JP6304375B2 - Method for dividing brittle substrate and scribing apparatus - Google Patents

Description

  The present invention relates to a brittle substrate cutting method and a scribing apparatus.

  In the manufacture of electrical equipment such as flat display panels or solar cell panels, it is often necessary to break a brittle substrate such as a glass substrate. First, a scribe line is formed on the substrate, and then the substrate is divided along the scribe line. The scribe line can be formed by sliding the blade edge on the substrate. By this sliding, a trench due to plastic deformation is formed on the substrate, and a vertical crack is formed immediately below the trench. Thereafter, stress is applied, which is called a break process. The substrate is divided by causing the crack to advance completely in the thickness direction by the break process.

  For example, according to JP2013-71871A, a scribe line is formed on a substrate using a diamond point having a blade portion. According to this publication, the cooling gas is injected to the blade portion of the diamond point, so that oxidation of the blade portion due to frictional heat generated between the blade portion and the substrate is suppressed. Life expectancy is realized.

JP 2013-71871 A

  Extending the life of the cutting edge in scribing a brittle substrate is still an important issue in this field, and further techniques are required. This problem is particularly serious when a cutting edge is used that does not roll like a scribing wheel but slides like the diamond point described above.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a brittle substrate cutting method and a scribing device that can extend the life of the cutting edge.

The method for dividing a brittle substrate of the present invention includes the following steps. To one of the brittle surface of the substrate, the cutting edge is pressed with a front that led to the protruding portion and the protrusion, Ru is is positioned inner side than the protrusion the surface of the brittle substrate. The pressed blade edge is slid in the direction in which the front part faces on the surface of the brittle substrate. When the cutting edge is slid, plastic deformation occurs in the brittle substrate, so that at least one trench line having a groove shape is formed on the surface of the brittle substrate. When the blade edge is slid, the position at the same height as the surface of the brittle substrate is changed in the front part of the blade edge. Further, the step of sliding the blade edge is performed so as to obtain a crackless state in which the blade edge is continuously connected in a direction intersecting the brittle substrate trench line immediately below the trench line .

According to the present invention, when the cutting edge is slid, the position at which the cutting edge is flush with the brittle substrate surface changes, and a plurality of positions in the front part of the cutting edge are at the same height as the brittle substrate surface. It is said. Thereby, the position where the blade edge is particularly worn is diffused. Therefore, the life of the blade edge can be extended.

It is a figure which shows schematically the structure of the scribing apparatus in Embodiment 1 of this invention. It is a figure which shows roughly the mode of the displacement of the blade edge | tip in Embodiment 1 of this invention, and a figure which shows a blade edge | tip in the visual field of the arrow IIB. It is sectional drawing (A) which shows schematically the structure of a trench line in a crackless state, and sectional drawing (B) which shows the structure of a crack line roughly. In the brittle substrate cutting method according to Embodiment 1 of the present invention, when the blade edge is slid, a plurality of positions on the side portion as the front portion of the blade edge are set to the same height as the surface of the brittle substrate. FIG. It is a perspective view (A)-(C) which shows each of the 1st-3rd example of the load change in the cutting method of a brittle board in Embodiment 1 of the present invention. It is sectional drawing which shows the 4th example of the load change in the cutting method of the brittle board | substrate in Embodiment 1 of this invention. It is a figure which shows roughly the mode of displacement of the blade edge | tip in Embodiment 2 of this invention, and a figure which shows a blade edge | tip in the visual field of the arrow VIIB. In the brittle substrate cutting method according to Embodiment 2 of the present invention, when the blade edge is being slid, a plurality of positions on the top surface as the front part of the blade edge are set to the same height as the surface of the brittle substrate. (A) which shows a mode to show, and the figure (B) of the visual field of the arrow VIIIB. It is a figure which shows schematically the structure of the scribing apparatus in Embodiment 3 of this invention. It is a figure which shows schematically the structure of the scribe head in the modification of Embodiment 3 of this invention. It is a top view (A) and (B) which shows each roughly the 1st and 2nd process of the cutting method of a brittle board in Embodiment 4 of the present invention. It is a top view (A) and (B) which shows each roughly the 1st and 2nd process of the cutting method of the brittle board | substrate of the 1st modification of Embodiment 4 of this invention. It is a top view which shows roughly the division | segmentation method of the brittle board | substrate of the 2nd modification of Embodiment 4 of this invention. It is a top view which shows roughly the division | segmentation method of the brittle board | substrate of the 3rd modification of Embodiment 4 of this invention. It is a top view which shows roughly the 1st process of the cutting method of a brittle board | substrate in Embodiment 5 of this invention. It is a top view which shows roughly the 2nd process of the cutting method of a brittle board | substrate in Embodiment 5 of this invention. It is a top view which shows roughly the 3rd process of the cutting method of a brittle board | substrate in Embodiment 5 of this invention. It is a top view which shows roughly the division | segmentation method of the brittle board | substrate of the 1st modification of Embodiment 5 of this invention. It is a top view (A) and (B) which shows each roughly the 1st and 2nd process of the cutting method of the brittle board | substrate of the 2nd modification of Embodiment 5 of this invention. It is a top view which shows roughly the division | segmentation method of the brittle board | substrate of the 3rd modification of Embodiment 5 of this invention. It is a top view which shows roughly the cutting method of the brittle board | substrate in Embodiment 6 of this invention. It is a top view (A) and (B) which shows each roughly the 1st and 2nd process of the cutting method of a brittle board in Embodiment 7 of the present invention. It is the top view (A) and (B) which shows each of the 1st and 2nd process of the cutting method of a brittle board | substrate in Embodiment 8 of this invention roughly. It is a top view which shows roughly the division | segmentation method of the brittle board | substrate of the modification of Embodiment 8 of this invention. It is the figure which shows the mode of the displacement of the blade edge | tip in Embodiment 9 of this invention schematically (A), and a figure which shows a blade edge | tip in the visual field of the arrow XXVB. In the brittle substrate cutting method according to the ninth embodiment of the present invention, when the blade edge is slid, a plurality of positions on the side portion as the front portion of the blade edge are set to the same height as the surface of the brittle substrate. FIG. It is the figure which shows the mode of the displacement of the blade edge | tip in the modification of Embodiment 9 of this invention (A), and a figure which shows a blade edge | tip in the visual field of the arrow XXVIIB. In the brittle substrate cutting method according to the modification of the ninth embodiment of the present invention, when the blade edge is slid, a plurality of positions in the front part of the blade edge are set to the same height as the surface of the brittle substrate. It is a figure which shows a mode.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.

