JP2013102246A - Substrate conveyor - Google Patents

Substrate conveyor Download PDF

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JP2013102246A
JP2013102246A JP2013045087A JP2013045087A JP2013102246A JP 2013102246 A JP2013102246 A JP 2013102246A JP 2013045087 A JP2013045087 A JP 2013045087A JP 2013045087 A JP2013045087 A JP 2013045087A JP 2013102246 A JP2013102246 A JP 2013102246A
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circuit board
substrate
support
elevating
push
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JP5728514B2 (en
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Akinobu Ito
明伸 伊藤
Hideki Hashimoto
英樹 橋本
Yukihiro Fukao
幸弘 深尾
Toshihiro Nonomura
年弘 野々村
Fumitaka Maeda
文隆 前田
Toshinori Shimizu
利律 清水
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To improve a substrate conveyor equipped with a conveyer belt that circulates and a guide rail which guides a side edge of a circuit board supported for transportation by a transportation part, being a horizontal straight part of the conveyer belt.SOLUTION: The substrate conveyor includes a push-up member which supports a lower surface of a side edge part of a circuit board being supported by a transportation part so that the circuit board is floated from the transportation part, a receiving member which extends parallel to the transportation part, above the transportation part, receives the side edge part of the circuit board that is pushed up by the push-up member, and sandwiches the side edge part of the circuit board in corporation with the push-up member, a support pin unit 704 which supports the circuit board from below, and a lift device which raises/lowers the push-up member and the support pin unit 704. The lift device lifts the push-up member up to a position for sandwiching the circuit board together with the receiving member. After that, an air cylinder 720 which is a part of the lift device raises the support pin unit 704 up to a position to contact to a lower surface of the circuit board.

Description

本発明は、電子回路部品装着機やスクリーン印刷機等、回路基板に作業を施す種々の対基板作業機に設けられ、回路基板を搬送し、所定の位置に停止させて保持する基板コンベヤに関するものである。   BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate conveyor that is provided in various anti-substrate working machines that perform operations on circuit boards, such as electronic circuit component mounting machines and screen printing machines, and that transports circuit boards and stops them at predetermined positions and holds them. It is.

この種の基板コンベヤは広く使用されており、それに含まれる基板支持装置は、例えば、下記の特許文献1に記載されているように、複数の支持部材と、それら支持部材を昇降させる昇降装置とを備え、支持部材が昇降装置により上昇させられて回路基板の下面に接触させられ、下方から支持する。
特開平11−195899号公報
This type of substrate conveyor is widely used, and a substrate support device included therein includes, for example, a plurality of support members and a lifting device that lifts and lowers the support members as described in Patent Document 1 below. The supporting member is raised by the lifting device and brought into contact with the lower surface of the circuit board, and is supported from below.
JP-A-11-195899

しかしながら、この種の基板保持装置を備えた基板コンベヤには未だ改良すべき点がある。本発明は、以上の事情を背景として為されたものであり、良好に回路基板を保持し得る基板支持装置を備えた基板コンベヤの提供を課題とする。   However, there is still a point to be improved in the substrate conveyor provided with this kind of substrate holding device. The present invention has been made in the background of the above circumstances, and an object of the present invention is to provide a substrate conveyor provided with a substrate support device that can hold a circuit board satisfactorily.

上記の課題は、基板コンベヤを、(a)水平な直線部を含む閉曲線に沿って周回するコンベヤベルトと、(b)そのコンベヤベルトの前記直線部に対応する部分である搬送部に支持されて搬送される回路基板の側縁を案内する案内面を備えた案内レールと、(c)前記搬送部に支持された回路基板の側縁部の下面を支持して前記搬送部から浮き上がらせる押上部材と、(d)前記搬送部の上方においてその搬送部に平行に延び、前記押上部材により押し上げられる回路基板の側縁部を受け、押上部材と共同して回路基板の側縁部を挟む受け部材と、(e)前記回路基板を下方から支持する基板支持部材と、(f)前記押上部材と前記基板支持部材とを昇降させる昇降装置とを含むものとするとともに、前記昇降装置を、前記押上部材を前記受け部材と共同して回路基板を挟む位置まで上昇させた後に、前記基板支持部材を前記回路基板の下面に接触する位置まで上昇させるものとすることにより解決される。   The above problems are supported by (a) a conveyor belt that circulates along a closed curve including a horizontal straight portion, and (b) a conveyor portion that is a portion corresponding to the straight portion of the conveyor belt. A guide rail having a guide surface for guiding a side edge of the circuit board to be transported, and (c) a push-up member for supporting the lower surface of the side edge portion of the circuit board supported by the transport section and floating from the transport section And (d) a receiving member that extends in parallel with the conveying portion above the conveying portion, receives a side edge portion of the circuit board that is pushed up by the lifting member, and sandwiches the side edge portion of the circuit board together with the lifting member. And (e) a substrate support member that supports the circuit board from below, and (f) a lifting device that lifts and lowers the push-up member and the substrate support member. Circuit board in cooperation with the receiving member After raising position to sandwich, is solved by shall be raised to a position in contact with the substrate support member to the lower surface of the circuit board.

押上部材が受け部材と共同して回路基板の側縁部を挟む前に、基板支持部材が回路基板の下面に接触すれば、回路基板をずらしてしまう恐れがあるのであるが、回路基板が押上部材と受け部材とに挟まれた状態で基板支持部材に回路基板を支持させれば、回路基板がずれることなく支持させることができる。   If the board support member contacts the lower surface of the circuit board before the push-up member cooperates with the receiving member to sandwich the side edge of the circuit board, the circuit board may be displaced. If the circuit board is supported by the board support member while being sandwiched between the member and the receiving member, the circuit board can be supported without shifting.

本発明の望ましい態様においては、前記(f)昇降装置が、(f-1)前記押上部材を押し上げる昇降部材と、(f-2)その昇降部材を昇降させる第一昇降部と、(f-3)前記昇降部材に保持され、その昇降部材に対して前記基板支持部材を相対的に昇降させる第二昇降部と、(f-4)前記押上部材が前記第一昇降部により前記受け部材と共同して回路基板を挟む位置まで上昇させられた後に、前記基板支持部材が前記第二昇降部により前記回路基板の下面に接触する位置まで上昇させられるように、前記第一昇降部と前記第二昇降部とを制御する昇降制御部とを含むものとされる。
また、別の望ましい態様においては、前記基板支持部材が、前記回路基板の裏面に装着されている電子回路部品に接触した場合に弾性変形し、電子回路部品の存在を許容しつつ回路基板を支持する軟質支持部材を含むものとされる。それにより、回路基板の裏面に既に電子回路部品が装着されていても、基板支持部材は回路基板を電子回路部品ごと支持することができ、回路基板の裏面の状態によって基板支持部材の配置を変えずに済み、複数種類の回路基板の支持に共用することができる。
さらに別の望ましい態様においては、前記昇降制御部が、前記昇降部材が前記第一昇降部により設定高さまで上昇させられることに応じて、前記第二昇降部に前記基板支持部材の上昇を開始させるものとされる。上記設定高さは、例えば、押上部材が受け部材と共同して回路基板を挟んだ後に、基板支持部材が回路基板の下面に接触するタイミングで第二昇降部を作動させる高さに設定される。
In a desirable aspect of the present invention, the (f) lifting device includes (f-1) a lifting member that pushes up the lifting member, (f-2) a first lifting unit that lifts and lowers the lifting member, and (f- 3) a second elevating unit held by the elevating member and moving the substrate support member relative to the elevating member; and (f-4) the push-up member is connected to the receiving member by the first elevating unit. The first elevating part and the first elevating part are arranged so that the board supporting member is raised to a position in contact with the lower surface of the circuit board by the second elevating part after being jointly raised to the position sandwiching the circuit board. And a lifting control unit for controlling the two lifting units.
In another desirable mode, the substrate support member elastically deforms when contacting an electronic circuit component mounted on the back surface of the circuit substrate, and supports the circuit substrate while allowing the presence of the electronic circuit component. It is assumed that a soft support member is included. As a result, even if electronic circuit components are already mounted on the back side of the circuit board, the board support member can support the circuit board together with the electronic circuit components, and the arrangement of the board support members can be changed depending on the state of the back side of the circuit board. It can be used for supporting a plurality of types of circuit boards.
In yet another desirable mode, the elevation control unit causes the second elevation unit to start raising the substrate support member in response to the elevation member being raised to a set height by the first elevation unit. It is supposed to be. The set height is set, for example, to a height at which the second elevating unit is operated at a timing when the board support member contacts the lower surface of the circuit board after the push-up member sandwiches the circuit board together with the receiving member. .

発明の態様Aspects of the Invention

以下に、本願において特許請求が可能と認識されている発明(以下、「請求可能発明」という場合がある。請求可能発明は、少なくとも、請求の範囲に記載された発明である「本発明」ないし「本願発明」を含むが、本願発明の下位概念発明や、本願発明の上位概念あるいは別概念の発明を含むこともある。)の態様をいくつか例示し、それらについて説明する。各態様は請求項と同様に、項に区分し、各項に番号を付し、必要に応じて他の項の番号を引用する形式で記載する。これは、あくまでも請求可能発明の理解を容易にするためであり、請求可能発明を構成する構成要素の組み合わせを、以下の各項に記載されたものに限定する趣旨ではない。つまり、請求可能発明は、各項に付随する記載,実施例の記載,従来技術等を参酌して解釈されるべきであり、その解釈に従う限りにおいて、各項の態様にさらに他の構成要素を付加した態様も、また、各項の態様から構成要素を削除した態様も、請求可能発明の一態様となり得るのである。   In the following, the invention that is claimed to be claimable in the present application (hereinafter referred to as “claimable invention”. The claimable invention is at least the “present invention” to the invention described in the claims. Some aspects of the present invention, including subordinate concept inventions of the present invention, superordinate concepts of the present invention, or inventions of different concepts) will be illustrated and described. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiments, the prior art, and the like. The added aspect and the aspect in which the constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention.

(1)脆性基板の下面を上端の支持面において支持する支持部材と、
その支持部材の支持面を含む支持平面より上方に突出した突出位置と、支持平面以下の引込位置とに移動可能な検出子と、
その検出子を前記引込位置から前記突出位置へ向かう方向に付勢する検出子付勢装置と、
それら支持部材,検出子および検出子付勢装置を、脆性基板を支持する支持位置とその支持位置より下方の退避位置とに昇降させる昇降装置と、
前記検出子の前記突出位置への移動を検知する突出検知器と、
前記支持部材による脆性基板の支持状態において、前記突出検知器により前記検出子の前記突出位置への突出が検知された場合に、脆性基板が割れたと判定する割れ判定部と
を含むことを特徴とする基板支持装置。
(2)前記検出子,前記検出子付勢装置および前記突出検知器が、水平方向に距離を隔てて複数組設けられた(1)項に記載の基板支持装置。
脆性基板の割れを複数箇所において検出することができ、割れ検出の信頼性が向上する。
(3)さらに、
前記脆性基板の上面に当接してその脆性基板を受ける受け部材と、
前記昇降装置により上昇させられ、脆性基板の側縁部を前記受け部材に押し付ける押付部材と
を含み、かつ、前記複数組の検出子,検出子付勢装置および突出検知器が、前記側縁部に直角な方向に距離を隔てて設けられた2組以上を含む(2)項に記載の基板支持装置。
基板支持装置が検出子,検出子付勢装置および突出検知器を2組含むのであれば、2組の検出子等が側縁部に直角な方向に距離を隔てて設けられ、3組以上含むのであれば、3組以上の検出子等の全部が側縁部に直角な方向に距離を隔てて設けられてもよく、2組以上であって、全部の組数より少ない組の検出子等が側縁部に直角な方向に距離を隔てて設けられ、残りは、側縁部に直角な方向においては、2組以上の検出子等のいずれかと同じ位置に設けられてもよい。
脆性基板の側縁部が受け部材と押付部材とによって挟まれて保持される場合、脆性基板は側縁部にほぼ平行な割れ目において割れ易く、2組以上の検出子等が側縁部に直角な方向に距離を隔てて設けられることにより、割れ検出の確実さが増す。
(4)前記支持部材が、発泡材から成り、脆性基板の下面に面接触してその脆性基板を支持する軟支持部材を含む (1)項ないし(3)項のいずれかに記載の基板支持装置。
軟支持部材は、1つでも複数でもよい。軟支持部材の脆性基板の下面に対する接触面積
(軟支持部材が1つの場合は、その1つの軟支持部材の接触面積、軟支持部材が複数の場合は、複数の軟支持部材の各接触面積の合計)は、脆性基板の下面の面積の20%以上であればよく、40%以上、60%以上であることが望ましい。
支持部材の脆性基板への接触時に脆性基板が割れる恐れが少なく、また、作業ヘッドによって脆性基板に作業が施される際に加えられる衝撃が軟支持部材により吸収され、脆性基板が割れ難い。あるいは脆性基板の振動が良好に抑制される。
(5)前記検出子が前記軟支持部材を厚さ方向に貫通して形成された貫通穴内に上下方向に相対移動可能に配設された(4)項に記載の基板支持装置。
検出子を脆性基板の軟支持部材によって支持される箇所に配設し、基板の割れを検出することができる。
(6)前記昇降装置により昇降させられる昇降部材と、
前記脆性基板の上面に当接してその脆性基板を受ける受け部材と、
前記昇降部材に対して相対的に昇降可能に設けられ、昇降部材の上昇に基づいて上昇させられ、脆性基板を前記受け部材に押し付ける押付部材と、
その押付部材を前記昇降部材に対して相対的に上昇方向に付勢する押付部材付勢装置と
を含む(1)項ないし(5)項のいずれかに記載の基板支持装置。
昇降部材は、押付部材が脆性基板を受け部材に押し付けた状態から更に上昇させられる。この上昇は、押付部材付勢装置の作用により、昇降部材が押付部材に対して上昇することにより許容される。押付部材は、昇降部材と押付部材との相対移動に基づいて生じる押付部材付勢装置の付勢力によって脆性基板を受け部材に押し付けるが、この付勢力は、昇降部材が押付部材付勢装置を介することなく、押付部材を直接上昇させ、脆性基板を受け部材に押し付けさせる場合に脆性基板に作用する力より小さく、脆性基板の割れを回避しつつ、確実に保持することができる。
(7)前記昇降部材の上昇限度を規定する上昇限度規定部を含む(6)項に記載の基板支持
装置。
上昇限度規定部は、昇降部材そのものの上昇を阻止する構成とされてもよく、昇降装置による昇降部材の上昇を止める構成とされてもよい。いずれにしても昇降部材の上昇限度が規定されることにより、押付部材付勢装置による昇降部材と押付部材との相対移動の許容が限度に達し、昇降部材と押付部材とが一体的に上昇する状態となって脆性基板に過大な押付力が作用することが回避される。あるいは、押付部材付勢装置が弾性部材の弾性力に基づいて付勢力を発生させるものである場合に、弾性部材の弾性変形量が過大となって弾性力が過大となり、押付部材が過大な押付力を脆性基板に加えることが回避される。
(11)水平な直線部を含む閉曲線に沿って周回するコンベヤベルトと、
そのコンベヤベルトの前記直線部に対応する部分である搬送部に支持されて搬送される回路基板の側縁を案内する案内面を備えた案内レールと、
前記搬送部に支持された回路基板の側縁部の下面を支持して前記搬送部から浮き上がらせる押上部材と、
前記搬送部の上方においてその搬送部に平行に延び、前記押上部材により押し上げられる回路基板の側縁部を受け、押上部材と共同して回路基板の側縁部を挟む受け部材と
を含み、回路基板を搬送方向に搬送する基板コンベヤにおいて、
前記受け部材に、その受け部材の自由端縁(先端縁)から下方へ垂下した垂下部を設けるとともに、前記案内レールに、前記垂下部が前記押上部材に対向する作用位置と、その作用位置から退避した退避位置とに移動可能に保持させ、かつ、前記受け部材の少なくとも前記垂下部にその垂下部を直角に横切る少なくとも1つの切欠を設けることにより垂下部を複数の部分垂下部とするとともに、前記案内レールの少なくとも前記案内面に、前記受け部材が前記退避位置へ移動した状態では前記複数の部分垂下部の各々を収容する収容凹部を形成したことを特徴とする基板コンベヤ。
受け部材が作用位置に位置する状態では、回路基板は垂下部により受けられ、受け部材の自由端縁より下方において受けられる。そのため、回路基板が上面に段差があり、作業装置により作業が施される被作業面が受け部材により受けられる被受け面より上方に位置
するものである場合、被作業面を、受け部材の自由端縁の下面以下の予め定められた位置に位置させて作業を施すことができる。
また、受け部材が退避位置に位置する状態では、部分垂下部が収容凹部内に収容されて案内面より引っ込んでいるため、回路基板は受け部材により受けられず、側縁部の上面が開放され、被作業面の一部として作業を施すことができる。この場合、回路基板は、押上部材により部分垂下部の下端より上方へ押し上げられるが、部分垂下部は搬送方向に間隔を隔てて位置し、それら部分垂下部の間に案内面があるため、回路基板は案内面に案内されつつ、昇降させられる。垂下部は切欠が設けられず、搬送方向に長いものとされることも可能であるが、その場合には、垂下部の下端縁以上の部分に案内面がなく、回路基板が案内面により案内されることなく昇降させられることとなり、搬送方向に直角な方向にずれ、下降時に収容凹部の下端縁に引っ掛かる恐れがあるのに対し、垂下部を複数の部分垂下部とすれば、案内面を残し、その案内面に回路基板を案内させつつ良好に昇降させることができる。
(12)前記受け部材の前記搬送方向に平行な方向に離れた複数箇所に、その搬送方向に直角な方向に延びる長穴が形成される一方、頭部を備えた雄ねじ部材が、前記複数の長穴の各々を貫通して前記案内レールの上面に形成された雌ねじ穴に螺合され、前記頭部と前記案内レールの上面とにより、前記受け部材がその受け部材の前記作用位置と退避位置とへの移動を許容する状態で挟まれた(11)項に記載の基板コンベヤ。
雄ねじ部材が雌ねじ穴に固く締め込まれた状態において、雄ねじ部材の頭部と案内レールの上面との隙間を、受け部材の長穴の周辺部の厚さより僅かに大きく保つ隙間規定部が設けられることが望ましい。例えば、雄ねじ部材を、受け部材の長穴の周辺部の厚さより僅かに長い大径部を備えた段付きねじとしたり、雄ねじ部材に受け部材の長穴の周辺部の厚さより僅かに長いスリーブを嵌合することにより目的を達し得、これら大径部やスリーブが隙間規定部を構成することとなる。
簡単な構成でありながら、搬送方向に平行な方向に離れた複数箇所において受け部材の案内レールからの浮上がりを規制し、作用位置において回路基板の側縁部を正確な高さで受けさせることができる。
(13)前記案内レールと前記受け部材との一方に弾性的に突出方向に付勢された係合突部が設けられ、前記案内レールと前記受け部材との他方に、前記係合突部と係合して前記受け部材を前記作用位置と前記退避位置とにそれぞれ位置決めする2つの係合凹部が設けられた(11)項または(12)項に記載の基板コンベヤ。
受け部材を、作用位置と退避位置とに選択的に保つことができる。係合突部と2つの係合凹部との組合わせから成る位置保持部が、受け部材の長手方向に隔たった2箇所以上に設けられることが望ましい。
(14)前記係合突部が、ボールプランジャのボールにより構成された(13)項に記載の基板コンベヤ。
(15)前記受け部材が前記作用位置に位置させられた状態で、前記押上部材を回路基板を介して前記受け部材に当接する第一上昇位置まで上昇させ、前記受け部材が前記退避位置に位置させられた状態で、前記押上部材を前記第一上昇位置より高い第二上昇位置へ上昇させる昇降装置を含む(11)項ないし(14)項のいずれかに記載の基板コンベヤ。
受け部材が作用位置に位置する状態では、回路基板の上昇端は垂下部によって決まるが、受け部材が退避位置に位置する状態では、回路基板を受けるものがないため、回路基板を垂下部によって受けられる場合より高い位置へ上昇させることができる。

