JP6249225B2 - レーザ加工装置及びレーザ加工方法 - Google Patents

レーザ加工装置及びレーザ加工方法 Download PDF

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Publication number
JP6249225B2
JP6249225B2 JP2014050470A JP2014050470A JP6249225B2 JP 6249225 B2 JP6249225 B2 JP 6249225B2 JP 2014050470 A JP2014050470 A JP 2014050470A JP 2014050470 A JP2014050470 A JP 2014050470A JP 6249225 B2 JP6249225 B2 JP 6249225B2
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Japan
Prior art keywords
laser
optical element
diffractive optical
laser beam
polarized light
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JP2014050470A
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Japanese (ja)
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JP2015174100A (ja
JP2015174100A5 (enExample
Inventor
北村　嘉朗
嘉朗 北村
中井　出
出 中井
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2014050470A priority Critical patent/JP6249225B2/ja
Priority to US14/626,850 priority patent/US20150260985A1/en
Priority to CN201510106475.3A priority patent/CN104907691B/zh
Publication of JP2015174100A publication Critical patent/JP2015174100A/ja
Publication of JP2015174100A5 publication Critical patent/JP2015174100A5/ja
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/106—Scanning systems having diffraction gratings as scanning elements, e.g. holographic scanners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0944—Diffractive optical elements, e.g. gratings, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3083—Birefringent or phase retarding elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2014050470A 2014-03-13 2014-03-13 レーザ加工装置及びレーザ加工方法 Active JP6249225B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014050470A JP6249225B2 (ja) 2014-03-13 2014-03-13 レーザ加工装置及びレーザ加工方法
US14/626,850 US20150260985A1 (en) 2014-03-13 2015-02-19 Laser processing apparatus and laser processing method
CN201510106475.3A CN104907691B (zh) 2014-03-13 2015-03-11 激光加工装置以及激光加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014050470A JP6249225B2 (ja) 2014-03-13 2014-03-13 レーザ加工装置及びレーザ加工方法

Publications (3)

Publication Number Publication Date
JP2015174100A JP2015174100A (ja) 2015-10-05
JP2015174100A5 JP2015174100A5 (enExample) 2017-02-09
JP6249225B2 true JP6249225B2 (ja) 2017-12-20

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Family Applications (1)

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JP2014050470A Active JP6249225B2 (ja) 2014-03-13 2014-03-13 レーザ加工装置及びレーザ加工方法

Country Status (3)

Country Link
US (1) US20150260985A1 (enExample)
JP (1) JP6249225B2 (enExample)
CN (1) CN104907691B (enExample)

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JP6468175B2 (ja) * 2015-12-09 2019-02-13 トヨタ自動車株式会社 密閉型容器の製造方法
JP6369454B2 (ja) * 2015-12-24 2018-08-08 トヨタ自動車株式会社 レーザー溶接装置
DE102016201418A1 (de) 2016-01-29 2017-08-03 Kjellberg-Stiftung Vorrichtung und Verfahren zur thermischen Bearbeitung
CN105772947B (zh) * 2016-03-23 2017-10-20 中国科学院上海光学精密机械研究所 双光源联用激光束抛光装置
CN105643096B (zh) * 2016-03-28 2017-07-21 大族激光科技产业集团股份有限公司 基于激光加工机台的标靶定位方法、装置和激光加工机台
CN105945422B (zh) * 2016-06-12 2018-01-05 西安中科微精光子制造科技有限公司 一种超快激光微细加工系统
CN109475976A (zh) * 2016-07-14 2019-03-15 三菱电机株式会社 激光加工装置
CN107876971A (zh) * 2016-09-30 2018-04-06 上海微电子装备（集团）股份有限公司 一种激光切割装置及方法
JP6974957B2 (ja) * 2017-03-31 2021-12-01 日本ケミコン株式会社 アルミ材のレーザキーホール溶接構造及びレーザキーホール溶接方法
JP6863050B2 (ja) 2017-04-28 2021-04-21 トヨタ自動車株式会社 レーザ溶接方法及びレーザ溶接装置
DE102017213511A1 (de) * 2017-08-03 2019-02-07 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zur Lasermaterialbearbeitung und Lasermaschine
BR112020007941B1 (pt) * 2017-10-25 2022-10-18 Nikon Corporation Aparelho de processamento
CN114995015B (zh) * 2018-01-15 2024-08-23 奥比中光科技集团股份有限公司 多功能照明模组
EP3766627B1 (en) * 2018-03-15 2023-09-06 Panasonic Intellectual Property Management Co., Ltd. Laser oscillator, laser machining device in which same is used, and laser oscillation method
JP6923570B2 (ja) * 2019-01-23 2021-08-18 株式会社アマダ レーザ加工装置及びレーザ加工ヘッド
SG11202007795UA (en) * 2019-01-30 2020-09-29 Hans Laser Technology Industry Group Co Ltd Laser cutting head for cutting hard, brittle products and laser cutting device thereof
CN118789117A (zh) * 2019-05-16 2024-10-18 松下知识产权经营株式会社 激光加工装置、激光加工方法以及生成方法
JP2020204734A (ja) * 2019-06-18 2020-12-24 パナソニックＩｐマネジメント株式会社 光源装置
JP7412925B2 (ja) * 2019-08-26 2024-01-15 キヤノン株式会社 光学装置、および、物品の製造方法
JP7321843B2 (ja) * 2019-08-30 2023-08-07 古河電子株式会社 ビーム整形装置、ビーム整形方法及び回折光学素子
WO2021117850A1 (ja) * 2019-12-13 2021-06-17 パナソニックＩｐマネジメント株式会社 レーザ装置
GB2592386B (en) 2020-02-26 2024-07-10 Univ Southampton Method of optical pulse delivery to multiple locations on a substrate
JP7507201B2 (ja) * 2022-05-30 2024-06-27 プライムプラネットエナジー＆ソリューションズ株式会社 レーザ溶接装置
CN115255635B (zh) * 2022-09-22 2023-01-10 苏州智慧谷激光智能装备有限公司 一种激光焊接系统及方法

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Publication number Publication date
JP2015174100A (ja) 2015-10-05
CN104907691A (zh) 2015-09-16
US20150260985A1 (en) 2015-09-17
CN104907691B (zh) 2019-03-08

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