(Embodiment 1)
FIG. 1 is a diagram schematically showing a configuration of a scribing apparatus 100 in the present embodiment. In the figure, a glass substrate 4 (brittle substrate) to be divided is indicated by a two-dot chain line. Further, for convenience of explanation, an XYZ orthogonal coordinate system is shown, and in the illustrated example, division along the X direction is performed. The scribing apparatus 100 includes a scribing head 60, a driving unit 70, a stage 80 (substrate support unit), and a control unit 90.

  The scribe head 60 includes a cutting tool 50, a posture adjusting unit 61, a holding unit 62, a pressurizing unit 63, and a main body unit 64. The cutting instrument 50 has a cutting edge 51 and a shank 52 (FIG. 2A). The posture adjustment unit 61 supports the cutting device 50 so that the posture of the cutting device 50 can be adjusted. The holding unit 62 holds the posture adjusting unit 61. The pressurizing unit 63 is an actuator that is fixed to the main body unit 64 and can apply a force to the holding unit 62.

  The stage 80 supports one glass substrate 4 (one brittle substrate) having a surface SF.

  The drive unit 70 relatively displaces the glass substrate 4 supported by the stage 80 and the blade edge 51. Therefore, the drive unit 70 may be one that displaces either the blade edge 51 or the stage 80, or may be one that displaces each of the blade edge 51 and the stage 80. In the present embodiment, the drive unit 70 includes a stage drive unit 71 that displaces the stage 80 and a head drive unit 72 that displaces the main body 64 of the scribe head 60. The stage drive unit 71 applies, for example, a translational displacement along each of the XYZ axes in the drawing and a rotational displacement around the Z axis in the drawing to the stage 80. The head drive unit 72 gives, for example, a translational displacement along the X axis in the drawing to the main body 64 of the scribe head 60.

  The control unit 90 includes a pre-sliding control unit 91, a sliding control unit 92, and a post-sliding control unit 93. The control unit 90 controls the driving unit 70 and the pressurizing unit 63.

  The pre-sliding control unit 91 controls the driving unit 70 so that the blade edge 51 is pressed onto the surface SF prior to the sliding of the blade edge 51 on the surface SF of the glass substrate 4.

  The sliding control unit 92 controls the driving unit 70 so that the blade edge 51 slides in the direction in which the front portion of the blade edge 51 faces on the surface SF of the glass substrate 4. Further, the sliding control unit 92 controls the pressing unit 63 so that a plurality of positions in the front part of the cutting edge 51 sliding on the glass substrate 4 are at the same height as the surface of the glass substrate 4. To do. In other words, the sliding control unit 92 controls the pressurizing unit 63 so that the front portion of the blade edge 51 sliding on the glass substrate 4 is positioned at the same height as the surface SF of the glass substrate 4. Change. For this purpose, the sliding control unit 92 changes the load applied to the blade edge 51 by changing the force generated by the pressurizing unit 63.

  The after-sliding control unit 93 controls the driving unit 70 so that the blade edge 51 is detached from the surface SF of the glass substrate 4 after the blade edge 51 is slid on the surface SF of the glass substrate 4. is there.

  2A and 2B, the blade edge 51 is provided with a top surface SD1 (first surface) and a plurality of surfaces surrounding the top surface SD1. The plurality of surfaces include a side surface SD2 (second surface) and a side surface SD3 (third surface). The top surface SD1, the side surfaces SD2, and SD3 (first to third surfaces) face different directions and are adjacent to each other. The blade edge 51 has a vertex at which the top surface SD1, the side surfaces SD2 and SD3 merge, and the protrusion PP of the blade edge 51 is configured by this vertex. Therefore, the top surface SD1 is connected to the protrusion PP. Further, the side surfaces SD2 and SD3 form ridge lines constituting the side portion PS of the blade edge 51. The side part PS is connected to the protrusion part PP and extends linearly from the protrusion part PP. Moreover, since the side part PS is a ridgeline as mentioned above, it has the convex shape extended linearly.

  The cutting edge 51 is preferably a diamond point. That is, the cutting edge 51 is preferably made of diamond from the viewpoint that the hardness and the surface roughness can be reduced. More preferably, the cutting edge 51 is made of single crystal diamond. More preferably, crystallographically, the top surface SD1 is a {001} plane, and each of the side surfaces SD2 and SD3 is a {111} plane. In this case, although the side surfaces SD2 and SD3 have different orientations, they are crystal surfaces that are equivalent to each other in terms of crystallography.

