JP2018063371A - Measuring device, lithography device, and production method of article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a measuring device advantageous for measuring positions of a plurality of marks arranged on a substrate at high precision.SOLUTION: A measuring device that includes a plurality of measuring parts arranged along the first direction and measures positions of a plurality of marks provided on a substrate while relatively scanning the substrate and the plurality of measuring parts by the plurality of measuring parts includes: a member having a plurality of reference marks arranged along the first direction; a detection part for detecting a deformation volume of the member in the first direction; and a controller for positioning each of the plurality of measuring parts on the basis of measuring results of the plurality of reference marks by the plurality of measuring parts, in which the controller estimates a positional deviation of each of the plurality of the reference marks in the first direction generated due to the deformation of the member from the deformation volume detected by the detection part and calibrates each of the plurality of measuring parts for which the positioning was performed based on the estimated positional deviation.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a measuring apparatus that measures the positions of a plurality of marks provided on a substrate, a lithography apparatus, and an article manufacturing method.

  In a lithographic apparatus used for manufacturing a semiconductor device, a flat panel display, or the like, it is required to accurately form a pattern in each of a plurality of shot regions on a substrate. Therefore, the lithography apparatus is provided with a measurement device that measures the position of each of a plurality of marks (alignment marks) formed on the substrate, and the substrate is positioned based on the measurement result of the measurement device.

  Patent Document 1 proposes a measurement device (detection device) in which a plurality of measurement units (detection units (off-axis scopes)) that measure the positions of marks on a substrate are arranged. In the measurement apparatus configured as described above, the plurality of measurement positions of the plurality of marks on the substrate are measured by causing the plurality of measurement units to measure the positions of the plurality of marks on the substrate while relatively scanning the plurality of measurement units and the substrate. The time required to measure each position can be shortened.

Japanese Patent Laying-Open No. 2015-76491

  In the measurement device, positioning (position calibration) is performed for each of the plurality of measurement units based on the result of measuring the plurality of reference marks by the plurality of measurement units. However, a member on which a plurality of reference marks are formed may be deformed over time. In this case, each of the plurality of reference marks may be displaced due to deformation of the member, and a measurement error may occur in each of the plurality of measurement units positioned based on the measurement results of the plurality of reference marks.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an advantageous measuring apparatus for accurately measuring the positions of a plurality of marks provided on a substrate.

  In order to achieve the above object, a measurement apparatus according to one aspect of the present invention includes a plurality of measurement units arranged along a first direction, and relatively scans a substrate and the plurality of measurement units. A measuring device for measuring the positions of a plurality of marks provided on the substrate by the plurality of measuring units, the member having a plurality of reference marks arranged along the first direction, and the first direction A detection unit that detects a deformation amount of the member in the control unit, and a control unit that positions each of the plurality of measurement units based on measurement results of the plurality of reference marks by the plurality of measurement units, The control unit predicts the positional deviation of each of the plurality of reference marks in the first direction caused by the deformation of the member from the deformation amount detected by the detection unit, and predicts the positional deviation. Based on It decided to perform calibration of each of the plurality of measuring portions made, characterized in that.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide an advantageous measuring device for accurately measuring the positions of a plurality of marks provided on a substrate.

It is a figure which shows exposure apparatus. It is the figure which looked at a plurality of 2nd measurement parts from the Y direction. It is the figure which looked at the substrate stage from the Z direction. It is the figure which looked at the detection state by a distance detection part from the Z direction. It is a figure which shows the structural example of a member and a distance detection part. It is a figure which shows the structural example of a member. It is a figure which shows the position of the reference | standard mark before and behind a deformation | transformation of a member. It is a figure for demonstrating the structure of the member of 2nd Embodiment. It is a figure which shows the position of each reference mark before and behind a deformation | transformation of a member. It is a figure for demonstrating the structure of the member of 3rd Embodiment. It is a figure which shows the position of the reference | standard mark before and behind a deformation | transformation of a member. It is a figure which shows the board | substrate stage provided with the distance detection part. It is a figure which shows the structural example of a member and a distance detection part.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member thru | or element, and the overlapping description is abbreviate | omitted. In the following embodiments, a step-and-scan type exposure apparatus (so-called scanner) that scans and exposes a substrate with slit light will be described. However, the present invention is not limited to this. For example, the present invention can be applied to another lithography apparatus such as a step-and-repeat type exposure apparatus (so-called stepper), imprint apparatus, and drawing apparatus.

<First Embodiment>
An exposure apparatus 100 according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a view showing an exposure apparatus 100 according to the first embodiment. The exposure apparatus 100 of the first embodiment is a step-and-scan type scanning exposure apparatus that scans and exposes a substrate with slit light. The exposure apparatus 100 can include an illumination optical system 10, a mask stage 20, a projection optical system 30, a substrate stage 40, and a control unit 50. The exposure apparatus 100 includes a plurality of first measurement units 60 each having a TTL (Through The Lens) type alignment scope, and a plurality of second measurement units 70 (measurement units) each having an off-axis type alignment scope. Have Here, the control unit 50 includes, for example, a CPU and a memory, and controls exposure processing (controls each unit of the exposure apparatus 100). The control unit 50 of the present embodiment has a function of controlling the positioning of each second measurement unit 70 and controls the positioning of the substrate 2 based on the measurement results of the positions of a plurality of marks provided on the substrate 2. It also has a function (function as a second control unit). However, the present invention is not limited to this, and a control unit that controls the positioning of each second measurement unit 70 and a control unit that controls the positioning of the substrate 2 may be configured separately.