(21)水平な直線部を含む閉曲線に沿って周回するコンベヤベルトと、
そのコンベヤベルトの前記直線部に対応する部分である搬送部に支持されて搬送される回路基板の側縁を案内する案内面を備えた案内レールと、
前記搬送部に支持された回路基板の側縁部の下面を支持して前記搬送部から浮き上がらせる押上部材と、
前記搬送部の上方においてその搬送部に平行に延び、前記押上部材により押し上げられる回路基板の側縁部を受け、押上部材と共同して回路基板の側縁部を挟む受け部材と、
前記回路基板を下方から支持する基板支持部材と、
前記押上部材と前記基板支持部材とを昇降させる昇降装置と
を含み、回路基板を搬送方向に搬送する基板コンベヤであって、
前記昇降装置が、
前記押上部材を押し上げる昇降部材と、
その昇降部材を昇降させる第一昇降部と、
前記昇降部材に保持され、その昇降部材に対して前記基板支持部材を相対的に昇降させる第二昇降部と、
前記押上部材が前記第一昇降部により前記受け部材と共同して回路基板を挟む位置まで上昇させられた後に、前記基板支持部材が前記第二昇降部により前記回路基板の下面に接触する位置まで上昇させられるように、前記第一昇降部と前記第二昇降部とを制御する昇降制御部と
を含む基板コンベヤ。
押上部材が受け部材と共同して回路基板の側縁部を挟む前に、基板支持部材が回路基板の下面に接触すれば、回路基板をずらしてしまう恐れがあるのに対し、回路基板が押上部材と受け部材とに挟まれた状態で基板支持部材に回路基板を支持させることができ、回路基板がずれることなく支持される。
(22)前記基板支持部材が、前記回路基板の裏面に装着されている電子回路部品に接触した場合に弾性変形し、電子回路部品の存在を許容しつつ回路基板を支持する軟質支持部材を含む(21)項に記載の基板コンベヤ。
基板支持部材は、電子回路部品の存在を許容しつつ回路基板の下面に接触してそれを支持するものでもよく、回路基板の下面には接触せず、電子回路部品を介して回路基板を支持するものでもよい。後者の基板支持部材は、例えば、弾性部材により形成されるものとされ、あるいはクッション機能を有するものとされ、回路基板の下面に接触する位置への上昇の途中に電子回路部品があれば止まり、弾性変形やクッション作用により、電子回路部品に当接しない基板支持部材の回路基板の下面への接触を許容する。
本項に係る発明によれば、回路基板の裏面に既に電子回路部品が装着されていても、基板支持部材は回路基板を電子回路部品ごと支持することができ、回路基板の裏面の状態によって基板支持部材の配置を変えずに済み、複数種類の回路基板の支持に共用することができる。
(21)項に係る発明は、基板支持部材が回路基板の下面のみを支持するものである場合にも有効であるが、本項におけるように、基板支持部材が自身の弾性変形により電子回路部品の存在を許容するものである場合に、特に有効である。
(23)前記昇降制御部が、前記昇降部材が前記第一昇降部により設定高さまで上昇させられることに応じて、前記第二昇降部に前記基板支持部材の上昇を開始させるものである(21)項または(22)項に記載の基板コンベヤ。
設定高さは、押上部材が受け部材と共同して回路基板を挟んだ後に、基板支持部材が回路基板の下面に接触するタイミングで第二昇降部を作動させる高さに設定される。
(31)それぞれ、回路基板を支持する基板支持装置と、その基板支持装置に支持された回路基板に電子回路部品を装着する装着装置とを備え、互いに隣接して配列された複数台の電子回路部品装着機と、
それら複数台の電子回路部品装着機を貫通して設けられ、それらに回路基板を搬入し、それらから搬出する基板コンベヤと
を含む電子回路部品装着システムであって、
前記基板支持装置の各々が、互いに独立な昇降装置により昇降させられる昇降部材を備え、かつ、当該電子回路部品装着システムが、
前記複数台の電子回路部品装着機に跨って配置され、前記基板コンベヤにより各電子回路部品装着機に搬入された回路基板を支持してその基板コンベヤから浮き上がらせる共通支持台と、
その共通支持台を前記複数の昇降部材の1つに固定する一方、その1つの昇降部材以外
の昇降部材に、前記共通支持台を弾性部材を介して支持させる共通支持台取付装置と
を含む電子回路部品装着システム。
例えば、複数の電子回路部品装着機に跨る長さを有する回路基板を共通支持台に支持させ、複数の装着装置に共同して電子回路部品を装着させることができる。
複数台の昇降装置によって共通支持台を昇降させれば、1台の昇降装置によって昇降させる場合のように、上昇速度が低下したり、搬送方向に長い共通支持台の昇降部材によって支持されていない部分が垂れ下がったりすることがないが、複数の昇降装置を完全に同期させて昇降させることは容易ではなく、案内部にこじりが発生して作動不能に陥るおそれがある。案内部を長くすれば、こじりの発生を回避し得るが昇降装置の大形化を避け得ない。それに対し、共通支持台が1つの昇降部材以外の昇降部材には弾性部材を介して支持されていれば、大きなこじり力が発生することが回避される。例えば、共通支持台の上昇時に、共通支持台の弾性部材を介して支持されている部分にも押上力が加えられ、上昇させられる。しかも、弾性部材の弾性変形により、共通支持台が固定された昇降部材とそれ以外の昇降部材との昇降の多少のずれは許容されるため、大きなこじり力が発生することがなく、複数の昇降装置が支障なく作動し得る。例えば、上昇時に複数の昇降装置のいずれかの作動速度が大きければ、その昇降装置に対する負荷が大きくなって作動速度が低下する一方、他の昇降装置の負荷が小さくなって作動速度が上昇し、ほぼ同じ速度で上昇することとなるのである。
なお、弾性部材は、複数の昇降部材がそれぞれ上昇端位置まで上昇させられた状態で、共通支持台を丁度水平に支持する寸法まで弾性変形させられた状態となるものとされることが望ましい。また、本発明の効果は、昇降装置がエアシリンダのように安価ではあるが作動速度の正確な制御がむつかしいものである場合に特に有効である。
(32)前記1つの昇降部材以外の昇降部材と、前記共通支持台のその昇降部材に対向する部分とのいずれか一方に、設定範囲内において昇降可能に設けられたスプリングリテーナと、
そのスプリングリテーナと前記一方との間に配設され、スプリングリテーナを前記昇降部材と共通支持台との他方に向かって付勢するスプリングと
を含み、そのスプリングが前記弾性部材として機能する(31)項に記載の電子回路部品装着システム。
(33)前記基板コンベヤが、前記複数台の電子回路部品装着機に跨る長さの基板キャリヤを搬送可能なものであり、前記共通支持台が、前記基板キャリヤに位置決めされかつ相対的に上昇可能に保持された複数の回路基板の各々を下方から支持して前記基板キャリヤから浮き上がらせる複数の基板支持突部を備えた(31)項または(32)項に記載の電子回路部品装着システム。
複数の回路基板は、直接搬送部に支持させて搬送させてもよいが、複数の回路基板の停止位置間にずれが生じ易い。それに対し、基板キャリヤに位置決めさせて搬送し、基板キャリヤを所定の位置に停止させれば、複数の回路基板を相互の位置ずれなく停止させることができる。
なお、基板キャリヤの使用による回路基板の搬送は、前記(11)〜(15),(21)〜(23)および以下に説明する(41),(51),(61),(71),(72),(81),(91),(101),(111)にそれぞれ記載の基板コンベヤにも適用可能である。基板キャリヤは、回路基板を位置決めする位置決め装置を備え、回路基板を位置決め支持して基板コンベヤにより搬送され、基板キャリヤを所定の位置に停止させることにより、回路基板の停止位置が決められる。
(41)(a)互いに水平方向に隔たって、水平な回転軸線のまわりに回転可能な2つのプ
ーリと、(b)それらプーリに巻き掛けられたコンベヤベルトとを含み、そのコンベヤベル
トの周回により、そのコンベヤベルトの前記2つのプーリの間において直線的に延びる搬送部により回路基板を支持して搬送する基板コンベヤであって、
前記搬送部の下方に、その搬送部に直角な回転軸線のまわりに回転可能に配設されて搬送部を支持する支持ローラと、前記搬送部に沿って延び、その搬送部を下方から支持する支持レールとの両方が配設されたことを特徴とする基板コンベヤ。
搬送部は支持ローラの回転によって軽快に移動させられるとともに、支持レールとの間の摩擦により移動が適度に抑えられる。例えば、搬送部を支持レールのみに支持させることも可能であるが、回路基板が重いものである場合には搬送部と支持レールとの摩擦抵抗が過大となり、回路基板の円滑な搬送が妨げられる。一方、支持ローラのみに支持させれば、搬送部は軽快に移動可能となるが、回路基板を停止させるために2つのプーリの一方の回転が阻止されても搬送部および回路基板が速やかに停止せず、余分に移動してしまう。搬送部が停止させられる場合、回路基板は慣性力により移動を続けようとするが、この移動は、搬送部と回路基板との間の摩擦力によって阻止される。上記摩擦力は、主として搬送部の支持ローラに支持された部分と回路基板との間に生じるのであるが、接触面積が小さいため、充分な摩擦力が得られにくい。また、支持ローラは搬送部に殆ど抵抗力を加えないため、搬送部自体も停止しにくい。そのために、搬送部および回路基板が余分に移動してしまうのである。それに対し、搬送部の一部を支持レールに支持させれば、搬送部と支持レールとの間に適度な摩擦力が生じるとともに、搬送部と回路基板との接触面積が増して両者間の摩擦力も適度な大きさとなり、結局、搬送部と回路基板とが適切な位置に停止させられることとなる。
中央部に支持レールを1つ設け、その支持レールの両側に少なくとも1つずつの支持ローラを配設することも、2つの支持レールの間に少なくとも1つの支持ローラを配設することも可能である。しかし、支持ローラも支持レールもそれぞれ複数ずつ設けることが望ましい場合が多い。
(51)(a)互いに水平方向に隔たって、水平な回転軸線のまわりに回転可能な2つのプ
ーリと、(b)それらプーリに巻き掛けられたコンベヤベルトとを含み、そのコンベヤベル
トの周回により、そのコンベヤベルトの前記2つのプーリの間において直線的に延びる搬送部により回路基板を支持して搬送する基板コンベヤが複数直列に配設された基板コンベヤ列であって、
前記コンベヤベルトの互いに隣接するものの、それぞれ前記プーリに巻き掛けられた部分の間に配設され、上端が、ほぼ、前記搬送部に接する平面である接平面上に位置し、それらコンベヤベルトに搬送される回路基板を下方から支持する付加支持部材を含む基板コンベヤ列。
例えば、回路基板の被搬送部の搬送方向における長さが、隣接する2つの基板コンベヤの各搬送部の間隔より短い場合、一方の搬送部により搬送されて来た回路基板の搬送部に支持されている後端部より支持されていない先端部の方が長くなれば、先端部が上記接平面より下に下がる。この先端部は下流側のコンベヤベルトのプーリに巻き掛けられた部分によって支持されて、再び接平面まで上昇させられるのが普通であるが、コンベヤベルト間における回路基板の受け渡しが滑らかに行われないことになる。
それに対し、本項の基板コンベヤ列においては、付加支持部材によって支持されることにより、回路基板の先端部の下降が防止される。また、回路基板の被搬送部が隣接する2つの基板コンベヤの搬送部の間隔より長いものである場合、付加支持部材があっても、その上端が回路基板の被搬送面より上の位置にはなく、搬送を妨げない。
(61)水平な直線部を含む閉曲線に沿って周回するコンベヤベルトと、
そのコンベヤベルトの前記直線部に対応する部分である搬送部に支持されて搬送される回路基板の側縁を案内する案内面を備えた案内レールと、
前記搬送部に支持された回路基板の側縁部の下面を支持して前記搬送部から浮き上がらせる押上部材と、
その押上部材を昇降させる昇降装置と、
前記搬送部の上方においてその搬送部に平行に延び、前記押上部材により押し上げられる回路基板の側縁部を受け、押上部材と共同して回路基板の側縁部を挟む受け部材と
を含み、回路基板を搬送方向に搬送する基板コンベヤであって、
前記受け部材が前記搬送方向において複数の部分受け部材に分割され、それら複数の部分受け部材の少なくとも1つが、前記案内レールに、前記押上部材と共同して回路基板の側縁部を挟む作用位置において固定され、前記複数の部分受け部材の別の少なくとも1つ
が、前記案内レールに、前記作用位置と、その作用位置から前記押上部材と対向しない退避位置とに移動可能に取り付けられたことを特徴とする基板コンベヤ。
移動可能な部分受け部材である可動部分受け部材が作用位置に位置する状態では、回路基板の側縁部が押上部材と可動部分受け部材とにより挟まれ、保持された状態で回路基板に作業を施すことができる。また、可動部分受け部材が退避位置に位置する状態では、回路基板の側縁部の上面が開放され、作業を施すことができる。1つの部分受け部材を作用位置と退避位置とに移動可能に設けることにより、2つの態様で回路基板に対して作業を施すことができ、受け部材を交換する場合に比較して容易に作業態様を変更することができる。
回路基板の上昇端は、可動部分受け部材が作用位置にある場合、側縁部が可動部分受け部材により受けられることにより決められ、可動部分受け部材が退避位置にある場合、案内レールに作用位置において固定された部分受け部材である固定部分受け部材に、押上部材が回路基板を挟むことなく当接することにより規定される。
(71)水平な直線部を含む閉曲線に沿って周回するコンベヤベルトと、
そのコンベヤベルトの前記直線部に対応する部分である搬送部に支持されて搬送される回路基板の側縁を案内する案内面を備えた案内レールと
を含み、回路基板を搬送方向に搬送する基板コンベヤであって、
前記コンベヤベルトの前記搬送部の前記搬送方向における上流側の端部に対向して設けられ、前記搬送方向の上流側から下流側に向かうに従って前記搬送部に漸近する向きに傾斜した案内面を有し、回路基板の側縁部が前記搬送部から浮き上がっている場合にその側縁部を前記搬送部に接触ないし近接する位置へ案内する案内部が設けられたことを特徴とする基板コンベヤ。
回路基板の浮き上がった側縁部は、案内部に案内されて搬送部に接触ないし近接させられることにより、搬送方向において案内部の前後においては搬送部にほぼ平行となる状態が得られる。
(72)前記コンベヤベルト,前記案内レールおよび前記案内部が、前記搬送方向に直角な方向に距離を隔てかつ前記案内面が互いに対向する状態で2組設けられるとともに、前記搬送方向において前記案内部に隣接する位置に、互いに対向する発光部と受光部とを備え、それら発光部と受光部との一方が、前記搬送部により搬送される回路基板より上方に位置し、発光部と受光部との他方が回路基板より下方に位置する透過型の基板検出器が設けられた(71)項に記載の基板コンベヤ。
発光部および受光部が、回路基板より上方と下方とに設けられることにより、発光部から受光部に向かって放射される光は回路基板を斜めに横切ることとなり、基板検出器の検出領域が上下方向において広くなる。その上、案内部の前後においては回路基板の側縁部の浮上がりが抑えられるため、回路基板の搬送方向における上流側端(前端)や下流側端(後端)が確実に検出領域内を通り、回路基板の搬入あるいは搬出が正確に検出される。回路基板の側縁部の浮上がりは、搬送方向において案内部に近い部分ほど抑えられるため、基板検出器は搬送方向において、案内部による抑え効果が得られる範囲内に設けられる。
(81)水平な直線部を含む閉曲線に沿って周回するコンベヤベルトと、
そのコンベヤベルトの前記直線部に対応する部分である搬送部に支持されて搬送される回路基板の側縁を案内する案内面を備えた案内レールと、
前記搬送部に支持された回路基板の側縁部の下面を支持して前記搬送部から浮き上がらせる押上部材と、
その押上部材を昇降させる昇降装置と、
前記搬送部の上方においてその搬送部に平行に延び、前記押上部材により押し上げられる回路基板の側縁部を受け面により受け、押上部材と共同して回路基板の側縁部を挟む受け部材と、
前記回路基板の側縁部が前記押上部材と受け部材とに挟まれて固定されたことを検出する基板固定検出装置と
を含み、回路基板を搬送方向に搬送する基板コンベヤであって、前記基板固定検出装置が、
接触子と被検出部とを一体的に備えて回動軸線まわりに回動可能であり、常には前記接触子の下端が前記受け部材の前記受け面より下方に位置し、回路基板の側縁部が前記押上部材により押し上げられるにつれて側縁部により前記受け面の位置へ移動させられる検出部材と、
前記接触子が前記受け面より下方に位置する状態では前記被検出部を検出せず、前記接触子が前記受け面の位置へ移動させられた状態では前記被検出部を検出するセンサ部と
を含むことを特徴とする基板コンベヤ。
接触子は回路基板によって移動させられ、回路基板がちょうど受け面に当接させられて押上部材と受け部材とに挟まれた状態において接触子が受け面の位置へ移動させられ、回路基板の保持が検出される。回路基板に検出部材を回動させ、センサ部に被検出部を検出させるため、昇降装置が押上部材を上昇させる量に基づいて回路基板の保持を検出する場合に比較して回路基板の固定検出の信頼性が高くなる。
(91)水平な直線部を含む閉曲線に沿って周回するコンベヤベルトと、
そのコンベヤベルトの前記直線部に対応する部分である搬送部に支持されて搬送される回路基板の側縁を案内する案内面を備えた案内レールと、
前記回路基板の側縁部を下方から押し上げて前記コンベヤベルトの前記搬送部から浮き上がらせる押上部材と、
基端部が前記案内レールに保持され、先端部が片持ち状に前記搬送部の上方へ延び出し、その先端部の下面である受け面によって前記前記回路基板の側縁部の上面を受け、その側縁部を前記押上部材と共同して挟む受け部材と
を含む基板コンベヤにおいて、
前記受け部材の前記基端部を、前記案内レールに、前記先端部の前記受け面が前記押上部材の上方に位置する作用位置と、その作用位置から前記案内面と直交する方向に退避した退避位置とに移動可能に保持させるとともに、前記受け面を、その受け部材の前記先端部側から前記基端部側に向かうに従って上昇する向きに傾斜させたことを特徴とする基板コンベヤ。
搬送方向と直交する方向に移動可能に設けられた受け部材は、その移動を案内する案内部との間に隙間が存在するため、押付部材によって回路基板の側縁部が押し付けられるとき、先端部側が浮き上がらされて受け面の向きが変わり、案内面に対して直角でなくなって回路基板が受け面の向きに沿って上反りする。それに対し、受け面を予め傾斜させておけば、受け部材の先端部の浮上がりによる受け面の案内面に対する傾斜が軽減され、直角に近くなり、あるいは直角となって回路基板の反りが軽減され、回路基板に対する作業が精度良く行われる。
受け部材の受け面は、前記押上部材が回路基板の側縁部を受け面に押し付けた際に、受け部材が案内レールに保持された基端部側に対して先端部側が相対的に浮き上がる向きに回動した状態で、丁度案内面に直角となる(通常は、水平になる)角度だけ傾斜させられることが望ましいが、小角度であれば、丁度案内面に直角となる角度より小さい角度で傾斜させられてもよく、大きい角度で傾斜させられてもよい。前者の場合、傾斜させられない場合よりは回路基板の上反りが減少させられ、後者であれば、受け部材が回動した状態で受け面は、ちょうど水平な状態より前下がりに(先端部側ほど下方となる向きに)傾斜し、回路基板を下反り気味に押さえ、上反りが除去される。
受け面の傾斜角度は、0.4度以上であればよく、1度以上、1.5度以上とすることが望ましい。
(101)水平な直線部を含む閉曲線に沿って周回するコンベヤベルトと、
そのコンベヤベルトの前記直線部に対応する部分である搬送部に支持されて搬送される回路基板の側縁を案内する案内面を備えた案内レールと
を含み、回路基板を搬送方向に搬送する基板コンベヤであって、
前記コンベヤベルトの回路基板の側縁部を支持する支持面に接触して設けられ、コンベ
ヤベルトの周回に伴って前記支持面を清掃する清掃ブラシが設けられたことを特徴とする基板コンベヤ。
コンベヤベルトの周回に伴って清掃ブラシはコンベヤベルトに対して相対移動し、コンベヤベルトの支持面に付着したごみや埃等を払い落とす。それにより、支持面の汚れによる支持面の摩擦係数の低下が抑制され、基板コンベヤの回路基板搬送機能が向上する。本項に係る発明は、コンベヤベルトを停止させることにより、摩擦力によって回路基板を停止させ、位置決めする形式の基板コンベヤにおいて特に有効である。
(111)水平な直線部を含む閉曲線に沿って周回するコンベヤベルトと、
そのコンベヤベルトの前記直線部に対応する部分である搬送部に支持されて搬送される回路基板の側縁を案内する案内面を備えた案内レールと、
前記搬送部に支持された回路基板の側縁部の下面を支持して前記搬送部から浮き上がらせる押上部材と、
前記搬送部の上方においてその搬送部に平行に延び、前記押上部材により押し上げられる回路基板の側縁部を受け、押上部材と共同して回路基板の側縁部を挟む受け部材と
を含み、回路基板を搬送方向に搬送する基板コンベヤにおいて、
前記押上部材を昇降させるために昇降させられる昇降部材に、回路基板の帯電電荷を中和するイオンを含むガスを噴射するイオナイザが配設されたことを特徴とする基板コンベヤ。
回路基板の静電気が除去され、静電気の悪影響が排除される。例えば、回路基板に装着された電子回路部品の帯電による破壊が回避され、また、基板コンベヤが電子回路部品を回路基板に装着する電子回路部品装着機へ回路基板を搬送するものである場合に、電子回路部品の正常な装着が静電気により妨げられることが回避される。
(1) a support member that supports the lower surface of the brittle substrate on the upper support surface;
A detector that can move to a protruding position that protrudes above a support plane including the support surface of the support member, and a retracted position that is below the support plane; and
A detector urging device that urges the detector in a direction from the retracted position toward the protruding position;
An elevating device that raises and lowers the support member, the detector, and the detector urging device to a support position for supporting the brittle substrate and a retracted position below the support position;
A protrusion detector for detecting movement of the detector to the protruding position;
A crack determination unit that determines that the brittle substrate is cracked when the protrusion detector detects the protrusion of the brittle substrate to the protruding position by the support detector in a state where the brittle substrate is supported by the support member;
A substrate support apparatus comprising:
(2) The substrate support device according to (1), wherein a plurality of sets of the detector, the detector urging device, and the protrusion detector are provided at a distance in the horizontal direction.
The crack of a brittle board | substrate can be detected in several places, and the reliability of crack detection improves.
(3) Furthermore,
A receiving member that contacts the upper surface of the brittle substrate and receives the brittle substrate;
A pressing member that is raised by the lifting device and presses a side edge of the brittle substrate against the receiving member;
And the plurality of sets of detectors, detector urging devices, and protrusion detectors include two or more sets provided at a distance in a direction perpendicular to the side edge portion. Substrate support device.
If the substrate support device includes two sets of detectors, detector urging devices, and protrusion detectors, the two sets of detectors and the like are provided at a distance in the direction perpendicular to the side edge and include three or more sets. In this case, all of the three or more sets of detectors, etc. may be provided at a distance in a direction perpendicular to the side edge, or two or more sets of detectors, etc. less than the total number of sets. May be provided at a distance in a direction perpendicular to the side edge, and the rest may be provided at the same position as any of two or more sets of detectors in the direction perpendicular to the side edge.
When the side edge of the brittle substrate is sandwiched and held between the receiving member and the pressing member, the brittle substrate easily breaks at a crack substantially parallel to the side edge, and two or more pairs of detectors are perpendicular to the side edge. By providing a distance in a proper direction, the reliability of crack detection is increased.
(4) The substrate support according to any one of (1) to (3), wherein the support member includes a soft support member made of a foam material and supporting the brittle substrate in surface contact with the lower surface of the brittle substrate. apparatus.
There may be one or more soft support members. Contact area of soft support member to bottom surface of brittle substrate
(When there is one soft support member, the contact area of the one soft support member, and when there are a plurality of soft support members, the total contact area of the plurality of soft support members) is the area of the lower surface of the brittle substrate. It may be 20% or more, and is preferably 40% or more and 60% or more.
The brittle substrate is less likely to crack when the support member contacts the brittle substrate, and the impact applied when the work head is applied to the brittle substrate is absorbed by the soft support member, and the brittle substrate is difficult to break. Or the vibration of a brittle board | substrate is suppressed favorably.
(5) The substrate support apparatus according to (4), wherein the detector is disposed in a through hole formed so as to penetrate the soft support member in the thickness direction so as to be relatively movable in the vertical direction.
The detector can be arranged at a location supported by the soft support member of the brittle substrate, and the crack of the substrate can be detected.
(6) a lifting member that is lifted and lowered by the lifting device;
A receiving member that contacts the upper surface of the brittle substrate and receives the brittle substrate;
A pressing member that is provided so as to be capable of moving up and down relatively with respect to the lifting member, is raised based on the lifting of the lifting member, and presses the brittle substrate against the receiving member;
A pressing member biasing device for biasing the pressing member in the upward direction relative to the lifting member;
The substrate support apparatus according to any one of (1) to (5), including:
The elevating member is further raised from the state where the pressing member presses the brittle substrate against the member. This rise is allowed when the elevating member rises with respect to the pressing member by the action of the pressing member urging device. The pressing member presses the brittle substrate against the receiving member by the biasing force of the pressing member biasing device generated based on the relative movement between the lifting member and the pressing member. This biasing force is applied by the lifting member via the pressing member biasing device. Therefore, when the pressing member is directly raised and pressed against the brittle substrate against the member, it is smaller than the force acting on the brittle substrate, and can be reliably held while avoiding cracking of the brittle substrate.
(7) The substrate support according to (6), including a rising limit defining portion that defines a rising limit of the lifting member.
apparatus.
The rising limit defining part may be configured to prevent the lifting member itself from rising, or may be configured to stop the lifting member from being lifted by the lifting device. In any case, since the upper limit of the lifting member is defined, the allowable movement of the lifting member and the pressing member by the pressing member urging device reaches the limit, and the lifting member and the pressing member rise integrally. It is avoided that an excessive pressing force acts on the brittle substrate in a state. Alternatively, when the pressing member biasing device generates a biasing force based on the elastic force of the elastic member, the elastic member is excessively deformed and the elastic force is excessive, and the pressing member is excessively pressed. Applying force to the brittle substrate is avoided.
(11) a conveyor belt that circulates along a closed curve including a horizontal straight portion;
A guide rail provided with a guide surface for guiding a side edge of a circuit board supported and transported by a transport portion which is a portion corresponding to the linear portion of the conveyor belt;
A push-up member that supports the lower surface of the side edge of the circuit board supported by the transport unit and floats up from the transport unit;
A receiving member that extends in parallel with the conveying portion above the conveying portion, receives a side edge portion of the circuit board that is pushed up by the lifting member, and sandwiches the side edge portion of the circuit board together with the lifting member;
In a substrate conveyor that conveys a circuit board in the conveyance direction,
The receiving member is provided with a hanging portion that hangs downward from a free end edge (tip edge) of the receiving member, and the guide rail has an operation position where the hanging portion faces the push-up member, and an operation position thereof. The suspending portion is movably held at the retracted retracted position, and at least one notch that crosses the hanging portion at a right angle is provided in at least the hanging portion of the receiving member, thereby making the hanging portion a plurality of partially hanging portions, 2. A substrate conveyor according to claim 1, wherein an accommodation recess is formed on at least the guide surface of the guide rail to accommodate each of the plurality of partial hanging portions when the receiving member is moved to the retracted position.
In a state where the receiving member is located at the operating position, the circuit board is received by the hanging portion and is received below the free end edge of the receiving member. Therefore, the circuit board has a step on the upper surface, and the work surface on which the work is performed is positioned above the receiving surface received by the receiving member.
In the case where the work is to be performed, the work surface can be placed at a predetermined position below the lower surface of the free end edge of the receiving member.
Further, in a state where the receiving member is located at the retracted position, the partial hanging portion is housed in the housing recess and is retracted from the guide surface, so that the circuit board is not received by the receiving member and the upper surface of the side edge portion is opened. The work can be performed as a part of the work surface. In this case, the circuit board is pushed upward by the push-up member from the lower end of the partial hanging part, but the partial hanging part is positioned at an interval in the transport direction, and there is a guide surface between the partial hanging parts, so that the circuit The substrate is moved up and down while being guided by the guide surface. The hanging part is not provided with a notch and can be long in the conveying direction. In this case, however, there is no guide surface above the lower edge of the hanging part, and the circuit board is guided by the guiding surface. If the hanging part is a plurality of partially hanging parts, the guide surface can be changed. It is possible to leave and lift the circuit board satisfactorily while guiding the circuit board on the guide surface.
(12) A plurality of elongated holes extending in a direction perpendicular to the conveying direction are formed at a plurality of locations separated in a direction parallel to the conveying direction of the receiving member, while a male screw member having a head includes the plurality of The receiving member is screwed into a female screw hole formed in the upper surface of the guide rail through each of the elongated holes, and the receiving member is moved to the working position and the retracted position by the head and the upper surface of the guide rail. The substrate conveyor as set forth in (11), which is sandwiched in a state that allows movement to and from.
A gap defining portion is provided that keeps the gap between the head of the male screw member and the upper surface of the guide rail slightly larger than the thickness of the peripheral portion of the elongated hole of the receiving member in a state where the male screw member is firmly tightened in the female screw hole. It is desirable. For example, the male screw member is a stepped screw having a large diameter portion slightly longer than the thickness of the peripheral portion of the long hole of the receiving member, or the sleeve is slightly longer than the thickness of the peripheral portion of the long hole of the receiving member. The purpose can be achieved by fitting the two, and the large diameter portion and the sleeve constitute the gap defining portion.
Regardless of the simple structure, the lifting of the receiving member from the guide rail is restricted at a plurality of locations separated in the direction parallel to the conveying direction, and the side edge of the circuit board is received at an accurate height at the operating position. Can do.
(13) An engaging protrusion that is elastically biased in a protruding direction is provided on one of the guide rail and the receiving member, and the engaging protrusion is provided on the other of the guide rail and the receiving member. The substrate conveyor according to (11) or (12), wherein two engaging recesses are provided to engage and position the receiving member at the operating position and the retracted position, respectively.
The receiving member can be selectively kept at the operating position and the retracted position. It is desirable that the position holding portions formed by the combination of the engaging protrusion and the two engaging concave portions are provided at two or more locations separated in the longitudinal direction of the receiving member.
(14) The substrate conveyor as set forth in the item (13), wherein the engagement protrusion is configured by a ball plunger ball.
(15) With the receiving member positioned at the operating position, the push-up member is raised to a first ascending position that contacts the receiving member via the circuit board, and the receiving member is positioned at the retracted position. The substrate conveyor according to any one of (11) to (14), further including an elevating device that raises the push-up member to a second ascending position that is higher than the first ascending position.
In the state where the receiving member is located at the operating position, the rising end of the circuit board is determined by the hanging part. However, in the state where the receiving member is located at the retracted position, there is nothing to receive the circuit board. Can be raised to a higher position.

