the same configuration as the movable member 25b, and thus detailed descriptions thereof are omitted.

Returning to the description of FIG. 2. The position measurement unit 39 is, for example, a linear encoder, and measures the positional relationship between the plate-shaped portion 23 and the stage 41, that is, the position of the stage 41 with respect to the origin position of the position measurement unit 39 (described later in detail) in the y direction. The position measurement unit 39 is provided at both ends in the x direction (the end on the −x side and the end on the + x side) of the second moving portion 30. The position measurement unit 39 includes a scale 39a provided on the −x-side end surface of the plate-shaped portion 23 (or the rail 31a) and a + x-side end surface of the plate-shaped portion 23 (or the rail 31b) and a platform. The detection head 39b of the end surface 41h and the end surface 41i of 41. Note that the scale 39a and the detection head 39b on the + x side are not shown in FIG. 2. The scale 39a is the same as the scale 29a, and the detection head 39b is the same as the detection head 29b, and therefore description thereof is omitted.

平台41為板狀，具有大致水平的上表面41a及下表面41b（參照圖7）。平台41使用熱膨脹係數大致為0.5～1×10^-7 /K的低膨脹性

陶瓷而形成。由此，可防止平台41的變形。另外，平台41亦可使用熱膨脹係數大致為5×10^-8 /K的超低膨脹性玻璃陶瓷而形成。該情況下，即便產生無法完全控制的溫度變化，亦可確實地防止平台41的變形。

The stage 41 is plate-shaped, and has an upper surface 41 a and a lower surface 41 b that are substantially horizontal (see FIG. 7). The stage 41 uses a low thermal expansion coefficient of approximately 0.5 to 1 × 10 ^-7 / K.

Ceramic. Thereby, deformation of the stage 41 can be prevented. In addition, the stage 41 may be formed using an ultra-low-expansion glass ceramic having a thermal expansion coefficient of approximately 5 × 10 ^-8 / K. In this case, even if a temperature change cannot be completely controlled, deformation of the stage 41 can be reliably prevented.

A cover M (not shown) is placed on the upper surface 41a. The end face 41 h is provided with a biasing portion 45 that applies a force in the + x direction to the cover M and a biasing portion 46 that applies a force in the + y direction to the cover M. The urging portion 45 and the urging portion 46 are, for example, a rotary cylinder. The urging portion 45 and the urging portion 46 will be described in detail later.

FIG. 6 is a schematic perspective view of the platform 41 as viewed obliquely from above. FIG. 7 is a schematic perspective view of the platform 41 as viewed obliquely from below.

A plurality of mask lifter holes 41d are formed in the platform 41 and penetrate in the plate pressing direction. A rod-shaped curtain lifter (not shown) is inserted into the curtain lifter hole 41d. A curtain lifter (not shown) is movable in the z direction, and is used when the curtain M is placed on the platform 41.

A plurality of air holes 41e are two-dimensionally arranged on the upper surface 41a of the platform 41. The air holes 41e are provided every 20 mm to 50 mm. Air supplied from a pump (not shown) or the like is ejected upward (toward the + z direction) from the air hole 41e. As a result, the cover M placed on the upper surface 41a of the platform 41 can be temporarily raised.

A rod mirror 41f is provided on the upper surface 41a of the stage 41 on two adjacent sides (here, the + x side and the -y side).

Furthermore, a hole 41j, a hole 41k, and a hole 41l are formed in the upper surface 41a of the platform 41 for inserting the pins 44a, 44b, and 44c. The pins 44a, 44b, and 44c are made of resin (for example, polyether ether ketone (PEEK)) and are rod-shaped members having a diameter of approximately 10 mm. The pins 44a, 44b, and 44c are respectively provided in a frame. The body 42 can be moved in the y direction and the z direction by a pin driving portion 44d (see FIG. 11) and a moving mechanism (not shown).

The pin driving portion 44d moves the pins 44a, 44b, and 44c in the z direction, and the pins 44a, 44b, and 44c are inserted into the holes 41j, 41k, and 41l, and the pins 44a, 44b, The pin 44c is pulled out from the hole 41j, the hole 41k, and the hole 41l, and the pin 44a, the pin 44b, and the pin 44c move between the positions where the pin 44a, the pin 44b, and the pin 44c leave the platform 41. The pin driving part 44d moves the pins 44a, 44b, and 44c in the y direction, and at the positions where the pins 44a, 44b, and 44c are inserted into the holes 41j, the pins 44a, 44b, and 44c are inserted into the holes 41k. In the position, the pins 44a, 44b, and 44c are inserted between the positions of the holes 41l, and the pins 44a, 44b, and 44c move. The pin 44a, the pin 44b, and the pin 44c are movably provided in the y direction and the z direction, and various known techniques can be used.

The holes 41j, 41k, and 41l are used separately according to the size of the mask M. When using a mask M of 800 mm × 520 mm, insert pins 44a, 44b, and 44c into the holes 41j. When using a mask M of 920 mm × 800 mm, insert pins 44a, 41k into the holes 41k. In the case of the pin 44b and the pin 44c, when the cover M of 1400 mm × 1220 mm is used, the pin 44a, the pin 44b, and the pin 44c are inserted into the hole 41l. In this way, the pins 44a, 44b, and 44c are detachably provided at positions where the two adjacent sides of the cover M come into contact.

In addition, the positions of the holes 41j, 41k, and 41l are formed at positions where the center of the platform 41 and the center of the cover M substantially coincide when the two adjacent sides of the corresponding cover M abut.

A plurality of convex portions 41c are formed two-dimensionally on the lower surface 41b of the platform 41. The front end of the convex portion 41c (a surface facing the rail 31 or the guide rail 32) is a flat surface. A plurality of (for example, five) air ejection portions 38 are provided in the convex portion 41c. The air ejection part 38 has an air hole opened in the front end surface of the convex part 41c. In addition, the air ejection portion 38 has a throttle opening with a narrowed inner diameter. Therefore, air supplied from a pump (not shown) or the like is ejected from the air ejection portion 38 toward the rail 31 and the guide rail 32 at a high pressure and high speed. As a result, an air layer is formed between the air ejection portion 38 and the rail 31 and the guide rail 32. Further, by providing a plurality of air ejection portions 38 in the convex portion 41c, the pressure of the air layer increases.

In this embodiment, the adjacent convex portions 41c are spaced apart in the x direction and the y direction, but the shape of the convex portions 41c is not limited to this. For example, the convex portion may have a rib shape that is long in the y direction, and a plurality of rib-shaped convex portions may be arranged in the x direction. Among them, in order to fix the thickness of the air layer formed between the air ejection portion 38 and the rail 31 and the guide rail 32, as shown in FIG. 7, it is desirable that the convex portion 41c be two-dimensional in the x direction and the y direction. Arrange like.

Returning to the description of FIG. 1. The frame body 42 is provided on the upper surface 11 a of the platen 11, and holds the light irradiation section 43 above (+ z direction) the stage 41. The frame 42 includes two pillars 42a and a beam 42b connecting the pillars 42a.

The light irradiation section 43 irradiates the mask M with laser light (in this embodiment, laser light). The light irradiation sections 43 are provided on the beam 42 b at a fixed interval (for example, approximately every 200 mm). In this embodiment, there are seven light irradiating sections 43a, 43b, 43c, 43d, 43e, 43f, 43g. Since the light irradiating section 43a to 43g have the same configuration, the light irradiating section 43a will be described below.

FIG. 8 is a perspective view of a main part showing an outline of the light irradiation section 43a. The light irradiation section 43 a mainly includes a housing 431, a light source 432 provided inside the housing 431, an objective lens 433 provided at a lower end of the housing 431, and an autofocus (AF) processing unit 435. In addition, the light irradiation section 43 a includes a temperature adjustment section (not shown) that maintains the temperature inside the housing 431 to be constant.

The light source 432 is a light source capable of emitting planar laser light, and the pixels are arranged two-dimensionally. As the light source 432, for example, a digital mirror device (Digital Mirror Device, DMD) can be used. The objective lens 433 images the laser light emitted from the light source 432 on the surface of the mask M.

At the time of drawing, light is irradiated from each of the light sources 432 of the light irradiating section 43a to 43g, and this light forms an image on the mask M, thereby drawing a pattern on the mask M.

The AF processing unit 435 focuses the light irradiated onto the mask M, and mainly includes a lens barrel lens group 435a, a beam splitter 435b, and two sensors 435c and 435d. As shown by the two-dot chain line in FIG. 8, the laser light irradiated from the light source 432 to the cover M is reflected by the cover M (not shown), and enters the beam splitter 435 b through the objective lens 433 and the lens barrel lens group 435 a. . The reflected light is divided into two lights with different optical path lengths in the beam splitter 435b, and the two lights are received by different sensors 435c and 435d, respectively. The AF processing unit 435 performs an autofocus process that obtains an in-focus position based on the results received by the sensors 435c and 435d. In addition, since autofocus processing is well known, description is omitted.

The frame body 431 is provided on the beam 42 b via the connection portion 434. The surface 434a is fixed to the frame 431, and the surface 434b is fixed to the beam 42b. The connection portion 434 has a link mechanism capable of moving in the z direction while the two parallel surfaces 434a and 434b are kept parallel by forming a hole 434c in the inside.

The connecting portion 434 is provided with a piezoelectric element 434d that moves the surface 434a in the z direction, and a linear encoder 434e that measures the amount of movement of the surface 434a.

Returning to the description of FIG. 1. A pattern reading section 47 that measures the position of the pattern drawn on the mask M is provided adjacent to the light irradiation section 43. The pattern reading section 47 includes seven pattern reading sections 47a, pattern reading sections 47b, pattern reading sections 47c, pattern reading sections 47d, pattern reading sections 47e, pattern reading sections 47f, and pattern reading sections 47g. The pattern reading portions 47a to 47g are provided adjacent to the light irradiation portions 43a to 43g, respectively. Since the pattern reading section 47a to 47g have the same configuration, the pattern reading section 47a will be described below.