  The illumination optical system 10 shapes light emitted from a light source (not shown) by a light shielding member such as a masking blade included therein into slit light having a strip-like or arc-like cross-sectional shape that is long in the X direction, for example. A part of the mask 1 is illuminated with slit light. The projection optical system 30 has a predetermined projection magnification, and projects the pattern formed on the mask 1 onto the substrate with slit light. Hereinafter, an area on the substrate on which the pattern of the mask 1 is projected (area where the slit light is irradiated) is referred to as an irradiation area. The mask 1 and the substrate 2 are held by the mask stage 20 and the substrate stage 40, respectively, and are arranged at optically conjugate positions (object plane and image plane of the projection optical system 30) via the projection optical system 30, respectively. Is done. The mask stage 20 is configured to be movable while holding the mask 1 by, for example, vacuum suction or electrostatic suction. The substrate stage 40 is configured to be movable while holding the substrate 2 by, for example, vacuum chucking or electrostatic chucking.

  The position of the substrate stage 40 is detected by a position detector 41 (second detector). The position detection unit 41 includes, for example, an interferometer, irradiates light (laser light) to the side surface of the member 42 provided on the substrate stage 40, and uses the light reflected by the side surface to emit light of the projection optical system 30. The position of the substrate stage 40 in the direction perpendicular to the axis (XY direction) is detected. For example, the side surface of the member 42 irradiated with the light from the position detection unit 41 may be mirror-finished so as to reflect the light, or may be provided with a mirror. Note that the position of the mask stage 20 is also detected by a position detection unit including an interferometer, as in the case of the substrate stage 40, but description thereof is omitted here.

  The exposure apparatus 100 configured in this manner relatively scans the mask stage 20 and the substrate stage 40 at a speed ratio corresponding to the projection magnification of the projection optical system 30 while being synchronized with each other. Accordingly, the pattern of the mask 1 can be transferred to the shot region 3 on the substrate by scanning the irradiation region in the Y direction on the substrate. Such scanning exposure is sequentially repeated for each of the plurality of shot regions 3 on the substrate 2, whereby the exposure process on one substrate 2 can be completed.

  In the exposure apparatus 100, the position of each of the plurality of marks 4 provided on the substrate 2 is measured, and based on the measurement result, the alignment between the mask 1 and the substrate 2 when exposing each shot region 3 (substrate 2). Positioning) is performed. In the exposure apparatus 100 of the present embodiment, the plurality of marks 4 provided on the substrate 2 are arranged (arranged) along the X direction so as to correspond to the marks 4 arranged in the X direction (first direction). A plurality of second measuring units 70 are provided. And the position in each of the some mark 4 provided in the board | substrate 2 is measured by the some 2nd measurement part 70 by scanning the board | substrate 2 and the some 2nd measurement part 70 relatively. Further, the substrate 2 is positioned based on the position information of each mark 4 obtained by the plurality of second measuring units 70.

  When positioning the board | substrate 2, the value which correct | amended the positional information on each mark 4 obtained by the some 2nd measurement part 70 with baseline information can be used. Baseline information is information indicating the distance (difference) between the measurement position of the first measurement unit 60 and the measurement position of the second measurement unit 70. Baseline information is generated based on the result of causing the first measurement unit 60 and the second measurement unit 70 to measure the position of the same mark (or the reference mark 43) on the substrate, and can be updated periodically. Specifically, the baseline information can be generated based on the amount of movement of the substrate stage 40 when the first measurement unit 60 and the second measurement unit 70 measure the position of the same mark on the substrate. The baseline information can be generated for a representative second measurement unit 70 (for example, the second measurement units 70a and 70b) among the plurality of second measurement units 70. Further, the measurement position can be defined as a measurement reference position (for example, the center position of the visual field) within the visual field of the alignment scope.

  Next, an arrangement example of the plurality of second measurement units 70 will be described with reference to FIGS. 2 and 3. FIG. 2 is a view of the plurality of second measuring units 70 viewed from the Y direction, and FIG. 3 is a view of the substrate stage 40 holding the substrate 2 viewed from the Z direction. In the example illustrated in FIG. 2, eight second measurement units 70 a to 70 h are provided. Of the eight second measurement units 70 a to 70 h, the second measurement units 70 a, 70 c, 70 e, and 70 g are on the left side of the plurality (six) of marks 4 provided in each shot region 3 of the substrate 2 ( It is arranged so that the position of the mark 4L on the −X direction side can be measured. The second measuring units 70b, 70d, 70f, and 70g measure the position of the mark 4R on the right side (+ X direction side) among the plurality (six) of marks 4 provided in each shot region 3 of the substrate 2. Can be arranged. In the example shown in FIGS. 2 and 3, eight second measurement units 70 are provided which are the same as the number of marks 4 arranged in the X direction among the plurality of marks 4 provided on the substrate 2. 2 The number of measurement units 70 and the number of marks 4 arranged in the X direction are not limited to the same number. Further, the number of second measuring units 70 is not limited to eight.

