JP6219080B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus for mounting a component on a substrate.

  Conventionally, as this kind of component mounting apparatus, a lifting member that can be lifted and lowered, a nozzle holder held by the lifting member, a nozzle body provided at the tip of the nozzle holder, and a relative movement in the vertical axis direction to the nozzle body A suction head that can hold the electronic component and can suck the electronic component, a spring that urges the suction head downward with respect to the nozzle body, an optical sensor that is attached to the elevating member and detects relative movement of the suction head with respect to the nozzle body, Have been proposed (see, for example, Patent Document 1). In this component mounting apparatus, a projector and a light receiver of an optical sensor are installed on the elevating member at a predetermined interval in the horizontal direction across the suction head, and the suction head blocks the optical axis from the light projector to the light receiver. The shielding part is provided. This shielding portion does not block the optical axis from the projector when the suction head is held at the lower end with respect to the nozzle body, and when the suction head moves backward relative to the nozzle body, the optical axis from the projector The optical sensor detects relative movement of the suction head with respect to the nozzle body based on the presence or absence of light reception by the light receiver.

JP 2006-196618 A

  However, in the component mounting apparatus described above, the projector and the light receiver of the optical sensor are installed at a predetermined interval in the horizontal direction, so that a relatively wide installation space is required in the horizontal direction, and the apparatus becomes large.

  The component mounting apparatus of the present invention is mainly intended to reduce the size of the apparatus by saving the space of the optical detector for detecting the relative movement of the nozzle with respect to the holding member.

  The component mounting apparatus of the present invention employs the following means in order to achieve the main object described above.

The component mounting apparatus of the present invention is
A component mounting device that performs a suction operation for sucking a component supplied from a component supply device and performs a mounting operation for mounting the component sucked by the suction operation on a mounting target,
A nozzle capable of adsorbing the component;
A holding member that holds the nozzle movably in the up-and-down direction;
Biasing means for biasing the nozzle downward with respect to the holding member;
Elevating means for elevating the holding member;
An optical detection means installed so that an optical axis is directed downward or upward, and detecting relative movement of the nozzle with respect to the holding member;
When performing the adsorption operation or the mounting operation, the gist is provided with control means for controlling the elevating means so that the holding member is lowered based on a detection signal from the optical detection means.

In the component mounting apparatus of the present invention, the optical detection means for detecting the relative movement of the nozzle with respect to the holding member is installed so that the optical axis direction is directed downward or upward. Since the elevating means is usually longer in the vertical direction than in the horizontal direction, by installing the optical detecting means so that the optical axis is directed downward or upward, the optical detecting means can be saved in space, Miniaturization can be achieved. Since the nozzle is urged by the urging means with respect to the holding member, the urging means can absorb the impact when the component adsorbed by the nozzle contacts the substrate.
Here, “installed so that the optical axis is directed downward or upward” means that the optical axis does not need to be completely parallel to the ascending / descending direction, even if the angle of the optical axis is slightly deviated from the ascending / descending direction. Good.

  In such a component mounting apparatus of the present invention, a reflection member provided on the nozzle and having a reflection surface in the direction of the optical axis is provided, and the optical detection means is provided on the holding member, and is displaced from the reflection surface. It is also possible to be a reflection type optical detection means for detecting.

  In the component mounting apparatus according to the aspect of the present invention, the reflection member may use an upper surface of a flange provided around the nozzle as the reflection surface. In this case, since it is not necessary to prepare a separate reflecting member, further space saving of the optical detection means can be achieved.

It is a block diagram which shows the outline of a structure of the component mounting apparatus 10 as one Example of this invention. 2 is a configuration diagram showing an outline of the configuration of a head 60. It is a block diagram which shows the outline of a structure of the nozzle holder 62 and the suction nozzle 64. FIG. 3 is a block diagram showing an electrical connection relationship of the control device 100. FIG. It is explanatory drawing which shows a mode that components are mounted on the board | substrate 16. FIG.

  The form for implementing this invention is demonstrated using an Example.