  Diamond that is not a single crystal may be used. For example, polycrystalline diamond synthesized by a CVD (Chemical Vapor Deposition) method may be used. Alternatively, sintered diamond obtained by bonding polycrystalline diamond particles, which are sintered from fine graphite or non-graphitic carbon without containing a binder such as an iron group element, with a binder such as an iron group element is used. May be.

  The shank 52 extends along the axial direction AX. The blade edge 51 is preferably attached to the shank 52 so that the normal direction of the top surface SD1 is approximately along the axial direction AX. It is preferable that the angle of the axial direction AX with respect to the surface SF of the glass substrate 4 can be adjusted by the attitude adjusting unit 61 (FIG. 1). In this case, the posture adjustment unit 61 can adjust the posture of the cutting edge 51 with respect to the surface SF.

  Next, the operation of the scribing apparatus 100 will be described.

  First, the cutting edge 51 is pressed against the surface SF of the glass substrate 4 by the control of the driving unit 70 and the pressurizing unit 63 by the pre-sliding control unit 91. When the blade edge 51 is pressed against the surface SF, the projecting portion PP is positioned on the substrate inner side with respect to the substrate surface SF.

  Next, by the control of the driving unit 70 by the sliding control unit 92, the pressed blade edge 51 is slid on the surface SF approximately along the direction in which the side portion PS is projected onto the upper surface SF1. In the present embodiment, the side part PS of the blade edge 51 is the front part during sliding, and the pressed blade edge 51 is on the surface SF of the glass substrate 4 in the direction DA (+ X axis in the figure). Direction). The direction DA corresponds to a direction obtained by projecting the axial direction AX extending from the blade edge 51 onto the surface SF. During sliding, the blade edge 51 is dragged on the surface SF by the shank 52.

  By causing plastic deformation of the glass substrate 4 by sliding the blade edge 51, at least one trench line TL having a groove shape on the surface SF of the glass substrate 4 (FIG. 3 (A) or (B)). Is formed. Although the trench line TL is generated by plastic deformation of the glass substrate 4, the glass substrate 4 may be slightly shaved at this time. However, since such scraping can generate fine fragments, it is preferable that the amount is as small as possible.

  When the trench line TL is formed without a crack by sliding the blade edge 51 (FIG. 3A), and when the trench line TL is formed and the crack line CL is formed substantially at the same time. There is. The crack line CL is a crack extending in the thickness direction DT from the recess of the trench line TL, and extends linearly on the surface SF.

  In the former case, the step of forming the trench line TL is performed in the direction DC (Y-axis direction in the drawing) in which the glass substrate 4 intersects the extending direction (X-axis direction in the drawing) of the trench line TL immediately below the trench line TL. ) In such a way that a crackless state, which is continuously connected, is obtained. In order to obtain a crackless state, the load applied to the blade edge 51 is made small to the extent that no cracks are generated and large to the extent that plastic deformation occurs. After the formation of the trench line TL in the crackless state (FIG. 3A), the cracks of the glass substrate 4 in the thickness direction DT are extended along the trench line TL by a method described later, thereby generating a crack. A line CL (FIG. 3B) may be formed. The crackless state is broken by the formation of the crack line CL. That is, the crack line CL breaks the continuous connection of the glass substrate 4 in the direction DC intersecting the trench line TL immediately below the trench line TL.

  In any case, the glass substrate 4 is divided along the crack line CL. At this time, a so-called break process is performed as necessary.

  When the cutting edge 51 is being slid by the sliding control unit 92, a plurality of positions (for example, positions O1 and O2 in FIG. 4) on the side portion PS as the front part of the cutting edge 51 are the surface SF of the glass substrate 4. And the same height. For that purpose, the load applied to the sliding blade edge 51 is changed. The load can be changed by adjusting the force generated by the pressurizing unit 63. The positions O1 and O2 are preferably separated from each other by, for example, about 0.5 to 2.5 μm in height.

  Note that only the positions O1 and O2 need not be the same height as the surface SF of the glass substrate 4, and the surface SF may be continuously displaced between the positions O1 and O2 during sliding. In this case, any position between the positions O1 and O2 has a time point having the same height as the surface SF.

  According to the present embodiment, when the blade edge 51 is slid on one glass substrate 4, the load on the blade edge 51 is changed. The load can be changed, for example, so that the maximum value is about 1.5 to 2 times the minimum value. Thereby, the positions O1 and O2 (FIG. 4) in the side part PS as the front part of the blade edge 51 are set to the same height as the surface SF of the glass substrate 4. Therefore, when the cutting edge 51 is slid on one glass substrate 4, only one position (for example, only the position O1) at the front portion of the cutting edge 51 is the same height as the surface SF of the glass substrate 4. Compared with the case where it is taken, the position where the blade edge 51 is particularly worn is diffused. Therefore, the life of the blade edge 51 can be extended.

  The load applied to the blade edge 51 during sliding can be changed at any time during scribing for one brittle substrate. Examples thereof will be described below.

  Each of FIGS. 5A to 5C shows an example of scribing on the glass substrate 4 as a brittle substrate. In the figure, a thick line represents a relatively large load, and a thin line represents a relatively small load.

  In the example of FIG. 5A, sliding of the blade edge 51 (FIG. 2A) on the surface SF of the glass substrate 4 is performed along a straight line SLXm along the X axis and a straight line SLYm along the Y axis. . A load change is applied to the cutting edge 51 during sliding in each of the straight lines SLXm. The same applies to each of the straight lines SLYm.