  Here, in the exposure apparatus 100 of the present embodiment, the substrate 2 is moved by the substrate stage 40 to relatively scan the substrate 2 and the plurality of second measuring units 70. However, the present invention is not limited to this. Absent. For example, it has a drive mechanism that drives the whole of the plurality of second measurement units 70, and moves the plurality of second measurement units 70 relative to the substrate 2, whereby the substrate 2 and the plurality of second measurement units 70 are moved. You may scan relatively. Further, the substrate 2 and the plurality of second measurement units 70 may be relatively scanned by moving both the substrate 2 and the plurality of second measurement units 70.

[Regarding positioning of the second measuring unit]
As described above, in the exposure apparatus 100 that measures the position of each mark 4 on the substrate using the plurality of second measurement units 70, information indicating the measurement position of each second measurement unit 70 is set in advance. Based on the information, position information of each mark 4 is generated. Therefore, in the exposure apparatus 100, the positioning of each second measurement unit 70 is periodically performed so that the measurement position of each second measurement unit 70 becomes the target position (measurement position set in the information). The positioning of each second measurement unit 70 is based on the result of observation (detection) by a plurality of second measurement units 70 (alignment scopes) of a plurality of reference marks 43 arranged along the X direction (first direction). Can be done. Specifically, the plurality of reference marks 43 are caused to be observed by the plurality of second measurement units 70, and the corresponding reference marks are arranged at the measurement positions (for example, the center position of the visual field) of each second measurement unit 70. This can be done by adjusting the position of each second measuring unit 70 in the direction. The adjustment of the position of each second measurement unit 70 can be performed by a drive unit 71 that individually drives each second measurement unit 70. The drive unit 71 can be configured by, for example, a pulse motor.

  Here, in the present embodiment, for example, the plurality of reference marks 43 can be provided on the upper surface of the member 42 to which the light emitted from the position detection unit 41 is irradiated on the side surface, but is not limited thereto. It may be provided on a member different from 42. Further, the reference mark 43 of the present embodiment is formed on the glass plate 44 provided on the upper surface of the member 42, but may be directly formed on the upper surface of the member 42.

  In the exposure apparatus 100, the member 42 provided with the plurality of reference marks 43 may be deformed over time. For example, the member 42 is thermally deformed due to heat generated by irradiation of the slit light on the substrate 2 during the exposure process and transmitted to the member 42, heat due to light emitted from the position detection unit 41, or the like. There is. In this case, each of the plurality of reference marks 43 is displaced due to the deformation of the member 42, and each of the plurality of second measurement units 70 in which positioning is performed based on the measurement results of the plurality of reference marks 43. Measurement errors (measurement tricks) can occur. That is, in this case, if the information indicating the measurement positions of the respective second measurement units 70 set in advance is used, the positions of the plurality of marks 4 provided on the substrate 2 are determined by the plurality of second measurement units 70. It can be difficult to measure accurately.

  Therefore, the exposure apparatus 100 of the present embodiment is provided with a detection unit that detects the deformation amount of the member 42 in the X direction (first direction). Then, the control unit 50 predicts the positional deviation of each reference mark 43 in the X direction caused by the deformation of the member 42 from the deformation amount detected by the detection unit, and based on the predicted deformation amount, Each second measuring unit 70 that has been positioned is calibrated. Thereby, even when the member 42 having the plurality of reference marks 43 is deformed, the information indicating the measurement positions of the respective second measurement units 70 set in advance is used to form a plurality of the plurality of reference marks 43 provided on the substrate 2. The position of the mark 4 can be accurately measured by the plurality of second measuring units 70. Here, an example using the distance detection unit 45 that detects a distance between at least two points of the member 42 in the X direction as a deformation amount of the member 42 in the X direction will be described, but the present invention is not limited to this. For example, a detection unit configured to include a camera that captures the member 42 and detect the deformation amount of the member 42 based on an image of the member 42 captured by the camera may be used.

[Configuration of distance detector]
The distance detection unit 45 is different from the substrate stage 40 so that, for example, the distance between at least two points of the member 42 in the X direction can be detected when the substrate stage 40 moves to a predetermined position. (A lens barrel that supports the projection optical system 30). The predetermined position includes, for example, a position at which the substrate stage 40 is disposed for transporting the substrate 2 onto the substrate stage by a transport unit (not shown) (hereinafter, substrate transport position), but is different from the substrate transport position. It may be a position. FIG. 4 is a view of the state in which the substrate stage 40 is disposed at the substrate transfer position and the distance between at least two points of the member 42 in the X direction is detected by the distance detection unit 45 from the Z direction. The light 46d (laser light) emitted from the light source 46a (laser light source) is split by the beam splitter 46b, a part thereof is guided to the position detector 41, and the other part is a distance detector 45 via the mirror 46c. Led to.