  FIG. 1 is a configuration diagram showing an outline of the configuration of a component mounting apparatus 10 according to an embodiment of the present invention. FIG. 2 is a configuration diagram showing an outline of the configuration of a head 60. FIG. FIG. 4 is a block diagram showing an outline of the configuration of the nozzle 64, and FIG. 4 is a block diagram showing an electrical connection relationship of the control device 100.

  As shown in FIG. 1, the component mounting apparatus 10 includes a component supply device 20 that supplies electronic components (hereinafter simply referred to as “components”) and a substrate transport that transports a circuit board (hereinafter simply referred to as “substrate”) 16. The apparatus 30, the backup device 40 that backs up the conveyed substrate 16, the component mounting device 50 that mounts the component supplied by the component supply device 20 on the substrate 16 backed up by the backup device 40, and the entire mounting device are controlled. And a substrate transfer device 30, a backup device 40, and a component mounting device 50 are accommodated in the housing 12. Although only one component mounting apparatus 10 is shown in FIG. 1, a plurality of component mounting apparatuses are arranged side by side in the component mounting line.

  As shown in FIG. 1, the component supply device 20 includes a tape feeder 22 detachably attached to the front side of the housing 12. The tape feeder 22 includes a reel 22a around which a tape is wound, and components are accommodated at predetermined intervals in each cavity of the carrier tape. These parts are protected by a film covering the surface of the tape, and when the tape is pulled out from the reel 22a, the film is peeled off and exposed in the feeder portion 22b.

  As shown in FIG. 1, the substrate transfer device 30 is a pair of conveyor rails provided on the base 14 installed at the lower stage of the housing 12 at a predetermined interval in the Y-axis direction (front-rear direction in FIG. 1). 32a and 32b, and a pair of conveyor belts 34a and 34b provided on the mutually opposing surfaces of the conveyor rails 32a and 32b. The pair of conveyor rails 32a and 32b is configured as a rectangular member whose longitudinal direction is the X-axis direction (left-right direction in FIG. 1), and driving wheels and driven wheels are provided at both ends in the longitudinal direction. . The conveyor belts 34a and 34b are stretched over driving wheels and driven wheels provided on the conveyor rails 32a and 32b, and the driving wheels are driven by a driving motor (not shown), so that the substrate 16 is moved from the left in FIG. Transport to the right.

  As shown in FIG. 1, the backup device 40 includes a backup plate 42 that can be moved up and down by a lifting device (not shown), and a base plate 44 that is mounted on the upper surface of the backup plate 42. The base plate 44 is provided with a plurality of backup pins 46 for backing up the substrate 16 from the back side.

  As shown in FIG. 1, the component mounting apparatus 50 includes an X-axis slider 52 that is moved in the X-axis direction (left-right direction in FIG. 1) by driving of a drive motor 51 (see FIG. 4), and a drive motor 53 (FIG. 4). The Y-axis slider 54 that is moved in the Y-axis direction (the front-rear direction in FIG. 1) by the drive of the reference), the head 60 attached to the X-axis slider 52, the movement in the Z-axis direction, and the rotation around the Z-axis A suction nozzle 64 that can be mounted on the head 60 and can suck the components, a parts camera 90 that is provided on the base 14 and that captures the components sucked by the suction nozzle 64, and a substrate 16 that is attached to the X-axis slider 52. A mark camera 92 for photographing a substrate positioning reference mark provided on the head 60 and a nozzle stocker 94 for stocking a plurality of types of suction nozzles that can be attached to the head 60 are provided.

  The X-axis slider 52 is attached to a guide rail 55 provided along the X-axis direction on the front surface of the Y-axis slider 54 and is slidable in the X-axis direction while being guided by the guide rail 55. The Y-axis slider 54 is attached to a guide rail 56 provided along the Y-axis direction at the top of the housing 12, and is slidable in the Y-axis direction while being guided by the guide rail 56.

  As shown in FIG. 2, the head 60 includes a nozzle holder 62 configured as a hollow cylindrical member that holds the suction nozzle 64, a Z-axis actuator 70 that moves the nozzle holder 62 in the Z-axis direction, and the nozzle holder 62 as Z And a θ-axis actuator 80 that rotates around the axis.

