JP6290419B2 - 有機ケイ素化合物を基剤とする架橋性組成物及びそれにより製造される成形体 - Google Patents
有機ケイ素化合物を基剤とする架橋性組成物及びそれにより製造される成形体 Download PDFInfo
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- JP6290419B2 JP6290419B2 JP2016537206A JP2016537206A JP6290419B2 JP 6290419 B2 JP6290419 B2 JP 6290419B2 JP 2016537206 A JP2016537206 A JP 2016537206A JP 2016537206 A JP2016537206 A JP 2016537206A JP 6290419 B2 JP6290419 B2 JP 6290419B2
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- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
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- 235000012222 talc Nutrition 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 2
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
- OEBXWWBYZJNKRK-UHFFFAOYSA-N 1-methyl-2,3,4,6,7,8-hexahydropyrimido[1,2-a]pyrimidine Chemical compound C1CCN=C2N(C)CCCN21 OEBXWWBYZJNKRK-UHFFFAOYSA-N 0.000 description 2
- BUZICZZQJDLXJN-UHFFFAOYSA-N 3-azaniumyl-4-hydroxybutanoate Chemical compound OCC(N)CC(O)=O BUZICZZQJDLXJN-UHFFFAOYSA-N 0.000 description 2
- 239000003341 Bronsted base Substances 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
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- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Natural products CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
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- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
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- 238000000354 decomposition reaction Methods 0.000 description 2
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- FSBVERYRVPGNGG-UHFFFAOYSA-N dimagnesium dioxido-bis[[oxido(oxo)silyl]oxy]silane hydrate Chemical compound O.[Mg+2].[Mg+2].[O-][Si](=O)O[Si]([O-])([O-])O[Si]([O-])=O FSBVERYRVPGNGG-UHFFFAOYSA-N 0.000 description 2
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- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
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- OYGYKEULCAINCL-UHFFFAOYSA-N triethoxy(hexadecyl)silane Chemical compound CCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC OYGYKEULCAINCL-UHFFFAOYSA-N 0.000 description 1
- LWJZSHFCERSHME-UHFFFAOYSA-N triethoxy(triacontyl)silane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC LWJZSHFCERSHME-UHFFFAOYSA-N 0.000 description 1
- QDWJJTJNXAKQKD-UHFFFAOYSA-N trihexyphenidyl hydrochloride Chemical compound Cl.C1CCCCC1C(C=1C=CC=CC=1)(O)CCN1CCCCC1 QDWJJTJNXAKQKD-UHFFFAOYSA-N 0.000 description 1
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- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