  FIG. 5 is a diagram illustrating a configuration example of the member 42 and the distance detection unit 45. The member 42 includes a first mirror 42a and a second mirror 42b whose positions in the X direction are different from each other. For example, as illustrated in FIG. 6, the member 42 is formed in a cylindrical shape, and the first mirror 42 a and the second mirror 42 b can be disposed inside the member 42. Here, in the example shown in FIGS. 5 and 6, the first mirror 42 a and the second mirror 42 b are provided at the end portions of the member 42, but the present invention is not limited to this, and the member 42 in the X direction is arbitrary. It suffices if it is provided at the position. In the present embodiment, an example using the cylindrical member 42 will be described. However, the member 42 may not be formed in a cylindrical shape, and the first mirror 42a and the second mirror 42b are members. The outer surface of 42 may be provided.

  The distance detection unit 45 includes a first interferometer 45a, a second interferometer 45b, a beam splitter 45c, and a mirror 45d. A part of the light 46d emitted from the light source 46a and guided to the distance detection unit 45 is reflected by the beam splitter 45c and enters the second interferometer 45b, and another part of the light passes through the beam splitter 45c. The light is transmitted, reflected by the mirror 45d, and enters the first interferometer 45a. The first interferometer 45a has a reference surface, and the X light of the first mirror 42a is generated by interference light between the light irradiated and reflected on the reference surface and the light irradiated and reflected on the first mirror 42a. Detect the position of the direction. Similarly to the first interferometer 45a, the second interferometer 45b has a reference surface, and light reflected by being irradiated on the reference surface and light reflected by being irradiated on the second mirror 42b. The position of the second mirror 42b in the X direction is detected by the interference light. As a result, the distance detection unit 45 calculates the difference between the position of the first mirror 42a detected by the first interferometer 45a and the position of the second mirror 42b detected by the second interferometer 45b at two points on the member 42. It can be detected as the distance between.

  The distance detection unit 45 of the present embodiment is configured to detect the distance between two points of the member 42 by two interferometers, but is not limited thereto, and the member 42 is detected by three or more interferometers. The distance between the three points may be detected. Further, for example, a distance between at least two points of the member 42 may be detected by an encoder. When an encoder is used, a plurality of marks (scales) arranged along the X direction are provided on the outer surface of the member 42. Then, the distance is detected based on the timing at which the detection sensor detects the plurality of marks when the member 42 is moved in the X direction by the substrate stage 40.

  Here, in the interferometers (the first interferometer 45a and the second interferometer 45b), the refractive index on the optical path changes due to slight fluctuations (so-called air fluctuations) such as atmospheric pressure, temperature, and humidity on the optical path. An error may occur. Therefore, the distance detection unit 45 causes each of the first interferometer 45a and the second interferometer 45b to detect the position of the mirror provided on the member 42 a plurality of times, and based on the average value of the measurement results obtained a plurality of times. Thus, the position of the mirror may be obtained. Thus, by causing each interferometer to perform measurement a plurality of times, not only the detection error due to the change in the refractive index on the optical path but also the detection error due to the vibration of the substrate stage 40 can be reduced.

[Prediction of misalignment of fiducial marks]
Next, a method for predicting the positional deviation of each reference mark 43 based on the distance between two points of the member 42 detected by the distance detection unit 45 will be described with reference to FIG. Here, a method for predicting the positional deviation (X direction) of the reference mark 43 when the member 42 is deformed from the first shape state to the second shape state will be described. FIG. 7 is a view showing the position of the reference mark 43 before and after the member 42 is deformed from the first shape to the second shape, and is a view of the upper surface of the member 42 as seen from the Z direction. FIG. 7A shows the position Ph of the reference mark 43 when the member 42 has the first shape, and FIG. 7B shows the position of the reference mark 43 when the member 42 has the second shape. It is a figure which shows position Ph '. Hereinafter, a method for predicting the positional deviation of one reference mark 43 provided on the member 42 will be described. However, the positional deviation of each of the plurality of reference marks 43 provided on the member 42 is also determined using the following method. Can be predicted.

  The state in which the member 42 has the first shape is a state in which the member 42 has the reference shape, for example, immediately after the exposure apparatus 100 is started up. In this state, the distance between the two points of the member 42 detected by the distance detection unit 45 (here, the distance between both end portions of the member 42 for the sake of easy understanding) is as shown in FIG. The distance A is stored in the memory as a reference distance. In addition, the position Ph of the reference mark 43 in this state is the reference position, and the measurement position of the second measurement unit 70 when the second measurement unit 70 measures the position Ph of the reference mark 43 is the “each It can be set as “information indicating the measurement position of the second measurement unit 70”.

When the exposure process of the substrate 2 held by the substrate stage 40 is completed and the substrate stage 40 is placed at the substrate transfer position in order to replace the substrate 2, the control unit 50 causes the distance detection unit 45 to 2 of the member 42. The distance between points is detected. The member 42 at this time is heated due to, for example, heat generated by irradiation of the slit light to the substrate 2 during the exposure process and transmitted to the member 42, heat by light emitted from the position detection unit 41, or the like. Deformation (becomes second shape). Then, the distance between the two points of the member 42 detected by the distance detection unit 45 is the distance D as shown in FIG. The distance D is “B” indicating a change in the position of one end (first mirror 42a) of the member 42 detected by the first interferometer 45a of the distance detector 45, and the distance D of the member 42 detected by the second interferometer 45b. When the change in the position of the other end (second mirror 42b) is “C”, it is expressed by Expression (1). Further, the change rate M of the distance detected by the distance detection unit 45 is expressed by Expression (2).
D = A + (B + C) (1)
M = D / A (2)