FIG. 9 is a perspective view showing an outline of the pattern reading section 47a, and is a view showing a main part thereof. The pattern reading section 47 a mainly includes a microscope and an ultraviolet (UV) camera 476 that images a pattern obtained by the microscope. The microscope includes a pattern P for obtaining a pattern P formed on the mask M (not shown in FIG. 9). An objective lens 471 (light), a light source unit 472 that irradiates the objective lens 471 with light (here, UV light), a lens barrel 473 formed of a low thermal conductor such as titanium or zirconia, and a lens barrel provided inside the lens barrel 473 A lens 474 and a reflecting mirror 475 that transmits light from the light source unit 472 and reflects light guided from the objective lens 471.

Near-ultraviolet rays (for example, light having a wavelength of approximately 375 nm) are radiated from the light source unit 472. The light source unit 472 includes a distant light source 472a, an optical fiber 472b for guiding light from the light source, a diffusion plate 472c provided near an end face of the optical fiber, and a collimator lens 472d provided adjacent to the diffusion plate 472c. .

The light source 472a is, for example, a UV laser or a Superluminescent Light Emitting Diode (sLED), and irradiates laser light in an ultraviolet region. Since the light source 472 a generates heat, the light source 472 a is provided at a position spaced from the light irradiation section 43. The light emitted from the light source 472a is guided using an optical fiber 472b. The diffuser plate 472c guides light by the optical fiber 472b, expands point-light-like light emitted from an end surface of the optical fiber 472b, and collimates the light into parallel light. Therefore, light from the light source unit 472 is radiated as a surface light source.

The light radiated from the light source unit 472 is reflected by the pattern P and guided to the objective lens "471. The objective lens 471 has a high magnification of approximately 100 times, the number of apertures (NA) is approximately 0.95, and the focal distance is approximately 2 mm. The objective lens 471 is ideally provided adjacent to the objective lens 433 because the pattern P formed by the light irradiating section 43 is read. The lens barrel lens 474 is formed by imaging the light from the objective lens 471 corrected at infinity. Lens with a focal distance of approximately 200 mm.

The resolution of the UV camera 476 is about a super extended graphics array (SXGA) (1280 × 1024 pixels), the size is about 1/4 inch, and the power consumption is about 0.1 W. The UV camera 476 can perform ultra-low-speed scanning by the control unit 151 a (see FIG. 12), and therefore can accurately read the fine pattern drawn on the mask M. In addition, it can be shut down automatically when not in use.

Returning to the description of FIG. 1. On the side of the -x side of the stage 41, a light reading unit 48 for measuring the position of the light (air image) i irradiated from the light irradiation unit 43 is provided. The optical reading section 48 includes seven optical reading sections 48a, 48b, 48c, 48d, 48e, 48f, 48g, and 48g. Since the light reading section 48a to 48g have the same configuration, the pattern reading section 47a will be described below.

FIG. 10 is a perspective view showing an outline of the optical reading section 48a, and is a view showing a main part thereof. The light reading section 48a mainly includes a microscope and a UV camera 485 for imaging a pattern obtained by the microscope. The microscope includes an objective lens 481 that acquires light from an aerial image i, and a reflective mirror 482 that reflects light guided by the objective lens 481. A lens barrel 483 formed of a low thermal conductor, and a barrel lens 484 provided inside the lens barrel 473. The objective lens 481, the reflecting mirror 482, the lens barrel 483, the lens barrel lens 484, and the UV camera 485 have the same configurations as the objective lens 471, the reflecting mirror 485, the lens barrel 473, the lens barrel lens 474, and the UV camera 476, respectively.

The stage 41 is moved, and the light irradiated from the light irradiation section 43 is incident on the light reading section 48. The aerial image i irradiated from the objective lens 433 of the light irradiating section 43 is enlarged by the objective lens 481 and then projected onto the UV camera 485, and its position is read. Since the image position of the aerial image i is easy to read, it is desirable to include one or more lines in the x direction and lines in the y direction. FIG. 10 illustrates a cross pattern each including a line in the x direction and a line in the y direction.

Returning to the description of FIG. 1. A laser interferometer 51 is provided on the post 42a provided on the -y side. A laser interferometer 52 (not shown in FIG. 1) is provided on the side of the + x side of the platen 11.

FIG. 11 is a schematic diagram showing a measurement performed by the laser interferometer 51, the laser interferometer 52, and the laser interferometer 53. In FIG. 9, the path of the laser light is indicated by a two-dot chain line. In FIG. 9, the positions of the light irradiating section 43 a to 43 g are indicated by broken lines.

The laser interferometer 51, the laser interferometer 52, and the laser interferometer 53 irradiate four laser beams. Two of the four laser beams are reflected by the rod mirror 41f, and the reflected light is received by the laser interferometer 51 and the laser interferometer 52.

A reflecting mirror 436 is provided on the side of the -y side of the light irradiation section 43a. The remaining two of the light irradiated from the laser interferometer 51 are reflected by the mirror 436, and the reflected light is received by the laser interferometer 51.

A reflecting mirror 437 is provided on the + x side surface of the light irradiating section 43a to 43g. The remaining two of the light irradiated from the laser interferometer 52 are reflected by the mirror 437, and the reflected light is received by the laser interferometer 52 and the laser interferometer 53.

The laser interferometer 52 and the laser interferometer 53 can move along the rail 11b by the drive unit 11c. The rail 11b is provided on the platen 11 so that the longitudinal direction thereof follows the y-direction. In this way, the laser interferometer 52 and the laser interferometer 53 can move in the y direction.

The laser interferometer 52 on the -y side is set at the position where the light irradiating portion 43a is irradiated during drawing, and at the time of calibration (during calibration), the position where the light irradiating portion 43a is irradiated and the light irradiating portion 43b The position of the light, the position of the light irradiated to the light irradiating portion 43c, are sequentially moved. The laser interferometer 53 on the + y side is always provided at a position where the light irradiating portion 43g irradiates light.

The reflecting mirror 436 and the reflecting mirror 437 are substantially parallel to the rod mirror 41f. Therefore, the laser interferometer 51 uses the reflecting mirror 436 as a reference position, and measures the position of the rod mirror 41f along the x direction of the rod mirror 411. The laser interferometer 52 and the laser interferometer 53 use the reflecting mirror 437 as a reference. The position is the position of the rod mirror 412 along the y direction among the rod mirrors 41f. In other words, the laser interferometer 51 measures the y-direction position of the stage 41 with respect to the light irradiating section 43 in the positional relationship between the light irradiating section 43 and the stage 41 (the position measuring section 29 and the position measuring section 39). The laser interferometer 52 and the laser interferometer 53 measure the position of the stage 41 with respect to the light irradiation unit 43 in the positional relationship between the light irradiation unit 43 and the stage 41 (the position measurement unit 29 and the position measurement unit 39).

The position of the rod mirror 41f measured by the laser interferometer 51, the laser interferometer 52, and the laser interferometer 53 in this way does not include errors caused by pitching or yawing of the plate-like portion 23 or the platform 41. Neither does it include errors caused by the air layer existing in the first moving section 20 or the second moving section 30. Therefore, in the present embodiment, the laser interferometer 51, the laser interferometer 52, and the laser interferometer 53 are used to correct the position measurement unit 29 and the position measurement unit 39 that perform measurements including these errors, thereby improving the platform. 41 mobility. The calibration of the position measurement unit 29 and the position measurement unit 39 will be described in detail later.

The laser interferometer 51, the laser interferometer 52, and the laser interferometer 53 superimpose the light reflected by the reflecting mirror 436 or the reflecting mirror 437 and the light reflected by the rod mirror 41f, and observe the interference of the waves to measure the position. Therefore, the wavelength of laser light changes due to air pressure, air temperature, humidity, etc. Even if the same position is measured, the measurement result may change. Therefore, it is also possible to accurately measure the temperature, air pressure, humidity, etc. and keep them fixed, or to measure a filter, for example, about 5 inches (125 mm) (for example, using multiple interferences of two opposing reflective surfaces) Etalon) to monitor the wavelength of laser light. The etalon is preferably formed using a low-expansion ceramic or an ultra-low-expansion glass ceramic similarly to the stage 41.

In addition, when a laser interferometer light source capable of irradiating 8 or more laser beams (for example, 12 channels) is used as the laser interferometer 52, the laser interferometer 52 may not have a mechanism for moving in the y direction. . The laser interferometer 53 on the + y side may not have a mechanism for moving in the y direction.

FIG. 12 is a block diagram showing the electrical configuration of the mask manufacturing apparatus 1. The mask manufacturing device 1 includes a central processing unit (CPU) 151, a random access memory (RAM) 152, a read only memory (ROM) 153, and an input / output interface ( I / F) 154, communication interface (I / F) 155, media interface (I / F) 156, and these are connected to the driving section 25, the driving section 34, the position measuring section 29, the position measuring section 39, the light irradiation section 43, The urging portion 45, the urging portion 46, the pattern reading portion 47, the optical reading portion 48, the laser interferometer 51, the laser interferometer 52, the laser interferometer 53, and the like are connected to each other.

The CPU 151 operates based on the programs stored in the RAM 152 and the ROM 153 and controls each unit. In the CPU 151, signals are input from the position measurement unit 29, the position measurement unit 39, the laser interferometer 51, the laser interferometer 52, and the like. The signals output from the CPU 151 are output to the driving section 25, the driving section 34, and the light irradiation section 43.

The RAM 152 is a volatile memory. The ROM 153 is a non-volatile memory that stores various control programs and the like. The CPU 151 operates based on the programs stored in the RAM 152 and the ROM 153 and controls each unit. The ROM 153 stores a startup program executed by the CPU 151 at the time of startup of the mask manufacturing apparatus 1, a program dependent on the hardware of the mask manufacturing apparatus 1, and the like. The ROM 153 stores information related to the position and shape of the pattern drawn on the mask M, that is, drawing information or correction substrate drawing information including information such as the position and shape of the correction substrate pattern. In this embodiment, since the planar laser light is irradiated from the light source 432, the drawing information includes position information obtained by correlating the position of the light source 432 with the presence or absence of light irradiation (pattern) in each pixel of the light source 432, and The irradiation timing information obtained by correlating the position of the light source 432 with the irradiation timing of light in each pixel of the light source 432. The RAM 152 stores programs executed by the CPU 151 and data used by the CPU 151.