(21) a conveyor belt that circulates along a closed curve including a horizontal straight portion;
A guide rail provided with a guide surface for guiding a side edge of a circuit board supported and transported by a transport portion which is a portion corresponding to the linear portion of the conveyor belt;
A push-up member that supports the lower surface of the side edge of the circuit board supported by the transport unit and floats up from the transport unit;
A receiving member that extends in parallel with the conveying portion above the conveying portion, receives a side edge portion of the circuit board that is pushed up by the push-up member, and sandwiches the side edge portion of the circuit board together with the raising member;
A board support member for supporting the circuit board from below;
An elevating device for elevating and lowering the push-up member and the substrate support member;
A substrate conveyor for conveying a circuit board in a conveyance direction,
The lifting device is
An elevating member for pushing up the push-up member;
A first elevating part for elevating the elevating member;
A second elevating unit held by the elevating member and relatively elevating the substrate support member with respect to the elevating member;
After the push-up member is raised to a position where the circuit board is sandwiched in cooperation with the receiving member by the first elevating part, the board support member is moved to a position where the second elevating part comes into contact with the lower surface of the circuit board. An elevating control unit for controlling the first elevating unit and the second elevating unit so as to be raised;
Including substrate conveyor.
If the board support member comes into contact with the lower surface of the circuit board before the push-up member cooperates with the receiving member to sandwich the side edge of the circuit board, the circuit board may be displaced. The circuit board can be supported by the board support member while being sandwiched between the member and the receiving member, and the circuit board is supported without being displaced.
(22) The board support member includes a soft support member that elastically deforms when contacting the electronic circuit component mounted on the back surface of the circuit board and supports the circuit board while allowing the electronic circuit part to exist. The substrate conveyor according to item (21).
The board support member may be a member that contacts and supports the lower surface of the circuit board while allowing the presence of the electronic circuit component, and does not contact the lower surface of the circuit board and supports the circuit board via the electronic circuit component. You may do it. The latter substrate support member is formed of, for example, an elastic member or has a cushion function, and stops if there is an electronic circuit component in the middle of ascending to a position in contact with the lower surface of the circuit board. Due to elastic deformation and cushioning action, the substrate support member that does not contact the electronic circuit component is allowed to contact the lower surface of the circuit board.
According to the invention of this section, even if the electronic circuit component is already mounted on the back surface of the circuit board, the board support member can support the circuit board together with the electronic circuit component, and the board depends on the state of the back surface of the circuit board. It is not necessary to change the arrangement of the supporting member, and it can be used for supporting a plurality of types of circuit boards.
The invention according to the item (21) is effective even when the substrate support member supports only the lower surface of the circuit board. However, as in this item, the substrate support member is an electronic circuit component due to its own elastic deformation. This is particularly effective when it is allowed to exist.
(23) The elevating control unit causes the second elevating unit to start raising the substrate support member in response to the elevating member being raised to a set height by the first elevating unit (21 ) Or substrate conveyor as described in (22).
The set height is set to a height at which the second elevating unit is actuated at a timing when the board support member comes into contact with the lower surface of the circuit board after the push-up member sandwiches the circuit board together with the receiving member.
(31) Each of a plurality of electronic circuits arranged adjacent to each other, each including a substrate support device for supporting a circuit board and a mounting device for mounting an electronic circuit component on the circuit board supported by the substrate support device A component mounting machine;
A board conveyor that is provided through the plurality of electronic circuit component mounting machines, and that carries circuit boards into and out of them.
An electronic circuit component mounting system comprising:
Each of the substrate support devices includes a lifting member that can be lifted and lowered by lift devices independent of each other, and the electronic circuit component mounting system includes:
A common support base that is arranged across the plurality of electronic circuit component mounting machines, supports the circuit board carried into each electronic circuit component mounting machine by the substrate conveyor, and floats from the substrate conveyor;
While fixing the common support base to one of the plurality of lifting members, other than the one lifting member
A common support base mounting device for supporting the common support base via an elastic member on the lifting member
Electronic circuit component mounting system including.
For example, a circuit board having a length extending over a plurality of electronic circuit component mounting machines can be supported on a common support base, and electronic circuit components can be mounted together with a plurality of mounting devices.
If the common support base is lifted and lowered by a plurality of lifting devices, the rising speed is reduced and it is not supported by the lifting member of the common support base that is long in the transport direction as in the case of lifting and lowering by the single lifting device. Although the portion does not hang down, it is not easy to lift and lower the plurality of lifting devices in perfect synchronization, and there is a risk that the guide will be twisted and become inoperable. If the guide portion is lengthened, the occurrence of twisting can be avoided, but the size of the lifting device cannot be avoided. On the other hand, if the common support base is supported by the lifting members other than the one lifting member via the elastic member, it is possible to avoid a large twisting force. For example, when the common support base is raised, a push-up force is also applied to the portion of the common support base that is supported via the elastic member, and the common support base is raised. In addition, because of the elastic deformation of the elastic member, a slight shift in the lifting and lowering of the lifting member to which the common support base is fixed and the other lifting members is allowed, so that a large twisting force is not generated and a plurality of lifting The device can operate without problems. For example, if the operating speed of any of the plurality of lifting devices is large when ascending, the load on the lifting device increases and the operating speed decreases, while the load on other lifting devices decreases and the operating speed increases. It will rise at almost the same speed.
It is desirable that the elastic member be in a state where it is elastically deformed to a size that supports the common support table horizontally, with the plurality of elevating members raised to the rising end position. The effect of the present invention is particularly effective when the lifting device is inexpensive, such as an air cylinder, but it is difficult to accurately control the operating speed.
(32) A spring retainer provided so as to be movable up and down within a set range on any one of the lifting members other than the one lifting member and the portion of the common support table facing the lifting member;
A spring disposed between the spring retainer and the one, and biasing the spring retainer toward the other of the elevating member and the common support;
The electronic circuit component mounting system according to item (31), wherein the spring functions as the elastic member.
(33) The substrate conveyor is capable of transporting a substrate carrier having a length straddling the plurality of electronic circuit component mounting machines, and the common support is positioned on the substrate carrier and can be relatively raised. The electronic circuit component mounting system according to item (31) or (32), further comprising a plurality of substrate support protrusions for supporting each of the plurality of circuit substrates held on the substrate from below and floating from the substrate carrier.
The plurality of circuit boards may be directly supported by the transport unit and transported, but a shift is likely to occur between the stop positions of the plurality of circuit boards. On the other hand, if the substrate carrier is positioned and transported, and the substrate carrier is stopped at a predetermined position, the plurality of circuit boards can be stopped without mutual displacement.
In addition, the conveyance of the circuit board by using the substrate carrier is the above (11) to (15), (21) to (23) and (41), (51), (61), (71), which will be described below. It can also be applied to the substrate conveyors described in (72), (81), (91), (101), and (111). The substrate carrier includes a positioning device for positioning the circuit board, is positioned and supported by the circuit board and is conveyed by the substrate conveyor, and the stop position of the circuit board is determined by stopping the substrate carrier at a predetermined position.
(41) (a) Two processes that can be rotated around a horizontal axis of rotation, separated from each other in the horizontal direction.
And (b) a conveyor belt wound around the pulleys, the conveyor bell
A circuit board conveyor that supports and conveys the circuit board by means of a conveying section that extends linearly between the two pulleys of the conveyor belt,
A support roller that is rotatably disposed around a rotation axis perpendicular to the transport unit and supports the transport unit, and extends along the transport unit, and supports the transport unit from below. A substrate conveyor comprising both support rails.
The transport unit is easily moved by the rotation of the support roller, and the movement is moderately suppressed by the friction with the support rail. For example, the transport unit can be supported only by the support rail, but if the circuit board is heavy, the frictional resistance between the transport unit and the support rail becomes excessive, preventing smooth transport of the circuit board. . On the other hand, if it is supported only by the support roller, the transport unit can be moved lightly, but the transport unit and the circuit board stop quickly even if one of the two pulleys is prevented from rotating to stop the circuit board. Without moving. When the transport unit is stopped, the circuit board tries to continue to move due to the inertial force, but this movement is blocked by the frictional force between the transport unit and the circuit board. The frictional force is mainly generated between the portion of the transport unit supported by the support roller and the circuit board. However, since the contact area is small, it is difficult to obtain a sufficient frictional force. Further, since the support roller hardly applies a resistance force to the transport unit, the transport unit itself is difficult to stop. For this reason, the transport unit and the circuit board are moved excessively. On the other hand, if a part of the transport unit is supported by the support rail, an appropriate frictional force is generated between the transport unit and the support rail, and the contact area between the transport unit and the circuit board is increased, resulting in friction between the two. The force also becomes an appropriate magnitude, and eventually, the transfer unit and the circuit board are stopped at appropriate positions.
It is possible to provide one support rail at the center and arrange at least one support roller on each side of the support rail, or at least one support roller between the two support rails. is there. However, it is often desirable to provide a plurality of support rollers and support rails.
(51) (a) Two processes that can be rotated about a horizontal axis of rotation, spaced horizontally from each other.
And (b) a conveyor belt wound around the pulleys, the conveyor bell
A substrate conveyor row in which a plurality of substrate conveyors are arranged in series by supporting a circuit board by a conveyance portion extending linearly between the two pulleys of the conveyor belt by the rotation of the conveyor belt,
Although the conveyor belts are adjacent to each other but are respectively disposed between the portions wound around the pulleys, the upper end is located on a tangential plane that is substantially a plane in contact with the conveying unit, and is conveyed to the conveyor belts. Board conveyor row including an additional support member for supporting the circuit board to be formed from below.
For example, when the length of the transported part of the circuit board in the transport direction is shorter than the distance between the transport parts of two adjacent board conveyors, the circuit board is supported by the transport part of the circuit board transported by one transport part. If the front end portion that is not supported is longer than the rear end portion, the front end portion is lowered below the tangential plane. This tip is usually supported by the part of the conveyor belt on the downstream side and is raised to the tangential plane again, but the circuit board is not smoothly transferred between the conveyor belts. It will be.
On the other hand, in the board conveyor row of this section, the tip of the circuit board is prevented from falling by being supported by the additional support member. In addition, when the transported part of the circuit board is longer than the distance between the transport parts of two adjacent board conveyors, the upper end of the additional support member is not located above the transported surface of the circuit board. Does not interfere with the transport.
(61) a conveyor belt that circulates along a closed curve including a horizontal straight portion;
A guide rail provided with a guide surface for guiding a side edge of a circuit board supported and transported by a transport portion which is a portion corresponding to the linear portion of the conveyor belt;
A push-up member that supports the lower surface of the side edge of the circuit board supported by the transport unit and floats up from the transport unit;
A lifting device that lifts and lowers the push-up member;
A receiving member that extends in parallel with the conveying portion above the conveying portion, receives a side edge portion of the circuit board that is pushed up by the lifting member, and sandwiches the side edge portion of the circuit board together with the lifting member;
A substrate conveyor for conveying a circuit board in a conveyance direction,
The receiving member is divided into a plurality of partial receiving members in the transport direction, and at least one of the plurality of partial receiving members sandwiches a side edge portion of the circuit board with the guide rail in cooperation with the push-up member. And at least one other of the plurality of partial receiving members
The substrate conveyor is attached to the guide rail so as to be movable between the operating position and a retracted position that does not face the push-up member from the operating position.
When the movable part receiving member, which is a movable part receiving member, is located at the operating position, the side edge of the circuit board is sandwiched and held between the push-up member and the movable part receiving member. Can be applied. Further, in a state where the movable part receiving member is located at the retracted position, the upper surface of the side edge portion of the circuit board is opened, and work can be performed. By providing one partial receiving member so as to be movable between the operating position and the retracted position, the work can be performed on the circuit board in two modes, and the working mode is easier than when the receiving member is replaced. Can be changed.
The rising end of the circuit board is determined by the side edge portion being received by the movable part receiving member when the movable part receiving member is in the operating position, and when the movable part receiving member is in the retracted position, The push-up member abuts on a fixed part receiving member, which is a fixed part receiving member in FIG.
(71) a conveyor belt that circulates along a closed curve including a horizontal straight portion;
A guide rail having a guide surface for guiding a side edge of a circuit board supported and transported by a transporting portion which is a portion corresponding to the linear portion of the conveyor belt;
A substrate conveyor for conveying a circuit board in a conveyance direction,
The conveyor belt has a guide surface that is provided opposite to an upstream end portion in the transport direction of the transport unit and is inclined in a direction asymptotic to the transport unit from the upstream side to the downstream side in the transport direction. A board conveyor characterized in that when the side edge portion of the circuit board is lifted from the transport portion, a guide portion is provided for guiding the side edge portion to a position in contact with or close to the transport portion.
The raised side edge of the circuit board is guided by the guide unit and brought into contact with or close to the transport unit, so that a state of being substantially parallel to the transport unit before and after the guide unit in the transport direction is obtained.
(72) The conveyor belt, the guide rail, and the guide portion are provided in two sets with a distance in a direction perpendicular to the transport direction and the guide surfaces facing each other, and the guide portion in the transport direction. A light-emitting part and a light-receiving part facing each other, and one of the light-emitting part and the light-receiving part is located above the circuit board carried by the carrying part, and the light-emitting part and the light-receiving part The substrate conveyor as set forth in (71), wherein a transmissive substrate detector is provided, the other of which is located below the circuit board.
By providing the light emitting part and the light receiving part above and below the circuit board, the light emitted from the light emitting part toward the light receiving part obliquely crosses the circuit board, and the detection area of the board detector moves up and down. Widen in direction. In addition, since the floating of the side edge of the circuit board is suppressed before and after the guide part, the upstream end (front end) and the downstream end (rear end) in the circuit board transport direction are surely within the detection region. Thus, the loading or unloading of the circuit board is accurately detected. Since the floating of the side edge portion of the circuit board is suppressed at a portion closer to the guide portion in the transport direction, the board detector is provided in a range in which the suppression effect by the guide portion can be obtained in the transport direction.
(81) a conveyor belt that circulates along a closed curve including a horizontal straight portion;
A guide rail provided with a guide surface for guiding a side edge of a circuit board supported and transported by a transport portion which is a portion corresponding to the linear portion of the conveyor belt;
A push-up member that supports the lower surface of the side edge of the circuit board supported by the transport unit and floats up from the transport unit;
A lifting device that lifts and lowers the push-up member;
A receiving member that extends in parallel with the conveying portion above the conveying portion, receives a side edge portion of the circuit board that is pushed up by the lifting member by a receiving surface, and sandwiches the side edge portion of the circuit board together with the lifting member;
A board fixing detecting device for detecting that a side edge portion of the circuit board is sandwiched and fixed between the push-up member and the receiving member;
A substrate conveyor for conveying a circuit board in a conveyance direction, wherein the substrate fixing detection device is
The contactor and the detected part are integrally provided and can be rotated around a rotation axis, and the lower end of the contactor is always located below the receiving surface of the receiving member, and the side edge of the circuit board. A detection member that is moved to the position of the receiving surface by a side edge as the portion is pushed up by the push-up member;
A sensor unit that does not detect the detected portion when the contact is positioned below the receiving surface, and detects the detected portion when the contact is moved to the position of the receiving surface;
A substrate conveyor characterized by comprising:
The contact is moved by the circuit board, and the contact is moved to the position of the receiving surface while the circuit board is just brought into contact with the receiving surface and sandwiched between the push-up member and the receiving member, and the circuit board is held. Is detected. Since the detection member is rotated on the circuit board and the detected part is detected by the sensor unit, the fixed detection of the circuit board is detected as compared with the case where the lifting device detects the holding of the circuit board based on the amount by which the lifting member is raised. The reliability will be higher.
(91) a conveyor belt that circulates along a closed curve including a horizontal straight portion;
A guide rail provided with a guide surface for guiding a side edge of a circuit board supported and transported by a transport portion which is a portion corresponding to the linear portion of the conveyor belt;
A push-up member that pushes up a side edge portion of the circuit board from below and floats up from the transport portion of the conveyor belt;
The base end is held by the guide rail, the tip extends in a cantilevered manner above the transport unit, receives the upper surface of the side edge of the circuit board by the receiving surface which is the lower surface of the tip, A receiving member that sandwiches the side edge jointly with the push-up member;
In the substrate conveyor including
The base end portion of the receiving member is retracted by retracting the guide rail to the guide rail, the working position where the receiving surface of the tip portion is located above the push-up member, and a direction perpendicular to the guide surface from the working position. The substrate conveyor is characterized in that the receiving surface is inclined so as to rise from the distal end side to the proximal end side of the receiving member.
Since the receiving member provided so as to be movable in the direction orthogonal to the transport direction has a gap between the guide member that guides the movement, the tip end portion is pressed when the side edge of the circuit board is pressed by the pressing member. As the side is lifted, the orientation of the receiving surface changes, and is no longer perpendicular to the guide surface, and the circuit board warps along the orientation of the receiving surface. On the other hand, if the receiving surface is inclined in advance, the inclination of the receiving surface with respect to the guide surface due to the rising of the tip of the receiving member is reduced, and the warping of the circuit board is reduced by being close to a right angle or at a right angle. Work on the circuit board is performed with high accuracy.
The receiving surface of the receiving member has a direction in which the distal end side floats relatively to the base end side held by the guide rail when the push-up member presses the side edge portion of the circuit board against the receiving surface. It is desirable to be tilted by an angle that is just perpendicular to the guide surface (usually horizontal) in the rotated state, but if it is a small angle, the angle is smaller than the angle that is just perpendicular to the guide surface. It may be tilted or tilted at a large angle. In the former case, the warping of the circuit board is reduced as compared with the case where it is not inclined, and in the latter case, the receiving surface is lowered forward from the horizontal state (the tip side) when the receiving member is rotated. The circuit board is tilted downward and the upper warp is removed.
The inclination angle of the receiving surface may be 0.4 degrees or more, and is preferably 1 degree or more and 1.5 degrees or more.
(101) a conveyor belt that circulates along a closed curve including a horizontal straight portion;
A guide rail having a guide surface for guiding a side edge of a circuit board supported and transported by a transporting portion which is a portion corresponding to the linear portion of the conveyor belt;
A substrate conveyor for conveying a circuit board in a conveyance direction,
The conveyor belt is provided in contact with a support surface that supports the side edge of the circuit board, and
A substrate conveyor comprising a cleaning brush for cleaning the support surface along with the rotation of the yabelt.
As the conveyor belt circulates, the cleaning brush moves relative to the conveyor belt and wipes off dust and dirt adhering to the support surface of the conveyor belt. Thereby, a decrease in the friction coefficient of the support surface due to the contamination of the support surface is suppressed, and the circuit board transfer function of the board conveyor is improved. The invention according to this section is particularly effective in a substrate conveyor of a type in which a circuit board is stopped and positioned by frictional force by stopping the conveyor belt.
(111) a conveyor belt that circulates along a closed curve including a horizontal straight portion;
A guide rail provided with a guide surface for guiding a side edge of a circuit board supported and transported by a transport portion which is a portion corresponding to the linear portion of the conveyor belt;
A push-up member that supports the lower surface of the side edge of the circuit board supported by the transport unit and floats up from the transport unit;
A receiving member that extends in parallel with the conveying portion above the conveying portion, receives a side edge portion of the circuit board that is pushed up by the lifting member, and sandwiches the side edge portion of the circuit board together with the lifting member;
In a substrate conveyor that conveys a circuit board in the conveyance direction,
A substrate conveyor, wherein an ionizer for injecting a gas containing ions that neutralizes a charged charge of a circuit board is disposed on a lifting member that is moved up and down to raise and lower the push-up member.
Static electricity on the circuit board is removed, and adverse effects of static electricity are eliminated. For example, when the electronic circuit component mounted on the circuit board is prevented from being damaged due to charging, and the board conveyor is for transferring the circuit board to an electronic circuit component mounting machine for mounting the electronic circuit component on the circuit board, The normal mounting of electronic circuit components is prevented from being disturbed by static electricity.