When the center of gravity Po (center) of the member 42 before deformation (first shape state) is used as a reference (origin), the control unit 50 expresses the center of gravity Po ′ of the member 42 after deformation (second shape state) by the formula ( 3). Further, the control unit 50 uses the position Ph of the reference mark 43 before the deformation of the member 42 to obtain the position Ph ′ of the reference mark 43 after the deformation of the member 42 by the equation (4), and is caused by the deformation of the member 42. Thus, the positional deviation (Ph′−Ph) of the reference mark 43 generated is predicted. Accordingly, the control unit 50 determines the measurement error of the second measurement unit 70 that has been positioned based on the measurement result of the position of the reference mark 43 that has caused the position shift based on the predicted position shift (predicted value). It can be corrected. Thus, the process of predicting the positional deviation of the reference mark 43 can be performed for each of the plurality of reference marks 43 provided on the member 42.
Po ′ = (B + C) / 2 (3)
Ph ′ = M (Ph−Po) + Po ′ (4)

  Here, the control unit 50 may predict the displacement of each reference mark 43 every time the substrate stage 40 is placed at the substrate transfer position. For example, each time when the change rate M becomes equal to or greater than a threshold value, The positional deviation of the reference mark 43 may be predicted. Further, the method for predicting misalignment is not limited to the method described above. For example, if it can be assumed that the position of the center of gravity of the member 42 does not change before and after the deformation of the member 42, the distance between the center of gravity of the member 42 and the reference mark 43 is multiplied by the rate of change M. You may obtain | require the position of the said reference mark 43 after a deformation | transformation.

[Calibration method for each second measuring section]
Next, a method for calibrating each second measuring unit 70 will be described. One method for calibrating each second measurement unit 70 is to calibrate each second measurement unit 70 by, for example, adjusting the position of each measurement unit 70 by the drive unit 71 based on the predicted positional deviation. There is a way. Specifically, the control unit 50 is driven so as to shift the position of each second measurement unit 70 that is positioned based on the measurement result of each reference mark 43 in the X direction by the predicted positional deviation. The position of each second measurement unit 70 is adjusted by the unit 71. Thus, by calibrating each 2nd measurement part 70, the position of the some mark 4 on a board | substrate can be accurately measured by each 2nd measurement part 70. FIG. Here, the process of shifting each second measurement unit 70 in the X direction by the predicted misalignment can be performed after positioning each second measurement unit 70 based on the measurement result of each reference mark 43. However, the present invention is not limited to this, and may be performed before or during the positioning.

  Further, as another method for calibrating each second measurement unit 70, for example, there is a method for calibrating each second measurement unit 70 by correcting measurement data from each second measurement unit 70. Specifically, the control unit 50 causes each second measurement unit 70 to measure the position of each mark 4 on the substrate without adjusting the position of each second measurement unit 70 based on the predicted positional deviation. Then, the measurement data obtained thereby is corrected based on the predicted positional deviation. For example, the control unit 50 corrects the measurement data by adding (or reducing) the predicted positional deviation to the position of each mark 4 included as information in the measurement data. Thus, also by calibrating each 2nd measurement part 70, the position of the some mark 4 on a board | substrate can be accurately measured by each 2nd measurement part 70. FIG.

  As described above, the exposure apparatus 100 of the present embodiment is provided with the distance detector 45 that detects the distance between two points of the member 42 in the X direction. Then, the positional deviation of each reference mark 43 in the X direction caused by the deformation of the member 42 is predicted from the distance detected by the distance detecting unit 45, and each second measuring unit 70 is based on the predicted positional deviation. Calibrate. Accordingly, even if each reference mark 43 is displaced due to deformation of the member 42, a measurement error that may occur in each second measurement unit 70 that is positioned using each reference mark 43. And the position of each mark 4 on the substrate can be accurately measured. Here, in the present embodiment, the plurality of second measurement units 70, the member 42 having the plurality of reference marks 43, and the distance detection unit 45 can constitute a measurement device that measures the position of each mark 4 on the substrate. . However, the present invention is not limited to these, and measurement is possible as long as it is used for measuring the position of each mark 4 on the substrate, such as the substrate stage 40, the drive unit 71, the position detection unit 41, and the first measurement unit 60. It can be included in the device.

Second Embodiment
An exposure apparatus according to a second embodiment of the present invention will be described. The exposure apparatus of the present embodiment is different from the exposure apparatus 100 of the first embodiment in the configuration of a member 42 having a plurality of reference marks 43. Therefore, in the present embodiment, a configuration of the member 42 and a method for predicting the positional deviation of each reference mark 43 will be described. Further, since the configuration of the exposure apparatus other than the configuration of the member 42 is the same as that of the first embodiment, the description thereof is omitted here.

  FIG. 8 is a view for explaining the configuration of the member 42 of the present embodiment. FIG. 8A is a view of the member 42 provided with a plurality of reference marks 43 on the upper surface, as viewed from the Z direction. FIG. 8B shows the distance in the X direction between at least two points of the member 42. It is the figure which looked at the state currently detected by the distance detection part 45 from the Z direction.

