JP6244665B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6244665B2 JP6244665B2 JP2013113009A JP2013113009A JP6244665B2 JP 6244665 B2 JP6244665 B2 JP 6244665B2 JP 2013113009 A JP2013113009 A JP 2013113009A JP 2013113009 A JP2013113009 A JP 2013113009A JP 6244665 B2 JP6244665 B2 JP 6244665B2
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- 239000004065 semiconductor Substances 0.000 title claims description 100
- 239000000758 substrate Substances 0.000 claims description 87
- 239000010410 layer Substances 0.000 claims description 80
- 239000011229 interlayer Substances 0.000 claims description 37
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 9
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 9
- 229910002601 GaN Inorganic materials 0.000 claims description 5
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims 1
- 210000000746 body region Anatomy 0.000 description 18
- 239000007789 gas Substances 0.000 description 16
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 230000005684 electric field Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 9
- 239000013078 crystal Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 238000000137 annealing Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000005755 formation reaction Methods 0.000 description 6
- 239000012535 impurity Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000012159 carrier gas Substances 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Description
はじめに概要について、以下の(i)〜(x)において説明する。
図1に示すように、MOSFET101(半導体装置)はトレンチゲート型トランジスタである。MOSFET101は、エピタキシャル基板20(半導体基板)と、ゲート酸化膜31(ゲート絶縁膜)と、ゲート電極32と、ドレイン電極層40(第1の電極層)と、ソース電極層50(第2の電極層)と、層間絶縁膜60とを有する。MOSFET101は、ドレイン電極層40およびソース電極層50の間でスイッチングを行う電力用半導体装置である。具体的には、MOSFET101はドレイン電極層40およびソース電極層50の間に電圧を600V以上印加可能に構成されていることが好ましく、1200V以上印加可能に構成されていることがより好ましく、3300V以上印加可能に構成されていることがさらに好ましい。
図4を参照して、下面P1を有する単結晶基板29が準備される。次に、下面P1と反対の面上におけるエピタキシャル成長によって、ドリフト層21が形成される。このエピタキシャル成長はCVD(Chemical Vapor Deposition)法により行われ得る。この際、キャリアガスとして水素ガスを用い得る。原料ガスとしては、たとえば、シラン(SiH4)とプロパン(C3H8)との混合ガスを用い得る。この際、不純物として、たとえば窒素(N)やリン(P)を導入することが好ましい。
図13に示すように、MOSFET102(半導体装置)はプレーナゲート型トランジスタである。MOSFET102は、エピタキシャル基板20p(半導体基板)と、ゲート酸化膜31p(ゲート絶縁膜)と、ゲート電極32pとを含む。エピタキシャル基板20pは、ボディ領域22pと、ソース領域23pと、コンタクト領域24pとを含む。
図14に示すように、ダイオード103(半導体装置)は、オーミック電極層70およびショットキー電極層80の間で整流を行うショットキーダイオードを含む。ダイオード103は、エピタキシャル基板20dと、オーミック電極層70(第1の電極層)と、ショットキー電極層80(第2の電極層)とを有する。ショットキー電極層80はショットキー部81と配線部82とを有する。
20E 素子部
20T 終端部
21 ドリフト層
22,22p ボディ領域
23,23p ソース領域
24 コンタクト領域
25 JTE領域
26 ガードリング部
27 フィールドストップ部
29 単結晶基板
31,31p ゲート酸化膜(ゲート絶縁膜)
32,32p ゲート電極
40 ドレイン電極層(第1の電極層)
50 ソース電極層(第2の電極層)
51 オーミック部
52,82 配線部
60,60a〜60c 層間絶縁膜
70 オーミック電極層(第1の電極層)
80 ショットキー電極層(第2の電極層)
61 低誘電率膜
62 高誘電率膜
81 ショットキー部
90 マスク層
101,102 MOSFET(半導体装置)
103 ダイオード(半導体装置)
BT 底面
OE 外端部
P1 下面(第1の面)
P2 上面(第2の面)
PS 基板側面
SW 側壁面
TR トレンチ
Claims (8)
- ワイドバンドギャップ半導体から作られ、第1の面と前記第1の面と反対の第2の面とを有する半導体基板を備え、前記半導体基板は素子部と前記素子部の外側に位置する終端部とを有し、さらに
前記半導体基板の前記第1の面上に設けられた第1の電極層と、
前記半導体基板の前記第2の面上において前記素子部上に設けられた第2の電極層と、
前記半導体基板の前記第2の面上に設けられた層間絶縁膜とを備え、前記層間絶縁膜は、前記半導体基板の前記素子部の一部と前記第2の電極層との間を絶縁する素子絶縁部と、前記半導体基板の前記終端部を覆う終端絶縁部とを有し、前記終端絶縁部は、前記素子絶縁部の誘電率よりも高い誘電率を有する高誘電率膜を含み、
前記高誘電率膜は前記素子絶縁部および前記終端絶縁部のうち前記終端絶縁部にのみ設けられ、
前記層間絶縁膜は、前記素子絶縁部の誘電率を有し前記素子絶縁部と前記終端絶縁部との各々に含まれる低誘電率膜を含み、
前記高誘電率膜は、前記半導体基板の前記第2の面と、前記低誘電率膜との間に位置している、半導体装置。 - 前記半導体基板の前記第2の面は、第1の導電型を有し前記第2の面の外端に位置する外端部と、前記外端部よりも内側に位置し前記第1の導電型と異なる第2の導電型を有するガードリング部とを含む、請求項1に記載の半導体装置。
- 前記高誘電率膜は前記半導体基板の前記第2の面上において前記ガードリング部および前記外端部にまたがっている、請求項2に記載の半導体装置。
- 前記半導体基板は前記第1の面と前記第2の面とをつなぐ基板側面を有し、前記高誘電率膜は前記基板側面と同一面上にまで延びている、請求項1〜3のいずれか1項に記載の半導体装置。
- 前記ワイドバンドギャップ半導体は炭化珪素および窒化ガリウムのいずれかである、請求項1〜4のいずれか1項に記載の半導体装置。
- 前記第1および第2の電極層の間に600V以上の電圧を印加可能に構成されている、請求項1〜5のいずれか1項に記載の半導体装置。
- 前記半導体装置は、前記第1および第2の電極層の間でスイッチングを行うトランジスタを含む、請求項1〜6のいずれか1項に記載の半導体装置。
- 前記半導体装置は、前記第1および第2の電極層の間で整流を行うダイオードを含む、請求項1〜7のいずれか1項に記載の半導体装置。
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