請求可能発明の実施例である基板支持装置をそれぞれ備えた複数の装着モジュールを含む電子回路部品装着システムの外観を示す斜視図である。It is a perspective view which shows the external appearance of the electronic circuit component mounting system containing several mounting modules each provided with the board | substrate support apparatus which is an Example of claimable invention. 上記システムの一部を拡大するともに、一部を除去して示す斜視図である。It is a perspective view which expands and shows a part of said system, and removes a part. 上記システムを構成する装着モジュールの部品装着装置のヘッド移動装置を分解して示す斜視図である。It is a perspective view which decomposes | disassembles and shows the head moving apparatus of the component mounting apparatus of the mounting module which comprises the said system. 上記装着モジュールの基板コンベヤの1対のサイドフレームの一方を示す正面図である。It is a front view which shows one side of a pair of side frame of the board | substrate conveyor of the said mounting module. 上記基板コンベヤを基板支持装置昇降装置と共に示す側面図(一部断面)である。It is a side view (partial cross section) which shows the said board | substrate conveyor with a board | substrate support apparatus raising / lowering apparatus. 上記基板コンベヤの1対のサイドフレームの一方を示す平面図である。It is a top view which shows one side of a pair of side frame of the said board | substrate conveyor. 上記基板コンベヤの支持レールおよびコンベヤベルトを示す側面図(一部断面)である。It is a side view (part cross section) which shows the support rail and conveyor belt of the said board | substrate conveyor. 上記基板コンベヤの支持ローラおよびコンベヤベルトを示す側面図(一部断面)である。It is a side view (partial cross section) which shows the support roller and conveyor belt of the said substrate conveyor. 上記基板コンベヤのサイドフレームの受け部材および案内レールのうち、垂下部および収容凹部が設けられた部分を示す斜視図であり、図9(a)は受け部材を示す図であり、図9(b)は案内レールを示す図であり、図9(c)は垂下部が収容凹部に収容された状態を示す図である。FIG. 9A is a perspective view showing a portion provided with a hanging portion and a receiving concave portion of the receiving member and the guide rail of the side frame of the substrate conveyor, FIG. 9A is a view showing the receiving member, and FIG. ) Is a view showing a guide rail, and FIG. 9C is a view showing a state in which the hanging portion is housed in the housing recess. 上記受け部材を構成する可動の部分受け部材が案内レールに雄ねじ部材によって移動可能に取り付けられた状態を示す側面断面図である。It is side surface sectional drawing which shows the state in which the movable partial receiving member which comprises the said receiving member was attached to the guide rail so that a movement was possible by the external thread member. 上記可動の部分受け部材を位置決めするボールプランジャおよび係合凹部を示す側面断面図である。It is side surface sectional drawing which shows the ball plunger and the engagement recessed part which position the said movable partial receiving member. 上記受け部材を構成する固定の部分受け部材を示す側面図(一部断面)である。It is a side view (partial cross section) which shows the fixed partial receiving member which comprises the said receiving member. 上記基板コンベヤにより搬送されるヒートシンク付回路基板を示す図であり、図13(a)は平面図、図13(b)は側面図である。It is a figure which shows the circuit board with a heat sink conveyed by the said board | substrate conveyor, FIG. 13 (a) is a top view, FIG.13 (b) is a side view. 上記ヒートシンク付回路基板が押上部材および受け部材によって挟まれた状態を示す側面断面図である。It is side surface sectional drawing which shows the state by which the said circuit board with a heat sink was pinched | interposed by the raising member and the receiving member. 上記可動の部分受け部材が退避位置に位置させられた状態を示す側面断面図であり、図15(a)は回路基板がコンベヤベルトにより支持された状態を示す図であり、図15(b)は回路基板が押上部材により押し上げられた状態を示す図である。FIG. 15A is a side sectional view showing a state in which the movable partial receiving member is positioned at a retracted position, and FIG. 15A is a view showing a state in which a circuit board is supported by a conveyor belt, and FIG. FIG. 4 is a view showing a state where a circuit board is pushed up by a push-up member. 上記複数の装着モジュールのうち、隣接する2つの各基板コンベヤの端に設けられた基板搬入検出器および基板搬出検出器の各発光部を示す正面図である。It is a front view which shows each light emission part of the board | substrate carrying-in detector and board | substrate carrying-out detector provided in the edge of each adjacent two board | substrate conveyor among the said some mounting modules. 上記基板搬出検出器を示す側面図である。It is a side view which shows the said board | substrate carry-out detector. 上記基板搬入検出器および基板搬出検出器の各ガイドに設けられた支持部を示す正面図である。It is a front view which shows the support part provided in each guide of the said board | substrate carrying-in detector and a board | substrate carrying-out detector. 上記複数の装着モジュールのうち、最も上流の装着モジュールの外側にイオナイザが設けられた状態を示す正面図である。It is a front view which shows the state by which the ionizer was provided in the outer side of the most upstream mounting module among the said several mounting modules. 上記1対のサイドフレームのうち、従属側のサイドフレームに設けられる別の受け部材を示す斜視図である。It is a perspective view which shows another receiving member provided in the side frame of a subordinate side among said pair of side frames. 上記1対のサイドフレームの各々に別の受け部材が取り付けられた状態を示す図であり、図21(a)は受け部材の可動の部分受け部材が作用位置へ移動させられた状態を示す側面断面図であり、図21(b)は退避位置へ移動させられた状態を示す側面断面図である。It is a figure which shows the state in which another receiving member was attached to each of a pair of said side frames, FIG.21 (a) is a side surface which shows the state by which the movable partial receiving member of the receiving member was moved to the action position. FIG. 21B is a cross-sectional side view showing a state in which it is moved to the retracted position. 上記サイドフレームの受け部材および案内レールの別の態様を示す側面断面図であり、受け部材が作用位置に位置する状態を示す図である。It is side surface sectional drawing which shows another aspect of the receiving member and guide rail of the said side frame, and is a figure which shows the state which a receiving member is located in an action position. 図22に示す受け部材が退避位置に位置する状態を示す側面断面図である。It is side surface sectional drawing which shows the state which the receiving member shown in FIG. 22 is located in a retracted position. 図22に示す受け部材および案内レールを概略的に示す正面図である。FIG. 23 is a front view schematically showing a receiving member and a guide rail shown in FIG. 22. 押上部材と受け部材とによる回路基板の保持を検知する機能を備えたサイドフレームを示す平面図である。It is a top view which shows the side frame provided with the function to detect holding | maintenance of the circuit board by a raising member and a receiving member. 図25に示すサイドフレームの切欠,検出部材の接触子を示す側面図(一部断面)である。FIG. 26 is a side view (partly cross-sectional view) showing the cutout of the side frame and the contact of the detection member shown in FIG. 25. 図25に示すサイドフレームにおける回路基板の保持の検知を説明する図であり、図27(a)は検出部材が非検出位置に位置する状態を示す図であり、図27(b)は検出位置に位置する状態を示す図である。FIGS. 27A and 27B are diagrams for explaining detection of holding of the circuit board in the side frame shown in FIG. 25. FIG. 27A is a diagram showing a state where the detection member is located at a non-detection position, and FIG. It is a figure which shows the state located in. 上記基板コンベヤを構成するサイドフレームであって、受け部材に案内突部が設けられたサイドフレームを示す正面図である。It is a side frame which is the side frame which comprises the said board | substrate conveyor, Comprising: It is a front view which shows the side frame by which the guide protrusion was provided in the receiving member. 図28に示すサイドフレームを示す側面図(一部断面)である。It is a side view (partial cross section) showing the side frame shown in FIG. 図28に示すサイドフレームの受け部材の傾斜させられた案内面を示す側面断面図であり、図30(a)は受け部材が回路基板を受けていない状態を示す図であり、図30(b)は回路基板を受けた状態を示す図である。FIG. 30 is a side sectional view showing the inclined guide surface of the receiving member of the side frame shown in FIG. 28, and FIG. 30 (a) is a view showing a state where the receiving member does not receive the circuit board, and FIG. ) Is a diagram showing a state in which the circuit board is received. 上記装着モジュールにおいて回路基板を支持する基板支持装置であって、回路基板の割れ検知機能を備えた基板支持装置を示す正面図である。It is a board | substrate support apparatus which supports a circuit board in the said mounting module, Comprising: It is a front view which shows the board | substrate support apparatus provided with the crack detection function of the circuit board. 図31に示す基板支持装置を示す平面図である。FIG. 32 is a plan view showing the substrate support apparatus shown in FIG. 31. 図31に示す基板支持装置の割れ検出ユニットを示す正面断面図である。It is front sectional drawing which shows the crack detection unit of the board | substrate support apparatus shown in FIG. 図31に示す基板支持装置により支持される回路基板を受け部材に押し付ける押付部材を示す正面図である。It is a front view which shows the pressing member which presses the circuit board supported by the board | substrate support apparatus shown in FIG. 31 against a receiving member. 上記装着モジュールにおいて回路基板を支持する基板支持装置であって、裏面に電子回路部品が装着された回路基板を支持する基板支持装置を示す正面図(一部断面)である。It is a board | substrate support apparatus which supports a circuit board in the said mounting module, Comprising: It is a front view (partial cross section) which shows the board | substrate support apparatus which supports the circuit board by which the electronic circuit component was mounted | worn on the back surface. 図35に示す基板支持装置を示す側面図である。It is a side view which shows the board | substrate support apparatus shown in FIG. 上記電子回路部品装着システムを構成する複数の装着モジュールのうち、隣接する2つの装着モジュールに跨って回路基板を支持する基板支持装置を示す正面図である。It is a front view which shows the board | substrate support apparatus which supports a circuit board across two mounting modules adjacent among several mounting modules which comprise the said electronic circuit component mounting system. 図37に示す基板支持装置の昇降台に取り付けられる共通支持台を示す平面図である。It is a top view which shows the common support stand attached to the raising / lowering stand of the board | substrate support apparatus shown in FIG. 上記共通支持台に取り付けられたスプリングリテーナおよびスプリングを示す正面断面図である。It is front sectional drawing which shows the spring retainer and spring which were attached to the said common support stand. 上記共通支持台により支持され、回路基板を搬送する基板キャリヤを示す平面図である。It is a top view which shows the board | substrate carrier supported by the said common support stand and conveying a circuit board. 図37に示す基板支持装置による回路基板の支持を説明する図であり、図41(a)は基板キャリヤがコンベヤベルトにより支持された状態を示す側面断面図であり、図41(b)は基板キャリヤおよび回路基板が共通支持台により支持された状態を示す側面断面図である。FIG. 41A is a side cross-sectional view illustrating a state in which the substrate carrier is supported by a conveyor belt, and FIG. It is side surface sectional drawing which shows the state in which the carrier and the circuit board were supported by the common support stand.

以下、請求可能発明の実施例を、図を参照しつつ説明する。なお、請求可能発明は、下記実施例の他、上記〔発明の態様〕の項に記載された態様を始めとして、当業者の知識に基づいて種々の変更を施した態様で実施することができる。   Hereinafter, embodiments of the claimable invention will be described with reference to the drawings. In addition to the following examples, the claimable invention can be practiced in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section. .

図1に、一実施例としての電子回路部品装着システム(以下、特に必要がない限り、システムと略称する)の外観を示す。本システムは、複数の電子回路部品装着機である装着モジュール10が、共通で一体のベース12上に、互いに隣接して1列に配列されて固定されることにより構成されている。   FIG. 1 shows the appearance of an electronic circuit component mounting system (hereinafter, abbreviated as “system” unless otherwise specified) as an embodiment. The present system is configured by mounting modules 10 as a plurality of electronic circuit component mounting machines arranged and fixed in a row adjacent to each other on a common base 12.

装着モジュール10については、例えば、特開2004−104075公報に詳細に記載されており、本請求可能発明に関する部分以外の部分については簡単に説明する。
各装着モジュール10はそれぞれ、図2に示すように、モジュール本体18と、それぞれモジュール本体18に設けられた基板搬送装置20,基板支持装置22,部品供給装置24,部品装着装置26,基準マーク撮像装置(図示省略),部品撮像装置28および制御装置30とを備えている。
The mounting module 10 is described in detail in, for example, Japanese Patent Application Laid-Open No. 2004-104075, and parts other than the part relating to the claimable invention will be briefly described.
As shown in FIG. 2, each mounting module 10 includes a module main body 18, a substrate transport device 20, a substrate support device 22, a component supply device 24, a component mounting device 26, and a reference mark imaging provided in the module main body 18. An apparatus (not shown), a component imaging device 28, and a control device 30 are provided.

部品装着装置26は、図2および図3に示すように、作業ヘッドたる装着ヘッド34と、その装着ヘッド34を、部品供給装置24の部品供給部と基板搬送装置20とに跨る装着作業領域内の任意の位置へ移動させ得るヘッド移動装置36とを備えている。ヘッド移動装置36は、図3に示すように、Y軸移動装置40およびX軸移動装置42を備えている。X軸方向は、複数の装着モジュール10が並ぶ方向と平行な方向であり、Y軸方向は水平面内においてX軸方向と直交する方向である。   2 and 3, the component mounting device 26 includes a mounting head 34 as a work head, and the mounting head 34 in a mounting work area straddling the component supply unit of the component supply device 24 and the substrate transport device 20. And a head moving device 36 that can be moved to an arbitrary position. As shown in FIG. 3, the head moving device 36 includes a Y-axis moving device 40 and an X-axis moving device 42. The X-axis direction is a direction parallel to the direction in which the plurality of mounting modules 10 are arranged, and the Y-axis direction is a direction orthogonal to the X-axis direction in the horizontal plane.

X軸移動装置42は、Y軸移動装置40上に設けられているが、Y軸スライド44に対してX軸方向に移動させられるとともに、互いにX軸方向に相対移動させられる第1,第2X軸スライド46,48を備え、第2X軸スライド48上に設けられた装着ヘッド34
は、X軸方向においてモジュール本体18の幅より広い範囲で移動可能である。したがって、互いに隣接する装着モジュール10の装着作業領域は、X軸方向の端部において互いに重なり合っている。
The X-axis moving device 42 is provided on the Y-axis moving device 40, but is moved in the X-axis direction with respect to the Y-axis slide 44 and is relatively moved in the X-axis direction relative to each other. A mounting head 34 provided with shaft slides 46 and 48 and provided on the second X-axis slide 48.
Is movable in a range wider than the width of the module body 18 in the X-axis direction. Accordingly, the mounting work areas of the mounting modules 10 adjacent to each other overlap each other at the end in the X-axis direction.

装着ヘッド34は、第2X軸スライド48上にZ軸に平行な回転軸線のまわりに回転可能に保持されている。Z軸は鉛直方向に平行な方向である。装着ヘッド34には、その回転軸線を中心とする一円周上に複数のノズルホルダが回転軸線に平行に保持され、それぞれ、部品保持具たる吸着ノズル50を着脱可能に保持し、上記回転軸線を中心とする一円周上に設定された部品吸着装着位置において、図示を省略する昇降装置により昇降させられ、吸着ノズル50に部品供給装置24からの電子回路部品の取出しおよび回路基板への電子回路部品の装着を行わせる。   The mounting head 34 is held on the second X-axis slide 48 so as to be rotatable around a rotation axis parallel to the Z-axis. The Z axis is a direction parallel to the vertical direction. The mounting head 34 holds a plurality of nozzle holders parallel to the rotation axis on one circumference centered on the rotation axis, respectively, and detachably holds the suction nozzle 50 serving as a component holder. Is lifted and lowered by a lifting device (not shown) at a component suction mounting position set on a circle around the center, and an electronic circuit component is taken out from the component supply device 24 to the suction nozzle 50 and electronic to a circuit board. Have the circuit components installed.

前記基板搬送装置20を説明する。
本基板搬送装置20は、図1に示すように、2レーンの基板コンベヤ100,102を備え、回路基板をX軸方向に平行な方向に搬送する。回路基板の搬送には基板コンベヤ100,102の少なくとも一方が使用されるが、複数の装着モジュール10の各々において使用される基板コンベヤは、複数の装着モジュール10を貫通して装着モジュール10に回路基板を搬入し、装着モジュール10から搬出する基板コンベヤないし基板コンベヤ列を構成する。基板コンベヤ100,102は同一の構成を備えているため、基板コンベヤ100を代表的に説明する。
The substrate transfer device 20 will be described.
As shown in FIG. 1, the substrate transport apparatus 20 includes two-lane substrate conveyors 100 and 102 and transports a circuit board in a direction parallel to the X-axis direction. At least one of the substrate conveyors 100 and 102 is used for transporting the circuit board, and the substrate conveyor used in each of the plurality of mounting modules 10 passes through the plurality of mounting modules 10 to the mounting module 10. A substrate conveyor or a substrate conveyor row is carried in and loaded out of the mounting module 10. Since the substrate conveyors 100 and 102 have the same configuration, the substrate conveyor 100 will be described as a representative.

基板コンベヤ100は、図5に示すように、1対のサイドフレーム110,112を有する。これらサイドフレーム110,112は門形を成し、一方、ここでは装着モジュール10の正面側ないし前側であって、部品供給装置24に近い側のサイドフレーム110はモジュール本体18に位置を固定して設けられ、遠い側のサイドフレーム112は基板搬送方向と直交する方向である基板搬送幅方向と平行な方向に移動可能に設けられ、サイドフレーム110,112の間隔が、サイドフレーム110の位置を基準として、回路基板の幅に応じた長さに調節される。以下、場合に応じて、サイドフレーム110を基準サイドフレーム110あるいは固定サイドフレーム110と称し、サイドフレーム112を従属サイドフレーム112あるいは可動サイドフレーム112と称する。   As shown in FIG. 5, the substrate conveyor 100 has a pair of side frames 110 and 112. These side frames 110 and 112 form a portal shape. On the other hand, here, the side frame 110 on the front side or the front side of the mounting module 10 and close to the component supply device 24 is fixed to the module body 18. The distant side frame 112 is provided so as to be movable in a direction parallel to the substrate transport width direction that is orthogonal to the substrate transport direction, and the distance between the side frames 110 and 112 is based on the position of the side frame 110. The length is adjusted according to the width of the circuit board. Hereinafter, the side frame 110 is referred to as a reference side frame 110 or a fixed side frame 110, and the side frame 112 is referred to as a subordinate side frame 112 or a movable side frame 112, depending on the case.

サイドフレーム110,112は、サイドフレーム110が固定、サイドフレーム112が可動とされていることを除いて同様に構成され、それぞれ、図4および図5に示すように、搬送方向に平行に設けられた側板116と、各側板116上に設けられた案内レール118と、各案内レール118上に設けられた受け部材120とを含む。サイドフレーム110,112の各側板116の互いに対向する内側面にはそれぞれ、駆動プーリ122および複数のガイドプーリ124がそれぞれ、互いに水平方向に隔たって、搬送方向と直交する方向に平行で水平な回転軸線のまわりに回転可能に取り付けられるとともに、それらプーリ122,124に無端のコンベヤベルト126が巻き掛けられ、プーリ122,124により画定される閉曲線に沿って周回させられる。この閉曲線のうち、搬送方向に平行な方向において両端のガイドプーリ124の間の部分が、搬送方向に平行で水平な直線部を成し、コンベヤベルト126のこの直線部に対応する部分であって、外側面が上向きの部分が搬送部128を構成する。駆動プーリ122がベルト周回用モータ132によって回転させられることによりコンベヤベルト126が周回させられ、1対のコンベヤベルト126の各外側面により構成される支持面131により、図15に示すように、回路基板129の互いに平行な側縁部130がそれぞれ支持され、搬送される。駆動プーリ122,ガイドプーリ124およびベルト周回用モータ132がベルト周回装置134を構成している。   The side frames 110 and 112 are configured in the same manner except that the side frame 110 is fixed and the side frame 112 is movable. As shown in FIGS. 4 and 5, the side frames 110 and 112 are provided in parallel with the conveyance direction, respectively. Side plates 116, guide rails 118 provided on the side plates 116, and receiving members 120 provided on the guide rails 118. A driving pulley 122 and a plurality of guide pulleys 124 are horizontally spaced apart from each other on inner surfaces of the side plates 116 of the side frames 110 and 112 that are opposed to each other in a horizontal direction, and are parallel and rotated in a direction perpendicular to the conveying direction. An endless conveyor belt 126 is wound around the pulleys 122 and 124 and is rotated around a closed curve defined by the pulleys 122 and 124. Of the closed curve, the portion between the guide pulleys 124 at both ends in the direction parallel to the transport direction forms a horizontal straight line parallel to the transport direction and corresponds to the straight portion of the conveyor belt 126. The portion with the outer surface facing upward constitutes the transport unit 128. As shown in FIG. 15, the driving pulley 122 is rotated by the belt rotating motor 132 to rotate the conveyor belt 126, and the support surface 131 constituted by the outer surfaces of the pair of conveyor belts 126, as shown in FIG. The side edge portions 130 of the substrate 129 that are parallel to each other are respectively supported and transported. The driving pulley 122, the guide pulley 124, and the belt rotating motor 132 constitute a belt rotating device 134.

サイドフレーム110,112の各側板116にはまた、図4に一方の側板116を示
すように、前記搬送部128の下方に複数の支持ローラ138および複数、本基板コンベヤ100では2つの支持レール140が配設されており、それぞれ図7および図8に示すように、搬送部128を下方から支持する。2つの支持レール140はそれぞれ搬送部128に沿って延び、搬送方向に平行な方向に距離を隔てて設けられている。支持ローラ138は、側板116の2つの支持レール140の間の部分と、2つの支持レール140の列の両端に隣接する部分とにそれぞれ、複数ずつ、プーリ122,124の回転軸線と平行であり、搬送部128に直角な回転軸線のまわりに回転可能に取り付けられている。
Each side plate 116 of the side frames 110 and 112 is also provided with a plurality of support rollers 138 and a plurality of support rails 140 in the substrate conveyor 100, as shown in FIG. As shown in FIGS. 7 and 8, respectively, the conveyance unit 128 is supported from below. The two support rails 140 each extend along the transport unit 128 and are provided at a distance in a direction parallel to the transport direction. A plurality of support rollers 138 are parallel to the rotation axis of the pulleys 122 and 124, respectively, in a portion between the two support rails 140 of the side plate 116 and a portion adjacent to both ends of the row of the two support rails 140. , And is rotatably attached around a rotation axis perpendicular to the transport unit 128.

1対のサイドフレーム110,112の各側板116にはそれぞれ、図4に一方の側板116を示すように、清掃ブラシ150が設けられている。清掃ブラシ150は、両端の2つのガイドプーリ124の一方の下側に、コンベヤベルト126の支持面131に接触して設けられ、コンベヤベルト126の周回に伴って支持面131に付着したごみ等を払い落とす。   Each side plate 116 of the pair of side frames 110 and 112 is provided with a cleaning brush 150, as shown in FIG. The cleaning brush 150 is provided on the lower side of one of the two guide pulleys 124 at both ends so as to contact the support surface 131 of the conveyor belt 126 and removes dust or the like attached to the support surface 131 as the conveyor belt 126 circulates. Dispel.

側板116にはさらに、図5に示すように、押上部材160が昇降可能に取り付けられている。押上部材160は、長手形状の薄い板状を成し、コンベヤベルト126の内側に、板面が鉛直にかつ搬送部128と平行に設けられ、基板コンベヤ100の搬入端側から搬出端側まで延びる押上部162を備え、側板116との間に配設されたスプリング(図示省略)により下方へ向かう向きに付勢され、このスプリングの付勢による下降限度が規定された状態では、押上部162の上端が搬送部128の上面よりやや下側に位置する。また、押上部材160には、ボルト164が下方へ突出する向きに螺合され、当接部を構成している。   Further, as shown in FIG. 5, a push-up member 160 is attached to the side plate 116 so as to be movable up and down. The push-up member 160 has a thin plate shape with a long shape, and the plate surface is provided vertically inside the conveyor belt 126 and in parallel with the transport unit 128, and extends from the carry-in end side to the carry-out end side of the substrate conveyor 100. In a state where a push-up portion 162 is provided and is biased downward by a spring (not shown) disposed between the push-up portion 162 and the lowering limit due to the bias of the spring is defined, The upper end is located slightly below the upper surface of the transport unit 128. In addition, the bolt 164 is screwed to the push-up member 160 so as to protrude downward to constitute a contact portion.

サイドフレーム110,112の各案内レール118は、図5に示すように、側板116上に、搬送部128の幅方向の一部を搬送方向にわたって覆う状態で着脱可能に固定され、その搬送部128上への突出部の搬送部128に直角で鉛直な端面は、図15に例示するように、回路基板129の側縁178を案内する案内面180を構成し、各案内レール118の案内面180は互いに対向している。   As shown in FIG. 5, each guide rail 118 of the side frames 110 and 112 is detachably fixed on the side plate 116 so as to cover a part in the width direction of the transport unit 128 in the transport direction. As shown in FIG. 15, the vertical end surface perpendicular to the conveying portion 128 of the upward projecting portion constitutes a guide surface 180 that guides the side edge 178 of the circuit board 129, and the guide surface 180 of each guide rail 118. Are facing each other.

サイドフレーム110,112の前記各受け部材120はそれぞれ、図5に示すように、案内レール118上に設けられ、搬送部128の上方に設けられている。これら受け部材120は同様に構成されており、基準サイドフレーム110の受け部材120を代表的に説明する。
受け部材120は、図6に示すように、3つの部分受け部材200,202,204に分割されている。これら部分受け部材200,202,204のうち真中の部分受け部材202は、電子回路部品の装着が予定されている全種類の回路基板の搬送方向に平行な方向の長さの最大長さより長く、案内レール118上に搬送部128に平行に設けられ、その自由端縁であるコンベヤベルト126側の端縁から下方へ垂下して垂下部210(図5参照)が形成されるとともに、案内レール118に搬送方向に直角な方向に移動可能に設けられ、可動受け部材とされている。
As shown in FIG. 5, the receiving members 120 of the side frames 110 and 112 are respectively provided on the guide rail 118 and provided above the transport unit 128. These receiving members 120 are similarly configured, and the receiving member 120 of the reference side frame 110 will be described as a representative.
As shown in FIG. 6, the receiving member 120 is divided into three partial receiving members 200, 202, and 204. Among these partial receiving members 200, 202, 204, the middle partial receiving member 202 is longer than the maximum length in the direction parallel to the conveying direction of all types of circuit boards on which electronic circuit components are scheduled to be mounted. A drooping portion 210 (see FIG. 5) is formed on the guide rail 118 in parallel with the transport unit 128 and hangs downward from the end edge on the conveyor belt 126 side which is a free end thereof. The movable receiving member is provided so as to be movable in a direction perpendicular to the conveying direction.

部分受け部材202には、図5および図9(a)に示すように、垂下部210を直角に横
切る複数の切欠212が適宜の間隔を隔てて、本部分受け部材202では等間隔で設けられ、垂下部210が複数の部分垂下部214とされている。案内レール118の前記案内面180には、図9(b)に示すように、案内レール118の上面と案内面180とに開口
させられ、複数の部分垂下部214の各々を収容する複数の収容凹部216が形成されており、部分受け部材202は、図11に示すように、部分垂下部214が押上部材160に対向する作用位置と、図9(c)および図15に示すように、作用位置から退避し、収容
凹部216に収容された退避位置とに移動させられる。複数の部分垂下部214のそれぞれ押上部材160と対向する下向きの面の集合が受け面218を構成している。
As shown in FIG. 5 and FIG. 9A, the partial receiving member 202 is provided with a plurality of notches 212 that cross the hanging portion 210 at right angles, and the partial receiving member 202 is provided at equal intervals. The hanging portion 210 is a plurality of partially hanging portions 214. 9B, the guide surface 180 of the guide rail 118 is opened to the upper surface of the guide rail 118 and the guide surface 180, and a plurality of housings for housing each of the plurality of partial hanging portions 214 are accommodated. As shown in FIG. 11, the concave portion 216 is formed, and the partial receiving member 202 acts as shown in FIGS. 9 (c) and 15 in which the partial hanging portion 214 opposes the push-up member 160. It retracts from the position and is moved to the retracted position accommodated in the accommodating recess 216. A set of downward surfaces facing the push-up member 160 of each of the plurality of partial hanging portions 214 constitutes a receiving surface 218.

図6に示すように、部分受け部材202の基端部には、搬送方向に平行な方向に離れた複数箇所にそれぞれ、搬送方向に直角な方向に延びる長穴220が形成され、雄ねじ部材222が長穴220を貫通して、案内レール118の上面223に形成された雌ねじ穴224に螺合されている。雄ねじ部材222は、図10に示すように、雄ねじ部228,軸部230および頭部232を備えた段付ねじとされ、長穴220は段付状を成す。軸部230は、雄ねじ部228より径が大きく、長さは長穴230の小長穴部234の深さよりやや長い大径部とされている。そのため、雄ねじ部228が雌ねじ穴224に固く締め込まれた状態では、頭部232と上面223との間に小長穴部234の周辺部の厚さより僅かに大きい隙間が確保され、部分受け部材202は、頭部232と上面223とにより、作用位置と退避位置とへの移動を許容する状態で挟まれている。   As shown in FIG. 6, elongated holes 220 extending in a direction perpendicular to the transport direction are formed at a plurality of locations separated in a direction parallel to the transport direction at the proximal end portion of the partial receiving member 202, and the male screw member 222. Passes through the long hole 220 and is screwed into a female screw hole 224 formed in the upper surface 223 of the guide rail 118. As shown in FIG. 10, the male screw member 222 is a stepped screw including a male screw portion 228, a shaft portion 230, and a head portion 232, and the long hole 220 has a stepped shape. The shaft part 230 has a larger diameter than the male screw part 228 and a length that is slightly longer than the depth of the small long hole part 234 of the long hole 230. Therefore, in a state where the male screw portion 228 is firmly tightened in the female screw hole 224, a gap slightly larger than the thickness of the peripheral portion of the small elongated hole portion 234 is secured between the head 232 and the upper surface 223, and the partial receiving member 202 is sandwiched between the head 232 and the upper surface 223 so as to allow movement to the operating position and the retracted position.