The CPU 151 controls an input / output device 141 such as a keyboard or a mouse via the input / output interface 154. The communication interface 155 receives data from other devices via the network 142 and sends them to the CPU 151, and sends data generated by the CPU 151 to other devices via the network 142.

The media interface 156 reads programs or data stored in the storage medium 143 and stores the programs or data in the RAM 152. In addition, the storage medium 143 is, for example, an integrated circuit (IC) card, a secure digital (SD) card, a digital video disk (DVD), or the like.

In addition, a program that realizes each function is read from, for example, the memory medium 143, is installed in the mask manufacturing apparatus 1 via the RAM 152, and is executed by the CPU 151.

The CPU 151 has a function of a control section 151 a that controls each section of the screen manufacturing apparatus 1 based on an input signal. The control unit 151a is constructed by executing a predetermined program read by the CPU 151. The processing performed by the control unit 151a will be described in detail later.

The configuration of the mask manufacturing apparatus 1 shown in FIG. 12 is a description of the main configuration when describing the features of this embodiment, and does not exclude, for example, a configuration included in a general information processing apparatus. The constituent elements of the mask manufacturing apparatus 1 can be classified into more constituent elements according to the processing content, and one constituent element can also perform processing of a plurality of constituent elements.

The operation of the mask manufacturing apparatus 1 configured as described above will be described. The following processes are mainly performed by the control unit 151a.

First, the laser interferometer 51, the laser interferometer 52, and the laser interferometer 53 are used to perform the correction processing of the correction position measurement unit 29 and the position measurement unit 39.

As already described, although the measured values of the laser interferometer 51, the laser interferometer 52, and the laser interferometer 53 are accurate, they may oscillate due to the down flow of the clean air in the mask manufacturing apparatus 1 . In addition, the laser interferometer 51, the laser interferometer 52, and the laser interferometer 53 can only measure the relative positions (the origin cannot be known).

Although the measurement results of the position measurement unit 29 and the position measurement unit 39 are not affected by the downflow of the clean air, they include errors caused by the pitch or swing of the plate-like portion 23 or the platform 41, and also include the existence of the first movement An error or the like caused by the air layer of the unit 20 or the second moving unit 30. Since the ruler 29a and the ruler 39a are formed of glass, the position measurement unit 29 and the position measurement unit 39 can accurately capture changes in the distance in nm, but may cause errors in measurement of long distances such as stretching and partial strain. .

However, the origin measurement signal (signal indicating the origin position) is usually attached to the position measurement unit 29 and the position measurement unit 39, and the reference point can be read with an accuracy equivalent to the analysis capability of the position measurement unit 29 and the position measurement unit 39. With this function, even if processing is stopped during drawing processing due to, for example, a data error, and it is necessary to return to the origin position of the platform 41, there is a possibility that the remaining drawing can be continued with good reproducibility.

Therefore, in order that the measurement results of the position measuring section 29 and the position measuring section 39 do not include errors, the measured values of the laser interferometer 51, the laser interferometer 52, and the laser interferometer 53 and the position measuring section 29 and position are investigated in advance. The relationship between the measurement values of the measurement unit 39 is subjected to the correction processing by the correction position measurement unit 29 and the position measurement unit 39, and then the drawing processing is performed using the position measurement unit 29 and the position measurement unit 39.

In the calibration process, the control unit 151a calculates a look-up table (LUT) for each of the light irradiation units 43a to 43g. The LUT is an error table between the measurement values of the laser interferometer 51, the laser interferometer 52, and the laser interferometer 53 and the measurement values of the position measurement unit 29 and the position measurement unit 39. As shown in FIG. 21, the LUT includes LUT181a to LUT188a.

As shown in FIG. 21, LUT181a (LUT1) is a value used for correction of the x-direction of the drawing information drawn by the light irradiation section 43a, and LUT182a (LUT2) is used for correction of the x-direction of the drawing information drawn by the light irradiation section 43b Value, LUT183a (LUT3) is a value used for correction of the x-direction of the drawing information drawn by the light irradiation section 43c, LUT184a (LUT4) is a value used for correction of the x-direction of the drawing information drawn by the light irradiation section 43d, LUT185a ( (LUT5) is a value used for the correction of the x-direction of the drawing information drawn by the light irradiation section 43e, LUT186a (LUT6) is a value used for the correction of the x-direction of the drawing information drawn by the light irradiation section 43f, and LUT187a (LUT6) is light The value used for the correction of the x direction of the drawing information drawn by the irradiation unit 43 g. The LUT 188a is a value used for correction in the y direction of the drawing information drawn by the light irradiating sections 43a to 43g.

First, calculation of LUT181a and LUT187a will be described. The control unit 151a obtains the measurement value of the position measurement unit 29 on the + y side and the measurement value of the position measurement unit 29 on the -y side while moving the plate-like portion 23 in the x direction. Then, the control unit 151a calculates a measurement value (a measurement value of the position of the light irradiation unit 43a or the light irradiation unit 43g) when the position measurement unit 29 is located at the position in the y direction of the light irradiation unit 43a or the light irradiation unit 43g.

It is assumed that the measurement value when the position measurement section 29 is located at the position in the y direction of the light irradiation section 43a or 43g is the measurement value of the position measurement section 29 on the + y side and the measurement of the position measurement section 29 on the -y side. The weighted average of the values. The weighted average is based on the distance between the measurement value of the position measurement section 29 on the + y side and the light irradiation section 43a or 43g, and the position measurement section 29 and the light irradiation section 43a or 43g on the -y side. The distance is weighted and averaged. For example, if the distance between the position measurement unit 29 on the + y side and the light irradiation unit 43a is a, and the distance between the position measurement unit 29 on the -y side and the light irradiation unit 43a is b, the control unit 151a The value obtained by multiplying the measurement value of the position measurement unit 29 on the + y side by a / (a + b) and the value obtained by multiplying the measurement value of the position measurement unit 29 on the -y side by b / (a + b). The values are added to calculate a measurement value when the position measurement unit 29 is assumed to be located in the y-direction position of the light irradiation unit 43a. The position of the light irradiating section 43a (the same applies to 43b to 43g) can be calculated from the design value (stored in the ROM 153) and the like when the mask manufacturing apparatus 1 is manufactured.

The control unit 151a performs measurement using the position measuring unit 29, and uses a laser interferometer 52 to measure a change in the position in the x-axis direction when the position in the y direction is the position of the light irradiating portion 43a, and uses the laser interferometer 53 to measure The change in the position in the x-axis direction when the position in the y direction is the position of the light irradiating portion 43g.

FIG. 13 shows measured values when the plate-shaped portion 23 is moved in the x direction, assuming that the position measuring portion 29 is located at the positions in the y direction of the light irradiating portion 43a and 43g, and the laser interferometer 52 and laser An example in which the measurement results of the interferometer 53 are compared. In FIG. 13, the measurement value when the position measurement section 29 is assumed to be at the position in the y direction of the light irradiation section 43 a is set to S1, and the measurement value when the position measurement section 29 is assumed to be at the position in the y direction of the light irradiation section 43 g is S2. . The measurement result of the laser interferometer 52 is set to S52, and the measurement result of the laser interferometer 53 is set to S53.

FIG. 13 shows that the measured value S1 and the measured value S2 move more than the measured value S52 and the measured value S53, that is, the pitching of the x-axis downward protrusion is caused. The measured values S1 and S2 include errors caused by pitching ( The amount of displacement in the pitch direction is the amount of pitch displacement). The control unit 151a compares the measured value S1 with the measured value S52 to create a LUT 181a, and compares the measured value S2 with the measured value S53 to create a LUT187a.

的差分按照x軸的位置的順序排列所得的數列ai（i為x軸的位置，例如可取以數nm為單位的

值）。而且，控制部151a將i為0～x_o （i＝0～x_o ）時的數列ai的部分和作為x軸的位置為x_o 時的修正值而算出。FIG. 14 is a graph showing a correction value (LUT181a) in the x direction when the measurement results shown in FIG. 13 are obtained. For example, the control unit 151a obtains the measured value S1 and the measured value S52.

The difference in the order of the position of the x-axis is arranged in the sequence ai (i is the position of the x-axis, for example, it can be taken in the unit of several nm

value). Further, the control unit 151a the number i is 0 (i = 0 ~ x _o) x _O columns when ai portion and the correction value as the x axis _O of x is calculated.

In addition, in FIG. 13, it can be seen that when the plate-shaped portion 23 moves in the + x direction, it initially rotates slightly to the right (clockwise in the xy plane), then rotates to the left (counterclockwise in the xy plane), and finally turns to approximately Straight (moves along the x axis). From this, the amount of displacement in the yaw direction, that is, the amount of yaw displacement, can be calculated. This deflection shift amount is corrected by a correction data generation process using a correction substrate described in detail later.

The control unit 151a obtains the measurement value of the position measurement unit 29 on the + y side and the measurement value of the position measurement unit 29 on the -y side while moving the plate-like portion 23 in the x direction, and performs laser interference. The meter 52 measures a change in the position in the x-axis direction when the position in the y-direction is the position of the light irradiation section 43b. Further, the control unit 151a calculates the measurement value when the position measurement unit 29 is located at the position in the y direction of the light irradiation unit 43b in the same manner as in the case of the light irradiation unit 43a, and compares it with the measurement value of the laser interferometer 52 to calculate LUT182a . The control unit 151a calculates LUT183a to LUT186a with the same method with respect to the light irradiating portions 43c to 43f.

The control unit 151 a calculates the correction value (LUT 188 a) of the position measurement unit 39 by the same method as the position measurement unit 29. The control unit 151a acquires the measurement value of the position measurement unit 39 on the + x side and the measurement value of the position measurement unit 39 on the -x side while moving the stage 41 in the y direction. At the same time, the laser interferometer 51 measures the change in the position in the y-axis direction when the position in the x-direction is the position of the light irradiation section 43a. Further, the control unit 151a calculates the measurement value when the position measurement unit 39 is located at the position in the x direction of the light irradiation unit 43a as in the case of LUT181a to LUT187a, and compares it with the measurement value of the laser interferometer 51 to calculate LUT188a.

