JP6282850B2 - 基板洗浄装置および基板処理装置 - Google Patents

基板洗浄装置および基板処理装置 Download PDF

Info

Publication number
JP6282850B2
JP6282850B2 JP2013241960A JP2013241960A JP6282850B2 JP 6282850 B2 JP6282850 B2 JP 6282850B2 JP 2013241960 A JP2013241960 A JP 2013241960A JP 2013241960 A JP2013241960 A JP 2013241960A JP 6282850 B2 JP6282850 B2 JP 6282850B2
Authority
JP
Japan
Prior art keywords
liquid
substrate
gas
fluid nozzle
supply line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013241960A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015103608A5 (enrdf_load_stackoverflow
JP2015103608A (ja
Inventor
知淳 石橋
知淳 石橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2013241960A priority Critical patent/JP6282850B2/ja
Priority to SG10201407598VA priority patent/SG10201407598VA/en
Priority to US14/541,488 priority patent/US10090189B2/en
Publication of JP2015103608A publication Critical patent/JP2015103608A/ja
Publication of JP2015103608A5 publication Critical patent/JP2015103608A5/ja
Priority to JP2018010305A priority patent/JP6473248B2/ja
Application granted granted Critical
Publication of JP6282850B2 publication Critical patent/JP6282850B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2013241960A 2013-11-19 2013-11-22 基板洗浄装置および基板処理装置 Active JP6282850B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013241960A JP6282850B2 (ja) 2013-11-22 2013-11-22 基板洗浄装置および基板処理装置
SG10201407598VA SG10201407598VA (en) 2013-11-19 2014-11-14 Substrate cleaning apparatus and substrate processing apparatus
US14/541,488 US10090189B2 (en) 2013-11-19 2014-11-14 Substrate cleaning apparatus comprising a second jet nozzle surrounding a first jet nozzle
JP2018010305A JP6473248B2 (ja) 2013-11-22 2018-01-25 基板洗浄装置、基板処理装置、および基板洗浄方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013241960A JP6282850B2 (ja) 2013-11-22 2013-11-22 基板洗浄装置および基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018010305A Division JP6473248B2 (ja) 2013-11-22 2018-01-25 基板洗浄装置、基板処理装置、および基板洗浄方法

Publications (3)

Publication Number Publication Date
JP2015103608A JP2015103608A (ja) 2015-06-04
JP2015103608A5 JP2015103608A5 (enrdf_load_stackoverflow) 2016-11-17
JP6282850B2 true JP6282850B2 (ja) 2018-02-21

Family

ID=53379095

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013241960A Active JP6282850B2 (ja) 2013-11-19 2013-11-22 基板洗浄装置および基板処理装置
JP2018010305A Active JP6473248B2 (ja) 2013-11-22 2018-01-25 基板洗浄装置、基板処理装置、および基板洗浄方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018010305A Active JP6473248B2 (ja) 2013-11-22 2018-01-25 基板洗浄装置、基板処理装置、および基板洗浄方法

Country Status (1)

Country Link
JP (2) JP6282850B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018101790A (ja) * 2013-11-22 2018-06-28 株式会社荏原製作所 基板洗浄装置および基板処理装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6902872B2 (ja) * 2017-01-10 2021-07-14 東京エレクトロン株式会社 基板処理システムおよび基板処理方法
WO2019150683A1 (ja) * 2018-01-31 2019-08-08 株式会社荏原製作所 基板洗浄装置、基板処理装置、超音波洗浄液供給装置および記録媒体
CN111162023B (zh) * 2018-11-08 2023-03-21 北京北方华创微电子装备有限公司 喷淋装置及清洗设备
JP7613953B2 (ja) 2021-03-03 2025-01-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、及び基板処理システム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3504023B2 (ja) * 1995-05-26 2004-03-08 株式会社ルネサステクノロジ 洗浄装置および洗浄方法
EP0862377B1 (de) * 1995-11-10 2005-08-24 Erbe Elektromedizin GmbH Verfahren und vorrichtung zum spülen
JP4069316B2 (ja) * 2000-07-24 2008-04-02 東京エレクトロン株式会社 洗浄処理方法および洗浄処理装置
JP4464850B2 (ja) * 2004-03-09 2010-05-19 株式会社ルネサステクノロジ 基板洗浄用２流体ノズル及び基板洗浄装置
JP2007027270A (ja) * 2005-07-13 2007-02-01 Sony Corp 洗浄装置及び洗浄方法
JP2010212519A (ja) * 2009-03-11 2010-09-24 Shimada Phys & Chem Ind Co Ltd 基板洗浄装置
JP5837788B2 (ja) * 2011-09-29 2015-12-24 株式会社Ｓｃｒｅｅｎホールディングス ノズル、基板処理装置、および基板処理方法
CN103295936B (zh) * 2012-02-29 2016-01-13 斯克林集团公司 基板处理装置及基板处理方法
JP2013214737A (ja) * 2012-03-09 2013-10-17 Ebara Corp 基板処理方法及び基板処理装置
JP6282850B2 (ja) * 2013-11-22 2018-02-21 株式会社荏原製作所 基板洗浄装置および基板処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018101790A (ja) * 2013-11-22 2018-06-28 株式会社荏原製作所 基板洗浄装置および基板処理装置

Also Published As

Publication number Publication date
JP2018101790A (ja) 2018-06-28
JP2015103608A (ja) 2015-06-04
JP6473248B2 (ja) 2019-02-20

Similar Documents

Publication Publication Date Title
US10090189B2 (en) Substrate cleaning apparatus comprising a second jet nozzle surrounding a first jet nozzle
JP6473248B2 (ja) 基板洗浄装置、基板処理装置、および基板洗浄方法
US11676827B2 (en) Substrate cleaning apparatus, substrate cleaning method, substrate processing apparatus, and substrate drying apparatus
JP5712061B2 (ja) 基板処理方法及び基板処理ユニット
US20080083437A1 (en) Method and apparatus for wafer cleaning
JPWO2007108315A1 (ja) 基板処理装置及び基板処理方法
KR102661662B1 (ko) 기판 세정 장치 및 기판 처리 장치
JP6321353B2 (ja) 基板洗浄装置および基板処理装置
KR102338647B1 (ko) 기판 세정 장치
JP7290695B2 (ja) 超音波洗浄装置および洗浄具のクリーニング装置
JP6860292B2 (ja) 基板洗浄装置及び基板処理装置
TWI666070B (zh) 基板處理裝置及基板處理方法
JP2015103608A5 (enrdf_load_stackoverflow)
JP2019169731A (ja) 基板洗浄装置
US9640384B2 (en) Substrate cleaning apparatus and substrate cleaning method
JP2015099852A (ja) 基板洗浄装置および基板処理装置
JP6339351B2 (ja) 基板洗浄装置および基板処理装置
JP6934918B2 (ja) 基板洗浄装置
JP2017204495A (ja) 基板洗浄装置
KR20160106950A (ko) 웨이퍼 이송용 저장유닛의 세정장치 및 세정방법
JP6933448B2 (ja) 基板洗浄装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160930

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160930

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170815

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171011

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20171226

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180125

R150 Certificate of patent or registration of utility model

Ref document number: 6282850

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250