JP2000261200A - Electronic component mounting apparatus and apparatus and method for arranging lower support pins for mounting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus capable of arranging lower support pins by a convenient and practical method and an apparatus and method for arranging lower support pins for a mounting board. SOLUTION: For determining a layout of lower support pins of a support jig 13 for supporting a mounted-component-existing surface of a double-side- mount board 3, a laser pointer mounted on an arm 17A meshed with a pinion 25 and extending symmetrically to both sides indicates other support-allowing spot than electronic component P positions on the mounted-component-existing surface of the board having mounted components, a laser point 26B mounted on an arm 17B indicates a symmetrical point on the jig 13 corresponding to the indicated position, and the support pin is inserted in a hole 13a located at the indicated position, thus efficiently arranging the support pins in a convenient method.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a board and a mounting board lowering jig for determining an arrangement of pins of a lower receiving jig for receiving an already mounted surface of a double-sided mounting board. The present invention relates to a receiving pin arrangement device and an arrangement method.

[0002]

2. Description of the Related Art As a substrate on which electronic components are mounted, there is a so-called double-sided mounting substrate on which electronic components are mounted not only on one side but also on both sides. In the mounting process of this double-sided mounting board,
First, after mounting on the first surface, the substrate is turned over and the second
Mounting on the surface is performed. When mounting on this second side,
The first surface, that is, the mounted surface on which the electronic components are mounted faces downward. Therefore, when positioning and holding the board at the mounting position, the electronic components become obstacles and directly support the mounted surface. Can not do. For this reason, a method is used in which an undercapable portion other than the electronic component mounting portion on the already mounted surface is appropriately selected, and this position is supported by the underpin. In this method, the positions of the pin holes corresponding to the above-mentioned lower-portable portions are selected on a lower-receiving jig composed of a plate member provided with a large number of pin holes, and the lower-pins are mounted in these pin holes. Thereby, a lower receiving jig corresponding to each substrate type is prepared.

[0003]

Conventionally, in the operation of mounting the support pins, the operator has selected the pin position by observing the actual substrate. However, the method of simply selecting the pin position by visual inspection is very inefficient, and in many cases, the method is repeated many times due to the interference between the pin and the electronic component, requiring a lot of labor and time. For this reason, it is required to efficiently arrange the support pins, and for example, an attempt to automatically determine the arrangement based on mounting data indicating the position of the electronic component on the board has been studied. Such a method requires complicated labor and cannot be said to be a practical method, and a simple and practical method of arranging the support pins has been demanded.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component mounting apparatus, an arrangement apparatus and an arrangement method of an underpin for a mounting board, in which underpins can be arranged by a simple and practical method.

[0005]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus for forming an electronic component mounting line for mounting an electronic component on a board, the electronic component mounting line comprising: A mounting board arrangement device for determining the arrangement of the support pins for supporting the mounting surface by specifying the position on the support jig corresponding to the supportable portion.

According to a second aspect of the present invention, in the mounting of the electronic component on the double-sided mounting board, the lower receiving pin arrangement device determines the arrangement of the lower receiving pins in the lower receiving jig for receiving the mounting surface. What is claimed is: 1. A receiving pin arranging device, comprising: a first position indicating means for indicating a lower supportable portion of an already mounted surface of an already mounted board; There is provided a second position indicator for indicating a position on the component, and a position correspondence unit for associating the index position by the first position indicator with the index position by the second position indicator.

According to a third aspect of the present invention, there is provided the underpinning device according to the second aspect, wherein the position indicating means is a laser pointer for irradiating a spot of a laser beam, and the position correspondence means. Are arranging means for arranging the mounted board and the lower receiving jig line-symmetrically, moving means for moving on the symmetrical line, a pinion provided on the moving means, and each of the pinions meshed with the pinion. And two rack members extended on the mounting board and the lower receiving jig.

According to a fourth aspect of the present invention, there is provided a method for arranging a lower support pin for mounting an electronic component on a double-sided mounting board, the lower mounting jig for determining the arrangement of lower support pins in a lower support jig for lowering an already mounted surface. A method of arranging receiving pins, in which a first position indicating means indicates a lower supportable portion of an already-mounted surface of an already-mounted board, and the index position is a second position index provided on a lower receiving jig. The index position of the means is made to correspond to the position corresponding means, and the support pin is attached to the index position of the second position index means.

According to a fifth aspect of the present invention, there is provided the lower pin arrangement method according to the fourth aspect, wherein the position indicating means is a laser pointer for irradiating a spot of a laser beam, and the position correspondence means. Means for arranging the mounting substrate and the lower receiving jig in line symmetry, moving means for moving on the line of symmetry, a pinion provided on the moving means, and each of the pinions meshing with the pinion. And two rack members extended on the mounting board and the lower receiving jig.