  In the example of FIG. 5B, sliding of the blade edge 51 (FIG. 2A) on the surface SF of the glass substrate 4 is performed by straight lines SLXw and SLXs along the X axis, and straight lines SLYw and SLYs along the Y axis. It is performed along with. The load on the blade edge 51 during sliding in each straight line is constant. The load on the straight line SLXs and the load on the straight line SLXw are different from each other. In other words, the load is changed between the straight lines SLXs and SLXw. The load on SLYs and the load on straight line SLYw are different from each other. In other words, the load is changed between the straight lines SLYs and SLYw. In this example, the load used differs between the mutually adjacent straight lines. For example, when sliding is performed in the order of the straight lines SLYs, SLYw, SLYs, and SLYw arranged in one direction (right direction in the figure), the load intensity changes alternately in sliding on these straight lines. Is granted.

  In the example of FIG. 5C, sliding of the blade edge 51 on the surface SF of the glass substrate 4 is performed along a straight line SLXs along the X axis and a straight line SLYw along the Y axis. The load on the blade edge 51 during sliding in each straight line is constant. The load on the straight line SLXs and the load on the straight line SLYw are different from each other. In other words, the load is changed between the straight lines SLXs and SLYw.

  In the example of FIG. 6, sliding is performed on the surface SF of one cell substrate 4C (brittle substrate). The cell substrate 4C includes substrates (for example, glass substrates) 4T and 4B made of a brittle material. The substrates 4T and 4B are stacked on each other via the joint 9. Thereby, the surface SF has a portion ST made of the substrate 4T and a portion SB made of the substrate 4B. Sliding of the blade edge 51 on the surface SF of the cell substrate 4C is performed on the part ST (see arrow SLTw) and the part SB (see arrow SLBs). The load on the cutting edge 51 during sliding on the portion ST is constant, and the load on the cutting edge 51 during sliding on the portion SB is constant. On the other hand, the load on the sliding blade edge 51 is increased on the portion SB as compared with the portion ST. In other words, the load is changed between the portions ST and SB.

(Embodiment 2)
7A and 7B, in the present embodiment, blade edge 51 is slid in direction DB opposite to direction DA (FIGS. 1A and 1B). Since the configuration other than the above is substantially the same as the configuration of the first embodiment described above, the same or corresponding elements are denoted by the same reference numerals, and description thereof is not repeated.

  According to the present embodiment, the load on the blade edge 51 is changed when the blade edge 51 is slid on one glass substrate 4, whereby the position on the top surface SD <b> 1 as the front portion of the blade edge 51. O1 and O2 (FIG. 8A) are at the same height as the surface SF of the glass substrate 4. Thereby, when the cutting edge 51 is slid on one glass substrate 4, only one position in the front part of the cutting edge 51 is set to the same height as the surface SF of the glass substrate 4. Thus, the position where the blade edge 51 is particularly worn is diffused. Therefore, the life of the blade edge 51 can be extended.

  When the blade edge 51 slides in the direction DB, the glass substrate 4 and the blade edge 51 are in contact with each other at a predetermined length at each of the positions O1 and O2, unlike when the blade edge 51 slides in the direction DA. Thus (see FIG. 8B), the life of the blade edge 51 can be further extended.

(Embodiment 3)
FIG. 9 is a diagram schematically showing the configuration of the scribing apparatus 100V in the present embodiment. In the figure, the glass substrate 4 to be divided is indicated by a two-dot chain line. Further, for convenience of explanation, an XYZ orthogonal coordinate system is shown, and in the illustrated example, division along the X direction is performed. The scribing device 100V includes a scribing head 60V and a control unit 90V.

  The scribing head 60V includes an attitude adjustment unit 61V that can change the attitude of the cutting edge 51 (see the arrow in the figure) when the cutting edge 51 (FIG. 2A) is slid. As the change in posture, for example, the angle of the axial direction AX (FIG. 2A or FIG. 7A) with respect to the surface SF is changed.

  The control unit 90V controls the drive unit 70, the pressurizing unit 63, and the posture adjusting unit 61V, and includes a sliding control unit 92V. The sliding control unit 92 </ b> V controls the driving unit 70 so that the cutting edge 51 slides in the direction in which the front part of the cutting edge 51 faces on the surface SF of the glass substrate 4. Further, the sliding control unit 92 </ b> V controls the posture adjusting unit 61 </ b> V so that a plurality of positions at the front part of the cutting edge 51 sliding on the glass substrate 4 are at the same height as the surface SF of the glass substrate 4. Control. In other words, the sliding control unit 92V controls the posture adjusting unit 61V so that the position of the same height as the surface SF of the glass substrate 4 at the front portion of the blade edge 51 sliding on the glass substrate 4 is obtained. Change. For this purpose, the sliding control unit 92V changes the posture of the cutting edge 51. For example, it is preferable to change the angle of the blade edge 51 by 1 to 5 °. When the posture of the blade edge 51 changes, the degree of the cutting edge 51 biting into the surface SF changes, so that the position at the same height as the surface SF of the glass substrate 4 at the front portion of the blade edge 51 changes.

