JP6301230B2 - 物理量測定装置 - Google Patents

物理量測定装置 Download PDF

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Publication number
JP6301230B2
JP6301230B2 JP2014201516A JP2014201516A JP6301230B2 JP 6301230 B2 JP6301230 B2 JP 6301230B2 JP 2014201516 A JP2014201516 A JP 2014201516A JP 2014201516 A JP2014201516 A JP 2014201516A JP 6301230 B2 JP6301230 B2 JP 6301230B2
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JP
Japan
Prior art keywords
housing
physical quantity
measuring device
quantity measuring
sensor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014201516A
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English (en)
Japanese (ja)
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JP2016070813A5 (enExample
JP2016070813A (ja
Inventor
秀司 遠山
秀司 遠山
信貴 山岸
信貴 山岸
山下　直樹
直樹 山下
祐介 緑川
祐介 緑川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nagano Keiki Co Ltd
Original Assignee
Nagano Keiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagano Keiki Co Ltd filed Critical Nagano Keiki Co Ltd
Priority to JP2014201516A priority Critical patent/JP6301230B2/ja
Priority to KR1020150134533A priority patent/KR102366689B1/ko
Priority to CN201510619871.6A priority patent/CN105466625B/zh
Priority to US14/865,568 priority patent/US9631991B2/en
Priority to CN201911295112.3A priority patent/CN110926691B/zh
Priority to ES19188999T priority patent/ES2835649T3/es
Priority to ES15187591T priority patent/ES2750561T3/es
Priority to EP15187591.1A priority patent/EP3002572B1/en
Priority to EP19188999.7A priority patent/EP3581905B1/en
Publication of JP2016070813A publication Critical patent/JP2016070813A/ja
Publication of JP2016070813A5 publication Critical patent/JP2016070813A5/ja
Application granted granted Critical
Publication of JP6301230B2 publication Critical patent/JP6301230B2/ja
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Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0044—Constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
JP2014201516A 2014-09-30 2014-09-30 物理量測定装置 Active JP6301230B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2014201516A JP6301230B2 (ja) 2014-09-30 2014-09-30 物理量測定装置
KR1020150134533A KR102366689B1 (ko) 2014-09-30 2015-09-23 물리량 측정 장치
US14/865,568 US9631991B2 (en) 2014-09-30 2015-09-25 Strain-gauge physical quantity measuring device with an electronic component provided on a flat surface of a cylindrical portion radially distanced from a diaphragm
CN201911295112.3A CN110926691B (zh) 2014-09-30 2015-09-25 物理量测量装置
CN201510619871.6A CN105466625B (zh) 2014-09-30 2015-09-25 物理量测量装置
ES15187591T ES2750561T3 (es) 2014-09-30 2015-09-30 Dispositivo de medición de cantidad física
ES19188999T ES2835649T3 (es) 2014-09-30 2015-09-30 Dispositivo de medición de cantidad física
EP15187591.1A EP3002572B1 (en) 2014-09-30 2015-09-30 Physical quantity measuring device
EP19188999.7A EP3581905B1 (en) 2014-09-30 2015-09-30 Physical quantity measuring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014201516A JP6301230B2 (ja) 2014-09-30 2014-09-30 物理量測定装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018034684A Division JP6407462B2 (ja) 2018-02-28 2018-02-28 センサモジュール

Publications (3)

Publication Number Publication Date
JP2016070813A JP2016070813A (ja) 2016-05-09
JP2016070813A5 JP2016070813A5 (enExample) 2016-09-29
JP6301230B2 true JP6301230B2 (ja) 2018-03-28

Family

ID=54249401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014201516A Active JP6301230B2 (ja) 2014-09-30 2014-09-30 物理量測定装置

Country Status (6)