  In the member 42, as shown in FIG. 8A, a plurality of glass plates 44 each having one reference mark 43 are arranged on the upper surface along the X direction. The member 42 is provided with a first mirror 42a and a second mirror 42b at positions in the X direction where the reference marks 43 are provided. Specifically, as shown in FIG. 8B, the first mirror 42 a is arranged at a position in the X direction where the first reference mark 43 a among the plurality of reference marks 43 is provided. Similarly, the 2nd mirror 42b is arrange | positioned in the position of the X direction in which the 2nd reference mark 43b different from the 1st reference mark 43a among the several reference marks 43 is provided. Here, the first mirror 42a and the second mirror 42b are arranged as close as possible in order to reduce detection errors caused by air fluctuations on the optical path in the first interferometer 45a and the second interferometer 45b of the distance detector 45. It is preferred that For example, the first mirror 45a and the second mirror 45b are preferably arranged at positions in the X direction where two reference marks 43 adjacent to each other in the X direction are provided. That is, the first reference mark 43a corresponding to the position of the first mirror 42a and the second reference mark 43b corresponding to the position of the second mirror 42b are preferably adjacent to each other.

  When the first mirror 42a and the second mirror 42b are thus arranged, the position of the first mirror 42a measured by the first interferometer 45a can be made to correspond to the position of the first reference mark 43a. That is, the positional deviation of the first reference mark 43a before and after the deformation of the member 42 can be easily obtained from the change in the position of the first mirror 42a measured by the first interferometer 45a. Similarly, the position of the second mirror 42b measured by the second interferometer 45b can be made to correspond to the position of the second reference mark 43b. That is, the positional deviation of the second reference mark 43b before and after the deformation of the member 42 can be easily obtained from the change in the position of the second mirror 42b measured by the second interferometer 45b.

  On the other hand, with respect to the reference marks 43c other than the first reference mark 43a and the second reference mark 43b, the distance (first mirror 42a and second mirror 42) detected by the distance detector 45 is the positional deviation before and after the deformation of the member 42. 42b), and can be predicted. Hereinafter, a method for predicting the positional deviation of the reference mark 43c based on the distance detected by the distance detection unit 45 will be described with reference to FIG. FIG. 9 is a view showing the position of each reference mark 43 before and after the member 42 is deformed from the first shape to the second shape, and is a view of the upper surface of the member 42 as seen from the Z direction. FIG. 9A is a diagram showing the position of each reference mark 43 when the member 42 has the first shape, and FIG. 9B shows each reference mark 43 when the member 42 has the second shape. FIG. In FIG. 9, the first mirror 42a is disposed at the position Pg in the X direction where the first reference mark 43a is disposed, and the second mirror 42b is disposed at the position Ph in the X direction where the second reference mark 43b is disposed. Is arranged.

The distance detected by the distance detection unit 45 in a state where the member 42 is in the first shape becomes the distance A as shown in FIG. 9A and is stored in the memory as a reference distance. When the exposure process of the substrate 2 held by the substrate stage 40 is completed and the substrate stage 40 is placed at the substrate transfer position in order to replace the substrate 2, the control unit 50 includes the first mirror 42a and the second mirror 42b. The distance detector 45 detects the distance between the two. The member 42 at this time is heated due to, for example, heat generated by irradiation of the slit light to the substrate 2 during the exposure process and transmitted to the member 42, heat by light emitted from the position detection unit 41, or the like. Deformation (becomes second shape). As shown in FIG. 9B, the first reference mark 43a is disposed at the position Pg ′, and the second reference mark 43b is disposed at the position Ph ′. Further, the distance detected by the distance detection unit 45 is the distance D. The distance D is “B” as the change in position of the first mirror 42a (first reference mark 43a) detected by the first interferometer 45a, and the second mirror 42b (second reference) detected by the second interferometer 45b. When the change in the position of the mark 43b) is “C”, it is expressed by the equation (5). Further, the change rate M of the distance detected by the distance detection unit 45 is expressed by Expression (6).
D = A−B + C (5)
M = D / A (6)

When the position of the reference mark 43c before the deformation of the member 42 is “Pa”, the control unit 50 obtains the position Pa ′ of the reference mark 43c after the deformation of the member 42 by Expression (7). Then, the positional deviation (Pa′−Pa) of the reference mark 43c caused by the deformation of the member 42 is predicted. Accordingly, the control unit 50 determines the measurement error of the second measurement unit 70 that has been positioned based on the measurement result of the position of the reference mark 43c that has caused the position shift based on the predicted position shift (predicted value). It can be corrected. The method for correcting the measurement error of the second measurement unit 70 is as described in the first embodiment. Thus, the process of predicting the positional deviation of the reference mark 43 can be performed for each of the plurality of reference marks 43 provided on the member 42.
Pa ′ = Pg′−M (Pg−Pa) (7)

  As described above, in the member 42 of the present embodiment, the first mirror 42a and the second mirror 42b are arranged at the position in the X direction where the reference mark 43 is provided. Also in the member 42 configured in this manner, the positional deviation of the reference mark 43 is predicted based on the detection result of the distance detecting unit 45, and each second measuring unit 70 is calibrated based on the predicted positional deviation. The position of each mark 4 on the substrate can be accurately measured.