  FIG. 10 is a diagram schematically showing a configuration of a scribe head 60W as a modification of the scribe head 60V (FIG. 9) in the present embodiment. Scribe head 60W has body part 110, cutting instrument 50, pressurizing part 63W, and main part 64W. The cutting instrument 50 is attached to the body part 110. The cutting tool 50 is pressed against the surface SF of the glass substrate 4 with a load F by the action from the body portion 110. The body part 110 includes a body main body 111 and a cutting tool support member 112. The cutting tool support member 112 supports the shank 52 so that the axial direction AX (FIG. 2) of the shank 52 of the cutting tool 50 can be adjusted. The main body portion 64 </ b> W includes a base main body 151 and a limiter 152. The base body 151 has a fulcrum ST that supports the body 110 so as to be rotatable. The limiter 152 limits the range in which the body portion 110 can rotate downward. The pressurizing part 63W is supported by the main body part 64W. The pressurizing part 63W can apply a continuous force LD to the body part 110 so that the cutting tool 50 is pressed onto the surface SF of the glass substrate 4. The pressurizing unit 63W includes an air cylinder for generating the force LD and a pressing pin for transmitting the force.

  According to the scribing head 60W of this modification, the load F applied to the blade edge 51 (FIG. 2) is changed by changing the force LD by the pressurizing part 63W, and at the same time, the body part 110 is rotated around the fulcrum ST. Accordingly, the posture of the blade edge 51 can be changed. Therefore, the posture of the blade edge 51 can be easily changed even during scribing. The scribe head 60W has a simple configuration as compared with a case where a dedicated mechanism for adjusting the posture during scribing is provided. Therefore, the scribe head 60W can be easily reduced in weight, and is therefore suitable for scribe with a low load.

  Since the configuration other than the above is substantially the same as the configuration of the first or second embodiment described above, the same or corresponding elements are denoted by the same reference numerals, and description thereof will not be repeated.

(Embodiment 4)
In the method for dividing a brittle substrate in the fourth and subsequent embodiments, a crackless trench line TL (FIG. 3A) is formed using the method described in any of the first to third embodiments, and the trench A crack line CL (FIG. 3B) along the line TL is formed. As described above, when the blade edge 51 is slid to form the trench line TL, a plurality of positions in the front portion of the blade edge 51 are set to the same height as the surface SF of the glass substrate 4. .

  Referring to FIG. 11A, first, a glass substrate 4 is prepared. The glass substrate 4 has a flat upper surface SF1 as the surface SF (FIG. 2A). The edge surrounding the upper surface SF1 includes a side ED1 and a side ED2 that face each other. In the example shown in FIG. 11A, the edge has a rectangular shape. Therefore, the sides ED1 and ED2 are sides parallel to each other. In the example shown in FIG. 11A, the sides ED1 and ED2 are rectangular short sides. The glass substrate 4 has a thickness direction DT (FIG. 2A) perpendicular to the upper surface SF1.

  Next, the blade edge 51 is pressed against the upper surface SF1 at the position N1. Details of the position N1 will be described later. With reference to FIG. 2A, the cutting edge 51 is pressed such that the projection PP of the cutting edge 51 is disposed between the side ED1 and the side portion PS on the upper surface SF1 of the glass substrate 4 and the cutting edge 51 is pressed. The side PS is arranged between the protrusion PP and the side ED2.

  Next, trench lines TLa to TLe (also collectively referred to as trench lines TL) are formed on upper surface SF1. At this time, as described in the first embodiment, when the blade edge 51 is slid, a change in load or posture can be given to the blade edge 51. Specifically, the load or posture of the blade edge 51 may be changed in each of the trench lines TLa to TLe, similarly to the straight line SLXm in FIG. Or the load or attitude | position of the blade edge | tip 51 may be changed between different trench lines among trench lines TLa-TLe similarly to the straight lines SLXw and SLXs of FIG.5 (B). For example, the trench lines TLa, TLc, and TLe may be formed with a relatively large load, and the trench lines TLb and TLd may be formed with a relatively small load.

  The formation of the trench line TL is performed between the position N1 (first position) and the position N3. A position N2 (second position) is located between the positions N1 and N3. Therefore, trench line TL is formed between positions N1 and N2 and between positions N2 and N3. The positions N1 and N3 are away from the edge of the upper surface SF1 of the glass substrate 4. Therefore, the formed trench line TL may be located away from the edge of the glass substrate 4 as shown in FIG. 11A, or one or both of them may be located at the edge of the upper surface SF1. . The formed trench line TL is separated from the edge of the glass substrate 4 in the former case, and is in contact with the edge of the glass substrate 4 in the latter case.

  Of the positions N1 and N2, the position N1 is closer to the side ED1, and the position N2 of the positions N1 and N2 is closer to the side ED2. In the example shown in FIG. 11A, the position N1 is close to the side ED1 of the sides ED1 and ED2, and the position N2 is close to the side ED2 of the sides ED1 and ED2, but both the positions N1 and N2 are the sides ED1 or It may be located near either one of ED2.

  When the trench line TL is formed, in the present embodiment, the blade edge 51 is displaced from the position N1 to the position N2, and is further displaced from the position N2 to the position N3. That is, with reference to FIG. 2A, the blade edge 51 is displaced in a direction DA that is a direction from the side ED1 toward the side ED2. The direction DA corresponds to a direction in which the axial direction AX extending from the blade edge 51 is projected onto the upper surface SF1. In this case, the blade edge 51 is dragged on the upper surface SF <b> 1 by the shank 52.

  Referring to FIG. 11B, after trench line TL is formed, glass substrate 4 in thickness direction DT extends from position N2 toward position N1 along trench line TL (see the broken line arrow in the figure). The crack line CL (FIG. 3B) is formed by extending the cracks. Formation of the crack line CL is started when the assist line AL and the trench line TL intersect each other at the position N2. For this purpose, the assist line AL is formed after the trench line TL is formed. The assist line AL is a normal scribe line with a crack in the thickness direction DT, and releases internal stress distortion in the vicinity of the trench line TL. The method of forming the assist line AL is not particularly limited, but may be formed using the edge of the upper surface SF1 as a base point as shown in FIG.