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- 239000008096 xylene Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/30—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Other silicon-containing organic compounds; Boron-organic compounds
- C04B26/32—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Other silicon-containing organic compounds; Boron-organic compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
欧州特許出願公開第2281782号及び欧州特許出願公開第1726622号は、熱伝導性充填材としてシリコーン組成物を記載している。
(A)少なくとも1つの架橋性有機ケイ素化合物を100重量部、
(B)少なくとも1つの充填材を900〜2400重量部、
場合により(C)触媒、
場合により(D)開始剤、
場合により(E)促進剤、
場合により(F)阻害剤、及び
場合により(G)更なる構成成分
を含む組成物であって、
組成物(M)中の充填材(B)の含有量が少なくとも85重量%であり、かつ、成分(B)が少なくとも部分的に、粒径0.2mm〜10mmの粗粒化充填材からなる組成物である。
本発明の好ましい実施形態において、本発明による組成物(M)は、好ましくは、縮合反応により架橋可能な有機ケイ素化合物(A1)を含む組成物(M−1)である。このような有機ケイ素化合物(A1)は、一般に、Si結合された水酸基及び/又はオルガニルオキシ基を含み、水及び/又は相当するアルコールが当該架橋の間に遊離されることを特徴とする。
(A−1)縮合可能な基を含有する少なくとも1つの有機ケイ素化合物100重量部、
(B)少なくとも1つの充填材900〜2400重量部、
場合により(C−1)縮合触媒、及び
場合により(G)更なる構成成分
から実質的になる組成物であって、
組成物(M−1)中の充填材(B)の含有量が少なくとも85重量%であり、かつ、成分(B)が少なくとも部分的に、粒径0.2mm〜10mmの粗粒化充填材からなる組成物である。
成分(A−1)中のオルガニルラジカルは、好ましくは、メチル、エチル、n−プロピル、ビニル、2,4,4−トリメチルペンチル、n−オクチル、フェニル又はヘキサデシルラジカルである。
縮合反応により架橋する有機ケイ素化合物(A−1)は、単一の有機ケイ素化合物又は複数の有機ケイ素化合物の混合物(縮合可能な基を有するシロキサンなど)及びシラン架橋剤である。
本発明の更に好ましい実施形態において、本発明による組成物(M)は、好ましくは、付加反応により架橋可能な有機ケイ素化合物(A−2)を含む組成物(M−2)である。これらの組成物(M−2)は、一般に、ヒドロシリル化反応を行うことができる基を有する有機ケイ素化合物(A−2)、好ましくは脂肪族炭素−炭素多重結合を伴うSiC結合ラジカルを含有する有機ケイ素化合物、Si結合水素原子を伴う有機ケイ素化合物、並びに/又は、脂肪族炭素−炭素多重結合を伴うSiC結合ラジカル及びSi結合水素原子の両方を含有する有機ケイ素化合物を含むことを特徴とする。
(A−2)脂肪族炭素−炭素多重結合を伴うSiC結合ラジカルを含有する有機ケイ素化合物(A−2−1)、Si結合水素原子を伴う有機ケイ素化合物(A−2−2)、並びに、脂肪族炭素−炭素多重結合を伴うSiC結合ラジカル及びSi結合水素原子の両方を含有し、脂肪族炭素−炭素多重結合を伴うSiC結合ラジカルに対するSi−Hのモル比が好ましくは0.5:1〜2:1である有機ケイ素化合物(A−2−3)からなる群から選択される少なくとも1つの架橋性有機ケイ素化合物100重量部、
(B)少なくとも1つの充填材900〜2400重量部、
(C−2)脂肪族多重結合に対するSi結合水素の付加を促進する触媒、
場合により(F−2)阻害剤、及び
場合により(G−2)更なる構成成分
から実質的になる組成物であって、
組成物(M−2)中の充填材(B)の含有量が少なくとも85重量%であり、かつ、成分(B)が少なくとも部分的に、粒径0.2mm〜10mmの粗粒化充填材からなる組成物である。
HC=C−C(CH3)(OH)−(CH2)2−CH=C(CH3)2
の化合物などの阻害剤である。
(A−2)Si−ビニル基を含む有機ケイ素化合物(A−2−1)及びSi−H基を含む有機ケイ素化合物(A−2−2)を、成分(A−2)中のSi−H:Si−ビニル基のモル比が合計で0.95:1〜1.05:1であるような比で含む少なくとも1つの架橋性有機ケイ素化合物(A−2)100重量部、
(B)粒径が0.02〜200μmである微粒子と粒径が0.2〜10mmである粗粒子との混合物の形態をなし、かつ、粗粒子に対する微粒子の混合比が、充填材の重量に対して4:1〜1:4である、天然源から得られる石英900〜2400重量部、
(C−2)カルステッド触媒の形態をなす白金0.0001〜0.005重量部、
(F−2)テトラメチルチウラムモノスルフィド及び1−エチニルシクロヘキサン−1−オールから選択される阻害剤0.001〜1重量部、及び
(G−2)更なる構成成分0.01〜10重量部
から実質的になる組成物である。
(A−2)Si−ビニル及びSi−H基を含む有機ケイ素化合物(A−2−3)、並びに、場合によりSi−H基を含む有機ケイ素化合物(A−2−2)及び/又はSi−ビニル基を含む有機ケイ素化合物(A−2−1)を、成分(A−2)中のSi−H:Si−ビニル基のモル比が合計で0.95:1〜1.05:1であるような比で含む少なくとも1つの架橋性有機ケイ素化合物(A−2)100重量部、
(B)粒径が0.02〜200μmである微粒子と粒径が0.2〜10mmである粗粒子との混合物の形態をなし、かつ、粗粒子に対する微粒子の混合比が、充填材の重量に対して4:1〜1:4である、天然源から得られる石英900〜2400重量部、