The control unit 151a adds the correction values (LUT181a to LUT188a) thus calculated to the measurement values of the position measurement unit 29 and the position measurement unit 39, thereby correcting the position measurement unit 29 and the position measurement unit 39. The control unit 151 a uses the measured values of the position measurement unit 29 and the position measurement unit 39 after the correction in subsequent processing.

Subsequent to the correction processing, a production of a correction substrate for correcting a light irradiation position or a light irradiation timing from the light irradiation unit 43 and a correction data generation process using the correction substrate are performed.

First, a process for producing a correction substrate will be described. First, a mounting process for placing a mask M for preparing a correction substrate on the stage 41 is performed. The mounting process will be specifically described below.

The control unit 151a places the curtain M on the curtain lifter in a state where the curtain lifter protrudes from the curtain lifter hole 41d in the + z direction. When the curtain M is placed on the curtain lifter, the control unit 151a ejects air from the air hole 41e and moves the curtain lifter in the -z direction. As a result, the mask M moves in the -z direction.

A plurality of air holes 41e are formed in the upper surface 41a, and air is ejected from all the air holes 41e at the same pressure. Therefore, if the hood lifter is lowered inside the hood lifter hole 41d, the hood M is pushed up evenly by air, and the hood M is placed through the air layer formed between the hood M and the upper surface 41a. On the upper surface 41a. In this state, the control unit 151 a drives the urging unit 45 and the urging unit 46 to apply a horizontal force to the mask M to perform positioning in the x direction and the y direction of the mask M.

FIG. 15 is a diagram illustrating a case where the urging portion 45 and the urging portion 46 press the cover M to perform positioning.

The control unit 151a drives the pin driving unit 44d, moves the pin 44a, the pin 44b, and the pin 44c in the -z direction, and inserts the pin 44a, the pin 44b, and the pin 44c into any of the holes 41j, 41k, and 41l. In FIG. 15, a pin 44a, a pin 44b, and a pin 44c are inserted into the hole 41l.

The urging portion 45 includes an arm 45a, and a roller 45b is provided at the tip of the arm 45a. When the control unit 151a rotates the arm 45a clockwise around the axis 45ax (refer to the arrow in FIG. 15), the roller 45b abuts on the end face on the -x side of the cover M, and applies a force in the + x direction to the cover M ( (Refer to the hollow arrow in Figure 15). Since an air layer is formed between the mask M and the upper surface 41a, the mask M moves in the + x direction. As a result, the mask M comes into contact with the pins 44b and 44c. Thereby, the mask M is positioned in the x direction. The urging portion 45 is preferably provided at a position substantially at the center in the y-direction of the roller 45b pressing the cover M. In addition, in order to make the distance between the arm 45a and the upper surface 41a constant, a roller (not shown) that contacts the upper surface 41a may be provided on the lower surface of the arm 45a.

Like the urging portion 45, the urging portion 46 includes an arm 46a, and a roller 46b is provided at the tip of the arm 46a. When the control unit 151a rotates the arm 46a counterclockwise around the shaft 46ax (see the arrow in FIG. 15), the roller 46b abuts on the end face on the -y side of the cover M, and applies a force in the + y direction to the cover M ( (Refer to the hollow arrow in Figure 15). Since an air layer is formed between the cover M and the upper surface 41a, the cover M is moved in the + y direction. As a result, the cover M is in contact with the pin 44a. Thereby, the mask M is positioned in the y direction. The urging portion 46 is preferably provided at a position near the angle of the −x direction and the −y direction in which the roller 46 b presses the cover M. In addition, in order to make the distance between the arm 46a and the upper surface 41a constant, a roller (not shown) that abuts the upper surface 41a may be provided on the lower surface of the arm 46a.

When the pins 44a, 44b, and 44c are in contact with the mask M and positioned in the horizontal direction of the mask M, the control unit 151a controls the platform 41 to stop ejecting air from the air hole 41e. As a result, the mask M is placed on the upper surface 41a while being positioned in the x-direction and the y-direction. The control unit 151a may determine that the pins 44a, 44b, and 44c are in contact with the cover M based on the detection results of sensors (not shown) provided on the pins 44a, 44b, and 44c.

Then, the control unit 151a controls the pin driving unit 44d to move the pins 44a, 44b, and 44c in the + z direction, and pulls the pins 44a, 44b, and 44c from any of the holes 41j, 41k, and 41l. Then, the pins 44a, 44b, and 44c are separated from the platform 41. Thereby, positioning of the mask M can be performed with high accuracy.

Since the mask M is placed on the upper surface 41a, the mask M is fixed to the upper surface 41a by friction between the upper surface 41a and the lower surface of the mask M. Therefore, after the cover M is placed on the upper surface 41a, even if, for example, the pins 44a, 44b, and 44c move in the + z direction, as long as the platform 41 is not deformed, the cover M will not be deformed or moved. In addition, since the pins 44a, 44b, and 44c are pulled out from the holes 41j, 41k, and 41l, the mask M can be prevented from abutting on the pins 44a, 44b, and 44c, and the mask M can be prevented from the pins 44a, The pins 44b and 44c receive a force, and the mask M is strained by the force.

When the mask M is placed on the stage 41, the control unit 151a draws a correction substrate pattern on the mask M to generate a correction substrate. The control unit 151a obtains the correction substrate drawing information, which is information related to the correction substrate pattern, from the ROM 153, and performs drawing processing based on the correction substrate drawing information. The process of irradiating light to the mask M can be performed using a well-known technique.

FIG. 16 is a diagram showing an example of the drawing information of the correction substrate. In FIG. 16, the position of the mask M is schematically shown by a dotted line. The correction substrate pattern is a pattern including a plurality of crosses arranged in a two-dimensional shape, and in this embodiment is a grid-shaped pattern. The control unit 151a controls the driving unit 25 and the driving unit 34 to move the stage 41 in the x-direction and the y-direction, and draws a correction substrate pattern facing the mask M to generate a correction substrate M1. The control unit 151 a moves the stage 41 in the x direction to perform one-line drawing, and then moves the stage 41 in the y direction to perform drawing processing of the correction substrate. The process of moving the platform 41 will be described in detail later.

FIG. 17 shows a correction substrate M1 generated based on the correction substrate drawing information shown in FIG. 16. In FIG. 17, the pattern of the area A1 is drawn by the light irradiation portion 43a, the pattern of the area A2 is drawn by the light irradiation portion 43b, the pattern of the area A3 is drawn by the light irradiation portion 43c, and the pattern of the area A4 is drawn by the light irradiation portion 43d In the drawing, the pattern in the area A5 is drawn by the light irradiation portion 43e, the pattern in the area A6 is drawn by the light irradiation portion 43f, and the pattern in the area A7 is drawn by the light irradiation portion 43g. In FIG. 17, due to various errors, the drawing pattern in the x direction is a curve formed by protruding y1 to the right side (−y direction) in FIG. 16.

Next, the control unit 151a generates correction data for correcting the setting error of the light irradiation unit 43 and the like using the correction substrate M1. Hereinafter, a method of generating correction data will be described in detail.

The control unit 151a corrects each of the initial state (0 degrees) when the correction substrate M1 is generated and the state where the correction substrate M1 is rotated from the initial state by approximately 90 degrees, approximately 180 degrees, and approximately 270 degrees. The substrate M1 is placed on the upper surface 41 a of the stage 41, and in each case, the correction substrate M1 is read using the pattern reading unit 47.

In the initial state, the pattern of area A1 is read by pattern reading section 47a, the pattern of area A2 is read by pattern reading section 47b, the pattern of area A3 is read by pattern reading section 47c, and the pattern of area A4 is read by pattern The fetching section 47d reads the pattern of the area A5 by the pattern reading section 47e, the pattern of the area A6 is read by the pattern reading section 47f, and the pattern of the area A7 is read by the pattern reading section 47g. Therefore, the result of reading the correction substrate M1 using the pattern reading unit 47 is consistent with the correction substrate drawing information shown in FIG. 15.

FIG. 18 shows a result of reading the correction substrate M1 using the pattern reading unit 47 in a state where the correction substrate M1 is rotated approximately 180 degrees from the initial state. In this case, the pattern of the area A1 is read by the pattern reading section 47g, the pattern of the area A2 is read by the pattern reading section 47f, the pattern of the area A3 is read by the pattern reading section 47e, and the pattern of the area A4 is read by the pattern The fetching section 47d reads the pattern of the area A5 by the pattern reading section 47c, the pattern of the area A6 is read by the pattern reading section 47b, and the pattern of the area A7 is read by the pattern reading section 47a. Therefore, as a result of reading the correction substrate M1 rotated by approximately 180 degrees from the initial state by the pattern reading unit 47 (see the solid line in FIG. 18), the drawing pattern in the x direction becomes the left side (+ y direction in FIG. 17). ) Protrude the curve obtained by y2. y2 is twice the size of y1. In addition, in FIG. 18, the dotted line shows the drawing information of the correction substrate.

The control unit 151a compares the reading result in the initial state (drawing information of the correction substrate, refer to the dotted line in FIG. 18) and the reading result in the state where the correction substrate M1 is rotated approximately 180 degrees from the initial state (refer to the actual state of FIG. 18). The middle of the line) (see the two-dot chain line in FIG. 18) is used as the correction value of the light irradiation unit 43.

In the case shown in FIG. 18, the correction value is a curve in which the drawing pattern in the x direction is convex to y1 in the + y direction. When the correction substrate M1 '(not shown) is drawn using information obtained by adding the correction value to the correction substrate drawing information, the pattern of the correction substrate M1' is a straight line, and the pattern reading unit 47 in the initial state The reading result of 一致 is consistent with the reading result of the pattern reading section 47 in a state where the correction substrate M1 ′ is rotated approximately 180 degrees from the initial state.

Similarly, the control unit 151a reads the reading result of the pattern reading unit 47 in a state where the correction substrate is rotated approximately 90 degrees from the initial state, and the pattern reading in a state where the correction substrate is rotated approximately 270 degrees from the initial state. The middle of the reading result of the fetching unit 47 is calculated as a correction value.