  As shown in FIG. 2, the Z-axis actuator 70 includes a Z-axis slider 72, a screw shaft 74 whose axial direction extends in the Z-axis direction, and a ball screw that passes through the screw shaft 74 and is attached to the Z-axis slider 72. The feed screw mechanism includes a nut 76 and a drive motor 78 having a rotation shaft connected to a screw shaft 74. The Z-axis actuator 70 drives the drive motor 78 to move the Z-axis slider 72 in the Z-axis direction. The Z-axis slider 72 rotatably supports the nozzle holder 62 via a bearing 79, and moves the nozzle holder 62 in the Z-axis direction as the Z-axis slider 72 moves in the Z-axis direction.

  As shown in FIG. 2, the θ-axis actuator 80 is spline-engaged with the nozzle holder 62 and is rotatably supported by the X-axis slider 52 via a bearing 83, and the nozzle holder 62 is splined. And a guide sleeve 84 rotatably supported on the X-axis slider 52 via a bearing 85, a gear 86 meshed with a gear 82 a provided on the outer periphery of the spline sleeve 82, and a rotation shaft of the gear 86. And a drive motor 88 connected thereto. The θ-axis actuator 80 rotates the spline sleeve 82 (guide sleeve 84) by driving the drive motor 88 to rotate. Since the spline sleeve 82 is spline-engaged with the nozzle holder 62, the nozzle holder 62 is rotated as the spline sleeve 82 rotates.

  As shown in FIG. 3, the nozzle holder 62 is configured as a hollow cylindrical member that extends in the Z-axis direction, and a flange portion 62c that protrudes outward from the front end portion 62a to a position away from the rear end side by a predetermined distance. Is provided. Further, the nozzle holder 62 is formed with a stepped portion 62d in which the inner diameter of the tip end portion 62a is larger than the inner diameter of the rear end side, and one end side abuts the annular end surface of the stepped portion 62d inside the tip end portion 62a. Further, a spring (coil spring) 68 is disposed. A rear end portion 65 b of the nozzle body 65 is in contact with the other end side of the spring 68. For this reason, the spring 68 urges the nozzle body 65 downward using the annular end surface of the stepped portion 62d as a spring receiver.

  As shown in FIG. 3, the suction nozzle 64 includes a nozzle main body 65 and a suction portion 66 that is detachably attached to a distal end portion 65 a (lower end) of the nozzle main body 65.

  As shown in FIG. 3, the nozzle body 65 is configured as a bottomed cylindrical member having an opening on the front end 65a side and a bottom on the rear end 65b side, and the outer peripheral surface of the rear end 65b is a nozzle holder. The inner end surface 62a of the 62 is slidably fitted (internally fitted). A through hole 65f is formed in the bottom of the rear end portion 65b of the nozzle body 65 to allow communication between the internal passage 65e of the nozzle body 65 and the internal passage 62e of the nozzle holder 62. Further, pin holes 65d are formed on both sides in the diameter direction of the nozzle body 65, and an engagement pin 67 is penetrated in the diameter direction through the pin hole 65d. A slit hole 62b having a predetermined length is formed along the axial direction on both sides in the diameter direction of the nozzle holder 62 to which the nozzle body 65 is fitted, and an engagement pin 67 is slid vertically in the slit hole 62b. It is movably engaged. Therefore, the nozzle body 65 can move in the vertical direction with respect to the nozzle holder 62 within the range of the length of the slit hole 62b. Further, the nozzle body 65 is provided with a disk-like flange portion 65c projecting outward at a position away from the front end portion 65a toward the rear end side by a predetermined distance. The lower surface (surface on the suction portion 66 side) of the flange portion 65c is configured as a reflection surface. The irradiation light irradiated from the side is reflected from behind the adsorbed component. Thus, image recognition is performed by capturing a silhouette image of the component formed by reflected light from behind the component as an image (an image in which the entire component appears black and the background appears white) (backlight recognition). In this embodiment, the backlight recognition is performed using the lower surface of the flange portion 65c as a reflection surface, but the present invention is not limited to this. For example, the lower surface of the flange portion 65c is subjected to a low reflection treatment (such as a satin finish) so that the reflection of the irradiation light is suppressed, and the component surface formed by the reflected light by direct illumination light on the component It is also possible to perform image recognition (front light recognition) by capturing the image as an image (an image in which parts appear whitish (gray) and a background appears black). The front light recognition is suitable for use when performing bump recognition such as BGA (Ball grid array). In the present embodiment, the upper surface of the flange portion 65c is also configured as a reflective surface, like the lower surface.