According to the present invention, the position on the lower receiving jig corresponding to the lower receiving portion of the lower receiving surface of the already mounted board on which the electronic component is mounted on one side is indicated by the position indicating means, thereby simplifying the operation. The arrangement of the support pins can be performed efficiently by a simple method.

[0011]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view of an electronic component mounting position of the electronic component mounting apparatus, and FIG. FIG. 4 is a plan view, FIG. 4 is a side view of an apparatus for arranging underpins for the mounting board, and FIGS. 5A, 5B, and 5C are process explanatory views of a method of arranging underpins for the mounting board. .

First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is provided at the center of a base 1. The transport path 2 transports the substrate 3 and positions the substrate 3 at the electronic component mounting position. An electronic component supply unit 4 is provided on the side of the transport path 2.
A large number of tape feeders 5 are arranged in the supply section 4. The tape feeder 5 supplies the electronic components to the pickup position.

A Y-axis table 8 is provided at both ends of the upper surface of the base 1.
A and the slide guide 8B are arranged in parallel,
An X-axis table 7 is installed on the Y-axis table 8A and the slide guide 8B. The transfer head 6 is mounted on the X-axis table 7. By driving the X-axis table 7 and the Y-axis table 8A, the transfer head 6 moves in the horizontal direction, picks up electronic components from the tape feeder 5 of the supply unit 4, and mounts them on the substrate 3.

Next, the structure of the electronic component mounting position provided at the center of the transport path 2 will be described with reference to FIG. In FIG. 2, a transport rail 2 a of the transport path 2 is erected on a base member 31 by a bracket 30.
The base member 31 is moved up and down by being guided by a slide guide 35 by driving a vertical movement mechanism including a feed screw 32 and a nut 33 provided on both side ends by a motor 34.

A lower receiving jig 13 is provided on the base member 31. The lower receiving jig 13 includes a feed screw 36, a nut 3
7. The guide shaft 39 is guided by a lifting mechanism including a motor 38 to move up and down. A large number of lower receiving pins 18 are vertically mounted on the lower receiving jig 13.
Reference numeral 8 denotes a transport rail 2a with the lower receiving jig 13 raised.
The lower surface of the double-sided mounting board positioned above, that is, the already mounted surface on which the electronic component P has already been mounted in the previous process is supported. These support pins 18 are selected and mounted so as not to cause positional interference with the electronic components on the mounted surface for each board type.

Referring again to FIG. 1, an arrangement device 10 for support pins for a mounting board is provided on the side of the electronic component mounting position. The arrangement device 10 is used to change the arrangement of the lower receiving pins 18 of the lower receiving jig 13 according to the type of the substrate when the type of the target substrate is changed when the double-sided mounting substrate is to be mounted. It is something that can be done. The arrangement device 10 is fixedly arranged at the above-mentioned position, or is mounted at the above-mentioned arrangement position each time it is used, and is detached when not in use.

Hereinafter, referring to FIGS. 3 and 4, the arrangement device 10 will be described.
Will be described. As shown in FIGS. 3 and 4, a pin hole 13 is provided on the lower receiving jig 13 for receiving a lower receiving pin 18 for supporting an already mounted substrate 3 'on which electronic components are mounted on one side.
a is provided in large numbers. In the operation of arranging the support pins, the pin holes 13a are selected so that the positions of the mounted support pins 18 do not interfere with the positions of the already mounted electronic components, and the support pins 18 directly support the substrate surface. Will be

A moving table 15 as moving means is disposed at a position parallel to the lower receiving jig 13, and at a position symmetrical to the lower receiving jig 13 with respect to the moving table 15,
A substrate mounting section 11 is provided. The actual mounted substrate is mounted on the substrate mounting unit 11 as a sample substrate with the mounted surface facing upward. At this time, the mounted board 3 ′ on which the electronic components P are mounted is arranged so as to be line-symmetric with respect to the lower receiving jig 13 with respect to the center line of the moving table 15. That is, the substrate mounting portion 11 is an arrangement means for arranging the already mounted substrate 3 ′ line-symmetrically with respect to the lower receiving jig 13.

