JP6282708B2 - 研磨用組成物、それを用いた研磨方法、及びその製造方法 - Google Patents
研磨用組成物、それを用いた研磨方法、及びその製造方法 Download PDFInfo
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- JP6282708B2 JP6282708B2 JP2016199201A JP2016199201A JP6282708B2 JP 6282708 B2 JP6282708 B2 JP 6282708B2 JP 2016199201 A JP2016199201 A JP 2016199201A JP 2016199201 A JP2016199201 A JP 2016199201A JP 6282708 B2 JP6282708 B2 JP 6282708B2
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- 229910052581 Si3N4 Inorganic materials 0.000 claims description 40
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 40
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- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- GUUULVAMQJLDSY-UHFFFAOYSA-N 4,5-dihydro-1,2-thiazole Chemical compound C1CC=NS1 GUUULVAMQJLDSY-UHFFFAOYSA-N 0.000 description 1
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- 229910019142 PO4 Inorganic materials 0.000 description 1
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- 235000011054 acetic acid Nutrition 0.000 description 1
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- 150000005215 alkyl ethers Chemical class 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
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- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- DHNRXBZYEKSXIM-UHFFFAOYSA-N chloromethylisothiazolinone Chemical compound CN1SC(Cl)=CC1=O DHNRXBZYEKSXIM-UHFFFAOYSA-N 0.000 description 1
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- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
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- BEGLCMHJXHIJLR-UHFFFAOYSA-N methylisothiazolinone Chemical compound CN1SC=CC1=O BEGLCMHJXHIJLR-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本実施形態の研磨用組成物は、有機酸を固定化したコロイダルシリカを水に混合して調製される。従って、研磨用組成物は、有機酸を固定化したコロイダルシリカを含有する。この研磨用組成物は、窒化ケイ素を研磨する用途、より具体的には、半導体配線基板のような研磨対象物における窒化ケイ素を含んだ表面を研磨する用途で主に使用される。
研磨用組成物中のコロイダルシリカの平均会合度は1.2以上であることが好ましく、より好ましくは1.5以上である。コロイダルシリカの平均会合度が大きくなるにつれて、研磨用組成物による窒化ケイ素の研磨速度が向上する有利がある。
・本実施形態の研磨用組成物は、スルホン酸やカルボン酸等の有機酸を固定化したコロイダルシリカを含有し、pHが6以下である。pH6以下のもとでは、有機酸を固定化したコロイダルシリカのゼータ電位はマイナスである。その一方、同じpH6以下のもとで窒化ケイ素のゼータ電位はプラスである。そのため、研磨用組成物のpHが6以下であれば、研磨用組成物中のコロイダルシリカが窒化ケイ素に対して電気的に反発することがない。よって、この研磨用組成物によれば、窒化ケイ素を高速度で研磨することができる。
・研磨用組成物中のコロイダルシリカの平均会合度が4.0以下である場合、さらに言えば3.0以下又は2.5以下である場合には、研磨用組成物を用いて研磨した後の研磨対象物の表面に欠陥が生じたり表面粗さが増大したりするのを良好に抑えることができる。
・前記実施形態の研磨用組成物は、有機酸を固定化したコロイダルシリカに加えて別の砥粒をさらに含有してもよい。
・前記実施形態の研磨用組成物は、防腐剤や防カビ剤のような公知の添加剤を必要に応じてさらに含有してもよい。防腐剤及び防カビ剤の具体例としては、例えば、2−メチル−4−イソチアゾリン−3−オンや5−クロロ−2−メチル−4−イソチアゾリン−3−オン等のイソチアゾリン系防腐剤、パラオキシ安息香酸エステル類及びフェノキシエタノールが挙げられる。
・前記実施形態の研磨用組成物は、研磨用組成物の原液を水などの希釈液を使って例えば10倍以上に希釈することによって調製されてもよい。
実施例1〜14及び比較例1〜4では、コロイダルシリカを水に混合し、適宜pH調整剤を加えることにより研磨用組成物を調製した。比較例5では、pH調整剤を使ってpH2に調整した水を研磨用組成物として調製した。各例の研磨用組成物中のコロイダルシリカ及びpH調整剤の詳細、並びに各研磨用組成物のpHを測定した結果を表1に示す。
Claims (11)
- スルホン酸を固定化し、かつ表面のゼータ電位がマイナスであるコロイダルシリカを含有し、pHが6以下であり、
前記コロイダルシリカの平均一次粒子径が5〜100nmであり、
多結晶シリコンを含む研磨対象物を研磨する用途で使用される研磨用組成物。 - さらにpH6以下でゼータ電位がプラスである材料(多結晶シリコンを除く)を含む研磨対象物を研磨する用途で使用される請求項1に記載の研磨用組成物。
- 前記多結晶シリコンの研磨速度に対する窒化ケイ素の研磨速度の比が2以上である、請求項2に記載の研磨用組成物。
- 前記研磨用組成物のpHが4以下である、請求項1〜3のいずれか一項に記載の研磨用組成物。
- 前記研磨対象物は、金属膜を含まない、請求項1〜3のいずれか一項に記載の研磨用組成物。
- 前記コロイダルシリカの平均二次粒子径が10〜150nmである、請求項1〜5のいずれか一項に記載の研磨用組成物。
- 前記コロイダルシリカの形状が非球形である、請求項1〜6のいずれか一項に記載の研磨用組成物。
- 前記コロイダルシリカの平均会合度が1.2〜4.0である、請求項1〜7のいずれか一項に記載の研磨用組成物。
- 請求項1〜8のいずれか一項に記載の研磨用組成物を用いて、多結晶シリコン及びpH6以下でゼータ電位がプラスである材料(多結晶シリコンを除く)を含む研磨対象物を研磨する研磨方法。
- 請求項1〜8のいずれか一項に記載の研磨用組成物の製造方法であって、
前記コロイダルシリカを配合し、pHが6以下である研磨用組成物の製造方法。 - 前記コロイダルシリカは、チオール基を有するシランカップリング剤をコロイダルシリカにカップリングさせた後にチオール基を酸化することにより得られる請求項10に記載の研磨用組成物の製造方法。
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