  Note that the crack line CL is less likely to be formed in the direction from the position N2 to the position N3 than in the direction from the position N2 to the position N1. That is, the ease of extension of the crack line CL has a direction dependency. Therefore, the phenomenon that the crack line CL is formed between the positions N1 and N2 but not between the positions N2 and N3 may occur. The present embodiment is intended to divide the glass substrate 4 along the positions N1 and N2, and is not intended to separate the glass substrate 4 along the positions N2 and N3. Therefore, while it is necessary to form the crack line CL between the positions N1 and N2, the difficulty of forming the crack line CL between the positions N2 and N3 is not a problem.

  Next, the glass substrate 4 is divided along the crack line CL. Specifically, a break process is performed. Note that, when the crack line CL is completely advanced in the thickness direction DT at the time of formation, the formation of the crack line CL and the division of the glass substrate 4 may occur at the same time. In this case, the break process can be omitted.

  Thus, the glass substrate 4 is divided.

  Next, the 1st-3rd modification of the said dividing method is demonstrated below.

  Referring to FIG. 12A, the first modification relates to a case where the intersection of the assist line AL and the trench line TL is insufficient as a trigger for starting the formation of the crack line CL (FIG. 11B). Is. Referring to FIG. 12B, by applying an external force that generates a bending moment or the like to glass substrate 4, a crack in thickness direction DT extends along assist line AL. As a result, glass substrate 4 is To be separated. Thereby, formation of the crack line CL is started. In FIG. 12A, the assist line AL is formed on the upper surface SF1 of the glass substrate 4, but the assist line AL for separating the glass substrate 4 is the lower surface of the glass substrate 4 (the surface opposite to the upper surface SF1). ) May be formed on. In this case, the assist line AL and the trench line TL intersect each other at the position N2 in the planar layout, but do not directly contact each other.

  Referring to FIG. 13, in the second modification, the blade edge 51 is pressed against the upper surface SF <b> 1 of the glass substrate 4 at a position N <b> 3. When the trench line TL is formed, in the present modification, the blade edge 51 is displaced from the position N3 to the position N2, and is further displaced from the position N2 to the position N1. That is, referring to FIG. 7, the blade edge 51 is displaced in a direction DB that is a direction from the side ED2 toward the side ED1. The direction DB corresponds to a direction opposite to the direction in which the axial direction AX extending from the blade edge 51 is projected onto the upper surface SF1. In this case, the blade edge 51 is pushed forward on the upper surface SF 1 by the shank 52.

  Referring to FIG. 14, in the third modification, when each trench line TLm included in the plurality of trench lines TL is formed, the blade edge 51 is formed on the upper surface SF <b> 1 of the glass substrate 4 as compared with the position N <b> 1. It is pressed with a larger load at the position N2. Specifically, with the position N4 as a position between the positions N1 and N2, the load on the blade edge 51 is increased when the formation of the trench line TLm reaches the position N4. In other words, the load on the trench line TLm is increased between the positions N4 and N3 which are the end portions of the trench line TLm, as compared with the position N1. Thereby, formation of the crack line CL from the position N2 can be easily induced while reducing a load at a portion other than the terminal portion.

  According to the present embodiment, the crack line CL can be more reliably formed from the trench line TL. Moreover, the lifetime of the blade edge | tip 51 can be lengthened by diffusing the position where the blade edge | tip 51 is worn similarly to Embodiment 1-3.

(Embodiment 5)
A method for dividing a brittle substrate in the present embodiment will be described below with reference to FIGS.

  Referring to FIG. 15, in the present embodiment, assist line AL is formed before formation of trench line TL. The method of forming the assist line AL is the same as that in FIG. 11B (Embodiment 4).

  Referring to FIG. 16, next, the blade edge 51 is pressed against the upper surface SF1, and the trench line TL is formed. The method of forming the trench line TL itself is the same as that in FIG. 11A (Embodiment 4). The assist line AL and the trench line TL intersect each other at the position N2.

  Referring to FIG. 17, next, glass substrate 4 is separated along assist line AL by a normal break process in which an external force that generates a bending moment or the like is applied to glass substrate 4. Thereby, formation of the crack line CL similar to that of the fourth embodiment is started (see the broken line arrow in the figure). In FIG. 15, the assist line AL is formed on the upper surface SF <b> 1 of the glass substrate 4, but the assist line AL for separating the glass substrate 4 may be formed on the lower surface of the glass substrate 4. In this case, the assist line AL and the trench line TL intersect each other at the position N2 in the planar layout, but do not directly contact each other.

  The configuration other than the above is substantially the same as the configuration of the fourth embodiment described above.

  Referring to FIG. 18, in the first modification, formation of crack line CL is started when assist line AL and scribe line SL intersect each other at position N2.

  Referring to FIG. 19A, in the second modified example, each trench line TL is formed from position N3 to position N1, as in FIG. 13 (Embodiment 4). Referring to FIG. 19B, the glass substrate 4 is separated along the assist line AL by applying an external force that generates a bending moment or the like to the glass substrate 4. Thereby, formation of the crack line CL is started (see the broken line arrow in the figure).

