JP6303867B2 - 基板検査装置及びその制御方法 - Google Patents

基板検査装置及びその制御方法 Download PDF

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JP6303867B2
JP6303867B2 JP2014132502A JP2014132502A JP6303867B2 JP 6303867 B2 JP6303867 B2 JP 6303867B2 JP 2014132502 A JP2014132502 A JP 2014132502A JP 2014132502 A JP2014132502 A JP 2014132502A JP 6303867 B2 JP6303867 B2 JP 6303867B2
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Japan
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solder
height
inspection
dimensional shape
fillet
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JP2014132502A
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Japanese (ja)
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JP2016011857A (ja
Inventor
貴行 西
貴行 西
心平 藤井
心平 藤井
森　弘之
弘之 森
隆一郎 紺田
隆一郎 紺田
政臣 吉田
政臣 吉田
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Omron Corp
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Omron Corp
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Priority to JP2014132502A priority Critical patent/JP6303867B2/ja
Priority to DE102015109843.1A priority patent/DE102015109843B4/de
Priority to CN201510359138.5A priority patent/CN105300315A/zh
Publication of JP2016011857A publication Critical patent/JP2016011857A/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646—Soldering

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Analysis (AREA)
JP2014132502A 2014-06-27 2014-06-27 基板検査装置及びその制御方法 Active JP6303867B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014132502A JP6303867B2 (ja) 2014-06-27 2014-06-27 基板検査装置及びその制御方法
DE102015109843.1A DE102015109843B4 (de) 2014-06-27 2015-06-19 Leiterplattenprüfvorrichtung und Verfahren zu deren Steuerung
CN201510359138.5A CN105300315A (zh) 2014-06-27 2015-06-25 基板检查装置及控制方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014132502A JP6303867B2 (ja) 2014-06-27 2014-06-27 基板検査装置及びその制御方法

Publications (2)

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JP2016011857A JP2016011857A (ja) 2016-01-21
JP6303867B2 true JP6303867B2 (ja) 2018-04-04

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Family Applications (1)

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JP2014132502A Active JP6303867B2 (ja) 2014-06-27 2014-06-27 基板検査装置及びその制御方法

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JP (1) JP6303867B2 (de)
CN (1) CN105300315A (de)
DE (1) DE102015109843B4 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6668853B2 (ja) * 2016-03-16 2020-03-18 日本電気株式会社 電子機器製造装置、および電子機器の製造方法
FR3054914B1 (fr) * 2016-08-03 2021-05-21 Vit Procede d'inspection optique d'un objet
US11694916B2 (en) 2018-10-15 2023-07-04 Koh Young Technology Inc. Apparatus, method and recording medium storing command for inspection
JP7424074B2 (ja) 2020-01-28 2024-01-30 オムロン株式会社 三次元形状計測装置、三次元形状計測方法及びプログラム
JP7459525B2 (ja) 2020-01-28 2024-04-02 オムロン株式会社 三次元形状計測装置、三次元形状計測方法及びプログラム
JP2022049269A (ja) * 2020-09-16 2022-03-29 セイコーエプソン株式会社 三次元形状計測方法および三次元形状計測装置
JP7490691B2 (ja) 2022-02-01 2024-05-27 本田技研工業株式会社 膨張収縮量算出装置、膨張収縮量算出プログラム、個別識別装置、及び、個別識別プログラム

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003042968A (ja) * 2001-07-27 2003-02-13 Hitachi Industries Co Ltd 基板検査結果表示装置
JP2004117276A (ja) * 2002-09-27 2004-04-15 Ricoh Microelectronics Co Ltd はんだ付け良否判定方法、はんだ付け良否判定装置、はんだ付け良否判定システム、プリント基板製造システム及びプログラム
KR101155816B1 (ko) * 2005-06-17 2012-06-12 오므론 가부시키가이샤 3차원 계측을 행하는 화상 처리 장치 및 화상 처리 방법
CN101960253B (zh) * 2008-02-26 2013-05-01 株式会社高永科技 三维形状测量装置及测量方法
JP2010071844A (ja) 2008-09-19 2010-04-02 Omron Corp 基板外観検査装置、およびはんだフィレットの高さ計測方法
US20100259746A1 (en) * 2009-04-10 2010-10-14 Omron Corporation Profilometer
DE102010064593A1 (de) * 2009-05-21 2015-07-30 Koh Young Technology Inc. Formmessgerät und -verfahren
JP2011047777A (ja) * 2009-08-26 2011-03-10 Panasonic Electric Works Co Ltd 外観検査装置
JP5621178B2 (ja) * 2009-10-24 2014-11-05 株式会社第一メカテック 外観検査装置及び印刷半田検査装置
JP5365644B2 (ja) * 2011-01-13 2013-12-11 オムロン株式会社 はんだ付け検査方法、およびはんだ付け検査機ならびに基板検査システム
JP5365645B2 (ja) * 2011-01-17 2013-12-11 オムロン株式会社 基板検査装置および基板検査システムならびに基板検査結果の確認用画面の表示方法
KR101614061B1 (ko) * 2012-03-29 2016-04-20 주식회사 고영테크놀러지 조인트 검사 장치
JP5874508B2 (ja) * 2012-04-17 2016-03-02 オムロン株式会社 はんだの濡れ上がり状態の検査方法およびこの方法を用いた自動外観検査装置ならびに基板検査システム
JP6963709B1 (ja) 2020-06-18 2021-11-10 日本碍子株式会社 電気化学セル、及び電気化学セル用電解質膜

Also Published As

Publication number Publication date
CN105300315A (zh) 2016-02-03
JP2016011857A (ja) 2016-01-21
DE102015109843B4 (de) 2022-09-01
DE102015109843A1 (de) 2015-12-31

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