部分受け部材202は、図6および図11に示すように、案内レール118に設けられたボールプランジャ240と、部分受け部材202に設けられた2つの係合凹部242,244とによって作用位置と退避位置とに位置決めされる。ボールプランジャ240と係合凹部242,244とを含む位置保持部は、本基板コンベヤ100では複数、例えば、2つが搬送方向ないし受け部材200の長手方向に隔たった2箇所に設けられている。   As shown in FIGS. 6 and 11, the partial receiving member 202 is moved and retracted by a ball plunger 240 provided on the guide rail 118 and two engaging recesses 242 and 244 provided on the partial receiving member 202. Position. In the substrate conveyor 100, a plurality of position holding portions including the ball plunger 240 and the engagement concave portions 242 and 244 are provided at two locations separated in the transport direction or the longitudinal direction of the receiving member 200.

ボールプランジャ240は、図11に示すように、ケーシング246内に移動可能に設けられ、係合突部を構成するボール248と、ボール248をケーシング246から突出し、案内レール118の上面223から突出する向きに付勢する付勢装置の一種である弾性部材たるスプリング(図示省略)とを含む。係合凹部242,244は円錐状を成し、搬送方向と直角な方向に距離を隔てて設けられ、ボール248が係合凹部242,244に選択的に嵌入させられることにより、部分受け部材202が作用位置と退避位置とにそれぞれ位置決めされる。部分受け部材202の退避位置は、部分垂下部214が案内レール118の案内面180より僅かに、誤差の範囲で収容凹部216内に引っ込んだ状態となる位置に設定されている。   As shown in FIG. 11, the ball plunger 240 is movably provided in the casing 246 and protrudes from the casing 246 and from the upper surface 223 of the guide rail 118. A spring (not shown) which is an elastic member which is a kind of biasing device biasing in the direction. The engaging recesses 242 and 244 have a conical shape and are provided at a distance in a direction perpendicular to the conveying direction, and the balls 248 are selectively fitted into the engaging recesses 242 and 244, whereby the partial receiving member 202. Are positioned at the operating position and the retracted position, respectively. The retracted position of the partial receiving member 202 is set to a position where the partial hanging portion 214 is slightly retracted from the guide surface 180 of the guide rail 118 into the accommodating recess 216 within an error range.

部分受け部材202の両側の部分受け部材200,204はそれぞれ、図6に示すように、案内レール118に、固定装置の一種であるボルト260によって着脱可能に固定された固定受け部材とされている。部分受け部材200,204には垂下部は設けられず、図12に示すように、案内レール118から押上部材160上へ突出させられ、押上部材160と対向する下向きの面が受け面262を構成している。   As shown in FIG. 6, each of the partial receiving members 200 and 204 on both sides of the partial receiving member 202 is a fixed receiving member fixed to the guide rail 118 by a bolt 260 which is a kind of fixing device. . The partial receiving members 200 and 204 are not provided with a hanging portion, and as shown in FIG. 12, a downward surface that protrudes from the guide rail 118 onto the push-up member 160 and faces the push-up member 160 constitutes a receiving surface 262. doing.

回路基板への電子回路部品の装着は、回路基板が、部品装着面を構成する上面が予め定められた基準高さに位置し、部品装着面を基準とする上面基準と、回路基板の押上部材160により押し上げられる下面が上記基準高さに位置し、その下面を基準とする下面基準との2種類の態様のいずれかで行われる。本装着モジュール10において基準高さは、案内レール118の上面223を含む平面の高さである。部分受け部材202の垂下部210が垂下させられていない部分の下面および部分受け部材200,204の各受け面262は基準高さに位置する。   The electronic circuit component is mounted on the circuit board. The upper surface of the circuit board is located at a predetermined reference height, the upper surface reference is based on the component mounting surface, and the circuit board push-up member. The lower surface pushed up by 160 is positioned at the reference height, and is performed in one of two types of modes: a lower surface reference with the lower surface as a reference. In the mounting module 10, the reference height is a height of a plane including the upper surface 223 of the guide rail 118. The lower surface of the portion where the hanging portion 210 of the partial receiving member 202 is not suspended and the receiving surfaces 262 of the partial receiving members 200 and 204 are positioned at the reference height.

前記部分受け部材202の垂下部210は、図13(a),(b)に例示するヒートシンク付回路基板264のように、上面に段差があり、部品装着面266が、コンベヤベルト126の搬送部128により支持される被搬送部たる側縁部268の上面であって、受け部材120により受けられる被受け面270より高い回路基板について、上面基準で電子回路部品の装着を行うために設けられている。ヒートシンク付回路基板264は、ヒートシンク272と、ヒートシンク272上に設けられた基板274とを備え、ヒートシンク272の側縁部268が搬送部128により支持される。ヒートシンク272のように回路基板に付属させられているものも回路基板の一部と見なす。したがって、搬送部128によ
り直接支持されるのはヒートシンク272であるが、その支持は回路基板の支持である。搬送部128により支持されたヒートシンク付回路基板264は、部品装着面266が被受け面270より上方に位置するため、部品装着面266を基準高さに位置させるためには、被受け面270が基準高さより下方において受け部材120によって受けられることが必要であり、そのために垂下部210が設けられ、垂下部210の垂下長さ(部分受け部材202の下面からの突出長さ)は、部品装着面266と被受け面270との高さの差に等しい長さとされている。また、ヒートシンク付回路基板264は、図13(a)に示す
ように、搬送部128により支持される被支持部276の搬送方向に平行な方向の長さがヒートシンク付回路基板264全体の長さより短く、隣接する2つの装着モジュール10の各基板コンベヤ100の搬送部128間の距離より短く、側縁部268には搬送方向に隔たった2箇所に被支持部276が設けられている。
The hanging portion 210 of the partial receiving member 202 has a step on the upper surface, like the circuit board 264 with a heat sink illustrated in FIGS. 13A and 13B, and the component mounting surface 266 is a conveying portion of the conveyor belt 126. 128 is provided on the upper surface of the side edge portion 268 that is a transported portion supported by 128 and is higher than the receiving surface 270 received by the receiving member 120 for mounting electronic circuit components on the upper surface basis. Yes. The circuit board 264 with a heat sink includes a heat sink 272 and a board 274 provided on the heat sink 272, and the side edge 268 of the heat sink 272 is supported by the transport unit 128. What is attached to the circuit board such as the heat sink 272 is also regarded as a part of the circuit board. Accordingly, although the heat sink 272 is directly supported by the transport unit 128, the support is the support of the circuit board. Since the circuit board 264 with a heat sink supported by the transport unit 128 has the component mounting surface 266 located above the receiving surface 270, the receiving surface 270 is required to position the component mounting surface 266 at the reference height. It is necessary to be received by the receiving member 120 below the reference height, and for that purpose, a hanging portion 210 is provided, and the hanging length of the hanging portion 210 (the protruding length from the lower surface of the partial receiving member 202) is component mounting. The length is equal to the height difference between the surface 266 and the receiving surface 270. In addition, as shown in FIG. 13A, the circuit board 264 with a heat sink has a length in a direction parallel to the transport direction of the supported part 276 supported by the transport unit 128 as compared with the length of the entire circuit board 264 with a heat sink. Short, shorter than the distance between the conveying portions 128 of the substrate conveyors 100 of the two adjacent mounting modules 10, the side edge portion 268 is provided with supported portions 276 at two locations separated in the conveying direction.

基板コンベヤ100には、図16に隣接する2つの装着モジュール10の各基板コンベヤ100について示すように、基板コンベヤ100の搬入側の端面に基板搬入検出器280が取り付けられ、搬出側の端面に基板搬出検出器282が取り付けられている。これら検出器280,282はそれぞれ、非接触型センサの一種である光電センサたる透過型センサにより構成されており、図17に基板搬出検出器282を示すように、サイドフレーム110,112にそれぞれ、互いに対向して設けられた発光部284および受光部286を備え、回路基板によって受光部286の受光が妨げられることにより、回路基板が検出される。   As shown for each of the substrate conveyors 100 of the two mounting modules 10 adjacent to FIG. 16, a substrate carry-in detector 280 is attached to the end surface on the carry-in side of the substrate conveyor 100, and the substrate is placed on the end surface on the carry-out side. A carry-out detector 282 is attached. Each of these detectors 280 and 282 is configured by a transmissive sensor as a photoelectric sensor which is a kind of non-contact type sensor. As shown in FIG. 17, the substrate carry-out detector 282 is provided on each of the side frames 110 and 112. A light emitting unit 284 and a light receiving unit 286 provided opposite to each other are provided, and the circuit board is detected by preventing the light receiving unit 286 from receiving light.

基板搬出検出器282は、図17に示すように、発光部284が、搬送部128により搬送される回路基板より上方に位置し、受光部286が回路基板より下方に位置するように設けられている。基板搬入検出器280においては逆にされ、発光部284は、基板搬送方向と直角な方向において基板搬出検出器282の発光部284と同じ側に設けられているが、受光部286の方が発光部284より上方の位置に設けられ、受光部286が回路基板より上方に位置し、発光部284が回路基板より下方に位置するように設けられている。そのため、発光部284および受光部286が同じ高さの位置に設けられる場合に比較して検出器280,282による基板検出範囲が広くなり、回路基板の検出精度が向上する。また、隣接する2つの装着モジュール10にそれぞれ設けられて互いに隣接する基板搬入検出器280と基板搬出検出器282との各光路の向きが上下方向において逆になり、受光部286が隣接する検出器の発光部が発する光を誤って受光することが回避される。なお、基板搬入検出器の発光部と基板搬出検出器の発光部とを、基板搬送方向と直角な方向において異なる側に設けるとともに、いずれも受光部より上方であって、回路基板より上方の位置に設けてもよく、いずれも受光部より下方であって、回路基板より下方の位置に設けてもよい。   As shown in FIG. 17, the board carry-out detector 282 is provided such that the light emitting part 284 is located above the circuit board carried by the carrying part 128 and the light receiving part 286 is located below the circuit board. Yes. In the substrate carry-in detector 280, the light emitting unit 284 is disposed on the same side as the light emitting unit 284 of the substrate carry-out detector 282 in the direction perpendicular to the substrate carrying direction, but the light receiving unit 286 emits light. The light receiving unit 286 is provided above the circuit board, and the light emitting unit 284 is provided below the circuit board. Therefore, the substrate detection range by the detectors 280 and 282 is widened compared with the case where the light emitting unit 284 and the light receiving unit 286 are provided at the same height, and the detection accuracy of the circuit board is improved. Further, the detectors provided in the two adjacent mounting modules 10 are respectively opposite to each other in the vertical direction in the substrate carry-in detector 280 and the substrate carry-out detector 282, and the light receiving unit 286 is adjacent. It is avoided that the light emitted from the light emitting unit is erroneously received. The light-emitting part of the substrate carry-in detector and the light-emitting part of the substrate carry-out detector are provided on different sides in the direction perpendicular to the substrate carrying direction, and both are located above the light receiving part and above the circuit board. They may be provided at the positions below the light receiving portion and below the circuit board.

検出器280,282の各発光部284および受光部286はそれぞれ、ガイド300,302によって保護されている。図16に検出器280,282の各発光部284について示すように、ガイド300は、サイドフレーム110,112の端面に、発光部284の外側(サイドフレーム110,112とは反対側)に位置し、搬送方向と直交する姿勢で設けられるとともに、図17に示すように、搬送方向と直交する方向の両端部はそれぞれ、互いに離れるほどサイドフレーム110,112に向かう向きに傾斜させられて案内部304,306が設けられている。ガイド302についても同様である。そのため、装着モジュール10が搬送方向と直交する方向において他の部材と相対移動させられるとき、その部材は案内部304,306に案内されてガイド300,302の外側を移動し、検出器280,282と干渉することが回避される。   The light emitting units 284 and the light receiving units 286 of the detectors 280 and 282 are protected by guides 300 and 302, respectively. As shown for each light emitting portion 284 of the detectors 280 and 282 in FIG. 16, the guide 300 is located on the end face of the side frames 110 and 112, outside the light emitting portion 284 (on the opposite side to the side frames 110 and 112). As shown in FIG. 17, both end portions in the direction orthogonal to the conveyance direction are inclined toward the side frames 110 and 112 as they are separated from each other, as shown in FIG. , 306 are provided. The same applies to the guide 302. Therefore, when the mounting module 10 is moved relative to another member in a direction orthogonal to the transport direction, the member is guided by the guide portions 304 and 306 and moves outside the guides 300 and 302, and the detectors 280 and 282 are detected. Interfering with is avoided.

ガイド300,302は、図16および図17に示すように、搬送方向と直交する水平方向および鉛直方向においてコンベヤベルト126と対向し、搬送部128に接する平面
である接平面308(図16参照)より0.5mm下方の位置まで延び出させられて支持部310が設けられ、ガイド300,302が、コンベヤベルト126により搬送される回路基板を下方から支持する付加支持部材としても機能するようにされている。付加支持部材の上端は、接平面以下の位置に位置させられて回路基板の搬送を妨げず、接平面に近い位置にあって回路基板を搬送部とほぼ同様に支持して落下を防止し、接平面の1mm以下の距離下方に位置させられればよい。支持部310の上端面には、図18に示すように、搬送方向における上流側の端部および下流側の端部にそれぞれ、丸味付け312が施され、回路基板の側端部を案内する案内部を構成している。面取りが施されて案内部が構成されてもよい。案内部は支持部の少なくとも搬送方向における上流側の端部に設けられればよい。なお、付加支持部材は、回路基板を下方から支持可能な作用状態と、前記回路基板を下方から支持不能な非作用状態とを取り得るものとしてもよい。付加支持部材を作用位置から下降させて非作用状態としても、取り外すことにより非作用状態としてもよい。付加支持部材の下降は、手動で行われてもよく、移動装置により自動で行われてもよい。
As shown in FIGS. 16 and 17, the guides 300 and 302 are opposed to the conveyor belt 126 in the horizontal direction and the vertical direction orthogonal to the conveyance direction, and are in contact with the conveyance unit 128 (see FIG. 16). The support portion 310 is provided so as to extend to a position 0.5 mm below, and the guides 300 and 302 function as additional support members that support the circuit board conveyed by the conveyor belt 126 from below. ing. The upper end of the additional support member is positioned at a position below the tangential plane and does not hinder the conveyance of the circuit board, and is located at a position close to the tangential plane to support the circuit board in substantially the same manner as the conveyance unit to prevent the fall. What is necessary is just to be located below the distance of 1 mm or less of a tangent plane. As shown in FIG. 18, the upper end surface of the support portion 310 is rounded 312 at the upstream end portion and the downstream end portion in the transport direction, and guides the side end portion of the circuit board. Part. The guide portion may be configured by chamfering. The guide part should just be provided in the edge part of the upstream in the conveyance direction at least of a support part. Note that the additional support member may have an operation state in which the circuit board can be supported from below and a non-operation state in which the circuit board cannot be supported from below. The additional support member may be lowered from the operating position to be in a non-operating state, or may be removed to be in a non-operating state. The additional support member may be lowered manually or automatically by a moving device.

前記基板支持装置22を説明する。
基板支持装置22は、図15に示すように、支持台320と、支持台320上に着脱可能に取り付けられる少なくとも1つの支持部材322とを含み、基板支持装置昇降装置324により昇降させられる。支持台320は大きさが異なる複数種類の回路基板の支持に使用可能な大きさを有する。回路基板を支持する支持部材の種類は様々であるが、支持部材322は、負圧によって回路基板を吸着し、保持する保持型の支持部材とされている。
The substrate support device 22 will be described.
As shown in FIG. 15, the substrate support device 22 includes a support base 320 and at least one support member 322 that is detachably mounted on the support base 320, and is lifted and lowered by a substrate support device lifting device 324. The support base 320 has a size that can be used to support a plurality of types of circuit boards having different sizes. There are various types of support members that support the circuit board, but the support member 322 is a holding-type support member that sucks and holds the circuit board by negative pressure.

支持部材322は、台座326と、台座326に立設された支持ピン328と、支持ピン328の上端面により構成される基板支持面330を囲む状態で設けられたゴム製のバキュームカップ332とを備え、基板支持面330に供給される負圧によってバキュームカップ332が回路基板を吸着し、基板支持面330に支持させる。台座326は、ボルト334が、支持台320に形成された複数の雌ねじ穴(図示省略)のうちの1つに螺合されることにより支持台320に着脱可能に固定され、基板支持面330が回路基板の裏面の被支持箇所に対応する位置に位置する状態で固定される。   The support member 322 includes a pedestal 326, a support pin 328 erected on the pedestal 326, and a rubber vacuum cup 332 provided so as to surround the substrate support surface 330 constituted by the upper end surface of the support pin 328. The vacuum cup 332 adsorbs the circuit board by the negative pressure supplied to the substrate support surface 330 and supports it on the substrate support surface 330. The pedestal 326 is detachably fixed to the support base 320 when the bolt 334 is screwed into one of a plurality of female screw holes (not shown) formed in the support base 320, and the substrate support surface 330 is fixed. It fixes in the state located in the position corresponding to the to-be-supported location of the back surface of a circuit board.

本基板支持装置昇降装置324は、図15に示すように、昇降部材たる昇降台350と、昇降部材駆動装置たるエアシリンダ352とを備え、ピストンロッド354の伸縮により、昇降台350が案内装置356により案内されつつ昇降させられる。エアシリンダは、駆動源の一種であり、流体圧アクチュエータの一種たる流体圧シリンダである。昇降台350は板状を成し、その上に支持台320が着脱可能に固定され、基板支持装置22がセットされる。   As shown in FIG. 15, the substrate support apparatus elevating apparatus 324 includes an elevating base 350 serving as an elevating member and an air cylinder 352 serving as an elevating member driving apparatus. It is moved up and down while being guided by. The air cylinder is a fluid pressure cylinder that is a kind of drive source and a kind of fluid pressure actuator. The lifting platform 350 has a plate shape, the support table 320 is detachably fixed thereon, and the substrate support device 22 is set.

基板支持装置22の支持台320は、その搬送方向に隔たった両端部に支持部材322が取り付けられず、空いており、それぞれイオナイザ370が取り付けられている(図5参照。図5には一方のイオナイザ370のみが図示されている)。本イオナイザ370は、高周波AC放電を行い、ノズル372により、プラスイオンを含むエアとマイナスイオンを含むエアとを交互に高速で放出する。ノズル372は、その角度が調整可能であり、回路基板に向かって下方からイオンを含むエアを噴射する。また、図19に示すように、複数の装着モジュール10のうち、搬送方向において最も上流側の装着モジュール10のモジュール本体18の外面にもイオナイザ374が取り付けられている。イオナイザ374は、イオナイザ370と同様に構成され、基板コンベヤ100,102の上方に設けられ、回路基板の上方から回路基板に向かってイオンを含むエアを噴射する。搬送方向において最も下流側の装着モジュール10の外面にイオナイザを取り付けてもよい。   The support base 320 of the substrate support device 22 is not provided with support members 322 at both ends separated in the transport direction, and is vacant, and each is provided with an ionizer 370 (see FIG. 5, one of which is shown in FIG. 5). Only the ionizer 370 is shown). The ionizer 370 performs high-frequency AC discharge, and the nozzle 372 alternately discharges air containing positive ions and air containing negative ions at a high speed. The angle of the nozzle 372 can be adjusted, and air containing ions is ejected from below toward the circuit board. As shown in FIG. 19, an ionizer 374 is also attached to the outer surface of the module body 18 of the mounting module 10 that is the most upstream in the transport direction among the plurality of mounting modules 10. The ionizer 374 is configured in the same manner as the ionizer 370, is provided above the substrate conveyors 100 and 102, and injects air containing ions from above the circuit board toward the circuit board. An ionizer may be attached to the outer surface of the mounting module 10 on the most downstream side in the transport direction.

前記制御装置30はコンピュータを主体として構成され、装着モジュール10を構成する各種装置を制御する。これら装置のうちの多くの駆動源を構成する電動モータはエンコ
ーダ付サーボモータにより構成され、可動部材の位置制御精度が高い。また、複数の装着モジュール10の各制御装置30のコンピュータは通信ケーブルによって互いに接続され、データのやり取り等を行うようにされている。
The control device 30 is mainly composed of a computer and controls various devices constituting the mounting module 10. Of these devices, the electric motor constituting many of the drive sources is constituted by a servo motor with an encoder, and the position control accuracy of the movable member is high. The computers of the control devices 30 of the plurality of mounting modules 10 are connected to each other via a communication cable so as to exchange data.

以上のように構成されたシステムにより、例えば、前記ヒートシンク付回路基板264(以下、回路基板264と略称する)に電子回路部品が装着される場合を説明する。また、2つの基板コンベヤ100,102のうちの一方、例えば、基板コンベヤ100のみが使用されることとする。基板コンベヤ100においては、1対のサイドフレーム110,112の各受け部材120において部分受け部材202が作用位置に位置させられる。また、回路基板264は厚く、撓む恐れのないものであるため、下方からの支持は不要であり、支持台320に支持部材322は取り付けられない。   A case will be described in which an electronic circuit component is mounted on the circuit board 264 with a heat sink (hereinafter abbreviated as a circuit board 264), for example, by the system configured as described above. In addition, one of the two substrate conveyors 100 and 102, for example, only the substrate conveyor 100 is used. In the substrate conveyor 100, the partial receiving member 202 is positioned at the operating position in each receiving member 120 of the pair of side frames 110 and 112. Further, since the circuit board 264 is thick and has no fear of bending, support from below is unnecessary, and the support member 322 is not attached to the support base 320.

回路基板264は、図5に示すように、その両側縁部においてそれぞれ2箇所ずつの被支持部276が1対のコンベヤベルト126の各搬送部128により支持され、コンベヤベルト126の周回により搬送される。回路基板264が最も上流側の装着モジュール10に搬入されるとき、イオナイザ374によって上方からイオンを含むエアが回路基板264に噴射され、回路基板264の静電気が除去される。   As shown in FIG. 5, the circuit board 264 has two supported portions 276 on the both side edge portions thereof supported by the conveying portions 128 of the pair of conveyor belts 126, and is conveyed by the circulation of the conveyor belt 126. The When the circuit board 264 is carried into the mounting module 10 on the most upstream side, the ionizer 374 jets air containing ions from above onto the circuit board 264, and static electricity on the circuit board 264 is removed.

回路基板264の搬送は、基板搬入検出器280により、回路基板264の搬送方向において上流側の端縁の通過が検出された後、所定距離、移動させられた状態で停止させられる。コンベヤベルト126は、支持ローラ138,支持レール140により支持されて周回し、搬送部128と支持レール140との間および回路基板264と搬送部128との間に適度な摩擦力が得られ、予め設定された停止位置に精度良く停止させられ、イオナイザ370によりイオンを含むエアが下方から噴射され、回路基板264の静電気が除去される。停止後、支持台320が基板支持装置昇降装置324により上昇させられ、押上部材160のボルト164に当接して押上部材160を上昇させる。支持台320は昇降台350に固定された状態では、昇降台350と共に昇降部材を構成し、基板支持装置昇降装置324が押上部材160を上昇させる。押上部材160は搬送部128に支持された回路基板264の被支持部276の下面を支持して搬送部128から浮き上がらせ、図14に示すように、被支持部276を部分受け部材202の部分垂下部214に押し付ける位置まで上昇させられる。押上部材160は、押付部材と考えることもできる。部分受け部材202は回路基板264の被支持部276を受け、押上部材160と共同して被支持部276を挟む。この状態では、回路基板264の部品装着面266が基準高さに位置し、その部品装着面266に電子回路部品を装着するようにノズルホルダの昇降が制御される。装着ヘッド34による回路基板への電子回路部品の装着は、特開2004−104075公報等により知られており、説明を省略する。   The conveyance of the circuit board 264 is stopped in a state where the circuit board 264 is moved by a predetermined distance after the board carry-in detector 280 detects the passage of the upstream edge in the conveyance direction of the circuit board 264. The conveyor belt 126 is supported by the support roller 138 and the support rail 140 and circulates to obtain an appropriate frictional force between the transport unit 128 and the support rail 140 and between the circuit board 264 and the transport unit 128. The stop is accurately performed at the set stop position, and air containing ions is jetted from below by the ionizer 370, and static electricity on the circuit board 264 is removed. After the stop, the support base 320 is raised by the substrate support device lifting / lowering device 324 and comes into contact with the bolt 164 of the push-up member 160 to raise the push-up member 160. In a state where the support base 320 is fixed to the lift base 350, it constitutes a lift member together with the lift base 350, and the substrate support apparatus lift device 324 raises the push-up member 160. The push-up member 160 supports the lower surface of the supported portion 276 of the circuit board 264 supported by the conveying portion 128 and floats up from the conveying portion 128, and the supported portion 276 is part of the partial receiving member 202 as shown in FIG. It is raised to a position where it is pressed against the drooping portion 214. The lifting member 160 can also be considered as a pressing member. The partial receiving member 202 receives the supported portion 276 of the circuit board 264 and sandwiches the supported portion 276 in cooperation with the push-up member 160. In this state, the component mounting surface 266 of the circuit board 264 is positioned at the reference height, and the elevation of the nozzle holder is controlled so that the electronic circuit component is mounted on the component mounting surface 266. The mounting of electronic circuit components onto a circuit board by the mounting head 34 is known from Japanese Patent Application Laid-Open No. 2004-104075 and the like, and the description thereof is omitted.