  Referring to FIG. 20, in the third modified example, when each trench line TLm included in the plurality of trench lines TL is formed, the blade edge 51 is on the upper surface SF <b> 1 of the glass substrate 4 as compared with the position N <b> 1. It is pressed with a greater force at the position N2. Specifically, with the position N4 as a position between the positions N1 and N2, the load on the blade edge 51 is increased when the formation of the trench line TLm reaches the position N4. In other words, the load on the trench line TLm is increased between the positions N4 and N3, which are the end portions of the trench line TL, as compared with the position N1. Thereby, formation of the crack line CL from the position N2 can be easily induced while reducing a load at a portion other than the terminal portion.

(Embodiment 6)
Referring to FIG. 21, in formation of each trench line TL in the present embodiment, blade edge 51 is slid beyond side ED2 from position N1. When the blade edge 51 passes the side ED2, the stress distortion generated in the substrate immediately below the trench line TL is released, and a crack line extends from the end of the trench line TL located on the side ED2 toward the position N1.

  The load applied to the blade edge 51 when forming the trench line TL may be constant, but when the blade edge 51 is displaced from the position N1 to the position N2, the load applied to the blade edge 51 at the position N2 increases. May be. For example, the load is increased by about 50%. The cutting edge 51 to which the increased load is applied is slid over the side ED2. In other words, the load on the cutting edge 51 is increased at the end of the trench line TL. When the blade edge 51 reaches the side ED2, the crack line extends from the end of the trench line TL located on the side ED2 toward the position N1 via the position N2. When the load is increased in this way, the stress distortion also increases, and the stress distortion is easily released when the cutting edge 51 passes the side ED2, so that the crack line can be formed more reliably. .

  The configuration other than the above is substantially the same as the configuration of the fourth embodiment described above.

(Embodiment 7)
Referring to FIG. 22A, in the method for dividing a brittle substrate in the present embodiment, trench line TL is formed from position N1 to side ED2 via position N2.

  Referring to FIG. 22B, next, a stress is applied between position N2 and side ED2 so as to release the distortion of internal stress in the vicinity of trench line TL. This induces the formation of crack lines along the trench line TL. Specifically, as the application of stress, the pressed blade edge 51 is slid between the position N2 and the side ED2 (the region between the broken line and the side ED2 in the drawing) on the upper surface SF1. This sliding is performed until the side ED2 is reached. The cutting edge 51 is preferably slid so as to intersect the track of the trench line TL formed first, and more preferably to overlap the track of the trench line TL formed first. The length of this second sliding is, for example, about 0.5 mm. This re-sliding may be performed on each of the plurality of trench lines TL (FIG. 22A) after they are formed, or the formation and re-sliding of one trench line TL may be performed. The process to be performed may be sequentially performed for each trench line TL.

  As a modification, in order to apply a stress between the position N2 and the side ED2, a laser beam is irradiated between the position N2 and the side ED2 on the upper surface SF1 instead of the sliding of the cutting edge 51 described above. May be. Due to the thermal stress generated thereby, the distortion of the internal stress in the vicinity of the trench line TL is released, thereby inducing the start of formation of the crack line.

  The configuration other than the above is substantially the same as the configuration of the fourth embodiment described above.

(Embodiment 8)
Referring to FIG. 23A, in the method for dividing a brittle substrate in the present embodiment, the blade edge 51 is moved away from the edge of upper surface SF1 by displacing blade edge 51 from position N1 to position N2, and further to position N3. A trench line TL is formed. The method of forming the trench line TL itself is almost the same as that in FIG. 11A (Embodiment 4).

  Referring to FIG. 23 (B), the same stress application as in FIG. 22 (B) (Embodiment 7 or its modification) is performed. This induces the formation of crack lines along the trench line TL.

  The configuration other than the above is substantially the same as the configuration of the fourth embodiment described above.

  Referring to FIG. 24, as a modification of the process of FIG. 23A, in forming trench line TL, cutting edge 51 may be displaced from position N3 to position N2 and from position N2 to position N1.

(Embodiment 9)
Referring to FIGS. 25 (A) and (B), in each of the above embodiments, blade edge 51v may be used instead of blade edge 51 (FIGS. 2 (A) and (B)). The blade edge 51v has a conical shape having a vertex and a conical surface SC. The protruding part PPv of the blade edge 51v is constituted by a vertex. The side portion PSv of the blade edge is configured along a virtual line (broken line in FIG. 25B) extending from the apex to the conical surface SC. Thereby, the side part PSv has a convex shape extending linearly.

  In the present embodiment, the side part PSv of the blade edge 51v is the front part in sliding, and the pressed blade edge 51v is slid on the surface SF of the glass substrate 4 in the direction DA in which the side part PS faces. The direction DA corresponds to a direction in which the axial direction AX extending from the blade edge 51v is projected onto the surface SF. During the sliding, the blade edge 51v is dragged on the surface SF by the shank 52.

  According to the present embodiment, when the cutting edge 51v is slid on one glass substrate 4, the load or posture of the cutting edge 51v is changed, whereby the side portion PSv as the front portion of the cutting edge 51v is changed. The positions O1 and O2 (FIG. 26) are set to the same height as the surface SF of the glass substrate 4. Thereby, when the blade edge 51v is slid on one glass substrate 4, only one position in the front portion of the blade edge 51v is set to the same height as the surface SF of the glass substrate 4. Thus, the position where the blade edge 51v is particularly worn is diffused. Therefore, the life of the blade edge 51v can be extended.