  As shown in FIG. 3, the suction portion 66 is provided with a suction port 66 a on a surface in contact with a component. The suction port 66a communicates with the internal passage 62e of the nozzle holder 62 via the internal passage 65e of the nozzle body 65. The internal passage 62e of the nozzle holder 62 passes through the electromagnetic valve 97 and the vacuum pump 98 and the air pipe 99. Either one of them is selectively communicated. Accordingly, when the solenoid valve 97 is driven so that the internal passage 62e of the nozzle holder 62 and the vacuum pump 98 communicate with each other, a negative pressure acts on the suction port 66a, and parts can be adsorbed. When the solenoid valve 97 is driven so that the air 62e and the air pipe 99 communicate with each other, a positive pressure acts on the suction port 66a, and the suction of the parts can be released.

  As shown in FIG. 3, the flange portion 62c of the nozzle holder 62 and the flange portion 65c of the nozzle body 65 are provided so that the lower surface of the flange portion 62c and the upper surface (reflection surface) of the flange portion 65c face each other. A reflective optical sensor 96 for measuring the distance to the upper surface of the flange portion 65c is installed on the lower surface of the flange portion 62c. As the optical sensor 96, for example, a laser type or an LED type can be used. The optical sensor 96 emits light downward from the light emitter toward the upper surface of the flange portion 65c of the nozzle main body 65, and the reflected light reflected upward from the upper surface of the flange portion 65c is received by the light receiver. The measurement is performed. In the present embodiment, the optical sensor 96 is installed in an empty space above the flange portion 65c provided in the nozzle body 65, so that it is not necessary to provide a new space for installing the optical sensor 96.

  As shown in FIG. 4, the control device 100 is configured as a microprocessor centered on a CPU 101, and includes a ROM 102 that stores a processing program, an HDD 103 that stores various data, a RAM 104 that is used as a work area, an external device and an electrical device. An input / output interface 105 for exchanging signals is provided, and these are connected via a bus 106. An image signal from the parts camera 90 and mark camera 92, a detection signal from the optical sensor 96, and the like are input to the control device 100 via the input / output interface 105. From the control device 100, the substrate transfer device 30 is input. Drive signals to the backup device 40, the drive motor 51 of the X-axis slider 52, the drive motor 53 of the Y-axis slider 54, the drive motor 78 of the Z-axis actuator 70, the drive motor 88 of the θ-axis actuator 80, the electromagnetic valve 97, etc. The data is output via the input / output interface 105. The control device 100 is connected to the component supply device 20 so as to be capable of bidirectional communication. Note that the X-axis slider 52 and the Y-axis slider 54 are provided with position sensors (not shown), and the control device 100 drives and controls the drive motors 51 and 53 while inputting position information from these position sensors. The Z-axis actuator 70 and the θ-axis actuator 80 are also equipped with position sensors (not shown), and the control device 100 drives and controls the drive motors 78 and 88 while inputting position information from these position sensors.

  In the component mounting apparatus 10 of the embodiment configured as described above, a component mounting process for mounting components on the substrate 16 will be described. The control device 100 of the component mounting apparatus 10 controls the X-axis slider 52 and the Y-axis slider 54 so that the suction nozzle 64 comes directly above the component supplied by the component supply device 20 (tape feeder 22), and the Z-axis The suction nozzle 64 (nozzle holder 62) is lowered by controlling the actuator 70, and a negative pressure is applied to the suction port 66a of the suction portion 66 by controlling the electromagnetic valve 97, thereby causing the suction nozzle 64 to suck the component. Thereafter, the control device 100 controls the Z-axis actuator 70 so that the suction nozzle 64 is raised, and controls the sliders 52 and 54 so that the component sucked by the suction nozzle 64 is directly above the mounting position of the substrate 16. . Then, the control device 100 controls the θ-axis actuator 80 to adjust the mounting angle of the component sucked by the suction nozzle 64 and controls the Z-axis actuator 70 until the component is pressed against the mounting position of the substrate 16. By lowering the suction nozzle 64 (nozzle holder 62) and controlling the electromagnetic valve 97 to apply a positive pressure to the suction port 66a of the suction portion 66, the suction of the parts by the suction nozzle 64 is released. In this way, each component is mounted on the substrate 16.