回路基板264への電子回路部品の装着終了後、支持台320が下降させられ、押上部材160がスプリングの付勢により下降させられ、回路基板264の被支持部276が搬送部128上に載置され、回路基板264が搬出される。被支持部276の搬送方向に平行な方向の寸法は短いが、被支持部276は、隣接する装着モジュール10の各基板コンベヤ100の間に設けられた2つの支持部310により下方から支持されるため、回路基板264はその先端部(搬送方向において下流側の端部)が下がることなく、隣接する搬送部128間を乗り移ることができる。この際、被支持部276は丸味付け312によって支持部310上へ導かれ、より確実に回路基板先端部の下がりが防止される。なお、回路基板への電子回路部品装着作業の開始後、何らかの理由で回路基板を装着モジュール10から取り出すことが必要となった場合、作業者は、基準サイドフレーム110の部分受け部材202を退避位置へ退避させ、回路基板264のクランプを解除することにより、回路基板264を取り出すことができる。   After the mounting of the electronic circuit components on the circuit board 264 is completed, the support base 320 is lowered, the push-up member 160 is lowered by the bias of the spring, and the supported part 276 of the circuit board 264 is placed on the transport unit 128. Then, the circuit board 264 is carried out. Although the dimension of the supported part 276 in the direction parallel to the conveying direction is short, the supported part 276 is supported from below by the two support parts 310 provided between the substrate conveyors 100 of the adjacent mounting modules 10. Therefore, the circuit board 264 can move between the adjacent conveyance sections 128 without lowering the tip end (the end on the downstream side in the conveyance direction). At this time, the supported portion 276 is guided onto the support portion 310 by the rounding 312 and the lowering of the front end portion of the circuit board is more reliably prevented. When it is necessary to remove the circuit board from the mounting module 10 for some reason after the start of the electronic circuit component mounting work on the circuit board, the operator moves the partial receiving member 202 of the reference side frame 110 to the retracted position. The circuit board 264 can be taken out by retracting and releasing the clamp of the circuit board 264.

図15に示す回路基板129のように、上面に段差がない回路基板について電子回路部品の装着を行う場合には段取り替えが行われ、部分受け部材202が退避位置へ退避させられて部分垂下部214が収容凹部216に収容され、支持台320に支持部材322が取り付けられる。回路基板129が基板コンベヤ100により搬入され、所定の位置に停止させられたならば、支持台320が上昇させられ、押上部材160を上昇させ、回路基板129を搬送部128から押し上げさせる。押上部材160の上昇は、部分受け部材200,204の各受け面262に当接することにより規定され、回路基板264の押上げ時より高い位置へ上昇させられる。受け面262は前記基準高さに位置し、回路基板129は、その下面が基準高さに位置することとなる。また、支持部材322の基板支持面330が基準高さに位置する状態となり、回路基板129は基板支持面330への負圧の供給によってバキュームカップ332により吸着され、基板支持面330に押し付けられて下面が基準高さに位置する状態に保たれる。装着ヘッド34が回路基板129に電子回路部品を装着する際、部品装着面412が回路基板129の厚さ分、基準高さより上方に位置することを考慮してノズルホルダの昇降が制御され、吸着ノズル50による電子回路部品の装着が支障なく行われる。1つの受け部材120により2つの態様で回路基板に対する電子回路部品の装着を行うことができる。   When mounting electronic circuit components on a circuit board having no step on the upper surface, such as the circuit board 129 shown in FIG. 15, the changeover is performed, and the partial receiving member 202 is retracted to the retracted position so that the partial hanging part is lowered. 214 is housed in the housing recess 216, and the support member 322 is attached to the support base 320. When the circuit board 129 is carried in by the board conveyor 100 and stopped at a predetermined position, the support base 320 is raised, the push-up member 160 is raised, and the circuit board 129 is pushed up from the transport unit 128. The raising of the push-up member 160 is defined by contacting the receiving surfaces 262 of the partial receiving members 200 and 204, and is raised to a higher position than when the circuit board 264 is pushed up. The receiving surface 262 is positioned at the reference height, and the lower surface of the circuit board 129 is positioned at the reference height. Further, the substrate support surface 330 of the support member 322 is positioned at the reference height, and the circuit board 129 is adsorbed by the vacuum cup 332 by the negative pressure supplied to the substrate support surface 330 and pressed against the substrate support surface 330. The lower surface is kept at the reference height. When the mounting head 34 mounts an electronic circuit component on the circuit board 129, the lifting and lowering of the nozzle holder is controlled in consideration of the fact that the component mounting surface 412 is positioned above the reference height by the thickness of the circuit board 129. The electronic circuit component can be mounted by the nozzle 50 without any trouble. The electronic circuit component can be mounted on the circuit board in two ways by the single receiving member 120.

回路基板129への電子回路部品の装着終了後、支持台320が下降させられ、押上部材160が下降させられて回路基板129が下降させられる。回路基板129は、案内面180の複数の部分垂下部214の間に位置する部分により下降開始当初から案内され、部分垂下部214の受け面218と収容凹部216の底面との間の隙間に引っ掛かることなく、下降させられる。回路基板129が、部品装着面412が基準高さより下方に位置させられた後、搬送部128に載置される前に支持部材322への負圧の供給が遮断されて回路基板129が開放され、搬送部128により支持されて搬出されるようにされる。   After completion of the mounting of the electronic circuit components on the circuit board 129, the support base 320 is lowered, the push-up member 160 is lowered, and the circuit board 129 is lowered. The circuit board 129 is guided from the beginning of the descent by the portion positioned between the plurality of partial hanging portions 214 of the guide surface 180, and is caught in the gap between the receiving surface 218 of the partial hanging portion 214 and the bottom surface of the receiving recess 216. Without being lowered. After the circuit board 129 is positioned below the reference height, the negative pressure supply to the support member 322 is interrupted and the circuit board 129 is opened before being placed on the transport unit 128. , And are carried out by being supported by the transport unit 128.

回路基板264の受けには、図20に示す受け部材430のように、切欠が形成されず、搬送方向に延びる長手形状の垂下部432を有するものを使用することもできる。受け部材430は、上面基準での電子回路部品の装着が行われる際に、1対のサイドフレーム110,112の一方、例えば、従属サイドフレーム112の案内レール118に、垂下部432が押上部材160と対向する状態で固定される。下面基準での電子回路部品の装着を行う場合には、受け部材430を垂下部を有さない受け部材に交換する。この受け部材は、例えば、3つに分割され、両端の部分受け部材は押上部材160と対向する状態で案内レール118に固定され、押上部材160の上昇限度を規定するものとされ、真中の部分受け部材は、その搬送方向に平行で鉛直な端面が案内面180と同一平面内に位置する状態で案内レール118に固定され、回路基板の昇降を許容するものとされる。基準サイドフレーム110側には受け部材120を設けることにより、上面基準での電子回路部品の装着中に、必要に応じて部分受け部材202を退避位置へ退避させて回路基板を取り出すことができる。   As the receiving member of the circuit board 264, a member having a long hanging part 432 extending in the transport direction without a notch can be used as in the receiving member 430 shown in FIG. When the electronic circuit component is mounted on the upper surface, the receiving member 430 has one of the pair of side frames 110, 112, for example, the guide rail 118 of the dependent side frame 112, and the hanging portion 432 is pushed up. It is fixed in a state of facing. When mounting electronic circuit components on the basis of the lower surface, the receiving member 430 is replaced with a receiving member that does not have a hanging portion. The receiving member is divided into three parts, for example, and the partial receiving members at both ends are fixed to the guide rail 118 in a state of facing the push-up member 160, and the upper limit of the push-up member 160 is defined. The receiving member is fixed to the guide rail 118 in a state where a vertical end surface parallel to the conveyance direction is located in the same plane as the guide surface 180, and allows the circuit board to be raised and lowered. By providing the receiving member 120 on the side of the reference side frame 110, the circuit board can be taken out by retracting the partial receiving member 202 to the retracted position as necessary during mounting of the electronic circuit component with respect to the upper surface.

図21に示す受け部材450を用いれば、コンベヤベルト126により支持された状態において部品装着面と被受け面との高さが同じであり、同一平面内に位置する回路基板について、その種類に応じて上面基準あるいは下面基準の2つの態様のいずれかで電子回路部品の装着を行うことができる。受け部材450は、前記受け部材120と同様に3つに分割され、3つの部分受け部材のうち、真中の部分受け部材452は、受け部材120の部分受け部材202と同様に、案内レール118上に搬送方向と直角な方向に移動可能に取り付けられ、上面基準で電子回路部品の装着が行われる回路基板460については、図21(a)に示すように、押上部材160と共同して回路基板460の側縁部を挟む作用位
置に位置させられ、下面基準で電子回路部品の装着が行われる回路基板462については、図21(b)に示すように、押上部材160と共同して回路基板の側縁部を挟まない状態
となる退避位置に退避させられる。両端の部分受け部材は、図示は省略するが、作用位置
において固定される。
If the receiving member 450 shown in FIG. 21 is used, the heights of the component mounting surface and the receiving surface are the same in the state of being supported by the conveyor belt 126, and depending on the type of circuit boards located in the same plane, Thus, the electronic circuit component can be mounted in either one of the two modes of the upper surface reference and the lower surface reference. The receiving member 450 is divided into three parts like the receiving member 120, and the middle partial receiving member 452 of the three partial receiving members is arranged on the guide rail 118 like the partial receiving member 202 of the receiving member 120. As shown in FIG. 21 (a), the circuit board 460, which is mounted so as to be movable in the direction perpendicular to the conveying direction and on which the electronic circuit components are mounted, is combined with the push-up member 160 as shown in FIG. With respect to the circuit board 462 that is positioned at the working position that sandwiches the side edge portion of the 460, and on which the electronic circuit components are mounted on the lower surface, as shown in FIG. Are retracted to a retracted position where the side edge portions of the two are not sandwiched. Although the partial receiving members at both ends are not shown, they are fixed at the operation positions.

図22〜図24に示す案内レール470および受け部材472を用いることもできる。案内レール470は、その搬送方向に平行な方向の両端部474,476の上面が基準高さに位置し、中央部478の上面が基準高さより高い位置に位置するように設けられるとともに、中央部478には、案内面480および上面に開口し、基準高さより下方に至る深さの収容凹部482が複数、搬送方向に距離を隔てて設けられている。受け部材472は3つに分割され、3つの部分受け部材486,488,490のうち、両側の部分受け部材486,490は、受け部材472の両端部474,476上に押上部材160と対向する状態で固定され、中央の部分受け部材488は中央部478上に搬送方向に直角な方向に移動可能に設けられ、その自由端縁から下方へ垂下する垂下部492が設けられるとともに、複数の切欠494が形成され、複数の部分垂下部496が形成されている。   The guide rail 470 and the receiving member 472 shown in FIGS. 22 to 24 can also be used. The guide rail 470 is provided such that the upper surfaces of both end portions 474 and 476 in the direction parallel to the conveying direction are positioned at the reference height, and the upper surface of the center portion 478 is positioned at a position higher than the reference height. A plurality of receiving recesses 482 that open to the guide surface 480 and the upper surface and have a depth that is lower than the reference height are provided in the 478 at a distance in the transport direction. The receiving member 472 is divided into three parts, and among the three partial receiving members 486, 488, 490, the partial receiving members 486, 490 on both sides face the push-up member 160 on both end portions 474, 476 of the receiving member 472. The central partial receiving member 488 is provided on the central portion 478 so as to be movable in a direction perpendicular to the conveying direction, and a hanging portion 492 hanging downward from its free edge is provided. 494 is formed, and a plurality of partially suspended portions 496 are formed.

受け部材472は、ヒートシンク付回路基板264を受ける場合、図22に示すように作用位置に位置させられ、回路基板129を受ける場合、図23に示すように退避位置に位置させられ、部分垂下部496が収容凹部482に収容される。案内レール470の中央部478は基準高さより高くされ、基準高さより上側に案内面480があるため、図24に概略的に示すように、回路基板129は常に案内面480によって案内され、搬送方向に直角な方向のずれがより確実に防止される。図21に示すように、上面基準での電子回路部品の装着時に回路基板を基準高さにおいて受ける受け部材についても同様に、案内レールの一部を基準高さより上方に案内面が存在するとともに、収容凹部を有するものとし、受け部材の一部を部分垂下部を有して作用位置と退避位置とに移動可能なものとしてもよい。   When receiving the circuit board 264 with the heat sink, the receiving member 472 is positioned at the working position as shown in FIG. 22, and when receiving the circuit board 129, the receiving member 472 is positioned at the retracted position as shown in FIG. 496 is received in the receiving recess 482. Since the central portion 478 of the guide rail 470 is made higher than the reference height and the guide surface 480 is above the reference height, the circuit board 129 is always guided by the guide surface 480 as schematically shown in FIG. Deviation in the direction perpendicular to the angle is more reliably prevented. As shown in FIG. 21, for the receiving member that receives the circuit board at the reference height when the electronic circuit component is mounted on the upper surface, similarly, there is a guide surface above the reference height for a part of the guide rail, It is good also as what has an accommodation recessed part and can move a part of receiving member to an action position and a retracted position by having a partial hanging part.

図25ないし図27に示すように、回路基板の側縁部が固定されたことを検出する機能を備えた案内・受け部材500により回路基板の移動を案内させるとともに、側縁部を保持させることもできる。案内・受け部材500は、図25および図27に示すように、鉛直な案内面502が設けられた案内レール部504と、案内レール部504から押上部材160上へ突出させられた受け部506とを備え、従属サイドフレーム112の側板116に着脱可能に固定される。   As shown in FIGS. 25 to 27, the movement of the circuit board is guided by the guide / receiving member 500 having a function of detecting that the side edge of the circuit board is fixed, and the side edge is held. You can also. 25 and 27, the guide / receiving member 500 includes a guide rail portion 504 provided with a vertical guide surface 502, and a receiving portion 506 projected from the guide rail portion 504 onto the push-up member 160. And is detachably fixed to the side plate 116 of the dependent side frame 112.

案内・受け部材500には、図25および図26に示すように、検出部材510が軸512により、搬送方向に平行な軸線まわりに回動可能に取り付けられている。検出部材510は、案内・受け部材500に設けられた凹部514内に収容され、少なくとも1つ、本検出部材510では複数の接触子516が搬送方向に距離を隔てて設けられるとともに、受け部506の搬送方向における少なくとも一部分、本検出部材510では、搬送方向に距離を隔てた複数部分を、搬送方向と直角な方向に貫通して形成された切欠518内にそれぞれ配設されている。切欠518の底面520は、図26に示すように、受け部506の受け面522より下方に位置させられている。   25 and 26, a detection member 510 is attached to the guide / receiving member 500 by a shaft 512 so as to be rotatable about an axis parallel to the transport direction. The detection member 510 is accommodated in a recess 514 provided in the guide / receiving member 500, and at least one of the detection members 510 is provided with a plurality of contacts 516 at a distance in the conveyance direction, and the receiving portion 506. In the present detection member 510, at least a part of the detection member 510 is disposed in a notch 518 formed so as to penetrate in a direction perpendicular to the conveyance direction. The bottom surface 520 of the notch 518 is located below the receiving surface 522 of the receiving portion 506 as shown in FIG.

検出部材510からは、図27に示すように、レバー530が接触子516とは逆向きに、サイドフレーム112の外側へ延び出す向きに設けられるとともに、その下端部にドグ532が設けられており、複数の接触子516と一体的に回動可能とされている。ドグ532が被検出部を構成し、検出部材510の回動軸線から接触子516の先端部の下端までの距離より、回動軸線からドグ532までの距離の方が大きくされており、接触子516の回動が拡大されてドグ532に得られる。検出部材510は、レバー530と側板116との間に配設された付勢装置の一種である弾性部材としてのスプリング534により、接触子516の先端部が下方へ、押上部材160側へ向かう向きに付勢されている。このスプリング534の付勢による検出部材510の回動は、図27(a)に示すように、
接触子516が切欠518の底面520に当接することにより規定され、その状態では、
接触子516の先端部の下端が受け面522より下方に位置し、ドグ532が、側板116に取り付けられたセンサ536から外れた状態となる。センサ536は、例えば、非接触型センサの一種である反射型の光電センサとされてセンサ部を構成し、図26および図27(b)に示すように、接触子516の下端が受け面522と同一面内に位置する状態で
は、ドグ532がセンサ536により検出される。なお、図示は省略するが、基準サイドフレーム110には、例えば、前記受け部材450が設けられる。
As shown in FIG. 27, the detection member 510 is provided with a lever 530 in a direction opposite to the contact 516 and extending to the outside of the side frame 112, and a dog 532 is provided at the lower end thereof. The plurality of contacts 516 can be integrally rotated. The dog 532 constitutes a detected portion, and the distance from the rotation axis to the dog 532 is larger than the distance from the rotation axis of the detection member 510 to the lower end of the tip of the contact 516, and the contact The rotation of 516 is enlarged and obtained in the dog 532. The detection member 510 has a direction in which the tip of the contact 516 is directed downward and toward the push-up member 160 by a spring 534 as an elastic member which is a kind of urging device disposed between the lever 530 and the side plate 116. Is being energized. The rotation of the detection member 510 due to the bias of the spring 534 is as shown in FIG.
The contact 516 is defined by contacting the bottom surface 520 of the notch 518, and in that state,
The lower end of the tip of the contact 516 is positioned below the receiving surface 522, and the dog 532 is detached from the sensor 536 attached to the side plate 116. The sensor 536 is, for example, a reflective photoelectric sensor which is a kind of non-contact type sensor, and constitutes a sensor unit. As shown in FIGS. 26 and 27B, the lower end of the contact 516 is a receiving surface 522. , The dog 532 is detected by the sensor 536. Although not shown, the reference side frame 110 is provided with the receiving member 450, for example.

案内・受け部材500および押上部材160が回路基板540を保持しない状態では、検出部材510は、図27(a)に示すように、接触子516の下端が受け面522より下
方に位置し、ドグ632がセンサ536から外れた非検出位置に位置し、回路基板540の側縁部が押上部材160により押し上げられるにつれて、検出部材510は側縁部によりスプリング534の付勢力に抗して回動させられ、図27(b)に示すように、接触子5
16の下端が受け面522の位置へ回動させられる。その状態では、検出部材510が検出位置に至り、ドグ532がセンサ536により検出され、回路基板540の側縁部が押上部材160と受け部506とによって挟まれたことが検出され、それに基づいて基板支持装置昇降装置の昇降台の上昇が止められる。検出部材510,センサ536およびスプリング534が基板固定検出装置542を構成している。接触子516および受け面522が搬送方向に距離を隔てた複数箇所にあるため、搬送方向に平行な方向の寸法が異なる複数種類の回路基板のいずれも受け面522により受けられるとともに、接触子516に接触して検出部材510を回動させることができ、受け部506と押上部材160とによる固定が検出される。
In a state where the guide / receiving member 500 and the push-up member 160 do not hold the circuit board 540, the detection member 510 has the lower end of the contact 516 positioned below the receiving surface 522 as shown in FIG. As the side edge portion of the circuit board 540 is pushed up by the push-up member 160, the detection member 510 is rotated against the biasing force of the spring 534 by the side edge portion. As shown in FIG. 27 (b), the contact 5
The lower end of 16 is rotated to the position of the receiving surface 522. In this state, the detection member 510 reaches the detection position, the dog 532 is detected by the sensor 536, and it is detected that the side edge portion of the circuit board 540 is sandwiched between the push-up member 160 and the receiving portion 506. The lift of the lifting platform of the substrate support lifting device is stopped. The detection member 510, the sensor 536, and the spring 534 constitute a substrate fixing detection device 542. Since the contactor 516 and the receiving surface 522 are located at a plurality of positions separated in the transport direction, any of a plurality of types of circuit boards having different dimensions in the direction parallel to the transport direction is received by the receiving surface 522 and the contactor 516. The detection member 510 can be rotated in contact with the contact, and the fixation by the receiving portion 506 and the push-up member 160 is detected.

図28ないし図30に示すように、1対の案内レール118にそれぞれ、回路基板の反りを矯正する機能を有する受け部材570を取り付け、回路基板を受けさせることもできる。受け部材570は垂下部を有さず、例えば、前記受け部材450と同様に3つの部分受け部材572,574,576に分割され、両側の部分受け部材572,576は案内レール118に固定され、真中の部分受け部材574は案内レール118により、作用位置と退避位置とに移動可能に保持されている。図28に示すように、搬送方向において上流側の部分受け部材572には、コンベヤベルト126の搬送部128の上流側の端部に対向する部分に案内突部580が設けられ、下流側の部分受け部材580には、搬送部128の下流側の端部に対向する部分に案内突部582が設けられ、これら案内突部580,582は案内部を構成している。案内突部580,582にはそれぞれ、搬送方向の上流側から下流側に向かうに従って搬送部128に直線状に漸近する向きに傾斜した案内面584と、下流側から上流側に向かうに従って搬送部128に直線状に漸近する向きに傾斜した案内面586とが形成されている。また、案内突部580,582の突出端部は、図29に示すように、部分球状の丸味部588とされている。前述のように、基板コンベヤ100の搬送方向の両側にそれぞれ設けられた前記基板搬入検出器280,基板搬出検出器282は、搬送方向において案内突部580,582に隣接する位置に位置する。   As shown in FIGS. 28 to 30, a receiving member 570 having a function of correcting the warp of the circuit board can be attached to each of the pair of guide rails 118 to receive the circuit board. The receiving member 570 does not have a hanging portion, for example, is divided into three partial receiving members 572, 574, and 576 similarly to the receiving member 450, and the partial receiving members 572 and 576 on both sides are fixed to the guide rail 118, The middle partial receiving member 574 is held by the guide rail 118 so as to be movable between the operating position and the retracted position. As shown in FIG. 28, the upstream portion receiving member 572 in the conveying direction is provided with a guide protrusion 580 at a portion facing the upstream end of the conveying portion 128 of the conveyor belt 126, and the downstream portion. The receiving member 580 is provided with a guide protrusion 582 at a portion facing the downstream end of the transport unit 128, and the guide protrusions 580 and 582 constitute a guide part. Each of the guide protrusions 580 and 582 includes a guide surface 584 that is inclined in a direction asymptotically linearly approaching the transport unit 128 from the upstream side to the downstream side in the transport direction, and the transport unit 128 from the downstream side to the upstream side. And a guide surface 586 that is inclined in a direction asymptotic to a straight line. Further, the protruding end portions of the guide protrusions 580 and 582 are partially spherical rounded portions 588 as shown in FIG. As described above, the substrate carry-in detector 280 and the substrate carry-out detector 282 provided on both sides in the carrying direction of the substrate conveyor 100 are located at positions adjacent to the guide protrusions 580 and 582 in the carrying direction.

真中の部分受け部材574の作用位置に位置する状態において案内レール118から片持ち状に搬送部128の上方へ延び出し、回路基板の側縁部を受ける先端部ないし延出し部590の下面により構成される受け面592は、図30(a)に示すように、部分受け部
材574の先端部ないし自由端部側から、案内レール118に保持された基端部側に向かうに従って、上昇する向きに傾斜させられている。この傾斜角度は、本部分受け部材574では2度とされている。
In the state where the middle partial receiving member 574 is located, it extends from the guide rail 118 in a cantilevered manner above the conveying portion 128, and is constituted by a front end portion or a lower surface of the extending portion 590 that receives the side edge portion of the circuit board. As shown in FIG. 30 (a), the receiving surface 592 is raised from the distal end portion or free end portion side of the partial receiving member 574 toward the proximal end portion held by the guide rail 118. It is tilted. This inclination angle is set to 2 degrees in the partial receiving member 574.

回路基板に反りがあり、側縁部が搬送部128から浮き上がっている場合、搬送時に案内突部580,582を通る際に案内面584に案内されて案内突部580,582と搬送部128との間へ導かれ、図29に示すように、搬送部128に近接させられる。搬送部128に接触させられることもあり、回路基板の側縁部は案内突部580,582の搬
送方向における前後において搬送部128とほぼ平行な姿勢となる。その上、検出器280,282は、検出領域が上下方向において広くされており、基板搬入検出器280による回路基板の搬送方向における上流側端の検出に基づいて回路基板の停止位置が精度良く制御され、基板搬出検出器282による回路基板の下流側端の検出に基づいて回路基板の搬出が確実に検出される。案内突部580,582の搬送方向における検出器280,282に対する位置は、回路基板の側縁部ができるだけ水平な状態で検出領域を通る位置に設定される。案内突部580,582はそれぞれ、回路基板の搬送方向における両側にそれぞれ案内面584,586を有するため、回路基板が正逆いずれの方向に移動させられても、その側縁部を搬送部128との間へ導くことができる。あるいは1対のサイドフレーム110,112において案内レール118を共通とすることができる。案内突部580,582には案内面584のみを設けてもよい。
When the circuit board is warped and the side edge portion is lifted from the transport unit 128, the guide projections 580 and 582 and the transport unit 128 are guided by the guide surface 584 when passing through the guide projections 580 and 582 during transport. As shown in FIG. 29, it is brought close to the transport unit 128. The circuit board may be brought into contact with the transport unit 128, and the side edge of the circuit board is substantially parallel to the transport unit 128 before and after the guide protrusions 580 and 582 in the transport direction. In addition, the detection areas of the detectors 280 and 282 are wide in the vertical direction, and the stop position of the circuit board is accurately controlled based on the detection of the upstream end in the circuit board transport direction by the board carry-in detector 280. Then, the circuit board unloading detector 282 reliably detects the circuit board unloading based on the detection of the downstream end of the circuit board. The positions of the guide protrusions 580 and 582 with respect to the detectors 280 and 282 in the conveying direction are set to positions where the side edges of the circuit board pass through the detection region in a state as horizontal as possible. Since the guide protrusions 580 and 582 have guide surfaces 584 and 586 on both sides in the circuit board transport direction, respectively, the side edges of the guide protrusions 580 and 582 can be moved in either the forward or reverse direction. Can lead to between. Alternatively, the guide rail 118 can be shared by the pair of side frames 110 and 112. Only the guide surface 584 may be provided on the guide protrusions 580 and 582.

