JP6304375B2 - 脆性基板の分断方法およびスクライブ装置 - Google Patents

脆性基板の分断方法およびスクライブ装置 Download PDF

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Publication number
JP6304375B2
JP6304375B2 JP2016529181A JP2016529181A JP6304375B2 JP 6304375 B2 JP6304375 B2 JP 6304375B2 JP 2016529181 A JP2016529181 A JP 2016529181A JP 2016529181 A JP2016529181 A JP 2016529181A JP 6304375 B2 JP6304375 B2 JP 6304375B2
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Japan
Prior art keywords
blade edge
brittle substrate
substrate
line
edge
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JP2016529181A
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Japanese (ja)
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JPWO2015198748A1 (ja
Inventor
曽山　浩
浩 曽山
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of JPWO2015198748A1 publication Critical patent/JPWO2015198748A1/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2016529181A 2014-06-26 2015-05-18 脆性基板の分断方法およびスクライブ装置 Active JP6304375B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014131092 2014-06-26
JP2014131092 2014-06-26
PCT/JP2015/064162 WO2015198748A1 (ja) 2014-06-26 2015-05-18 脆性基板の分断方法およびスクライブ装置

Publications (2)

Publication Number Publication Date
JPWO2015198748A1 JPWO2015198748A1 (ja) 2017-04-20
JP6304375B2 true JP6304375B2 (ja) 2018-04-04

Family

ID=54937846

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JP2016529181A Active JP6304375B2 (ja) 2014-06-26 2015-05-18 脆性基板の分断方法およびスクライブ装置

Country Status (5)

Country Link
JP (1) JP6304375B2 (zh)
KR (1) KR101895819B1 (zh)
CN (1) CN106470814B (zh)
TW (1) TWI651182B (zh)
WO (1) WO2015198748A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202039193A (zh) * 2016-02-26 2020-11-01 日商三星鑽石工業股份有限公司 脆性基板之分斷方法
DE102018131179A1 (de) * 2018-12-06 2020-06-10 Schott Ag Glaselement mit geschnittener Kante und Verfahren zu dessen Herstellung
JP2023123189A (ja) * 2022-02-24 2023-09-05 株式会社デンソー 半導体装置の製造方法
CN116238058B (zh) * 2023-05-12 2023-07-11 山东理工大学 一种脆性材料高效低损加工方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003183040A (ja) * 2001-12-18 2003-07-03 Oputo System:Kk ポイントカッター並びにその使用の方法及び装置
CN1665656A (zh) * 2002-07-01 2005-09-07 三星钻石工业股份有限公司 脆性材料衬底的划线装置以及划线方法
CN100528507C (zh) * 2002-11-06 2009-08-19 三星钻石工业股份有限公司 划线形成设备和划线形成方法
DE102007033242A1 (de) * 2007-07-12 2009-01-15 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Trennen einer Planplatte aus sprödbrüchigem Material in mehrere Einzelplatten mittels Laser
JP5121055B2 (ja) * 2008-02-21 2013-01-16 ＡｖａｎＳｔｒａｔｅ株式会社 スクライブ装置
TWI494284B (zh) * 2010-03-19 2015-08-01 Corning Inc 強化玻璃之機械劃割及分離
TWI498293B (zh) * 2011-05-31 2015-09-01 Mitsuboshi Diamond Ind Co Ltd 劃線方法、鑽石尖、劃線裝置
JP5310787B2 (ja) * 2011-05-31 2013-10-09 三星ダイヤモンド工業株式会社 スクライブ方法
TWI483911B (zh) * 2011-09-28 2015-05-11 Mitsuboshi Diamond Ind Co Ltd 劃線裝置
JP5447478B2 (ja) * 2011-09-28 2014-03-19 三星ダイヤモンド工業株式会社 スクライブ装置
JP2013071871A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd スクライブ装置

Also Published As

Publication number Publication date
JPWO2015198748A1 (ja) 2017-04-20
CN106470814A (zh) 2017-03-01
TW201603981A (zh) 2016-02-01
WO2015198748A1 (ja) 2015-12-30
KR20170007478A (ko) 2017-01-18
TWI651182B (zh) 2019-02-21
KR101895819B1 (ko) 2018-09-07
CN106470814B (zh) 2019-02-12

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