  Referring to FIG. 27, as a modification, the cutting edge 51v may be slid in the direction DB opposite to the direction DA. When the cutting edge 51v is slid on one glass substrate 4, the load or posture of the cutting edge 51v is changed, so that the positions O1 and O2 at the front portion (the part opposite to the side portion PSv) of the cutting edge 51v. (FIG. 28) is the same height as the surface SF of the glass substrate 4. Thereby, when the blade edge 51v is slid on one glass substrate 4, only one position in the front portion of the blade edge 51v is set to the same height as the surface SF of the glass substrate 4. Then, it comes into contact with the surface SF of the glass substrate 4 in a larger area, and the position where the blade edge 51v is particularly worn is diffused. Therefore, the life of the blade edge 51v can be extended.

  In the above embodiments, the first and second sides of the edge of the glass substrate are rectangular short sides, but the first and second sides may be rectangular long sides. The shape of the edge is not limited to a rectangle, and may be a square, for example. Further, the first and second sides are not limited to being linear, and may be curved. In each of the above embodiments, the surface of the glass substrate is flat, but the surface of the glass substrate may be curved.

  Although a glass substrate is used as a brittle substrate particularly suitable for the above-described cutting method, the brittle substrate is not limited to the glass substrate. In addition to glass, the brittle substrate can be made of, for example, ceramics, silicon, compound semiconductors, sapphire, or quartz.

  The control unit of the scribe device can be configured by a computer having an input unit, an output unit, a storage unit, and a CPU (Central Processing Unit). In this case, the program causes the CPU to execute processing of the control unit. The program can be recorded on a recording medium. The recording medium is, for example, a recording disk, a solid memory, or a recording tape.

  The present invention can be freely combined with each other within the scope of the invention, and each embodiment can be appropriately modified or omitted.

4 Glass substrate (brittle substrate)
4C cell substrate (brittle substrate)
51, 51v Cutting edge 60, 60V, 60W Scribe head 61, 61V Attitude adjustment unit 62 Holding unit 63, 63W Pressurization unit 64, 64W Main unit 70 Drive unit 71 Stage drive unit 72 Head drive unit 80 Stage 90, 90V Control unit 91 Pre-sliding control unit 92, 92V Sliding control unit 93 Post-sliding control unit 100, 100V Scribing device AL Assist line CL Crack line SL Scribe line TL Trench line

Claims (7)

To one of the brittle surface of the substrate, and pressing the cutting edge having a front that led to the protrusion and the protrusion, Ru said protrusion is positioned toward the inside from the surface of the brittle substrate step,
A step of sliding the pressed blade edge on the surface of the brittle substrate in a direction in which the front portion faces, and the step of sliding the blade edge causes plastic deformation in the brittle substrate, whereby the brittleness On the surface of the substrate, at least one trench line having a groove shape is formed, and in the step of sliding the blade edge, a position where the front portion of the blade edge is at the same height as the surface of the brittle substrate is Changed,
Step of sliding the cutting edge, the crack-free state Ru performed so as to obtain a state in which the brittle substrate immediately below the trench line is continuously connected in a direction crossing the trench line,
Method for cutting a brittle substrate.   The method for dividing a brittle substrate according to claim 1, wherein a load applied to the blade edge is changed in the step of sliding the blade edge.   The brittle substrate cutting method according to claim 1, wherein in the step of sliding the blade edge, the posture of the blade edge is changed.   The method further includes forming a crack line that breaks the continuous connection of the brittle substrate in a direction intersecting the trench line immediately below the trench line by extending a crack of the brittle substrate along the trench line. The method for dividing a brittle substrate according to any one of claims 1 to 3. In the step of pressing the blade edge, the surface of the brittle substrate includes one surface, and the one surface is surrounded by an edge including first and second sides facing each other.
The front portion of the blade edge is a side portion of the blade edge, the side portion extends from the protrusion and has a convex shape;
The step of pressing the blade edge includes the protrusion portion of the blade edge disposed between the first side and the side portion on the one surface of the brittle substrate, and the side portion of the blade edge and the protrusion portion. Being placed between the second sides,
In the step of sliding the blade edge, the trench line includes a first position of the first and second sides close to the first side and the second of the first and second sides. A second position close to the side of
The step of forming the crack line is performed by extending a crack of the brittle substrate from the second position toward the first position along the trench line.
The method for dividing a brittle substrate according to claim 4 . In the step of pressing the blade edge, the surface of the brittle substrate includes one surface, and the one surface is surrounded by an edge including first and second sides facing each other.
The cutting edge has a side portion extending from the protrusion and having a convex shape,
The step of pressing the blade edge includes the protrusion portion of the blade edge disposed between the first side and the side portion on the one surface of the brittle substrate, and the side portion of the blade edge and the protrusion portion. Being placed between the second sides,
In the step of sliding the blade edge, the trench line includes a first position of the first and second sides close to the first side and the second of the first and second sides. A second position close to the side of
The step of forming the crack line is performed by extending a crack of the brittle substrate from the second position toward the first position along the trench line.
The method for dividing a brittle substrate according to claim 4 . A substrate support for supporting one brittle substrate having a surface;
A cutting edge having a protruding portion and a front portion connected to the protruding portion;
A drive unit that relatively displaces the brittle substrate and the cutting edge;
A pressurizing part for applying a load to the cutting edge;
The drive unit is controlled so that the blade edge slides in the direction in which the front portion of the blade edge faces on the surface of the brittle substrate, and the protrusion is positioned on the inner side of the surface of the brittle substrate. wherein a that control section to control the pressing in, the prior SL control section, in the front portion of the cutting edge that slides the brittle upper substrate, flush with the surface of the brittle substrate The load is applied to the blade edge so that a crackless state in which the brittle substrate is continuously connected in the direction intersecting the trench line formed by sliding of the blade edge is obtained. is Ru is added,
Scribe device.

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