図30(b)に示すように、回路基板594が押上部材160により押し上げられ、作用
位置に位置する部分受け部材574の受け面592との間に挟まれるとき、部分受け部材574は移動可能に設けられていて案内レール118との間に隙間があるため、押上部材160に押されて延出し部590が僅かに回動させられ、基端部に対して浮き上がらされて水平ではなくなる。しかし、受け面592は傾斜面とされているため、延出し部590が浮き上がらされた状態において受け面592が水平となり、回路基板594の側縁部を水平に押さえ、回路基板594が水平な姿勢で保持される。
As shown in FIG. 30B, when the circuit board 594 is pushed up by the push-up member 160 and is sandwiched between the receiving surface 592 of the partial receiving member 574 located at the operating position, the partial receiving member 574 is movable. Since it is provided and there is a gap between it and the guide rail 118, it is pushed by the push-up member 160 to slightly rotate the extension portion 590, and is lifted with respect to the base end portion so that it is not horizontal. However, since the receiving surface 592 is an inclined surface, the receiving surface 592 is horizontal in a state in which the extended portion 590 is lifted, the side edge of the circuit board 594 is pressed horizontally, and the circuit board 594 is in a horizontal posture. Held in.

電子回路部品が装着される回路基板が、例えば、セラミックス製の回路基板のように脆性基板である場合、図31〜図33に示す基板支持装置600を用いることにより、回路基板の割れを検出することができる。基板支持装置600は、図31に示すように、支持台602と、支持台602上に昇降可能に設けられた支持部材604と、支持部材604を支持台602上において昇降させる昇降装置606とを含み、支持台602は前記基板支持装置昇降装置324の昇降台350に取り付けられる。   When the circuit board on which the electronic circuit component is mounted is a brittle board such as a ceramic circuit board, the circuit board breakage is detected by using the board support device 600 shown in FIGS. be able to. As shown in FIG. 31, the substrate support device 600 includes a support base 602, a support member 604 that can be moved up and down on the support base 602, and a lift device 606 that lifts and lowers the support member 604 on the support base 602. In addition, the support base 602 is attached to the lift base 350 of the substrate support apparatus lift 324.

支持部材604は、発泡材の一種であるスポンジから成る軟支持部材であり、支持する回路基板とほぼ同じ大きさを有し、下端面側を裏板610によって保持され、上端面が支持面612を構成している。本昇降装置606はエアシリンダ614により構成され、ピストンロッド616の伸縮により、支持部材604がガイドロッド618を含む案内装置620に案内されつつ昇降させられる。エアシリンダ614に供給されるエア圧力は、圧力制御装置たるレギュレータ(図示省略)により制御され、支持部材604による回路基板の支持力が変えられる。支持部材604には、図32および図33に示すように、回路基板の割れを検出する割れ検出ユニット630が複数、例えば、3つ以上、本基板支持装置600では3つ、設けられている。割れ検出ユニット630のユニット本体632は、図33に示すように、裏板610の下面に着脱可能に固定され、上面に開口して形成された有底穴634にホルダ636が昇降可能に嵌合されるとともに、ホルダ636内に検出子としてのピン638が嵌合され、ねじ640により着脱可能に固定されており、ピン638の摩耗時に摩耗のないピン638と交換することができる。   The support member 604 is a soft support member made of sponge, which is a kind of foam material, and has substantially the same size as the circuit board to be supported, the lower end surface side is held by the back plate 610, and the upper end surface is the support surface 612. Is configured. The lifting device 606 is composed of an air cylinder 614, and the support member 604 is lifted and lowered while being guided by the guide device 620 including the guide rod 618 by the expansion and contraction of the piston rod 616. The air pressure supplied to the air cylinder 614 is controlled by a regulator (not shown) as a pressure control device, and the support force of the circuit board by the support member 604 is changed. 32 and 33, the support member 604 is provided with a plurality of, for example, three or more crack detection units 630 for detecting cracks in the circuit board, and three in the substrate support apparatus 600. As shown in FIG. 33, the unit main body 632 of the crack detection unit 630 is detachably fixed to the lower surface of the back plate 610, and the holder 636 is fitted in a bottomed hole 634 formed to open on the upper surface. At the same time, a pin 638 as a detector is fitted in the holder 636, and is detachably fixed by a screw 640. When the pin 638 is worn, it can be replaced with a pin 638 having no wear.

ピン638は、図33に示すように、支持部材604および裏板610を厚さ方向に貫通して形成された貫通穴642内に上下方向に相対移動可能に嵌入させられている。ホルダ636は、有底穴634の底面との間に配設された検出子付勢装置たるスプリング644により、ピン638が支持面612を含む支持平面より上方へ突出する方向に付勢されており、スプリング644の付勢によるホルダ636の上昇が、肩面646が裏板610に当接することにより規定された状態では、ピン638が、その先端部ないし上端部が上記支持平面から上方へ突出した突出位置に位置させられる。また、ピン638は、二点鎖線で示すように、ホルダ636を介してスプリング644の付勢力に抗して下降し、その先端ないし上端が貫通穴642内に引っ込み、支持面612を含む支持平面以下の位置に
位置する引込位置へ移動可能である。ピン638は、スプリング644により引込位置から突出位置へ向かう方向に付勢されている。
As shown in FIG. 33, the pin 638 is fitted into a through-hole 642 formed through the support member 604 and the back plate 610 in the thickness direction so as to be relatively movable in the vertical direction. The holder 636 is urged in a direction in which the pin 638 protrudes upward from the support plane including the support surface 612 by a spring 644 which is a detector urging device disposed between the bottom surface of the bottomed hole 634. In the state where the rise of the holder 636 due to the bias of the spring 644 is defined by the shoulder surface 646 coming into contact with the back plate 610, the pin 638 protrudes upward from the support plane at the tip or upper end. Located in the protruding position. Further, as indicated by a two-dot chain line, the pin 638 descends against the urging force of the spring 644 via the holder 636, and the tip or upper end of the pin 638 is retracted into the through hole 642 and includes a support surface 612. It is possible to move to the retracting position located at the following position. The pin 638 is biased by the spring 644 in the direction from the retracted position to the protruding position.

ユニット本体634にはまた、図33に示すように、突出検知器たるセンサ650がピン638の軸線と直角な向きに取り付けられている。本基板支持装置600においてセンサ650は、非接触型センサの一種である近接センサにより構成されている。ホルダ636には、その外周面に開口する円環状の溝652が設けられて被検出部を構成し、ピン638が突出位置に位置する状態では、図33に実線で示すように、溝652がセンサ650と正対し、ピン638が引込位置に位置する状態では、二点鎖線で示すように、溝652がセンサ650から外れてホルダ636の溝652が形成されていない部分がセンサ650と正対し、各状態においてセンサ650は異なる信号を制御装置30のコンピュータへ出力する。3つの割れ検出ユニット630は、図32に示すように、いずれも水平方向である搬送方向に平行な方向および直角な方向(基板支持装置600により支持される回路基板の電子回路部品が装着される作業面たる部品装着面内において側縁部に直角な方向)における各位置を異にする3つの位置にそれぞれ設けられている。   As shown in FIG. 33, a sensor 650 as a protrusion detector is attached to the unit main body 634 in a direction perpendicular to the axis of the pin 638. In the substrate support apparatus 600, the sensor 650 is a proximity sensor that is a kind of non-contact type sensor. The holder 636 is provided with an annular groove 652 that is opened on the outer peripheral surface thereof to constitute a detected portion. When the pin 638 is located at the protruding position, the groove 652 is formed as shown by a solid line in FIG. When the pin 638 is positioned at the retracted position when facing the sensor 650, the portion where the groove 652 is detached from the sensor 650 and the groove 652 of the holder 636 is not formed is aligned with the sensor 650 as indicated by a two-dot chain line. In each state, the sensor 650 outputs a different signal to the computer of the control device 30. As shown in FIG. 32, the three crack detection units 630 are each mounted with a circuit board electronic circuit component supported by the board support device 600 in a direction parallel to and perpendicular to the transport direction which is the horizontal direction. In the component mounting surface which is a work surface, the respective positions in the direction perpendicular to the side edge portion are provided at three positions different from each other.

また、図34に示すように、押付部材660は搬送方向に平行な方向において3つに分割され、分割押付部材662,664,666のうち、両側の分割押付部材662,666は連結部材668によって連結され、真中の分割押付部材664は連結部材668に昇降可能に取り付けられている。分割押付部材664は、連結部材668との間に配設された押付部材付勢装置たるスプリング670により、連結部材668に対して上方へ付勢されている。分割押付部材664は、連結部材668に上下方向に設けられて係合凹部を構成する長穴672と、分割押付部材664に水平に設けられて係合突部を構成するねじ部材674との嵌合により、連結部材668に上下方向に相対移動可能に保持されるとともに、ねじ部材674の長穴672の上端面との係合により、スプリング670の付勢による分割押付部材664の移動が規定され、移動が規定された状態では分割押付部材662,664,666の上端が同じ高さに位置する。また、連結部材668には、分割押付部材662,666にそれぞれ対応する箇所にボルト676が下向きに螺合され、当接部を構成している。さらに、受け部材680は、前記受け部材450と同様に構成され、両側の部分受け部材682,684は分割押付部材662,666と対向する状態で案内レール118に固定され、真中の部分受け部材686は案内レール118に搬送方向と直交する方向に移動可能に設けられ、作用位置と退避位置とに移動させられる。   Also, as shown in FIG. 34, the pressing member 660 is divided into three parts in a direction parallel to the conveying direction. Of the divided pressing members 662, 664, 666, the divided pressing members 662, 666 on both sides are connected by a connecting member 668. The middle divided pressing member 664 is connected to the connecting member 668 so as to be movable up and down. The divided pressing member 664 is biased upward with respect to the connecting member 668 by a spring 670 that is a pressing member biasing device disposed between the split pressing member 664 and the connecting member 668. The divided pressing member 664 is fitted between the elongated hole 672 provided in the vertical direction in the connecting member 668 and constituting the engaging recess, and the screw member 674 provided horizontally in the divided pressing member 664 and constituting the engaging protrusion. Accordingly, the connecting member 668 is held so as to be relatively movable in the vertical direction, and the engagement of the screw member 674 with the upper end surface of the elongated hole 672 defines the movement of the divided pressing member 664 by the bias of the spring 670. In the state where the movement is defined, the upper ends of the divided pressing members 662, 664 and 666 are positioned at the same height. In addition, a bolt 676 is screwed downward at a position corresponding to each of the divided pressing members 662 and 666 to the connecting member 668 to constitute a contact portion. Further, the receiving member 680 is configured in the same manner as the receiving member 450, and the partial receiving members 682 and 684 on both sides are fixed to the guide rail 118 so as to face the divided pressing members 662 and 666, and the partial receiving member 686 in the middle. Is provided on the guide rail 118 so as to be movable in a direction perpendicular to the conveying direction, and is moved between the operating position and the retracted position.

支持台602等は、セラミックス製の脆性基板688(図33参照)の搬入後、基板支持装置昇降装置324により退避位置から上昇させられる。上昇時に支持台602がボルト676に当接し、連結部材668を上昇させて押付部材662,664,666を上昇させ、脆性基板688をコンベヤベルト126から持ち上げさせる。押付部材662,664,666は押上部材でもある。支持台602は、部分受け部材686の受け面690が脆性基板688の上面に当接し、脆性基板688の側縁部を受け、部分押付部材664と共に脆性基板688を挟んだ状態から更に上昇させられ、連結部材668がスプリング670を圧縮しつつ部分押付部材664に対して上昇する。連結部材668は、部分押付部材662,666が部分受け部材682,684に当接するまで上昇させられる。その状態では、ピン638が脆性基板688の裏面より下方に位置し、押付部材660の上昇後、支持部材604が昇降装置606により上昇させられる。この際、まず、図33に実線で示すように、ピン638が脆性基板688に接触して上昇を止められ、その後、更に支持部材604がスプリング644を圧縮しつつピン638に対して上昇し、ピン638は脆性基板688により押されて二点鎖線で示すように引込位置に位置する状態となり、支持面612が退避位置より上方の支持位置に位置して脆性基板688の下面に面接触し、脆性基板688を支持する。   The support base 602 and the like are raised from the retracted position by the substrate support device lifting device 324 after the ceramic brittle substrate 688 (see FIG. 33) is carried in. When rising, the support base 602 contacts the bolt 676 and raises the connecting member 668 to raise the pressing members 662, 664 and 666, and lifts the brittle substrate 688 from the conveyor belt 126. The pressing members 662, 664, and 666 are also lifting members. The support base 602 is further raised from a state in which the receiving surface 690 of the partial receiving member 686 is in contact with the upper surface of the brittle substrate 688, receives the side edge of the brittle substrate 688, and sandwiches the brittle substrate 688 together with the partial pressing member 664. The connecting member 668 moves upward relative to the partial pressing member 664 while compressing the spring 670. The connecting member 668 is raised until the partial pressing members 662 and 666 abut on the partial receiving members 682 and 684. In this state, the pin 638 is positioned below the back surface of the brittle substrate 688, and after the pressing member 660 is lifted, the support member 604 is lifted by the lifting device 606. At this time, first, as shown by a solid line in FIG. 33, the pin 638 comes into contact with the brittle substrate 688 to stop the rise, and then the support member 604 further rises with respect to the pin 638 while compressing the spring 644, The pin 638 is pushed by the brittle substrate 688 to be in the retracted position as indicated by a two-dot chain line, and the support surface 612 is located at the support position above the retracted position and is in surface contact with the lower surface of the brittle substrate 688, A brittle substrate 688 is supported.

昇降装置606は、ピン638が引込位置に位置する状態となり、ホルダ636の溝634から外れた状態となり、センサ650の検出信号が突出位置検出信号から引込位置検出信号に変わることに基づいて作動を停止させられ、支持部材604が所定の圧力で脆性基板688を支持するが、脆性基板688が押付部材660により部分受け部材684に押し付けられる際の衝撃により割れることがあれば、ピン638は脆性基板688により押されず、突出位置に位置したままであり、信号が変わらない。そのため、例えば、支持部材604の上昇開始からの時間が計測され、設定時間が経過し、支持部材604が脆性基板688を支持する状態となる時間が経過しても、突出位置検出信号が出力されているのであれば、脆性基板688が割れたと判定される。脆性基板688が割れることなく支持部材604により支持され、ピン638が引込位置に位置する状態となった場合でも、電子回路部品の装着中等に脆性基板が割れれば、ピン638が脆性基板688により押されなくなってスプリング644の付勢により突出位置へ移動し、ホルダ636の溝634がセンサ650と正対する状態となり、センサ650の出力信号が引込位置検出信号から突出位置検出信号に変わることから脆性基板688が割れたと判定される。脆性基板688の割れの判定に基づいて、例えば装着ヘッド34による電子回路部品の装着動作が止められ、吸着ノズル50が割れた回路基板に引っ掛かって損傷することが回避される。
基板支持装置昇降装置324および昇降装置606が昇降装置を構成し、連結部材668が昇降部材を構成し、コンピュータのセンサ650の出力信号に基づいて脆性基板688の割れを判定する部分が割れ判定部を構成し、装着ヘッド34の作動を止める部分が作動停止部を構成し、部分受け部材682,684が上昇限度規定部を構成している。
本基板支持装置600においては、支持部材604が2つの昇降装置324,606により、2段階に昇降させられるようにされているが、昇降装置606は省略してもよい。
The elevating device 606 operates based on the pin 638 positioned at the retracted position, disengaged from the groove 634 of the holder 636, and the detection signal of the sensor 650 changing from the protruding position detection signal to the retracted position detection signal. If the supporting member 604 is stopped and supports the brittle substrate 688 with a predetermined pressure, but the brittle substrate 688 may be broken by an impact when being pressed against the partial receiving member 684 by the pressing member 660, the pin 638 is It is not pushed by 688 and remains in the protruding position, and the signal does not change. Therefore, for example, the time from when the support member 604 starts to rise is measured, and even if the set time has elapsed and the time for the support member 604 to support the brittle substrate 688 has elapsed, the protruding position detection signal is output. If it is, it is determined that the brittle substrate 688 is cracked. Even when the brittle substrate 688 is supported by the support member 604 without being cracked and the pin 638 is in the retracted position, if the brittle substrate is cracked during mounting of the electronic circuit component, the pin 638 is caused by the brittle substrate 688. Since it is not pushed and moves to the protruding position by the bias of the spring 644, the groove 634 of the holder 636 faces the sensor 650, and the output signal of the sensor 650 changes from the retracted position detection signal to the protruding position detection signal, so that it is brittle It is determined that the substrate 688 is cracked. Based on the determination of the crack of the brittle substrate 688, for example, the mounting operation of the electronic circuit component by the mounting head 34 is stopped, and the suction nozzle 50 is prevented from being caught by the cracked circuit substrate and being damaged.
The substrate support device elevating device 324 and the elevating device 606 constitute an elevating device, the connecting member 668 constitutes the elevating member, and the portion for determining the crack of the brittle substrate 688 based on the output signal of the sensor 650 of the computer is a crack determining unit. The part which stops the operation | movement of the mounting head 34 comprises an operation stop part, and the partial receiving members 682 and 684 comprise the raise limit prescription | regulation part.
In this substrate support apparatus 600, the support member 604 is moved up and down in two stages by the two lift apparatuses 324 and 606, but the lift apparatus 606 may be omitted.

なお、検出子を構成するピンは、工具を使用することなく、ホルダに取付け,取外しされる構造のものとしてもよい。例えば、ピンのホルダに嵌合される部分の端部であって、下端部を、直径がホルダのピン嵌合穴の内径より僅かに大きい大径部とし、その大径部に対してピンの先端部である上端部側に隣接する部分を直径がピン嵌合穴の内径より僅かに小さい小径部とするとともに、小径部の一部および大径部を直径方向に貫通するスリットを形成して二股状とし、ピンの下部に1対の係合部たる係合脚部を設ける。また、これら係合脚部の自由端部(下端部)の外面にそれぞれ、先端(下端)側ほど直径が減少するテーパ面の一部を成す案内面を設ける。ピンをホルダのピン嵌合穴に嵌合する際には、1対の係合脚部が案内面により案内され、互いに接近する向きに弾性変形させられつつホルダに嵌合され、ピン嵌合穴の底面に当接するまで嵌合された状態では、1対の係合脚部が弾性復元力によりピン嵌合穴の内周面に係合し、ピンがホルダに嵌合された状態に保たれる。ピンをホルダから取り外す場合には、ピンに力を加え、1対の係合脚部とピン嵌合穴の内周面との間の摩擦力に打ち勝ちつつピンを上方へ移動させ、ホルダから抜け出させる。   The pins constituting the detector may have a structure that is attached to and detached from the holder without using a tool. For example, the end of the portion of the pin that is fitted to the holder, and the lower end is a large diameter portion whose diameter is slightly larger than the inner diameter of the pin fitting hole of the holder, and the pin A portion adjacent to the upper end side, which is the tip, is a small diameter portion whose diameter is slightly smaller than the inner diameter of the pin fitting hole, and a slit that penetrates a part of the small diameter portion and the large diameter portion in the diameter direction is formed. It has a bifurcated shape, and an engagement leg portion as a pair of engagement portions is provided at the lower portion of the pin. In addition, a guide surface that forms part of a tapered surface whose diameter decreases toward the tip (lower end) side is provided on the outer surface of the free end portion (lower end portion) of the engaging leg portion. When the pins are fitted into the pin fitting holes of the holder, the pair of engaging legs are guided by the guide surfaces, and are fitted into the holder while being elastically deformed in directions approaching each other. In the state of being fitted to contact with the bottom surface, the pair of engaging legs are engaged with the inner peripheral surface of the pin fitting hole by the elastic restoring force, and the pin is kept in the state of being fitted to the holder. When removing the pin from the holder, force is applied to the pin, the pin is moved upward while overcoming the frictional force between the pair of engaging leg portions and the inner peripheral surface of the pin fitting hole, and is removed from the holder. .

図35および図36に示す基板支持装置700を使用することにより、裏面ないし下面に既に電子回路部品が装着されている回路基板を電子回路部品ごと下方から支持することができる。
基板支持装置700は、支持台702と、支持台702に取り付けられた支持ピンユニット704とを含み、支持台702は前記基板コンベヤ100の基板支持装置昇降装置324の昇降台350(図示省略)上に着脱可能に固定される。支持ピンユニット704の支持台702に着脱可能に固定されたユニット本体706には、支持ピン群708が昇降可能に設けられている。支持ピン群708は、基台710上に突設されたスポンジ製の軟質支持部材たる複数の支持ピン712を含む。基台710には、その中央の下面にピストン716が突設されるとともに、ユニット本体706に形成されたシリンダボア718に気密にかつ軸方向に摺動可能に嵌合されてエアシリンダ720を構成し、エア源722からエア室724へのエアの供給は制御弁たる電磁方向切換弁726により制御される。
By using the substrate support device 700 shown in FIGS. 35 and 36, it is possible to support the circuit board on which the electronic circuit components are already mounted on the back surface or the bottom surface from the lower side together with the electronic circuit components.
The substrate support device 700 includes a support table 702 and a support pin unit 704 attached to the support table 702, and the support table 702 is on the lifting table 350 (not shown) of the substrate support device lifting device 324 of the substrate conveyor 100. Removably fixed to. A unit body 706 detachably fixed to the support base 702 of the support pin unit 704 is provided with a support pin group 708 so as to be movable up and down. The support pin group 708 includes a plurality of support pins 712 that are soft support members made of sponge and projecting on the base 710. A piston 716 protrudes from the lower surface of the center of the base 710 and is fitted into a cylinder bore 718 formed in the unit main body 706 so as to be airtight and slidable in the axial direction to constitute an air cylinder 720. The supply of air from the air source 722 to the air chamber 724 is controlled by an electromagnetic direction switching valve 726 serving as a control valve.

支持ピン群708の昇降は、基台710に突設され、ユニット本体706に昇降可能に嵌合された複数の案内部材たるガイドロッド730を含む案内装置732により案内され、支持ピン群708は、ガイドロッド730とユニット本体706との間に配設されたスプリング734により下方へ付勢されている。また、支持ピン群708のユニット本体706に対する上昇端は、基台710に設けられた当接部740がユニット本体706に設けられたストッパ742に当接することにより規定される。さらに、前記支持台702にはドグ750が設けられ、支持台702の上昇の途中で接触式センサの一種であるリミットスイッチ752を切り換えるようにされている。支持ピンユニット704は、回路基板の大きさに応じた数、支持台702に取り付けられる。また、本基板支持装置700を含む基板コンベヤ100は、例えば、押上部材160および受け部材450を含む。   The raising and lowering of the support pin group 708 is guided by a guide device 732 including a plurality of guide rods 730 projecting from the base 710 and fitted to the unit main body 706 so as to be movable up and down. It is biased downward by a spring 734 disposed between the guide rod 730 and the unit main body 706. The rising end of the support pin group 708 with respect to the unit main body 706 is defined by the contact portion 740 provided on the base 710 contacting the stopper 742 provided on the unit main body 706. Further, a dog 750 is provided on the support base 702, and a limit switch 752 which is a kind of contact type sensor is switched during the ascent of the support base 702. A number of support pin units 704 are attached to the support base 702 according to the size of the circuit board. The substrate conveyor 100 including the substrate support apparatus 700 includes a push-up member 160 and a receiving member 450, for example.