  Here, the operation when pressing the component against the mounting position of the substrate 16 will be described in more detail. FIG. 5 is an explanatory diagram showing a state in which components are mounted on the substrate 16. When the component held by the suction nozzle 64 by lowering the nozzle holder 62 contacts the substrate 16, the lowering of the suction nozzle 64 (nozzle body 65) is stopped (see FIG. 5A). At this time, since the spring 68 is interposed between the nozzle holder 62 and the suction nozzle 64 (nozzle body 65), the impact when the component contacts the substrate 16 is absorbed by the spring 68. When the nozzle holder 62 is further lowered while the component is in contact with the substrate 16, the nozzle body 65 is retracted relative to the nozzle holder 62 while the spring 68 is compressed (see FIG. 5B). As a result, the distance between the flange portion 62c of the nozzle holder 62 and the flange portion 65c of the nozzle body 65 changes (shrinks), so that the component comes into contact with the substrate 16 by detecting the change in this distance with the optical sensor 96. Can be detected. Then, after detecting that the component has contacted the substrate 16, the component is pressed against the substrate 16 by further lowering the nozzle holder 62 by a predetermined amount (see FIG. 5C). Since the amount of shrinkage of the spring 68 and the load are in a proportional relationship, the component is placed on the substrate 16 with an appropriate pressing load by controlling the downward displacement (predetermined amount) of the nozzle holder 62 after the component contacts the substrate 16. Can be pressed against. In this embodiment, the control device 100 uses the suction nozzle 64 (nozzle holder 62) at a normal speed until the component is positioned on a predetermined height (for example, 5 mm) based on the substrate surface height input in advance by an operator or the like. When the component is positioned above the predetermined height, the suction nozzle 64 is lowered by switching from the normal speed to the low speed. At this time, when the optical sensor 96 detects that the component has actually contacted the surface of the substrate 16, the suction nozzle 64 is further lowered and stopped by a predetermined amount (for example, 0.3 mm). A positive pressure is applied to the part to release the suction of the part. When the components are mounted in this manner, the suction nozzle 64 is raised by an operation opposite to that at the time of lowering, that is, the suction nozzle 64 is lowered at a low speed until it is detected by the optical sensor 96 that the contact between the suction nozzle 64 and the component is released. When it is detected that the contact between the suction nozzle 64 and the component has been released, the suction nozzle 64 is raised by switching from the low speed to the normal speed. Of course, the suction nozzle 64 is not limited to lowering the suction nozzle 64 by switching between the normal speed and the low speed, and the suction nozzle 64 may be lowered at a constant speed.

  According to the component mounting apparatus 10 of the embodiment described above, the reflective optical sensor 96 that detects the relative movement of the suction nozzle 64 with respect to the nozzle holder 62 is installed so that the optical axis direction is directed downward. Thereby, since the optical sensor 96 can be installed in the empty space of the head 60, it is not necessary to provide a new space for installing the optical sensor 96. As a result, the head 60 can be reduced in size. In addition, since the upper surface of the flange portion 65c provided in the nozzle body 65 is used as a reflection surface, the suction nozzle 64 can be made smaller than the case where a separate reflection member is provided in the nozzle body 65. In addition, since the spring 68 is installed on the nozzle holder 62 and the suction nozzle 64 is biased downward, the spring 68 can absorb an impact when a component sucked by the suction nozzle 64 contacts the substrate 16.

  In the component mounting apparatus 10 according to the embodiment, after the optical sensor 96 detects that the component has contacted the surface of the substrate 16, the suction nozzle 64 (nozzle holder 62) is further lowered by a predetermined amount to push the component against the substrate 16. However, the present invention is not limited to this, and the descent of the suction nozzle 64 may be stopped when the optical sensor 96 detects that the component has contacted the substrate 16.

