JP6250997B2 - 電子制御装置 - Google Patents
電子制御装置 Download PDFInfo
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- JP6250997B2 JP6250997B2 JP2013191938A JP2013191938A JP6250997B2 JP 6250997 B2 JP6250997 B2 JP 6250997B2 JP 2013191938 A JP2013191938 A JP 2013191938A JP 2013191938 A JP2013191938 A JP 2013191938A JP 6250997 B2 JP6250997 B2 JP 6250997B2
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- 238000005452 bending Methods 0.000 description 18
- 239000011800 void material Substances 0.000 description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
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- 229910000679 solder Inorganic materials 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
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- 239000000956 alloy Substances 0.000 description 5
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
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- 238000001816 cooling Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
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- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- 230000020169 heat generation Effects 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
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- 229910052759 nickel Inorganic materials 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 2
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- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
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- 229910000906 Bronze Inorganic materials 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
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- 239000003566 sealing material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013191938A JP6250997B2 (ja) | 2013-09-17 | 2013-09-17 | 電子制御装置 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2013191938A JP6250997B2 (ja) | 2013-09-17 | 2013-09-17 | 電子制御装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015060865A JP2015060865A (ja) | 2015-03-30 |
JP2015060865A5 JP2015060865A5 (fr) | 2016-02-04 |
JP6250997B2 true JP6250997B2 (ja) | 2017-12-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013191938A Active JP6250997B2 (ja) | 2013-09-17 | 2013-09-17 | 電子制御装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6250997B2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112020006724T5 (de) | 2020-02-14 | 2022-12-01 | Nidec Corporation | Wechselrichter-vorrichtung, motor und motoreinheit |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6540358B2 (ja) * | 2015-08-13 | 2019-07-10 | 沖電気工業株式会社 | 放熱構造、筐体および携帯端末 |
JP2017199846A (ja) * | 2016-04-28 | 2017-11-02 | 本田技研工業株式会社 | 電子制御装置 |
JP6597476B2 (ja) * | 2016-05-20 | 2019-10-30 | 日亜化学工業株式会社 | 配線基体の製造方法並びに配線基体及びそれを用いた発光装置。 |
JP7257893B2 (ja) * | 2019-06-25 | 2023-04-14 | 日立Astemo株式会社 | 電子制御装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2973864B2 (ja) * | 1995-04-11 | 1999-11-08 | ダイキン工業株式会社 | スイッチボックスのパワーデバイス支持構造 |
JPH1195871A (ja) * | 1997-09-17 | 1999-04-09 | Matsushita Electric Ind Co Ltd | 電子機器の放熱構造 |
JP2003289191A (ja) * | 2002-03-28 | 2003-10-10 | Denso Corp | 電子制御装置 |
JP4187596B2 (ja) * | 2003-06-26 | 2008-11-26 | Dxアンテナ株式会社 | 電子機器の放熱構造 |
JP2006059706A (ja) * | 2004-08-20 | 2006-03-02 | Toyo Tire & Rubber Co Ltd | リブ付き基板及びその製造方法 |
JP4350762B2 (ja) * | 2007-03-19 | 2009-10-21 | レノボ・シンガポール・プライベート・リミテッド | 携帯式コンピュータ |
JP5151933B2 (ja) * | 2008-11-27 | 2013-02-27 | 株式会社Ihi | 電子機器用放熱器 |
JP5222838B2 (ja) * | 2009-12-21 | 2013-06-26 | 日立オートモティブシステムズ株式会社 | 制御装置 |
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2013
- 2013-09-17 JP JP2013191938A patent/JP6250997B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112020006724T5 (de) | 2020-02-14 | 2022-12-01 | Nidec Corporation | Wechselrichter-vorrichtung, motor und motoreinheit |
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Publication number | Publication date |
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JP2015060865A (ja) | 2015-03-30 |
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