JP6224710B2 - 環境制御型ｓｅｍガス注入システム - Google Patents

環境制御型ｓｅｍガス注入システム Download PDF

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JP6224710B2
JP6224710B2 JP2015525521A JP2015525521A JP6224710B2 JP 6224710 B2 JP6224710 B2 JP 6224710B2 JP 2015525521 A JP2015525521 A JP 2015525521A JP 2015525521 A JP2015525521 A JP 2015525521A JP 6224710 B2 JP6224710 B2 JP 6224710B2
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gas
workpiece
gas concentration
sample
concentration structure
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Japanese (ja)
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JP2015524987A (ja
JP2015524987A5 (enExample
Inventor
マーク・カスターニャ
クライブ・ディー・チャンドラー
ウェイン・クロウスキ
ダニエル・ウッドロー・ハイファー・ジュニア
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エフ・イ−・アイ・カンパニー
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004—Charge control of objects or beams
    • H01J2237/0041—Neutralising arrangements
    • H01J2237/0044—Neutralising arrangements of objects being observed or treated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/006—Details of gas supplies, e.g. in an ion source, to a beam line, to a specimen or to a workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/2444—Electron Multiplier
    • H01J2237/24445—Electron Multiplier using avalanche in a gas

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2015525521A 2012-07-30 2013-07-30 環境制御型ｓｅｍガス注入システム Active JP6224710B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261677226P 2012-07-30 2012-07-30
US61/677,226 2012-07-30
PCT/US2013/052777 WO2014022429A1 (en) 2012-07-30 2013-07-30 Environmental sem gas injection system

Publications (3)

Publication Number Publication Date
JP2015524987A JP2015524987A (ja) 2015-08-27
JP2015524987A5 JP2015524987A5 (enExample) 2016-09-23
JP6224710B2 true JP6224710B2 (ja) 2017-11-01

Family

ID=50024551

Family Applications (1)

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JP2015525521A Active JP6224710B2 (ja) 2012-07-30 2013-07-30 環境制御型ｓｅｍガス注入システム

Country Status (5)

Country Link
US (1) US9070533B2 (enExample)
EP (1) EP2880675A4 (enExample)
JP (1) JP6224710B2 (enExample)
CN (1) CN104508791B (enExample)
WO (1) WO2014022429A1 (enExample)

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* Cited by examiner, † Cited by third party
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US9799490B2 (en) * 2015-03-31 2017-10-24 Fei Company Charged particle beam processing using process gas and cooled surface
US9633816B2 (en) * 2015-05-18 2017-04-25 Fei Company Electron beam microscope with improved imaging gas and method of use
DE102017201706B4 (de) * 2017-02-02 2025-10-23 Carl Zeiss Microscopy Gmbh Teilchenstrahlgerät mit einer Abbildungseinrichtung zur Abbildung eines Objekts und zur Abbildung einer Baueinheit in dem Teilchenstrahlgerät sowie Verfahren zum Betrieb des Teilchenstrahlgeräts
WO2019000021A1 (en) * 2017-06-26 2019-01-03 Gerasimos Daniel Danilatos MEANS FOR SAMPLE MANAGEMENT FOR PARTICLE BEAM MICROSCOPY
US20220305584A1 (en) * 2021-03-24 2022-09-29 Fei Company In-situ laser redeposition reduction by a controlled gas flow and a system for reducing contamination
DE102022208597A1 (de) 2022-08-18 2024-02-29 Carl Zeiss Microscopy Gmbh Vorrichtung zum Abbilden und Bearbeiten einer Probe mit einem fokussierten Teilchenstrahl
CN118712038B (zh) * 2024-05-31 2025-09-23 国仪量子技术(合肥)股份有限公司 气体注入装置

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US6683320B2 (en) 2000-05-18 2004-01-27 Fei Company Through-the-lens neutralization for charged particle beam system
DE10032607B4 (de) * 2000-07-07 2004-08-12 Leo Elektronenmikroskopie Gmbh Teilchenstrahlgerät mit einer im Ultrahochvakuum zu betreibenden Teilchenquelle und kaskadenförmige Pumpanordnung für ein solches Teilchenstrahlgerät
DE50113837D1 (de) 2000-07-07 2008-05-21 Zeiss Carl Nts Gmbh Detektor für variierende druckbereiche und elektronenmikroskop mit einem entsprechenden detektor
US6838380B2 (en) * 2001-01-26 2005-01-04 Fei Company Fabrication of high resistivity structures using focused ion beams
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US8013300B2 (en) 2008-06-20 2011-09-06 Carl Zeiss Nts, Llc Sample decontamination
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JP2011034695A (ja) * 2009-07-30 2011-02-17 Hitachi High-Technologies Corp 走査電子顕微鏡
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Also Published As

Publication number Publication date
EP2880675A4 (en) 2016-03-30
EP2880675A1 (en) 2015-06-10
JP2015524987A (ja) 2015-08-27
US20140034830A1 (en) 2014-02-06
CN104508791A (zh) 2015-04-08
WO2014022429A1 (en) 2014-02-06
US9070533B2 (en) 2015-06-30
CN104508791B (zh) 2017-03-01

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