回路基板の搬入,停止後、基板支持装置700が基板支持装置昇降装置324により上昇させられる。この上昇に伴って支持台702が押上部材160を上昇させ、押上部材160は回路基板を搬送部128から押し上げ、作用位置に位置する部分受け部材452との間に挟む。支持台702の上昇の途中でドグ750がリミットスイッチ752を切り換え、出力信号がOFF信号からON信号に変わり、それに基づいて電磁方向切換弁726が切り換えられ、エアシリンダ720にエアが供給されて支持ピン群708が上昇させられ、支持ピン712が回路基板を支持する。ドグ750,リミットスイッチ752は、押上部材160が部分受け部材452との間に回路基板を挟んだ後に、支持ピン712が、回路基板の裏面に装着されている電子回路部品のうち、最も高さが高い電子回路部品の下面に接触するタイミングでエアシリンダ720にエアが供給され、支持ピン群708が上昇させられるように設けられている。そのため、支持ピン712は、回路基板を動かすことなく支持することができる。支持ピン712は軟質支持部材であり、回路基板が押上部材160と部分受け部材452との間に挟まれていない状態で電子回路部品に接触すれば、軸線と直角な方向に弾性変形し、電子回路部品を避けつつ上昇させられることにより生じる反力によって電子回路部品を押し、回路基板をずらしてしまうのに対し、回路基板が押上部材160と部分受け部材452とによって保持された状態であれば、電子回路部品があり、支持ピン712が弾性変形により非対称な状態で電子回路部品に接触し、弾性変形の反力が電子回路部品に作用しても回路基板が動かされることはなく、支持ピン712が弾性変形により電子回路部品の存在を許容しつつ、回路基板の下面に接触し、下方から支持することができるのである。支持ピン群708は、当接部740がストッパ742に当接する上昇端位置まで上昇させられる。
支持台702が昇降部材を構成し、基板支持装置昇降装置324が第1昇降部を構成し、エアシリンダ720が第2昇降部を構成している。また、リミットスイッチ752が検知器を構成し、制御装置30の基板支持装置昇降装置324およびエアシリンダ720を制御し、リミットスイッチ752による支持台702の設定高さへの上昇の検知に基づいて電磁方向切換弁726を切り換え、エアシリンダ720へのエアの供給を許容させる部分および電磁方向切換弁726と共に昇降制御部を構成している。
After carrying in and stopping the circuit board, the substrate support device 700 is raised by the substrate support device lifting device 324. Along with this rise, the support base 702 raises the push-up member 160, and the push-up member 160 pushes up the circuit board from the transport unit 128 and sandwiches it between the partial receiving member 452 located at the operating position. The dog 750 switches the limit switch 752 while the support base 702 is raised, and the output signal changes from the OFF signal to the ON signal. Based on this, the electromagnetic direction switching valve 726 is switched, and air is supplied to the air cylinder 720 for support. The pin group 708 is raised, and the support pins 712 support the circuit board. The dog 750 and limit switch 752 have the highest height among the electronic circuit components mounted on the back surface of the circuit board after the push-up member 160 sandwiches the circuit board between the push-up member 160 and the partial receiving member 452. Is provided so that air is supplied to the air cylinder 720 at a timing when it contacts the lower surface of the electronic circuit component having a high height, and the support pin group 708 is raised. Therefore, the support pins 712 can be supported without moving the circuit board. The support pin 712 is a soft support member. If the circuit board is in contact with the electronic circuit component without being sandwiched between the push-up member 160 and the partial receiving member 452, the support pin 712 is elastically deformed in a direction perpendicular to the axis line. If the electronic circuit component is pushed by the reaction force generated by being lifted while avoiding the circuit component and the circuit board is displaced, the circuit board is held by the push-up member 160 and the partial receiving member 452. There is an electronic circuit component, the support pin 712 contacts the electronic circuit component in an asymmetric state due to elastic deformation, and the circuit board is not moved even if the reaction force of the elastic deformation acts on the electronic circuit component. 712 can contact the lower surface of the circuit board and can be supported from below while allowing the presence of electronic circuit components by elastic deformation. The support pin group 708 is raised to the rising end position where the contact portion 740 contacts the stopper 742.
The support base 702 constitutes an elevating member, the substrate support apparatus elevating device 324 constitutes a first elevating part, and the air cylinder 720 constitutes a second elevating part. In addition, the limit switch 752 constitutes a detector, controls the substrate support device lifting device 324 and the air cylinder 720 of the control device 30, and is electromagnetic based on detection of the rise of the support base 702 to the set height by the limit switch 752. A lift control unit is configured together with a portion that switches the direction switching valve 726 and allows the supply of air to the air cylinder 720 and the electromagnetic direction switching valve 726.

図37に示す基板支持装置800を使用することにより、複数の装着モジュール10、例えば、隣接する2台の装着モジュール10に跨って回路基板を配設し、電子回路部品を装着することができる。基板支持装置800は、共通支持台802および共通支持台取付装置804を含む。共通支持台802は、その一端部が、2つの装着モジュール10のうちの一方、例えば、矢印で示す搬送方向において下流側の装着モジュール10の基板支持装置昇降装置324の昇降台350にスペーサ806を介して、固定装置の一種である複数のボルト808により着脱可能に固定される。   By using the substrate support apparatus 800 shown in FIG. 37, it is possible to dispose a circuit board across a plurality of mounting modules 10, for example, two adjacent mounting modules 10, and to mount electronic circuit components. The substrate support device 800 includes a common support base 802 and a common support base mounting device 804. One end of the common support base 802 has a spacer 806 on one of the two mounting modules 10, for example, the lifting base 350 of the substrate supporting apparatus lifting device 324 of the mounting module 10 on the downstream side in the transport direction indicated by the arrow. And are detachably fixed by a plurality of bolts 808 which are a kind of fixing device.

共通支持台802は、図37に示すように、下流側の昇降台350から上流側の装着モジュール10の基板支持装置昇降装置324の昇降台350上へ延び出させられ、その自由端側の部分であって、上流側の昇降台350に対向する部分にスプリングリテーナ81
0が昇降可能に設けられるとともに、共通支持台802との間に配設された弾性部材たるスプリング812により、上流側の昇降台350に向かって付勢されている。スプリングリテーナ810は、図39に示すように、頭部814を有する頭付きのボルト816および2つのナット818,820を含む。ボルト816は、共通支持台802に形成された上下方向の貫通穴824に、頭部814が昇降台350と対向する状態で摺動可能に嵌合され、貫通穴824から突出した雄ねじ部826にナット818,820が螺合されている。スプリング812は、頭部814と共通支持台802との間に配設され、2つのナット818,820の雄ねじ部826への螺合位置の調節により、頭部814の位置が調節可能である。共通支持台802にはまた、図38に示すように、2つの昇降台350にそれぞれ対応する2箇所ずつにボルト828が螺合され、位置決め部を構成している。
As shown in FIG. 37, the common support base 802 is extended from the downstream lift base 350 onto the lift base 350 of the substrate support device lift 324 of the upstream mounting module 10, and a portion on the free end side thereof. A spring retainer 81 is provided at a portion facing the upstream lifting platform 350.
0 is provided so as to be movable up and down, and is urged toward the upstream lifting platform 350 by a spring 812 as an elastic member disposed between the common supporting platform 802. The spring retainer 810 includes a headed bolt 816 having a head 814 and two nuts 818 and 820 as shown in FIG. The bolt 816 is slidably fitted in a vertical through hole 824 formed in the common support base 802 in a state where the head 814 faces the lifting base 350, and is attached to the male screw portion 826 protruding from the through hole 824. Nuts 818 and 820 are screwed together. The spring 812 is disposed between the head 814 and the common support base 802, and the position of the head 814 can be adjusted by adjusting the screwing position of the two nuts 818 and 820 to the male screw portion 826. As shown in FIG. 38, bolts 828 are screwed into the common support base 802 at two locations corresponding to the two lift bases 350, respectively, thereby constituting a positioning portion.

共通支持台802には、図37および図38に示すように、複数の基板支持部たる基板吸着突部840が突設されている。これら基板吸着突部840には、その表面である上端面により構成される支持面たる吸着面842に開口して複数の環状の溝が同心状に形成されて負圧室844が設けられ、各負圧室844には負圧通路846,848(図37,図38参照)により、図示を省略する負圧源から負圧が供給される。また、共通支持台802の搬送方向に隔たった両端部にそれぞれ、案内部854が設けられている。これら案内部854はそれぞれ板状を成し、共通支持台802から直角に立ち上がった後、上方ほど互いに離間する向きに傾斜させられている。   As shown in FIGS. 37 and 38, the common support base 802 is provided with a plurality of substrate suction protrusions 840 as a plurality of substrate support portions. Each of the substrate suction protrusions 840 is provided with a negative pressure chamber 844 having a plurality of annular grooves concentrically formed by opening on a suction surface 842 that is a support surface constituted by an upper end surface that is a surface thereof. Negative pressure is supplied to the negative pressure chamber 844 from a negative pressure source (not shown) through negative pressure passages 846 and 848 (see FIGS. 37 and 38). In addition, guide portions 854 are provided at both ends of the common support base 802 separated from each other in the transport direction. Each of these guide portions 854 has a plate shape, and after rising from the common support base 802 at a right angle, the guide portions 854 are inclined so as to be separated from each other toward the upper side.

回路基板868は、図40に示す基板キャリヤ870に載せられて搬送される。基板キャリヤ870は、隣接する2つの装着モジュール10の各基板支持装置昇降装置324に跨る長さを有する板状を成し、前記複数の基板吸着突部840がそれぞれ嵌合可能な複数の開口872が形成されるとともに、位置決め部材の一種である位置決め突部たるピン874が複数、立設されて位置決め装置を構成し、回路基板868の側面に当接し、基板キャリヤ870に対する昇降を許容しつつ、搬送方向に平行な方向と、基板キャリヤ870に載せられた回路基板の部品装着面に平行な平面である水平面内において搬送方向と直角な方向とに位置決めする。図40には、搬送方向に長い回路基板868が2枚、搬送方向に直角な方向に並べて載せられた例が図示されている。   The circuit board 868 is placed on the board carrier 870 shown in FIG. The substrate carrier 870 has a plate shape having a length straddling the substrate support device lifting / lowering devices 324 of the two adjacent mounting modules 10, and a plurality of openings 872 into which the plurality of substrate suction protrusions 840 can be respectively fitted. And a plurality of pins 874 as positioning protrusions, which are a kind of positioning members, are provided upright to constitute a positioning device, abut against the side surface of the circuit board 868, and allow the substrate carrier 870 to move up and down. Positioning is performed in a direction parallel to the transport direction and in a direction perpendicular to the transport direction in a horizontal plane that is a plane parallel to the component mounting surface of the circuit board placed on the substrate carrier 870. FIG. 40 shows an example in which two circuit boards 868 that are long in the transport direction are arranged side by side in a direction perpendicular to the transport direction.

基板キャリヤ870は、その長手方向の両側縁部がそれぞれ、回路基板が基板コンベヤ100によって直接搬送される場合と同様に、基板コンベヤ100の1対のコンベヤベルト126の各搬送部128上に載せられ、コンベヤベルト126の周回により移動させられ、載せられた回路基板868を搬送する。基板キャリヤ870の移動は、1対のサイドフレーム110,112の各案内レール118により案内される。基板キャリヤ870は、図37および図41(a)に示すように、共通支持台802上に停止させられ、2つの装
着モジュール10の各基板支持装置昇降装置324の昇降台350が上昇させられ、共通支持台802を上昇させる。共通支持台802は、下流側の装着モジュール10の昇降台350と一体的に上昇させられるが、上流側の装着モジュール12の昇降台350は、スプリングリテーナ810を介して共通支持台802を上昇させる。スプリング812は予圧縮されて配設されており、その予圧縮およびボルト816の頭部814の位置の調節は、2つの昇降台350が同じ高さに位置する状態で頭部814が昇降台350に当接し、ナット818,820が共通支持台802から僅かに離れた状態で、共通支持台802がちょうど水平な姿勢となるように行われる。そのため、2つの昇降台350の上昇にずれがあれば、共通支持台802の自由端側を支持する昇降台350がスプリング812を圧縮し、あるいはボルト816から離間して、その昇降台350を昇降させるエアシリンダ352に作用する負荷が変化し、2つの昇降台350がほぼ同じ速度で上昇させられ、共通支持台802を上昇させる。
Substrate carrier 870 is mounted on each conveying section 128 of a pair of conveyor belts 126 of substrate conveyor 100, as is the case when the circuit board is directly conveyed by substrate conveyor 100, with both longitudinal edges thereof. The circuit board 868 is moved by the circumference of the conveyor belt 126 and transported. The movement of the substrate carrier 870 is guided by the guide rails 118 of the pair of side frames 110 and 112. As shown in FIGS. 37 and 41 (a), the substrate carrier 870 is stopped on the common support base 802, and the lift base 350 of each substrate support apparatus lift 324 of the two mounting modules 10 is raised. The common support base 802 is raised. The common support base 802 is raised integrally with the lifting platform 350 of the downstream mounting module 10, but the lifting platform 350 of the upstream mounting module 12 lifts the common support base 802 via the spring retainer 810. . The spring 812 is arranged in a pre-compressed manner, and the pre-compression and the adjustment of the position of the head 814 of the bolt 816 are performed with the head 814 in the state where the two elevators 350 are at the same height. The common support base 802 is placed in a horizontal posture with the nuts 818 and 820 slightly separated from the common support base 802. Therefore, if there is a deviation in the ascent of the two lifting platforms 350, the lifting platform 350 that supports the free end side of the common support platform 802 compresses the spring 812 or moves away from the bolt 816 to move the lifting platform 350 up and down. The load acting on the air cylinder 352 to be changed is changed, and the two lifting platforms 350 are raised at substantially the same speed, and the common support table 802 is raised.

共通支持台802の上昇の途中で、図41(b)に示すように、基板吸着突部840が基
板キャリヤ870の開口872に嵌合され、回路基板868をピン874に対して上昇させ、基板キャリヤ870から浮き上がらせる。共通支持台802と基板キャリヤ870との間に搬送方向のずれがあっても、案内部854に案内されて基板キャリヤ870が移動し、ずれが修正されて基板吸着突部840が開口872に嵌合される。そして、共通支持台802の基板吸着突部840の周囲の部分が基板キャリヤ870に当接し、搬送部128から持ち上げる。基板吸着突部840の高さおよびピン874の高さは、回路基板をピン874から外れることなく、支持する大きさに設定されている。2つの昇降台350の上昇端位置は、前記ボルト828が基板コンベヤ100の側板116に当接することにより規定され、回路基板868の部品装着面が前記基準高さに位置させられる。共通支持台802の上昇端を決めることにより2つの昇降台350の上昇端位置が決められるのであり、スプリング812の予圧縮量の設定およびボルト816の頭部814の位置の調節により、2つの昇降台350の上昇端位置が等しく、共通支持台802の姿勢が水平となる状態が得られる。
In the middle of the raising of the common support base 802, as shown in FIG. 41 (b), the board suction protrusion 840 is fitted into the opening 872 of the board carrier 870, and the circuit board 868 is raised with respect to the pins 874, Lift from carrier 870. Even if there is a deviation in the transport direction between the common support 802 and the substrate carrier 870, the substrate carrier 870 is moved by being guided by the guide portion 854, the deviation is corrected, and the substrate suction protrusion 840 is fitted into the opening 872. Combined. Then, a portion around the substrate suction protrusion 840 of the common support base 802 comes into contact with the substrate carrier 870 and is lifted from the transport unit 128. The height of the board suction protrusion 840 and the height of the pin 874 are set to a size that supports the circuit board without detaching from the pin 874. The rising end positions of the two lifting platforms 350 are defined by the bolts 828 coming into contact with the side plates 116 of the board conveyor 100, and the component mounting surface of the circuit board 868 is positioned at the reference height. By determining the rising end of the common support base 802, the rising end positions of the two lifting bases 350 are determined. By setting the pre-compression amount of the spring 812 and adjusting the position of the head 814 of the bolt 816, two lifting positions A state is obtained in which the rising end positions of the base 350 are equal and the posture of the common support base 802 is horizontal.

昇降台350の上昇後、負圧室844に負圧が供給され、回路基板868が吸着面842に吸着される。そして、2つの装着モジュール10の各装着ヘッド34が移動させられて電子回路部品を回路基板868に装着する。これら装着ヘッド34の装着エリアは重複しており、回路基板868の2つの装着モジュール10の間の部分にも電子回路部品が装着される。電子回路部品の装着終了後、負圧室844への負圧の供給が遮断されて回路基板868が開放されるとともに、2つの昇降台350が同時に下降させられ、共通支持台802が下降させられるが、この下降時にも自由端側の昇降台350の頭部814からの離間あるいはスプリング812の圧縮により、2つの昇降台350がほぼ同じ速度で下降させられる。そして、基板キャリヤ870が搬送部128上に載置されるとともに、基板吸着突部840が開口872から抜け出させられ、回路基板868が基板キャリヤ870により支持される。ボルト808,スプリングリテーナ810およびスプリング812が共通支持台取付装置804を構成し、昇降台350が昇降部材を構成し、エアシリンダ352が昇降装置を構成している。   After the lift 350 is lifted, negative pressure is supplied to the negative pressure chamber 844 and the circuit board 868 is sucked to the suction surface 842. Then, the mounting heads 34 of the two mounting modules 10 are moved to mount the electronic circuit component on the circuit board 868. The mounting areas of these mounting heads 34 overlap, and an electronic circuit component is also mounted on the portion of the circuit board 868 between the two mounting modules 10. After the mounting of the electronic circuit components is completed, the supply of negative pressure to the negative pressure chamber 844 is interrupted, the circuit board 868 is opened, the two lifting platforms 350 are simultaneously lowered, and the common support platform 802 is lowered. However, even during this lowering, the two lifting platforms 350 are lowered at substantially the same speed due to the separation from the head 814 of the lifting platform 350 on the free end side or the compression of the spring 812. Then, the substrate carrier 870 is placed on the transport unit 128, the substrate suction protrusion 840 is pulled out from the opening 872, and the circuit board 868 is supported by the substrate carrier 870. The bolt 808, the spring retainer 810, and the spring 812 constitute a common support mounting device 804, the lifting platform 350 constitutes a lifting member, and the air cylinder 352 constitutes a lifting device.

なお、基板キャリヤには、基板キャリヤに形成された複数の開口の各々について回路基板が位置決めされ、搬送されてもよい。この場合、複数の開口の各々についてピンが立設され、回路基板を搬送方向に平行な方向および直角な方向に位置決めするようにされ、複数の回路基板が1つずつ、基板吸着突部により吸着される。開口の搬送方向における数より少ない数であって、複数の開口について1枚の回路基板が位置決めされ、搬送されてもよい。隣接する電子回路部品装着機の間の部分にも回路基板を位置させて電子回路部品を装着することができる。
また、ピン等、位置決め部材は、回路基板を搬送方向と直角な方向にのみ位置決めするように設けられてもよい。
The circuit board may be positioned and transported to each of the plurality of openings formed in the substrate carrier. In this case, a pin is erected for each of the plurality of openings so that the circuit boards are positioned in a direction parallel to and perpendicular to the transport direction, and the plurality of circuit boards are sucked by the board suction protrusions one by one. Is done. The number may be smaller than the number of openings in the transport direction, and one circuit board may be positioned and transported for a plurality of openings. An electronic circuit component can be mounted by positioning a circuit board in a portion between adjacent electronic circuit component mounting machines.
Further, positioning members such as pins may be provided so as to position the circuit board only in a direction perpendicular to the transport direction.

さらに、請求可能発明に係る基板コンベヤは、電子回路部品装着機の他、スクリーン印刷機,高粘性流体塗布機等、種々の対基板作業機に設けることができる。また、請求可能発明に係る基板コンベヤ列は、複数の対基板作業機が直列に配設されて構成される対基板作業システムに設けることができる。   Further, the substrate conveyor according to the claimable invention can be provided on various substrate working machines such as a screen printing machine and a highly viscous fluid coating machine in addition to the electronic circuit component mounting machine. Moreover, the substrate conveyor row | line | column which concerns on a claimable invention can be provided in the board | substrate work system comprised by arrange | positioning a several board | substrate working machine in series.

10:装着モジュール 20:基板搬送装置 22:基板支持装置 100,102:基板コンベヤ 118:案内レール 120:受け部材 126:コンベヤベルト 128:搬送部 138:支持ローラ 140:支持レール 150:清掃ブラシ 160:押上部材 180:案内面 210:垂下部 212:切欠 214:部分垂下部 216:収容凹部 280:基板搬入検出器 282:基板搬出検出器 310:支持部 320:支持台 322:支持部材 324:基板支持装置昇降装置 350:昇降台 370,374:イオナイザ 430:受け部材 432:垂下部 450:受け部材 470:案内レール 472:受け部材 492:垂下部 494:切欠 496:部分垂下部 500:案内・受け部材 510:検出部材 516:接触子 536:センサ 542:基板固定検出装置 570:受け部材 580,582:案内突部 588:丸味部 600:基板支持装置 602:支持台 604:支持部材 606:昇降装置 630:割れ検出ユニット 638:ピン 650:センサ 660:押付部材 680:受け部材 688:脆性基板 700:基板支持装置 702:支持台 704:支持ピンユニット 712:支持ピン 800:基板支持装置 802:共通支持台 804:共通支持台取付装置 810:スプリングリテーナ 812:スプリング 870:基板キャリヤ   10: Mounting module 20: Substrate transport device 22: Substrate support device 100, 102: Substrate conveyor 118: Guide rail 120: Receiving member 126: Conveyor belt 128: Transport section 138: Support roller 140: Support rail 150: Cleaning brush 160: Push-up member 180: Guide surface 210: Hanging portion 212: Notch 214: Partial hanging portion 216: Housing recess 280: Substrate carry-in detector 282: Substrate carry-out detector 310: Support unit 320: Support base 322: Support member 324: Substrate support Device elevating device 350: Elevating platform 370, 374: Ionizer 430: Receiving member 432: Hanging member 450: Receiving member 470: Guide rail 472: Receiving member 492: Hanging member 494: Notch 496: Partial hanging portion 00: Guide / receiving member 510: Detection member 516: Contact 536: Sensor 542: Substrate fixing detection device 570: Reception member 580, 582: Guide protrusion 588: Round portion 600: Substrate support device 602: Support base 604: Support Member 606: Lifting device 630: Crack detection unit 638: Pin 650: Sensor 660: Pressing member 680: Receiving member 688: Brittle substrate 700: Substrate support device 702: Support base 704: Support pin unit 712: Support pin 800: Substrate support Device 802: Common support 804: Common support mounting device 810: Spring retainer 812: Spring 870: Substrate carrier

Claims (4)

水平な直線部を含む閉曲線に沿って周回するコンベヤベルトと、
そのコンベヤベルトの前記直線部に対応する部分である搬送部に支持されて搬送される回路基板の側縁を案内する案内面を備えた案内レールと、
前記搬送部に支持された回路基板の側縁部の下面を支持して前記搬送部から浮き上がらせる押上部材と、
前記搬送部の上方においてその搬送部に平行に延び、前記押上部材により押し上げられる回路基板の側縁部を受け、押上部材と共同して回路基板の側縁部を挟む受け部材と、
前記回路基板を下方から支持する基板支持部材と、
前記押上部材と前記基板支持部材とを昇降させる昇降装置と
を含み、回路基板を搬送方向に搬送する基板コンベヤであって、
前記昇降装置が、前記押上部材を前記受け部材と共同して回路基板を挟む位置まで上昇させた後に、前記基板支持部材を前記回路基板の下面に接触する位置まで上昇させるものであることを特徴とする基板コンベヤ。
A conveyor belt that circulates along a closed curve including a horizontal straight section;
A guide rail provided with a guide surface for guiding a side edge of a circuit board supported and transported by a transport portion which is a portion corresponding to the linear portion of the conveyor belt;
A push-up member that supports the lower surface of the side edge of the circuit board supported by the transport unit and floats up from the transport unit;
A receiving member that extends in parallel with the conveying portion above the conveying portion, receives a side edge portion of the circuit board that is pushed up by the push-up member, and sandwiches the side edge portion of the circuit board together with the raising member;
A board support member for supporting the circuit board from below;
A lifting / lowering device that lifts and lowers the push-up member and the substrate support member;
The elevating device raises the board supporting member to a position in contact with the lower surface of the circuit board after raising the push-up member to a position sandwiching the circuit board together with the receiving member. Substrate conveyor.
前記昇降装置が、
前記押上部材を押し上げる昇降部材と、
その昇降部材を昇降させる第一昇降部と、
前記昇降部材に保持され、その昇降部材に対して前記基板支持部材を相対的に昇降させる第二昇降部と、
前記押上部材が前記第一昇降部により前記受け部材と共同して回路基板を挟む位置まで上昇させられた後に、前記基板支持部材が前記第二昇降部により前記回路基板の下面に接触する位置まで上昇させられるように、前記第一昇降部と前記第二昇降部とを制御する昇降制御部と
を含む請求項1に記載の基板コンベヤ。
The lifting device is
An elevating member for pushing up the push-up member;
A first elevating part for elevating the elevating member;
A second elevating unit held by the elevating member and relatively elevating the substrate support member with respect to the elevating member;
After the push-up member is raised to a position where the circuit board is sandwiched in cooperation with the receiving member by the first elevating part, the board support member is moved to a position where the second elevating part comes into contact with the lower surface of the circuit board. The substrate conveyor according to claim 1, further comprising an elevating control unit that controls the first elevating unit and the second elevating unit so as to be raised.
前記基板支持部材が、前記回路基板の裏面に装着されている電子回路部品に接触した場合に弾性変形し、電子回路部品の存在を許容しつつ回路基板を支持する軟質支持部材を含む請求項1または2に記載の基板コンベヤ。   The said board | substrate support member is elastically deformed when it contacts the electronic circuit component with which the back surface of the said circuit board was mounted | worn, and includes the soft support member which supports a circuit board, accept | permitting presence of an electronic circuit component. Or the substrate conveyor of 2. 前記昇降制御部が、前記昇降部材が前記第一昇降部により設定高さまで上昇させられることに応じて、前記第二昇降部に前記基板支持部材の上昇を開始させるものである請求項2または3に記載の基板コンベヤ。   The said raising / lowering control part makes the said 2nd raising / lowering part start the raise of the said board | substrate support member according to said raising / lowering member being raised to set height by said 1st raising / lowering part. The substrate conveyor as described in.
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