In this way, the control unit 151a obtains each state of the initial state (0 degrees) when the correction substrate M1 is generated, and the state where the correction substrate M1 is rotated from the initial state by approximately 90 degrees, approximately 180 degrees, and approximately 270 degrees. When reading the position of the correction substrate pattern when the correction substrate M1 is read, the correction value as the correction data of the light irradiating section 43 is used. The correction value makes the reading result in the initial state and rotates the correction substrate M1 by approximately 180. The reading result in the state of 1 degree is consistent, and the reading result in the state of rotating the correction substrate M1 by approximately 90 degrees is consistent with the reading result in the state of rotating the correction substrate M1 by approximately 270 degrees. Note that the cases where the read values match are only the cases where the pattern drawn on the correction substrate M1 and the pattern shown on the correction substrate drawing information completely match.

Thereby, self-calibration can be performed by the light irradiation section 43 alone, and the pattern drawn on the mask M can be completely matched with the pattern shown in the drawing information. Further, by using a correction substrate pattern including positions of a plurality of crosses, correction values can be obtained in the x direction and the y direction, respectively. In addition, in the present embodiment, the control unit 151a performs the preparation of the correction substrate and the correction data generation processing using the correction substrate once, and may also generate the correction substrate and the correction data using the correction substrate. Each process was performed multiple times. Further, in the present embodiment, the control unit 151a uses the correction values of the light irradiation unit 43 as correction data, which correct the reading result in the initial state and the reading in a state where the correction substrate M1 is rotated approximately 180 degrees. The results are consistent, and the reading result in a state where the correction substrate M1 is rotated approximately 90 degrees is consistent with the reading result in a state where the correction substrate M1 is rotated approximately 270 degrees. The reading in the initial state may also be made. As the correction data, a value that matches the reading result in a state where the correction substrate M1 is rotated approximately 180 degrees.

Next, the drawing processing will be described. First, a mounting process of placing the mask M on the platform 41 is performed. Since this mounting process is the same as that in the case where the correction substrate M1 is generated, the description is omitted.

When the mask M is placed on the platform 41, the control unit 151a places the mask M in this state until a predetermined time (for example, several hours) elapses. Then, the control unit 151a controls the AF processing unit 435 to obtain distance information obtained by associating the position of the mask M with the distance between the light irradiation unit 43 and the mask M, and generates correction information (xy correction table) based on the distance information (for The drawing position correction processing will be described in detail later).

FIG. 19 is a schematic diagram showing a state of the mask M when dust D is attached between the mask M and the upper surface 41 a of the platform 41. If the mask M is bent due to the dust D, a position where the laser beam is to be irradiated when the laser beam in the vertical direction is irradiated from the light irradiating portion 43a to 43g on the premise that the photosensitive substrate does not flex. An error occurs between the position where the laser beam is actually irradiated when the cover M is flexed.

For example, since the center line of the mask M (refer to the one-dot chain line in FIG. 19) protrudes upward (+ z side), the surface of the mask M extends. Therefore, it is necessary to increase the amount of movement in the y direction during the drawing process. . On the other hand, since the surface of the mask M is contracted in the part where the center line of the mask M protrudes downward (-z side), it is necessary to reduce the amount of movement in the y direction during the drawing process.

Furthermore, when the thickness of the mask M is not uniform, an error may also occur between the position where the laser beam is to be irradiated from the self-light irradiating portion 43a to 43g and the position where the laser beam is actually irradiated. Therefore, the control unit 151 a obtains the thickness distribution (Total Thickness Variation (TTV)) of the mask M as the distance information.

In this way, based on the obtained distance information, the control unit 151a creates an xy correction table that correlates the position of the mask M and the positional displacement in the horizontal direction of the mask M to correct the drawing information.

The control unit 151a uses the light reading unit 48a to 48g to obtain the positional relationship between the light irradiation unit 43a to 43g. First, the control unit 151a moves the stage 41 so that the positions of the xy planes of the light irradiation units 43a to 43g coincide with the positions of the xy planes of the light reading units 48a to 48g. Further, the control unit 151a irradiates light from the light irradiation unit 43a to the light irradiation unit 43g, reads the aerial image i irradiated from the light irradiation unit 43a with the light reading unit 48a, and reads the light irradiation unit 43b with the light reading unit 48b. The irradiated aerial image i reads the aerial image i irradiated from the light irradiation unit 43c by the light reading unit 48c, and the optical reading unit 48d reads the aerial image i irradiated from the light irradiation unit 43d, and the light reading unit 48e The aerial image i irradiated from the light irradiation section 43e is read, the aerial image i irradiated from the light irradiation section 43f is read by the light reading section 48f, and the aerial image i irradiated from the light irradiation section 43g is read by the light reading section 48g . The control unit 151a converts the results read by the optical reading unit 48a to the optical reading unit 48g into positions of the x coordinate and the y coordinate, respectively.

Next, the control unit 151a moves the stage 41 in the -y direction, reads the aerial image i irradiated from the light irradiation unit 43b by the light reading unit 48a, and reads the aerial image irradiated from the light irradiation unit 43c by the light reading unit 48b. i, the aerial image i irradiated from the light irradiation unit 43d is read by the light reading unit 48c, the aerial image i irradiated from the light irradiation unit 43e is read by the light reading unit 48d, and the self light is read by the light reading unit 48e The aerial image i irradiated by the irradiation unit 43f is read by the light reading unit 48f from the aerial image i irradiated from the light irradiation unit 43g. The control unit 151a converts the results read by the optical reading unit 48a to the optical reading unit 48f into positions of the x coordinate and the y coordinate, respectively.

The control unit 151a compares the result of the first reading (the position of the x coordinate and the y coordinate) with the result of the second reading (the position of the x coordinate and the y coordinate) to obtain the light irradiation portion 43a and Positional relationship of light irradiating portion 43b, Positional relationship of light irradiating portion 43b and light irradiating portion 43c, Positional relationship of light irradiating portion 43c and light irradiating portion 43d, Positional relationship of light irradiating portion 43d and light irradiating portion 43e, Light irradiating portion The positional relationship between 43e and the light irradiation portion 43f, and the positional relationship between the light irradiation portion 43f and the light irradiation portion 43g. The accuracy of the position measurement is approximately 10 nm or less based on the magnification of the microscope of the light irradiation section 43 and the like. The control unit 151a uses these positional relationships to correct the drawing information.

Next, the control unit 151a moves the stage 41 to the position where the light irradiation unit 43a irradiates light to the -x side end and the -y side end of the mask M based on the measurement values obtained by the position measurement unit 29 and the position measurement unit 39. . Then, the control unit 151 a irradiates light from the light irradiation unit 43 and moves the stage 41 to perform drawing processing. The control unit 151a obtains drawing information from the ROM 153 before drawing processing. Then, the control unit 151a corrects the drawing information based on the calculated correction value, and performs drawing processing using the corrected drawing information.

First, the movement of the stage 41 in the drawing process will be described. The control unit 151a continuously ejects air from the air ejection unit 28 and the air ejection unit 38 during the drawing process. As a result, an air layer is formed between the plate-shaped portion 23 and the rail 21 and the guide rail 22, so that the plate-shaped portion 23 moves smoothly on the rail 21 and the guide rail 22. Moreover, since an air layer is formed between the platform 41 and the rail 31 and the guide rail 32, the platform 41 moves smoothly on the rail 31 and the guide rail 32. Thereby, the platform 41 can be smoothly moved in the horizontal direction (x direction and y direction). In particular, the convex portion 23c or the convex portion 41c is arranged two-dimensionally, and the air layer has a fixed thickness, so that the plate-like portion 23 or the platform 41 can be moved in the horizontal direction without changing the height of the platform 41.

Although air is ejected from the air ejection portion 28 to form an air layer between the plate-shaped portion 23 and the rail 21 or the guide rail 22, the rod-shaped member 26 is attracted by the magnet 27, thereby preventing the plate-shaped portion 23 from being excessively excessive from the rail 21 or the guide rail 22. Float. Furthermore, although air is ejected from the air ejection portion 28 and the air ejection portion 38 to form an air layer between the platform 41 and the rail 31 or the rail 32, the rod-shaped member 36 is attracted by the magnet 37, thereby preventing the platform 41 from the rail 31 or The guide rail 32 floats too much. Thereby, fluctuation in the height of the plate-like portion 23 or the platform 41 can be prevented. Further, by providing a plurality of air ejection portions 28 and air ejection portions 38 in the convex portion 23c and the convex portion 41c, respectively, the air layer formed between the plate-like portion 23 and the rail 21 or the guide rail 22 can be increased, and The rigidity of the plate-like portion 23 or the platform 41 can be increased by the pressure of the air layer between the platform 41 and the rail 31 or the guide rail 32.

Furthermore, the rod-shaped member 26 is attracted by the magnet 27, so that the air layer formed between the plate-shaped portion 23 and the rail 21 or the guide rail 22 is thinned. This can increase the pressure of the air-layer and increase the plate-shaped portion. 23's rigidity. In addition, the rod-shaped member 36 is attracted by the magnet 37, so that the air layer formed between the platform 41 and the rail 31 or the guide rail 32 can be thinned. This can increase the pressure of the air layer and increase the rigidity of the platform 41.

The driving portion 25 is provided near the guide rail 22 at a position that is linearly symmetrical with the guide rail 22 as a center. Therefore, the driving portion 25 can prevent the plate-shaped portion 23 (platform 41) from rotating in a horizontal plane, and the plate-shaped portion 23 (platform 41). Move in the x direction. In addition, the driving portion 34 is provided near the guide rail 32 at a position that is linearly symmetric with the guide rail 32 as a center. Therefore, the driving portion 34 can prevent the platform 41 from rotating in a horizontal plane and move the platform 41 in the y direction.

The control unit 151 a controls the drive unit 25 based on the information obtained from the position measurement unit 29 and controls the drive unit 34 based on the information obtained from the position measurement unit 39 when the platform 41 is moved. FIG. 20 is a diagram explaining the control of the drive section 25 and the drive section 34 performed by the control section 151a.