Country Link
US (1) US9631991B2 (enExample)
EP (2) EP3002572B1 (enExample)
JP (1) JP6301230B2 (enExample)
KR (1) KR102366689B1 (enExample)
CN (2) CN110926691B (enExample)
ES (2) ES2835649T3 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20120456A1 (it) * 2012-03-23 2013-09-24 Microtel Tecnologie Elettroniche S P A Sensore di pressione ceramico e relativo metodo di produzione, e trasduttore che incorpora un sensore di pressione ceramico
JP5677641B1 (ja) * 2014-04-04 2015-02-25 三菱電機株式会社 電気機器の絶縁支持物
JP6283307B2 (ja) * 2014-12-24 2018-02-21 長野計器株式会社 物理量測定装置
JP6480375B2 (ja) * 2016-04-07 2019-03-06 長野計器株式会社 圧力センサ
JP2018021608A (ja) * 2016-08-03 2018-02-08 日本電産トーソク株式会社 センサ取付け構造
DE102017213894A1 (de) * 2017-08-09 2019-02-14 Ifm Electronic Gmbh Messgerät zur Messung des Drucks eines Mediums in einem Behältnis und kapazitive Druckmesszelle
IT201700103447A1 (it) * 2017-09-15 2019-03-15 Kolektor Microtel S P A Sensore di pressione ceramico
JP6841794B2 (ja) * 2018-06-26 2021-03-10 長野計器株式会社 物理量測定装置及び物理量測定装置の製造方法
JP6964063B2 (ja) * 2018-11-28 2021-11-10 長野計器株式会社 センサアッシーおよび物理量測定装置
JP7105492B2 (ja) * 2019-02-25 2022-07-25 ヤマシンフィルタ株式会社 差圧検出装置
JP7005550B2 (ja) * 2019-03-29 2022-01-21 長野計器株式会社 物理量測定装置および物理量測定装置の製造方法
KR102274093B1 (ko) * 2019-12-16 2021-07-07 주식회사 현대케피코 온도-압력 디지털 센서 측정장치
CN114636510A (zh) * 2020-12-15 2022-06-17 浙江三花汽车零部件有限公司 传感器组件以及阀装置
KR102564528B1 (ko) * 2021-01-23 2023-08-09 대양전기공업 주식회사 온도 센서가 구비된 압력 센서 유닛
US20250290814A1 (en) * 2022-04-26 2025-09-18 Autonics Corporation Sensor module

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Publication number Priority date Publication date Assignee Title
DE4215722C2 (de) * 1992-05-13 1997-02-13 Bosch Gmbh Robert Sensorsubstrat mit einer Membran und Verfahren zu deren Herstellung
US5583295A (en) 1994-03-14 1996-12-10 Nippondenso Co., Ltd. Pressure sensor having gauge resistors and temperature compensating resistors on the same surface
JPH1114485A (ja) * 1997-06-24 1999-01-22 Fuji Koki Corp 圧力センサ
US5974893A (en) 1997-07-24 1999-11-02 Texas Instruments Incorporated Combined pressure responsive transducer and temperature sensor apparatus
JP3319990B2 (ja) * 1997-08-29 2002-09-03 三菱電機株式会社 圧力センサ装置
EP1118849B1 (en) 2000-01-18 2002-08-14 Denso Corporation High-pressure sensor with one or two threaded stems bearing multi-pad sensor chips
JP2002236070A (ja) * 2001-02-07 2002-08-23 Tgk Co Ltd 圧力センサ
CN1209609C (zh) * 2003-07-31 2005-07-06 西安交通大学 固态压阻式耐高温压力传感器及其制备方法
US6945118B2 (en) 2004-01-13 2005-09-20 Honeywell International Inc. Ceramic on metal pressure transducer
JP2006078379A (ja) 2004-09-10 2006-03-23 Tgk Co Ltd 圧力センサおよびその製造方法
JP2006258471A (ja) * 2005-03-15 2006-09-28 Denso Corp 圧力センサ
US7762140B2 (en) * 2008-01-10 2010-07-27 Sensata Technologies, Inc. Combined fluid pressure and temperature sensor apparatus
EP2078940B1 (en) * 2008-01-10 2018-04-04 Sensata Technologies, Inc. Combined fluid pressure and temperature sensor apparatus
ITTO20080484A1 (it) * 2008-06-19 2009-12-20 Eltek Spa Dispositivo sensore di pressione
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JP2013124947A (ja) * 2011-12-15 2013-06-24 Panasonic Corp 半導体圧力センサ
US8833172B2 (en) * 2012-06-27 2014-09-16 Continental Automotive Systems, Inc Pressure sensing device with stepped cavity to minimize thermal noise
CN105452830B (zh) * 2013-03-15 2018-02-16 测量有限公司 低剖面压力传感器

Also Published As

Publication number Publication date
CN105466625B (zh) 2019-12-03
CN110926691A (zh) 2020-03-27
EP3002572B1 (en) 2019-09-18
ES2835649T3 (es) 2021-06-22
EP3581905A1 (en) 2019-12-18
KR102366689B1 (ko) 2022-02-22
US20160091377A1 (en) 2016-03-31
EP3002572A2 (en) 2016-04-06
JP2016070813A (ja) 2016-05-09
EP3002572A3 (en) 2016-06-29
CN110926691B (zh) 2021-12-31
ES2750561T3 (es) 2020-03-26
EP3581905B1 (en) 2020-10-28
US9631991B2 (en) 2017-04-25
CN105466625A (zh) 2016-04-06
KR20160038775A (ko) 2016-04-07

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