(C−2)カルステッド触媒の形態をなす白金0.0001〜0.005重量部、
(F−2)テトラメチルチウラムモノスルフィド及び1−エチニルシクロヘキサン−1−オールから選択される阻害剤0.001〜1重量部、及び
(G−2)更なる構成成分0.01〜10重量部
から実質的になる組成物である。
本発明による組成物(M)が、ラジカル架橋性有機ケイ素化合物(A−3)を含む組成物(M−3)である場合、成分(A−3)は、一般に、ラジカル反応を行うことができるSi結合されたモノ若しくはポリ不飽和アルケニル基、好ましくはビニル若しくはアリル基、及び/又は、Si結合され、場合により置換された炭化水素ラジカルを含むことを特徴とする。
(A−3)SiC結合フェニル及び/又はSiC結合メチル及び/又はSiC結合ビニル若しくはアリル基を含有し、それにより、線状オルガノポリシロキサン単位から実質的に構成される及び/又は樹脂構造を有する分岐オルガノポリシロキサン単位から実質的に構成される有機ケイ素化合物からなる群から選択される少なくとも1つの架橋性有機ケイ素化合物100重量部、
(B)少なくとも1つの充填材900〜2400重量部、
場合により(D−3)阻害剤、
場合により(E−3)促進剤、及び
場合により(G−3)更なる構成成分
から実質的になる組成物であって、
組成物(M−3)中の充填材(B)の含有量が少なくとも85重量%であり、かつ、成分(B)が少なくとも部分的に、粒径0.2mm〜10mmの粗粒化充填材からなるものである。
以下の例において、有機ケイ素化合物の絶対粘度は、DIN 53019に従って測定される。好ましくは、その手順は以下の通りである。特記しない限り、粘度は、Anton Paar社製の「Physical MCR 300」回転式流量計を用いて25℃で測定される。10〜200mPa・sの粘度については、1.13mmの環状測定ギャップを備える同軸シリンダー測定システム(CC27)を使用し、200mPa・sよりも大きい粘度については、コーン/プレート測定システム(測定コーンCP50−1付きSearle−System)を使用する。剪断速度をポリマー粘度に対応させる(100s−1では1〜99mPa・s;200s−1では100〜999mPa・s;120s−1では1000〜2999mPa・s;80s−1では3000〜4999mPa・s;62s−1では5000〜9999mPa・s;50s−1では10000〜12499mPa・s;38.5s−1では12500〜15999mPa・s;33s−1では16000〜19999mPa・s;25s−1では20000〜24999mPa・s;20s−1では25000〜29999mPa・s;17s−1では30000〜39999mPa・s;10s−1では40000〜59999mPa・s;5s-1では60000〜149999;3.3s-1では150000〜199999mPa・s;2.5s-1では200000〜299999mPa・s;1.5s-1では300000〜1000000mPa・s)。
方法:DIN 55672−1に準拠したサイズ排除クロマトグラフィー(SEC)
流速:1.00ml/分
注入システム:Agilent 1200オートサンプラー(Agilent Technologies)
注入容量:100μl
溶離剤:フェニル基を含む生成物の場合には、250ppmの2,6−ジーtert−ブチル−4−メチルフェノール(BHT)で安定化させたテトラヒドロフラン(>99.5%)を使用した。フェニル基を含まない材料の場合には、トルエン(>99.9%、p.A.)を使用した。すべての化学物質は、D−DarmstadtのMerck KGaAなどから市販されている。
カラム:固定相:Agilent Technologies社製ポリスチレン−ジビンルベンゼン
評価:各々の場合において、求めたモル重量を100の単位まで四捨五入した。
本発明において、支持間隔180mmで、DIN EN 14617−2:2008−11に準拠して曲げ強度を測定した。
DIN EN ISO 868:2003−10に従って、硬度を測定した。好ましくは、手順は以下の通りであった。デュロメーター(ショアD硬度)を使用して、長さ×幅×厚さ=40mm×40mm×6mmの寸法を有するシート状試験片に関する測定を実施した。これらの試験片は、DIN EN ISO 10724−1:2002−04の形式2に準拠して、交換可能な金型キャビティプレートを有するツールを使用して射出成形法によって製造し、例に示す条件(温度、時間)下で硬化させた。測定する前に、23℃かつ50%相対湿度で、例に示した時間、予め試験片を保管した。
平均分子量Mwが6600g/mol、平均分子量Mnが2000g/mol及び多分散度が3.3である、平均式(MeSiO3/2)0.88(MeSi(OH)O2/2)0.05(MeSi(OEt)O2/2)0.06(Me2SiO2/2)0.01の粉末有機ケイ素化合物100重量部と、平均分子量Mwが1550g/mol、平均分子量Mnが550g/mol及び多分散度が2.8である、平均組成が(MeSiO3/2)0.19(i−OctSiO3/2)0.05(MeSi(OMe)O2/2)0.30(i−OctSi(OMe)O2/2)0.08(MeSi(OMe)2O1/2)0.16(i−OctSi(OMe)2O1/2)0.07(Me2SiO2/2)0.15の有機ケイ素化合物65重量部とを丸底フラスコ内に入れた。次いで、混合物を攪拌しながら55℃まで加熱することにより、均一な混合物が形成された。その後、混合物の温度を95℃まで上昇させ、その温度に達したら、100mbarの圧力をかけた。それらの条件下で攪拌を更に2.5時間行った後、100mbarの圧力で23℃の温度まで混合物を放冷すると、真空破壊を起こした。そのようにして得られた樹脂混合物の絶対粘度は、25℃では6000mPa・sであり、80℃では200mPa・sであった。