  In the component mounting apparatus 10 of the embodiment, the detection signal from the optical sensor 96 is used for controlling the Z-axis actuator 70 when performing the mounting operation, but the present invention is not limited to this, and the suction operation is performed. It may be used for controlling the Z-axis actuator 70 at that time. In this case, the adsorption operation may be performed as follows. That is, the control device 100 moves the suction nozzle 64 (nozzle holder 62) at a normal speed until the suction port 66a of the suction nozzle 64 is positioned above a predetermined height based on the part surface height input in advance by an operator or the like. When the suction port 66a is positioned at a predetermined height, the suction nozzle 64 is lowered by switching from the normal speed to the low speed. At this time, when the optical sensor 96 detects that the suction port 66a of the suction nozzle 64 has actually contacted the component surface, the control device 100 stops the lowering of the suction nozzle 64 and applies a negative pressure to the suction nozzle 64. Acts to adsorb parts. Of course, the suction nozzle 64 is not limited to lowering the suction nozzle 64 by switching between the normal speed and the low speed, and the suction nozzle 64 may be lowered at a constant speed.

  In the component mounting apparatus 10 of the embodiment, the present invention in which the mounting operation is performed based on the detection signal from the optical sensor 96 has been applied to the case where the component is directly mounted on the substrate 16, but the present invention is not limited to this. It is not a thing. Since the optical sensor 96 can detect contact between the suction nozzle 64 or a component sucked by the suction nozzle 64 and the object, for example, a PoP (Package On Package) in which a plurality of components are stacked on the substrate 16 is used. It may be applied when mounting components. In this case, the Z-axis actuator 70 may be controlled such that a new component is mounted on the upper surface of the mounted component by detecting the height of the upper surface of the mounted component with the optical sensor 96. Further, the warpage state of the substrate 16 may be measured by detecting a plurality of surface heights of the substrate 16 by the optical sensor 96. Furthermore, it is good also as what detects the attachment defect of the suction nozzle 64 with respect to the nozzle holder 62 based on the detected value of the optical sensor 96. FIG. In this case, for example, when the detection value of the optical sensor 96 is out of the normal range, or when the lowering amount of the suction nozzle 64 does not correspond to the displacement amount of the detection value of the optical sensor 96, the nozzle holder 62. It may be determined that the suction nozzle 64 is not attached correctly. In addition, when a plurality of types of suction nozzles that can be attached to the nozzle holder 62 have flange portions with different heights for each nozzle, the types of suction nozzles attached to the nozzle holder 62 are determined based on the detection value of the optical sensor 96. It may be detected.

  In the component mounting apparatus 10 of the embodiment, the optical sensor 96 is installed on the lower surface of the flange portion 62c of the nozzle holder 62 so that the optical axis from the light emitter is directed downward, and the reflection surface is provided on the upper surface of the flange portion 65c of the nozzle body 65. However, the present invention is not limited to this. The optical sensor 96 is installed on the upper surface of the flange portion 65c of the nozzle body 65 so that the optical axis from the light emitter is directed upward, and the flange portion of the nozzle holder 62 is provided. It is good also as what forms a reflective surface in the lower surface of 62c.

  In the component mounting apparatus 10 of the embodiment, the reflective surface is formed on the flange portion 65c of the nozzle body 65. However, the present invention is not limited to this, and a separate reflective member may be provided on the nozzle body 65.

  In the component mounting apparatus 10 of the embodiment, the flange 62c is provided in the nozzle holder 62 and the optical sensor 96 is provided in the flange 62c. However, the present invention is not limited to this, and the optical axis is downward. If the optical sensor 96 can be installed so as to face, the installation method is not limited.

  In the component mounting apparatus 10 of the embodiment, the displacement between the nozzle holder 62 and the suction nozzle 64 is detected by using the reflective optical sensor 96. However, the present invention is not limited to this. It is good also as what detects using. In this case, for example, a light emitter may be installed on the flange portion 62c of the nozzle holder 62 and a light receiver may be installed on the flange portion 65c of the suction nozzle 64 (nozzle body 65), or the suction nozzle 64 (nozzle body 65). ) And a light receiver may be installed on the flange 62c of the nozzle holder 62.