<Third Embodiment>
An exposure apparatus according to a third embodiment of the present invention will be described. The exposure apparatus of the present embodiment is different from the exposure apparatus 100 of the first embodiment in the configuration of a member 42 having a plurality of reference marks 43. Therefore, in the present embodiment, a configuration of the member 42 and a method for predicting the positional deviation of each reference mark 43 will be described. Further, since the configuration of the exposure apparatus other than the configuration of the member 42 is the same as that of the first embodiment, the description thereof is omitted here.

  FIG. 10 is a view for explaining the configuration of the member 42 of the present embodiment, and is a view of the member 42 as viewed from the Z direction. In FIG. 10, illustration of the plurality of reference marks 43 provided on the member 42 is omitted, and the first mirror 42a and the second mirror 42b arranged inside the member 42 formed in a cylindrical shape are illustrated. (The member 42 is shown in a watermarked state). The member 42 is supported by a plurality of support portions 47 arranged along the X direction (supported by the substrate stage 40 via the plurality of support portions 47), and the support portion 47 is provided. The 1st mirror 42a and the 2nd mirror 42b are arrange | positioned in the position of a direction. Specifically, the first mirror 42a is disposed at a position in the X direction where the first support portion 47a is disposed among the plurality of support portions 47, and the second mirror 42b is different from the first support portion 47a. It arrange | positions in the position of the X direction in which the 2nd support part 47b is arrange | positioned.

  Next, a method for predicting the positional deviation of the reference mark 43 based on the distance detected by the distance detector 45 (the distance between the first mirror 42a and the second mirror 42b) will be described with reference to FIG. To do. FIG. 11 is a view showing the position of the reference mark 43 before and after the member 42 is deformed from the first shape to the second shape, and is a view of the member 42 and the plurality of support portions 47 as seen from the Z direction. FIG. 11A is a diagram illustrating a state in which the member 42 has the first shape, and FIG. 11B is a diagram illustrating a state in which the member 42 has the second shape. In FIG. 11, the first mirror 42a is disposed at the position Pa in the X direction where the first support 47a is disposed, and the second mirror 42b is disposed at the position Po in the X direction where the second support 47b is disposed. Is arranged. Hereinafter, a method for predicting the positional shift of the reference mark 43 arranged at the position in the X direction between the first mirror 42a and the second mirror 42b will be described.

The distance detected by the distance detection unit 45 in the state where the member 42 is in the first shape becomes the distance A as shown in FIG. 11A and is stored in the memory as the reference distance. When the exposure process of the substrate 2 held by the substrate stage 40 is completed and the substrate stage 40 is placed at the substrate transfer position in order to replace the substrate 2, the control unit 50 includes the first mirror 42a and the second mirror 42b. The distance detector 45 detects the distance between the two. The member 42 at this time is heated due to, for example, heat generated by irradiation of the slit light to the substrate 2 during the exposure process and transmitted to the member 42, heat by light emitted from the position detection unit 41, or the like. Deformation (becomes second shape). As shown in FIG. 11B, the first mirror 42a is arranged at the position Pa ′, and the second mirror 42b is arranged at the position Po ′. Further, the distance detected by the distance detection unit 45 is the distance D. For the distance D, “B” represents a change in the position of the first mirror 42 a detected by the first interferometer 45 a of the distance detector 45, and “A” represents a change in the position of the second mirror 42 b detected by the second interferometer 45 b. C ”is expressed by the equation (8). Further, the change rate M of the distance detected by the distance detection unit 45 is expressed by Expression (9).
D = A + B-C (8)
M = D / A (9)

When the position of the reference mark 43 before the deformation of the member 42 is “Pc”, the control unit 50 obtains the position Pc ′ of the reference mark 43 after the deformation of the member 42 by Expression (10). Then, the positional deviation (Pc′−Pc) of the reference mark 43 caused due to the deformation of the member 42 is predicted. Accordingly, the control unit 50 determines the measurement error of the second measurement unit 70 that has been positioned based on the measurement result of the position of the reference mark 43 that has caused the position shift based on the predicted position shift (predicted value). It can be corrected. The method for correcting the measurement error of the second measurement unit 70 is as described in the first embodiment. Thus, the process of predicting the positional deviation of the reference mark 43 can be performed for each of the plurality of reference marks 43 provided on the member 42.
Pc ′ = M (Pc−Po) + C (10)

  As described above, the member 42 of the present embodiment is supported by the plurality of support portions 47 arranged along the X direction, and the first mirror 42a and the position of the first mirror 42a and the support portion 47 are provided at the position in the X direction. A second mirror 42b is arranged. Also in the member 42 configured in this manner, the positional deviation of the reference mark 43 is predicted based on the detection result of the distance detecting unit 45, and each second measuring unit 70 is calibrated based on the predicted positional deviation. The position of each mark 4 on the substrate can be accurately measured.