最初に、(Me3SiO1/2)2(Me(H)SiO2/2)35の組成を有する有機ケイ素化合物10.5重量部を、式[MeViSiO2/2]4の有機ケイ素化合物10.0重量部及び式[MeViSiO2/2]5の有機ケイ素化合物4.5重量部と混合した。
「Millisil W12」タイプの細粒化石英粉末350重量部の代わりに、「Millisil W12」タイプの細粒化石英粉末250重量部、及び、針長が5〜150μmであり、かつ、平均長さ:直径比が7:1である「Tremin 939−100 VST」タイプの、ビニルジメチルクロロシランでコーティングした細粒化ウォラストナイト粉末100重量部(いずれも、D−FrechenのQuarzwerke GmbHから市販されている)のみを使用したことを除き、実施例2に記載した手順を繰り返した。測定された曲げ強度値は17.0MPaであった。
Claims (12)
- (A)少なくとも1種以上の架橋性有機ケイ素化合物を100重量部、
(B)少なくとも1種以上の充填材を900〜2400重量部、
を含む架橋性組成物(M)であって、
前記充填材の含有量が、少なくとも85重量%であり、
前記充填材が、前記充填材の総量に対し、粒径0.2mm〜10mmの粗粒化充填材を少なくとも20重量%を含むことを特徴とする、架橋性組成物(M)。 - 充填材(B)が、架橋性組成物(M)100重量部に対して、合計で90〜99重量部の量で存在する、請求項1に記載の架橋性組成物。
- 有機ケイ素化合物(A)が、縮合反応によって架橋可能である有機ケイ素化合物又は付加反応によって架橋可能である有機ケイ素化合物である、請求項1又は2に記載の架橋性組成物。
- 架橋性組成物(M)が、(C)触媒、(D)開始剤、(E)促進剤、(F)阻害剤、及び(G)更なる構成成分からなる群より選択される少なくとも1つを含む、請求項1〜3のいずれか一項に記載の架橋性組成物。
- 個々の成分を混合することによって、請求項1〜4のいずれか一項に記載の架橋性組成物(M)を製造する方法。
- 請求項1〜4のいずれか一項に記載の架橋性組成物(M)又は請求項5に記載されるように製造される架橋性組成物(M)を成形し、かつ、硬化させる、有機ケイ素化合物を基剤とする成形体を製造する方法。
- 架橋性組成物(M)を機械的圧力によって成形し、温度を上昇させることによって成形中及び/又は後に架橋性組成物(M)を硬化させる、請求項6に記載の方法。
- 金型に低大気圧を印加することによって成形中に架橋性組成物(M)中の過剰な空気を部分的に又は完全に除去する、請求項6又は7に記載の方法。
- 金型を振動させることによって成形中及び/又は後に更なる高密度化を達成する、請求項6〜8のいずれか一項に記載の方法。
- 請求項1〜4のいずれか一項に記載の架橋性組成物(M)又は請求項5に記載されるように製造される架橋性組成物(M)を架橋することによって製造される成形体。
- 人工石である、請求項10に記載の成形体。
- 少なくとも50ショアDの硬度を有する、請求項10又は11に記載の成形体。
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PCT/EP2014/067166 WO2015028296A1 (de) | 2013-08-28 | 2014-08-11 | Vernetzbare massen auf der basis von organosiliciumverbindungen und daraus hergestellte formkörper |
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CN107473644B (zh) * | 2017-09-11 | 2020-06-19 | 东莞环球经典新型材料有限公司 | 一种高疏水耐紫外线无机人造石材及其制备方法 |
KR102345920B1 (ko) * | 2017-09-15 | 2022-01-03 | 와커 헤미 아게 | 경화성 유기폴리실록산 조성물 |
CN111670173A (zh) * | 2018-10-26 | 2020-09-15 | 瓦克化学股份公司 | 可固化有机聚硅氧烷组合物 |
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CN110078489B (zh) * | 2019-05-13 | 2021-11-16 | 海宁联丰磁业股份有限公司 | 一种低损耗软磁铁氧体材料及其制备方法 |
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EP3039078B1 (de) | 2018-05-16 |
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CN110482912A (zh) | 2019-11-22 |
RU2660123C2 (ru) | 2018-07-05 |
WO2015028296A1 (de) | 2015-03-05 |
IL244160A0 (en) | 2016-04-21 |
KR20160031528A (ko) | 2016-03-22 |
CN105473663A (zh) | 2016-04-06 |
EP3039078A1 (de) | 2016-07-06 |
KR102058070B1 (ko) | 2019-12-20 |
ES2676272T3 (es) | 2018-07-18 |
US9862642B2 (en) | 2018-01-09 |
DE102013217221A1 (de) | 2015-03-05 |
RU2016111156A (ru) | 2017-10-03 |
JP2016529365A (ja) | 2016-09-23 |
RU2016111156A3 (ja) | 2018-04-28 |
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