First, the thrust conversion unit 164 and the thrust conversion unit 174 output signals to the U-phase, V-phase, and W-phase of the movable member 25b and the movable member 34b, respectively, and the thrust conversion unit 164 and the thrust conversion unit 174 obtain the movable member 25b, Power factor (power factor information) of U-phase, V-phase, and W-phase of the movable member 34b.

The measurement signal in the position measurement unit 29 on the -y side of the first moving unit 20 is input to the X counter (1) 161, and the measurement signal in the position measurement unit 29 on the + y side is input to the X counter (2) 162. The control unit 151a sets the average value of the output of the X counter (1) 161 and the output of the X counter (2) 162 to the current position.

The target coordinate calculation unit 163 calculates a target coordinate (position command) at the current point in time based on a pulse or the like output from the CPU 151. The control unit 151a calculates a linear function (P) of the output signals from the X counter (1) 161 and the X counter (2) 162 and the deviation from the position command output from the target coordinate calculation unit 163. Then, the control unit 151 a calculates an input value (I) that changes in proportion to the integral of the deviation and an input value (D) that changes in proportion to the differentiation of the deviation. These values are input to the thrust conversion unit 164.

Further, the control unit 151a calculates a first differential term that differentiates the position command calculated by the target coordinate calculation unit 163 once and a second differential term that differentiates the position command twice. These values are input to the thrust conversion unit 164. The thrust conversion unit 164 receives an origin signal which is a reference for managing the position of the drive unit 25 from the origin sensor 165.

The thrust conversion unit 164 generates a signal for driving the driving unit 25 based on the input information. Specifically, the thrust conversion unit 164 performs proportional-integral-differential (PID) control combining a proportional action, an integral action, and a differential action, and based on a position command input from the target coordinate calculation unit 163 and a primary differentiation Term, feed forward control of the second derivative term. The thrust conversion unit 164 generates a drive signal based on a control result, power factor information, and the like. The driving signals are signals corresponding to U-phase, V-phase, and W-phase, respectively, and are amplified by amplifiers 166, 167, and 168, respectively, and output to the U-phase, V-phase, and W-phase coils of the movable member 25b. Therefore, the platform 41 can be accurately moved. In addition, in order to perform high-precision control (control in units of nm to several tens of nm), the amplifier 166, the amplifier 167, and the amplifier 168 are preferably a direct current (DC) linear amplifier.

The measurement signal in the -x position measurement unit 39 of the second moving unit 30 is input to the Y counter (1) 171, and the measurement signal in the + x position measurement unit 39 is input to the Y counter (2) 172. The control unit 151a sets the average value of the output of the Y counter (1) 171 and the output of the Y counter (2) 172 to the current position.

The target coordinate calculation unit 173 calculates a position command in the same manner as the target coordinate calculation unit 163. The control unit 151a calculates a linear function (P) of the output signals from the Y counter (1) 171 and the Y counter (2) 172 and the deviation from the position command output from the target coordinate calculation unit 173. Then, the control unit 151 a calculates an input value (I) that changes in proportion to the integral of the deviation and an input value (D) that changes in proportion to the differentiation of the deviation. These values are input to the thrust conversion unit 174.

Furthermore, the control unit 151a calculates the primary differential term of the position command and the secondary differential term of the position command calculated by the target coordinate calculation unit 173. These values are input to the thrust conversion unit 174. In the thrust conversion unit 174, an origin signal which is a reference for managing the position of the driving unit 34 is input from the origin sensor 175.

The thrust conversion unit 174 generates a signal for driving the driving unit 25 based on the input information. Specifically, the thrust conversion unit 174 performs PID control and feedforward control similarly to the thrust conversion unit 164, and generates a drive signal based on a control result, power factor information, and the like. The driving signals are signals corresponding to U-phase, V-phase, and W-phase, respectively, which are amplified by amplifiers 176, 177, and 178, respectively, and output to the U-phase, V-phase, and W-phase coils of the movable member 34b. Therefore, the plate-like portion 23 can be accurately moved. In addition, like the amplifier 166, the amplifier 167, and the amplifier 168, it is desirable that the amplifier 176, the amplifier 177, and the amplifier 178 are DC linear amplifiers.

When the platform 41 is moved, the control unit 151 a controls the drive unit 34 so that the platform 41 does not protrude from the plate-like portion 23. In addition, when the control portion 151 a moves the plate-shaped portion 23, the control portion 151 a controls the driving portion 25 so that the plate-shaped portion 23 does not protrude from the rail 21 and the guide rail 22. This can prevent the holding position of the cover M from being shifted due to the deflection of the platform 41.

Next, control of the light irradiation unit 43 in the drawing process will be described. FIG. 21 is a diagram illustrating a drawing position correction process performed by the control unit 151a. The LUT181a to LUT188a have been obtained by the correction process. Regarding LUT181a to LUT188a, as long as the traveling conditions of the platform 41, such as replacing the scale 29a, scale 39a, changing the pressure of the air ejected from the air ejection portion 28, and the air ejection portion 38, do not change, it need not be updated. The LUT 181a to LUT 187a may include a value that corrects the positional relationship between the light irradiation section 43a to 43g obtained by the light reading section 48a to 48g.

The control unit 151a calculates the offsets in the x-direction offset table 181b to the offset table 187b and the y-direction of each of the light irradiation portions 43a to 43g based on the correction data and the xy correction table using the correction substrate M1 described above. Table 188b to offset table 188h. The correction data and the xy correction table are data related to the position on the mask M. Therefore, the control unit 151a adds the correction data of the position p (not shown) on the mask M to the xy correction table, for example. The amount of displacement in the x direction and the amount of displacement in the y direction at the position p are calculated. Then, the control unit 151a performs this processing on all positions on the mask M, and divides the results according to the positions of the mask M drawn by each of the light irradiating portions 43a to 43g, thereby calculating an offset table in the x direction. 181b to offset table 187b, offset table 188b to offset table 188h in the y direction. The offset tables 181b to 187b and the offset tables 188b to 188h are fixed values. Further, the offset table 181b to 187b, the offset table 188b to 188h are two-dimensional values corresponding to each pixel of the light source 432 for the positions of each of the light irradiating sections 43a to 43g. Configured by.

The control unit 151a drives the drive unit 25 and the drive unit 34 based on the drive signals generated based on the PID control and the feedforward control in the thrust conversion unit 164 and the thrust conversion unit 174, and is measured by the position measurement unit 29 and the position measurement unit 39. The position in the x direction of the plate-like portion 23 and the position in the y direction of the platform 41. Then, these values are weighted and added according to the positions of the light irradiation sections 43a to 43g, and the x-direction positions 191 to 197 and the current time of the light irradiation section 43a to 43g at the current time point are calculated. A point 198 in the y-direction of the spot light irradiation portion 43a. The calculation of the positions 191 to 198 by weighted addition is performed by the same method as the calculation of the measured values assuming that the position measurement section 29 and the position measurement section 39 are located at the light irradiation sections 43a to 43g. .

In addition, since the measurement values of the position measurement unit 29 and the position measurement unit 39 include deflection displacement amounts, the position 198 in the y direction must be added with the rotation amount obtained from the measurement values of the position measurement unit 29 and the position measurement unit 39. And figure it out.

When the control unit 151a obtains the position 191 in the x direction of the light irradiation unit 43a, it obtains the correction value of the position 191 from the LUT 181a and the offset table 181b, and adds the obtained values as the x direction of the light irradiation unit 43a. The pattern position correction amount is calculated. Similarly, the control unit 151a obtains corrections for the positions 192 to 197 from the LUT 182a to LUT187a and the offset tables 182b to 187b based on the positions 192 to 197 in the x direction of the light irradiating section 43b to 43g. The value is calculated by adding the obtained values as the pattern position correction amount in the x direction of the light irradiating portion 43b to 43g.

When the control unit 151a obtains the position 198 in the y direction of the light irradiation unit 43a, it obtains the correction value of the position 191 from the LUT 188a and the offset table 188b, and adds these values as the y direction of the light irradiation unit 43a. The pattern position correction amount is calculated. Similarly, the control unit 151a calculates the pattern position correction amounts in the y direction of the light irradiation unit 43b to the light irradiation unit 43g based on the LUT 188a and the offset tables 188c to 188h, respectively.

The control unit 151 a uses the calculated pattern position correction amount in the x direction and the pattern position correction amount in the y direction to correct the drawing information. Specifically, as shown in FIG. 22 or FIG. 23, the control unit 151 a moves the optical member included in the light irradiation unit 43 to perform position correction in the x direction and the y direction.

22 and 23 are schematic diagrams showing a case where the position (image position) for imaging the light irradiated from the light source 432 is moved in the horizontal direction. In FIG. 22 and FIG. 23, the light path in a state where the optical member is not moved is shown by a thin solid line, and the light path in a state where the optical member is moved is shown by a thin two-dot chain line. In addition, in FIG. 22 and FIG. 23, only the light irradiated from a certain point among the planar lights irradiated from the light source 432 is illustrated for illustration.

As shown in FIG. 22, by moving the barrel lens group 435a in the horizontal direction (x direction and / or y direction), the image position is moved in the horizontal direction. In FIG. 22, as a result of moving the barrel lens group 435a from the position shown by the solid line to the position shown by the two-dot chain line, the image position moves in the -y direction. In addition, with a configuration in which only the barrel lens group 435a is moved in the horizontal direction, aberration is suppressed.

Further, as shown in FIG. 23, by tilting the parallel flat plate 439 with respect to the x direction and / or the y direction, the apparent light emitting point is moved in the horizontal direction, and the image position is moved in the horizontal direction. In FIG. 23, with the axis of y correction rotation as the center, the parallel flat plate 439 is tilted downward from the right side in FIG. 23, and the light emitting point thus seen is directed to the left side in FIG. The position of is shifted to the position shown by the dotted line), and the image position is shifted to the right (-y direction) in FIG. 23. Then, by rotating the parallel flat plate 439 about the axis of the x-correction rotation, the image position is moved in the x-direction. In order to suppress aberrations, the parallel flat plate 439 is desirably set to a slope of approximately 1 degree to 2 degrees.

As described above, by using either the method of moving the barrel lens group 435a in the horizontal direction or tilting the parallel flat plate 439, when the laser light is irradiated on the surface, the drawing information can be corrected to irradiate the light.