<Fourth embodiment>
In the first to third embodiments, the distance detection unit 45 is supported by the structure 6 different from the substrate stage 40, and the X direction between at least two points of the member 42 when the substrate stage 40 moves to a predetermined position. An example of detecting the distance has been described. In the present embodiment, an example in which the distance detection unit 45 is supported by the substrate stage 40 will be described. When the distance detection unit 45 is supported by the substrate stage 40 as described above, the distance in the X direction between at least two points of the member 42 is not limited to when the substrate stage 40 is disposed at a predetermined position. It can be detected by the distance detector 45. Here, since the configuration other than the configuration of the distance detection unit 45 is the same as in the first to third embodiments, the description thereof is omitted.

  FIG. 12 is a diagram illustrating the substrate stage 40 provided with the distance detection unit 45, and FIG. 13 is a diagram illustrating a configuration example of the member 42 and the distance detection unit 45. The light 46d emitted from the light source 46a is split by the beam splitter 46b, a part thereof is guided to the position detection unit 41, and the other part is guided to the distance detection unit 45 via the mirror 46c. The distance detection unit 45 includes a first interferometer 45a, a second interferometer 45b, a beam splitter 45c, and a mirror 45d. A part of the light 46d emitted from the light source 46a and guided to the distance detection unit 45 is reflected by the beam splitter 45c and enters the second interferometer 45b, and another part of the light passes through the beam splitter 45c. The light is transmitted, reflected by the mirror 45d, and enters the first interferometer 45a. Other configurations are as described in the first embodiment.

<Embodiment of Method for Manufacturing Article>
The method for manufacturing an article according to an embodiment of the present invention is suitable, for example, for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to the present embodiment includes a step of forming a pattern on the substrate using the above-described lithography apparatus, and a step of processing the substrate on which the pattern is formed in this step. Further, the manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  As mentioned above, although preferred embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

1: mask, 2: substrate, 10: illumination optical system, 20: mask stage, 30: projection optical system, 40: substrate stage, 41: position detector, 42: member, 43: reference mark, 45: distance detector 47: support unit, 50: control unit, 60: first measurement unit, 70: second measurement unit

Claims (15)

A plurality of measurement units arranged along the first direction, and the plurality of measurement units determine the positions of the plurality of marks provided on the substrate while relatively scanning the substrate and the plurality of measurement units; A measuring device for measuring,
A member having a plurality of reference marks arranged along the first direction;
A detection unit for detecting a deformation amount of the member in the first direction;
A control unit that positions each of the plurality of measurement units based on a result of having the plurality of measurement units observe the plurality of reference marks;
Including
The control unit predicts a positional shift of each of the plurality of reference marks in the first direction caused by the deformation of the member from the deformation amount detected by the detection unit, and the predicted position Based on the deviation, calibrate each of the plurality of measuring units that have been positioned,
A measuring device characterized by that. The control unit adjusts the position of each of the plurality of measurement units so that the position of each of the plurality of measurement units where the positioning has been performed is shifted in the first direction by the predicted positional deviation. To perform the calibration,
The measuring apparatus according to claim 1. The control unit performs the calibration by correcting measurement data from each of the plurality of measurement units based on the predicted positional deviation.
The measuring apparatus according to claim 1. A stage that holds and moves the substrate;
The member is supported by the stage;
The measuring apparatus according to any one of claims 1 to 3, wherein The detection unit is supported by a structure different from the stage so that the deformation amount can be detected when the stage moves to a predetermined position.
The measuring apparatus according to claim 4. The predetermined position is a position where the stage is arranged to transport the substrate onto the stage.
The measuring apparatus according to claim 5. The detection unit is supported by the stage,
The measuring apparatus according to claim 4. A second detector for detecting the position of the stage in a second direction different from the first direction using light reflected on the side surface of the member and reflected on the side surface;
The measuring device according to claim 4, wherein the measuring device is any one of claims 4 to 7. The detection unit detects a distance between at least two points of the member in the first direction as the deformation amount;
The measuring apparatus according to claim 1, wherein the measuring apparatus is one of the following. The member includes a first mirror and a second mirror that are different from each other in the first direction,
The detector uses light to determine the position of the first mirror and the position of the second mirror, and detects the difference between the position of the first mirror and the position of the second mirror as the distance;
The measuring apparatus according to claim 9. The member is formed in a cylindrical shape,
The first mirror and the second mirror are disposed inside the member,
The measuring apparatus according to claim 10. The first mirror is disposed at a position in the first direction where a first reference mark is provided among the plurality of reference marks,
The second mirror is disposed at a position in the first direction where a second reference mark different from the first reference mark among the plurality of reference marks is provided.
The measuring apparatus according to claim 10 or 11, wherein The member is supported by a plurality of support portions arranged along the first direction,
The first mirror is disposed at a position in the first direction where the first support portion is disposed among the plurality of support portions,
The second mirror is disposed at a position in the first direction in which a second support portion different from the first support portion among the plurality of support portions is disposed.
The measuring apparatus according to claim 10 or 11, wherein A lithographic apparatus for forming a pattern on a substrate,
The measurement apparatus according to any one of claims 1 to 13, which measures positions of a plurality of marks provided on the substrate.
A second control unit for controlling the positioning of the substrate based on a measurement result by the measurement device;
A lithographic apparatus comprising: Forming a pattern on a substrate using the lithographic apparatus according to claim 14;
Processing the substrate on which the pattern has been formed in the step;
A method for producing an article comprising:

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