  In the component mounting apparatus 10 of the embodiment, the nozzle body 65 is urged downward with respect to the nozzle holder 62 by the spring 68 (coil spring). However, the present invention is not limited to this, and a disc spring is used. Any other elastic member may be used.

  Here, the correspondence between the main elements of the embodiment and the main elements of the invention described in the column of means for solving the problems will be described. In the embodiment, the suction nozzle 64 corresponds to “nozzle”, the nozzle holder 62 corresponds to “holding member”, the spring 68 corresponds to “biasing means”, and the Z-axis actuator 70 corresponds to “lifting means”. The optical sensor 96 corresponds to “optical detection means”, and the control device 100 corresponds to “control means”. The correspondence between the main elements of the embodiment and the main elements of the invention described in the column of means for solving the problem is the same as that of the embodiment described in the column of means for solving the problem. Therefore, the elements of the invention described in the column of means for solving the problems are not limited. In other words, the interpretation of the invention described in the column of means for solving the problems should be made based on the description of the column, and the examples are those of the invention described in the column of means for solving the problems. It is only a specific example.

  The embodiments of the present invention have been described using the embodiments. However, the present invention is not limited to these embodiments, and can be implemented in various forms without departing from the gist of the present invention. Of course you get.

  The present invention can be used in the manufacturing industry of component mounting apparatuses.

  DESCRIPTION OF SYMBOLS 10 Component mounting apparatus, 12 Housing | casing, 14 Base, 16 Board | substrate, 20 Component supply apparatus, 22 Tape feeder, 22a Reel, 22b Feeder part, 30 Substrate conveyance apparatus, 32a, 32b Conveyor rail, 34a, 34b Conveyor belt, 40 Backup device, 42 Backup plate, 44 Base plate, 46 Backup pin, 50 Component mounting device, 51 Drive motor, 52 X-axis slider, 53 Drive motor, 54 Y-axis slider, 55, 56 Guide rail, 60 head, 62 Nozzle holder, 62a tip, 62b slit hole, 62c flange, 62d internal passage, 62e stepped portion, 64 suction nozzle, 65 nozzle body, 65a tip, 65b rear end, 65c flange, 65d pin hole, 65e internal passage, 65f Through hole, 66 Suction part, 66a Suction port, 68 Spring, 70 Z-axis actuator, 72 Z-axis slider, 74 Screw shaft, 76 Ball screw nut, 78 Drive motor, 79 Bearing, 80 θ-axis actuator, 82 Spline sleeve, 82a Gear, 83 bearing, 84 guide sleeve, 85 bearing, 86 gear, 88 drive motor, 90 parts camera, 92 mark camera, 94 nozzle stocker, 96 optical sensor, 97 solenoid valve, 98 vacuum pump, 99 air piping, 100 control device , 101 CPU, 102 ROM, 103 HDD, 104 RAM, 105 I / O interface, 106 bus.

Claims (3)

A component mounting device that performs a suction operation for sucking a component supplied from a component supply device and performs a mounting operation for mounting the component sucked by the suction operation on a mounting target,
A nozzle capable of adsorbing the component;
A holding member that holds the nozzle movably in the up-and-down direction;
Biasing means for biasing the nozzle downward with respect to the holding member;
Elevating means for elevating the holding member;
An optical detection means installed so that an optical axis is directed downward or upward, and detecting relative movement of the nozzle with respect to the holding member;
A component mounting apparatus comprising: control means for controlling the lifting means so that the holding member is lowered based on a detection signal from the optical detection means when performing the suction operation or the mounting operation. The component mounting apparatus according to claim 1,
A reflective member provided on the nozzle and having a reflective surface in the direction of the optical axis;
The component mounting apparatus, wherein the optical detection unit is a reflection type optical detection unit that is provided on the holding member and detects a displacement with respect to the reflection surface. The component mounting apparatus according to claim 2 ,
The component mounting apparatus, wherein the reflecting member uses an upper surface of a flange provided around the nozzle as the reflecting surface.

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