JP6247188B2 - 積層セラミックキャパシタ - Google Patents

積層セラミックキャパシタ Download PDF

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Publication number
JP6247188B2
JP6247188B2 JP2014203082A JP2014203082A JP6247188B2 JP 6247188 B2 JP6247188 B2 JP 6247188B2 JP 2014203082 A JP2014203082 A JP 2014203082A JP 2014203082 A JP2014203082 A JP 2014203082A JP 6247188 B2 JP6247188 B2 JP 6247188B2
Authority
JP
Japan
Prior art keywords
lead
lead portion
ceramic body
internal electrodes
ceramic capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014203082A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015088747A (ja
JP2015088747A5 (enExample
Inventor
クァン リー、キョ
クァン リー、キョ
キム、ジン
ギュ アーン、ヨン
ギュ アーン、ヨン
ファ リー、ビョン
ファ リー、ビョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020130131110A external-priority patent/KR20140038916A/ko
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2015088747A publication Critical patent/JP2015088747A/ja
Publication of JP2015088747A5 publication Critical patent/JP2015088747A5/ja
Application granted granted Critical
Publication of JP6247188B2 publication Critical patent/JP6247188B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
JP2014203082A 2013-10-31 2014-10-01 積層セラミックキャパシタ Active JP6247188B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020130131110A KR20140038916A (ko) 2013-10-31 2013-10-31 적층 세라믹 커패시터 및 그 실장 기판
KR10-2013-0131110 2013-10-31
KR10-2014-0084594 2014-07-07
KR1020140084594A KR101514604B1 (ko) 2013-10-31 2014-07-07 적층 세라믹 커패시터 및 그 실장 기판

Publications (3)

Publication Number Publication Date
JP2015088747A JP2015088747A (ja) 2015-05-07
JP2015088747A5 JP2015088747A5 (enExample) 2015-08-06
JP6247188B2 true JP6247188B2 (ja) 2017-12-13

Family

ID=52994139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014203082A Active JP6247188B2 (ja) 2013-10-31 2014-10-01 積層セラミックキャパシタ

Country Status (2)

Country Link
US (1) US9524825B2 (enExample)
JP (1) JP6247188B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220528A (ja) * 2014-08-13 2014-11-20 株式会社村田製作所 積層コンデンサ
JP2014222783A (ja) * 2014-08-13 2014-11-27 株式会社村田製作所 積層コンデンサ及び積層コンデンサの実装構造体
JP6694235B2 (ja) * 2015-01-29 2020-05-13 Tdk株式会社 電子部品
KR101771798B1 (ko) 2015-08-26 2017-08-25 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
US10096426B2 (en) * 2015-12-28 2018-10-09 Tdk Corporation Electronic device
KR101892802B1 (ko) * 2016-04-25 2018-08-28 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
JP2017216329A (ja) * 2016-05-31 2017-12-07 株式会社村田製作所 セラミックコンデンサ
KR101832611B1 (ko) * 2016-06-21 2018-02-26 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
US12170170B2 (en) * 2020-12-24 2024-12-17 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component
KR102789013B1 (ko) * 2021-12-08 2025-04-01 삼성전기주식회사 적층형 전자 부품
WO2023157753A1 (ja) * 2022-02-15 2023-08-24 京セラ株式会社 積層セラミックコンデンサおよびその実装構造体

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6048230U (ja) * 1983-09-11 1985-04-04 株式会社村田製作所 積層コンデンサ
US4590437A (en) 1984-04-27 1986-05-20 Gte Laboratories Incorporated High frequency amplifier
JP2002203736A (ja) * 2000-12-28 2002-07-19 Nec Tokin Corp 積層セラミックコンデンサの製造方法
JP2002299152A (ja) * 2001-03-29 2002-10-11 Kyocera Corp コンデンサ
JP3788329B2 (ja) * 2001-11-29 2006-06-21 株式会社村田製作所 コンデンサアレイ
JP4864271B2 (ja) * 2002-10-17 2012-02-01 株式会社村田製作所 積層コンデンサ
JP2004140211A (ja) * 2002-10-18 2004-05-13 Murata Mfg Co Ltd 積層コンデンサ
KR100920614B1 (ko) 2007-02-05 2009-10-08 삼성전기주식회사 적층형 칩 커패시터
US7920370B2 (en) 2007-02-05 2011-04-05 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
JP2009021512A (ja) * 2007-07-13 2009-01-29 Taiyo Yuden Co Ltd 積層コンデンサ
KR101018254B1 (ko) 2009-10-23 2011-03-03 삼성전기주식회사 적층형 칩 캐패시터
JP5035318B2 (ja) 2009-10-23 2012-09-26 Ｔｄｋ株式会社 積層型コンデンサ
KR101548774B1 (ko) 2011-08-26 2015-08-31 삼성전기주식회사 적층 세라믹 커패시터
KR101525645B1 (ko) * 2011-09-02 2015-06-03 삼성전기주식회사 적층 세라믹 커패시터
KR101872524B1 (ko) * 2011-11-14 2018-06-28 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR101309479B1 (ko) 2012-05-30 2013-09-23 삼성전기주식회사 적층 칩 전자부품, 그 실장 기판 및 포장체

Also Published As

Publication number Publication date
JP2015088747A (ja) 2015-05-07
US20150114702A1 (en) 2015-04-30
US9524825B2 (en) 2016-12-20

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