In addition, the position correction in the x direction by the control unit 151a may be performed by staggering the timing of lighting the pixels of the light source 432, that is, the irradiation timing information (the output timing of the horizontal drive signal). In addition, regarding the position correction in the y direction by the control unit 151a, the drawing information may be moved by using redundant pixels provided outside the drawing information (pixels arranged two-dimensionally) of the light source 432, that is, the position information is staggered. get on.

In this way, the control unit 151a corrects the drawing information based on the current positions of the light irradiation units 43a to 43g, and performs drawing processing based on the corrected drawing information. In the drawing process, the control unit 151 a moves the stage 41 in the x direction to perform one-line drawing, and then moves the stage 41 in the y direction. In addition, the control unit 151a moves the frame 431 in the z direction as necessary during the drawing process. The movement of the casing 431 is performed by measuring the amount of movement in the z direction of the casing 431 with a linear encoder 434e, and driving the piezoelectric element 434d. Thereby, even if the thickness of the mask M changes, etc., the light irradiated from the light irradiation part 43 can be imaged on the mask M.

According to this embodiment, since the laser interferometer 51, the laser interferometer 52, and the laser interferometer 53 are used to correct the position measurement unit 29 and the position measurement unit 39, the platform can be accurately moved in the horizontal direction. Therefore, the positional accuracy of the pattern drawn on the mask M can be improved.

Furthermore, according to the present embodiment, the light irradiation unit 43 is used to generate the correction substrate, the correction substrate is used to generate the correction data, and the correction data is used to correct the drawing information. Therefore, it is possible to correct the setting error of the light irradiation unit 43 and accurately draw the pattern.

In addition, according to this embodiment, the AF processing unit 435 is controlled to obtain changes in the height direction such as the deflection of the mask M, and an xy correction table is created so as to correct it, and the drawing information is corrected using the xy correction table. The deflection of the curtain M can accurately draw a pattern. Furthermore, by using the ceramic to form the stage 41 with a thermal expansion coefficient of approximately 1 × 10 ^-7 / K or less (less than the thermal expansion coefficient of the screen M), even when there is a temperature change that cannot be completely controlled (about 0.01 degree), It is also possible to prevent deformation of the stage 41 and prevent deflection (deflection due to expansion and contraction) of the mask M caused thereby, thereby improving the positional accuracy of the pattern.

Furthermore, according to this embodiment, since an air layer is formed between the air ejection portion 28 and the rail 21 and the guide rail 22, and between the air ejection portion 38 and the rail 31 and the guide rail 32, the platform 41 can be smoothly and accurately moved , Thereby improving the positional accuracy of the pattern. Furthermore, an air layer is formed between the guide rail 22 and the groove 23d, and an air layer is formed between the guide rail 32 and the groove 41g, so that the plate-like portion 23 or the platform 41 can be smoothly and accurately moved, thereby effectively improving the positional accuracy of the pattern. .

In the present embodiment, a pipe 25c is provided inside the movable member 25b for the coolant to flow, and a pipe 34c is provided inside the movable member 34b for the coolant to flow. However, the pipe 25c, the pipe 25d, the pipe 34c, and the pipe are provided. 34d is not required. Moreover, the method of cooling the movable member 25b, the movable member 34b, or the fixed member 25a, and the fixed member 34a is not limited to this.

Further, in this embodiment, a rod-shaped member 26 and a magnet 27 are provided between the platen 11 and the plate-shaped portion 23, and a rod-shaped member 36 and a magnet 37 are provided between the plate-shaped portion 23 and the platform 41, thereby forming The air layer between the platform 41 and the rail 31 or the guide rail 32 is thinned, but the method of thinning these air layers is not limited to this. For example, the convex portion 23c of the plate-shaped portion 23A may be further provided with an air suction portion that sucks air, and the convex portion 41c of the stage 41 may be further provided with an air suction portion that sucks air. In addition, a configuration in which the air layer such as the rod-shaped member 26, the magnet 27, the rod-shaped member 36, the magnet 37, or the air suction portion is thinned is not necessary.

In the present embodiment, seven light irradiating sections 43 are provided. However, the number of the light irradiating sections 43 is not limited to seven, and may be one. Among them, in order to reduce the amount of movement in the y direction, it is desirable to provide a plurality of light irradiation sections 43.

Furthermore, in the present embodiment, the pattern reading section 47 is separately provided, but as long as the light irradiation section 43 can include the function of the pattern reading section 47, it is not necessary to provide the pattern reading section 47 separately. The light irradiation section 43 may include a part of the function of the pattern reading section 47. That is, the pattern reading section 47 may be provided adjacent to the light irradiation section 43 or may be provided on the light irradiation section 43.

Furthermore, in this embodiment, the pins 44a, 44b, and 44c are movably provided with respect to the frame body 42, and if necessary, the pins 44a, 44b, and 44c are inserted into any of the holes 41j, 41k, and 41l. In this case, the pins 44a, 44b, and 44c are provided on the platform 41, but the pins 44a, 44b, and 44c may be provided on the platform 41 in advance. Among them, in order to prevent the strain of the mask M caused by the mask M always abutting on the pins 44a, 44b, and 44c, it is desirable to make the pins 44a and 44b after the mask M is placed on the platform 41. The pin 44c is separated from the platform 41. Moreover, the form in which the pin 44a, the pin 44b, and the pin 44c are inserted into or pulled out from the hole 41j, the hole 41k, the hole 41l is not limited to this.

The embodiment of the present invention has been described in detail with reference to the drawings, but the specific configuration is not limited to the embodiment, and includes design changes and the like without departing from the spirit of the present invention. As long as it is a person skilled in the art, each element of an embodiment can change, add, convert, etc. suitably.

In addition, in the present invention, "approximately" includes not only strictly identical cases, but also a concept of errors or distortions to such an extent that the identity is not lost. For example, the approximate level is not limited to a strict level, and includes, for example, a concept including an error of several degrees. Furthermore, for example, when the expression is only parallel, orthogonal, etc., it includes not only the case of strict parallelism, orthogonality, etc., but also the case of approximately parallelism, approximately orthogonality, and the like. In addition, the "nearby" in the present invention refers to an area including a range (arbitrarily arbitrarily specified) located near the reference position. For example, when the vicinity of A is mentioned, it means a region located in the vicinity of A, and the concept of A may be included or not.

1, 2‧‧‧ mask manufacturing device
11‧‧‧ platen
11a, 23a, 41a‧‧‧ Top surface
11b, 21, 21a, 21b, 31, 31a, 31b
11c, 25, 34‧‧‧Driver
12, 13‧‧‧ Vibration damper
20, 20A‧‧‧The first mobile unit
22, 32‧‧‧ rail
23, 23A‧‧‧ Plate
23b, 41b‧‧‧ lower surface
23c, 24, 24A, 33, 33A, 41c ‧‧‧ convex
23d, 41g‧‧‧ trench
23e, 23f, 41h, 41i‧‧‧
24a, 28, 33a, 38‧‧‧Air ejection unit
25a, 34a‧‧‧Fixture
25b, 34b‧‧‧movable parts
25c, 25d, 34c, 34d
26, 36‧‧‧ rod-shaped members
27, 37‧‧‧ magnets
29, 39‧‧‧ Position Measurement Department
29a, 39a‧‧‧ ruler
29b, 39b ‧‧‧ detection head
30, 30A‧‧‧The second mobile unit
41, 41A‧‧‧platform
41d‧‧‧Hole for curtain lift
41e‧‧‧air hole
41f‧‧‧ rod mirror
41i, 41j, 41k, 434c‧‧‧holes
42, 431‧‧‧frame
42a‧‧‧column
42b‧‧‧Beam
43, 43a, 43b, 43c, 43d, 43e, 43f, 43g
44a, 44b, 44c ‧‧‧ pins
44d‧‧‧pin drive unit
45, 46‧‧‧force department
47, 47a, 47b, 47c, 47d, 47e, 47f, 47g ‧‧‧ pattern reading section
48, 48a, 48b, 48c, 48d, 48e, 48f, 48g
51, 52, 53‧‧‧ laser interferometer
141‧‧‧I / O device
142‧‧‧Internet
143‧‧‧Memory media
151‧‧‧CPU
151a‧‧‧Control Department
152: RAM
153: ROM
154‧‧‧I / O interface
155‧‧‧ communication interface
156‧‧‧Media Interface
161‧‧‧X counter (1)
162‧‧‧X counter (2)
163, 173‧‧‧ Target coordinate calculation department
164, 174‧‧‧thrust conversion unit
165, 175‧‧‧ origin sensor
166, 167, 168‧‧‧ amplifier
171‧‧‧Y counter (1)
172‧‧‧Y counter (2)
176, 177, 178‧‧‧ amplifier
181a, 182a, 183a, 184a, 185a, 186a, 187a, 188a‧‧‧LUT
181b, 182b, 183b, 184b, 185b, 186b, 187b, 188b, 188c, 188d, 188e, 188f, 188g, 188h
191, 192, 193, 194, 195, 196, 197, 198‧‧‧ position
411, 412‧‧‧ position
432‧‧‧light source
433‧‧‧ Objective
434‧‧‧Connection Department
434a, 434b ‧‧‧ faces
434d‧‧‧Piezoelectric element
434e‧‧‧ Linear Encoder
435‧‧‧AF (Auto Focus) Processing Department
435a‧‧‧Barrel lens group
435b‧‧‧Beam Beamsplitter
435c, 435d‧‧‧ sensors
436, 437‧‧‧ mirror
439‧‧‧ Parallel Plate
471‧‧‧ Objective
472‧‧‧light source unit
472a‧‧‧light source
472b‧‧‧optical fiber
472c‧‧‧ diffuser
472d‧‧‧collimating lens
473‧‧‧Mirror tube
474‧‧‧Barrel lens
475‧‧‧Reflector
476‧‧‧UV Camera
481‧‧‧ Objective
482‧‧‧Reflector
483‧‧‧Mirror tube
484‧‧‧Barrel lens
485‧‧‧UV Camera
D‧‧‧ dust
i‧‧‧light (air image)
M‧‧‧ Mask
M1, M1'‧‧‧ correction substrate
P‧‧‧Pattern
A1 ～ A7‧‧‧area
S1, S2‧‧‧Measured values
S52 、 S53‧‧‧Measurement results
x, y, z‧‧‧ directions
y1, y2‧‧‧‧ protruding

FIG. 1 is a perspective view showing an outline of a mask manufacturing apparatus 1 according to the first embodiment. FIG. 2 is a perspective view showing the outline of the first moving section 20 and the second moving section 30. FIG. 3 is an enlarged view of a portion of the first moving section 20. FIG. 4 is a perspective view of the plate-like portion 23 as viewed from the back side. FIG. 5 is a partially enlarged view of the second moving section 30. FIG. 6 is a schematic perspective view of the platform 41 as viewed obliquely from above. FIG. 7 is a schematic perspective view of the platform 41 as viewed obliquely from below. FIG. 8 is a perspective view of a main part showing an outline of the light irradiation section 43a. FIG. 9 is a perspective view showing an outline of the pattern reading section 47a, and is a view showing a main part thereof. FIG. 10 is a perspective view showing an outline of the optical reading section 48a, and is a view showing a main part thereof. FIG. 11 is a schematic diagram showing a measurement performed by the laser interferometer 51, the laser interferometer 52, and the laser interferometer 53. FIG. 12 is a block diagram showing the electrical configuration of the mask manufacturing apparatus 1. FIG. 13 is an example in which the measurement results of the two position measuring units 29 when the plate-like portion 23 is moved in the x direction are compared with the measurement results of the laser interferometer 52 and the laser interferometer 53. FIG. 14 is a graph showing correction values in the x direction when the measurement results shown in FIG. 13 are obtained. FIG. 15 is a diagram illustrating a case where the urging portion 45 and the urging portion 46 press the cover M to perform positioning. FIG. 16 is a diagram showing an example of the drawing information of the correction substrate. FIG. 17 is a diagram showing a correction substrate M1 generated based on the correction substrate drawing information shown in FIG. 16. FIG. 18 is a diagram showing a result of reading the correction substrate M1 using the pattern reading unit 47 in a state where the correction substrate M1 is rotated approximately 180 degrees from the initial state. FIG. 19 is a schematic diagram showing a state of the mask M when dust D is attached between the mask M and the upper surface 41 a of the platform 41. FIG. 20 is a diagram explaining the control of the drive section 25 and the drive section 34 performed by the control section 151a. FIG. 21 is a diagram explaining a drawing position correction process performed by the control unit 151a. FIG. 22 is a schematic diagram showing a case where a position (image position) for imaging light irradiated from the light source 432 is moved in the horizontal direction. FIG. 23 is a schematic diagram illustrating a case where a position (image position) for imaging light irradiated from the light source 432 is moved in the horizontal direction.

1‧‧‧Mask manufacturing device

11‧‧‧ platen

11a‧‧‧upper surface

12, 13‧‧‧ Vibration damper

20‧‧‧The first mobile unit

30‧‧‧ The second mobile unit

41‧‧‧platform

42‧‧‧Frame

42a‧‧‧column

42b‧‧‧Beam

43, 43a, 43b, 43c, 43d, 43e, 43f, 43g

47, 47a, 47b, 47c, 47d, 47e, 47f, 47g ‧‧‧ pattern reading section

48, 48a, 48b, 48c, 48d, 48e, 48f, 48g

51‧‧‧laser interferometer

x, y, z‧‧‧ directions

Claims (8)

An apparatus for manufacturing a curtain, comprising: a platform, which is a plate-shaped platform on which a curtain is placed on a substantially horizontal upper surface, and a rod mirror is provided along two adjacent sides of the upper surface; A pressure plate; a first moving portion mounted on the pressure plate having a plate-like portion and a first driving portion that moves the plate-like portion in a first direction; a second moving portion placed on the plate An upper surface of the plate-like portion, and the platform is placed on the second moving portion, and the second driving portion moves the platform in the second direction; a light irradiating portion is provided on the cover; The surface is irradiated with light, and two reflecting mirrors are provided in parallel with the rod mirror. The frame is provided on the platen and holds the light irradiating part above the platform. The position measuring part includes: a first position. The measurement section and the second position measurement section are provided on both sides in the second direction of the first moving section and acquire positions in the first direction of the plate-shaped section, and a third position measurement section And a fourth position measuring unit, which are provided on both sides in the first direction of the second moving unit and obtain the flat The position in the second direction of the stage; the laser interferometer measures the position of the light irradiating part and the stage by measuring the position of the rod mirror based on the positions of the two reflecting mirrors Positional relationship; and a control unit that obtains information related to the position and shape of the pattern drawn on the mask, that is, drawing information, and drives the first driving unit and the first driving unit based on a value obtained by the position measuring unit. 2 a driving unit for moving the stage in a horizontal direction, and performing drawing processing for irradiating light from the light irradiation unit to the mask based on the drawing information, the control unit is configured to measure from the first position A value obtained by the unit and a value obtained by the second position measuring unit, and a weighted average value obtained by weighting the values obtained by the first position measuring unit and the distance between the second position measuring unit and the light irradiation unit, and And the value obtained by the third position measurement unit and the value obtained by the fourth position measurement unit are performed based on the distance between the third position measurement unit and the fourth position measurement unit and the light irradiation unit. Weighted average To obtain a measurement value assuming that the position measurement unit is located at the position of the light irradiation unit, and comparing the obtained measurement value with a measurement result of the laser interferometer to correct the position measurement And performing the drawing processing based on a value obtained by the corrected position measurement unit. The mask manufacturing device according to item 1 of the scope of patent application, comprising a reading section, the reading section being adjacent to or provided in the light irradiation section, and the control section obtaining and including the arrangement The correction substrate drawing information, which is information related to the correction substrate pattern in the two-dimensional position of the plurality of crosses, controls the first driving section and the second driving section so that the platform moves along the first Moving in the direction and the second direction, while irradiating light to the mask from the light irradiation unit based on the correction substrate drawing information, and drawing the correction substrate pattern on the mask to generate a correction substrate, The reading is used in each state of an initial state, which is a state when the correction substrate is generated, and a state where the correction substrate is rotated approximately 90 degrees, approximately 180 degrees, and approximately 270 degrees from the initial state. The unit reads the correction substrate, corrects the drawing information based on a result of the reading, and performs the drawing processing based on the corrected drawing information. The mask manufacturing device according to item 2 of the scope of patent application, wherein the control unit generates a correction value and uses the generated correction value to correct the drawing information, and the correction value is in the initial state The result of reading the correction substrate is consistent with the result of reading the correction substrate while the correction substrate is rotated by approximately 180 degrees, and the result of rotating the correction substrate by approximately 90 degrees The result of reading the correction substrate in a state is consistent with the result of reading the correction substrate in a state where the correction substrate is rotated by approximately 270 degrees. The mask manufacturing apparatus according to any one of claims 1 to 3, wherein the light irradiation section includes an autofocus section that focuses a light irradiated on the mask Aiming at the mask, the control unit controls the auto-focusing unit to obtain distance information related to the distance between the light irradiation unit and the mask, and corrects the drawing information based on the acquired distance information , Performing the drawing processing based on the corrected drawing information. The mask manufacturing device according to any one of claims 1 to 4, wherein the light irradiating portion has a surface irradiating portion in which pixels are arranged two-dimensionally, and the drawing information includes: Position information obtained by associating the position of the surface irradiated portion with the presence or absence of light irradiation in each pixel of the surface irradiated portion, and the position of the surface irradiated portion with each of the pixels in the surface irradiated portion The irradiation timing information obtained by associating the irradiation timing of light with each other, the control unit corrects the drawing information by staggering the irradiation timing information in the first direction and staggering the position information in the second direction. After the platform is moved in the first direction for one line of drawing, the platform is moved in the second direction to perform the drawing process. The mask manufacturing device according to any one of claims 1 to 4, wherein the light irradiation section includes an optical member, and the control section corrects the drawing by moving the optical member. Information. According to the mask manufacturing device according to any one of claims 1 to 6, in which the platform is formed using a material having a thermal expansion coefficient of approximately 1 × 10 ^-7 / K or less, and the control unit uses The platform controls the second driving section so that the platform does not protrude from the plate-like section. A method for controlling a mask manufacturing apparatus. The method for controlling a mask manufacturing apparatus is to place a mask on an upper surface of a platform, and irradiate the mask with light from a light irradiation unit to draw the mask. The control method of the mask manufacturing apparatus is characterized in that it includes the following steps: based on the values obtained by the first position measuring section and the second position measuring section of the first moving section provided on both sides of the second direction, based on A weighted average value obtained by weighting a distance between the first position measuring unit and the second position measuring unit and the light irradiating unit, and a second moving unit provided on both sides of the first direction in the first direction; The values obtained by the three-position measurement unit and the fourth-position measurement unit are obtained by weighting an average value obtained by weighting the distances between the third-position measurement unit and the fourth-position measurement unit and the light irradiation unit. The measured value of the position of the light irradiating part, the first moving part is placed on a platen having a substantially rectangular parallelepiped and has a plate-shaped part, and a first driving part for moving the plate-shaped part in the first direction, The second table on which the second moving portion is placed. In addition, the second moving unit is provided with the platform on which the platform is moved and has a second driving unit that moves the platform in the second direction; based on the measured value obtained and the measurement result of the laser interferometer, The first position measurement unit, the second position measurement unit, the third position measurement unit, and the fourth position measurement unit are corrected, and the measurement result of the laser interferometer is set in the The position of the two mirrors of the light irradiation unit is used as a reference to measure the position of the rod mirror provided on the stage, and the positional relationship between the light irradiation unit and the stage is measured; and one side is based on the correction step Corrected values obtained by the first position measurement unit, the second position measurement unit, the third position measurement unit, and the fourth position measurement unit are used to drive the first drive unit and the second drive While moving the platform in a horizontal direction, based on information related to the position and shape of the pattern drawn on the mask, that is, drawing information, the light irradiates the mask with light from the light irradiating section to the mask. The curtain is drawn.