A pin position arranging unit 14 is provided on a moving table 15 between the lower receiving jig 13 and the substrate placing portion 11. The pin position arrangement unit 14 includes two arms 17A and 17B that are slidably extended from the moving table 15 in both outward directions. As shown in FIG. 2, sliders 2 are provided on the side surfaces of two brackets 20 </ b> A and 20 </ b> B that are erected opposite to the movable part of the moving table 15.
1A and 21B are fixed, and slide rails 22A and 22B slidably fitted to the sliders 21A and 21B are fixed to plates 23A and 23B. Plate 23
A rack member 24A, 24B is provided on the opposite surface of A, 3B, and the rack members 24A, 24B are brackets 20A,
The pinion 25 rotatably supported by the pin 20B is interposed and engaged with the pinion 25 from both sides.

The pinion 25 is located on the center line CL of the moving table 15, and by moving the arm 17A on one side in the direction of the arrow, the arm 17B on the other side moves in the opposite direction symmetrically with respect to the center line CL. Make a move.
Laser pointers 26A and 26B are mounted on the side surfaces of the distal ends of the plates 23A and 23B at symmetrical positions with respect to the center point of the pinion 25. Laser pointer 26A,
Reference numeral 26B irradiates the spot of the laser beam downward, and indicates the irradiated point.

By irradiating the laser pointers 26A and 26B while moving the arms 17A and 17B, a symmetrical point on the lower receiving jig 13 with respect to the center line CL of an arbitrary point on the mounted board 3 'is obtained. Can be. That is, if the laser pointer 26 indicates a specific point on the mounted substrate 3 ', the laser pointer 26 on the lower receiving jig 13 indicates a symmetric point of the point with respect to the center line CL.

Next, a method of arranging the support pins will be described with reference to FIG. As shown in FIG. 5A, a mounted substrate 3 ′ as a sample substrate is mounted on the substrate mounting portion 11. Next, the laser pointer 26A is irradiated and the arm 17 is irradiated.
By manually moving A in the horizontal direction, a position other than the electronic component P, that is, a part capable of receiving the lower part is indicated by the laser spot. That is, the laser pointer 26A
Is the first position indicator.

As a result, the laser pointer 26B located on the lower receiving jig 13 indicates the position corresponding to the above-mentioned lower receiving enabled portion by the laser spot. That is, the laser pointer 26B serves as a second position indicator. As described above, the two laser pointers 26A, 26
B is connected to the rack members 24A and 24B via the pinion 25 and is always at a position symmetrical with respect to the center line CL. Therefore, the substrate placing section 11 and the moving table 1
The rack member 24 and the pinion 25 serve as position correspondence means for causing the index positions of the two laser pointers 26A and 26B to correspond to each other.

In this way, the lower receiving portion is determined on the already mounted board 3 ', and the corresponding pin hole 13a on the lower receiving jig 13 is specified. When this operation is performed, on the contrary, the pin hole 13a on the lower receiving jig 13 is indexed by the laser pointer 26B, and whether or not the electronic component exists at a point on the mounted board 3 'corresponding to the pin hole 13a is determined. May be checked.

When the required lower receiving position is obtained in this way, as shown in FIG.
The lower support pin 18 is mounted on the lower case. Next, as shown in FIG. 5C, the mounted substrate 3 'is placed on the lower receiving jig 13 with the mounted surface facing downward. At this time, since the arrangement of the support pins 18 is correctly determined corresponding to a portion of the mounted board 3 'where the electronic components P are not present, interference between the positions of the support pins 18 and the electronic components P may occur. In addition, there is no need for rework for position correction, which has been frequently performed in the past. Therefore, the efficiency of the pin arrangement work can be significantly improved as compared with the conventional pin position determination method by trial.

In this embodiment, the combination of the rack member and the pinion is used as the position correspondence means.
Alternatively, a method of numerically detecting the plane coordinates and performing an operation following the position index means on the opposite side may be used. Further, in the present embodiment, the arrangement device 10 is arranged on the side of the transport path 2 and the operation of directly selecting the position of the support pin at the electronic component mounting position is performed. It is also possible to arrange the arrangement device 10 at a location and arrange the support pins in an offline operation. Further, in the present embodiment, the lower supportable position is indexed by the laser pointer, but the member corresponding to the lower support pin is moved up and down to contact the substrate or the electronic component,
The presence / absence of a component may be checked and indexed.

Further, in the present embodiment, an example of an electronic component mounting apparatus on which electronic components are mounted is shown as an electronic component mounting apparatus, but the present invention is not limited to this. The present invention can be applied to any device that can be used for mounting an electronic component on another surface and then performing a mounting operation again on another surface.

[0028]

According to the present invention, the position on the lower receiving jig corresponding to the lower receiving possible portion of the already-mounted surface of the already-mounted substrate on which the electronic component is mounted on one side is indicated by the position indicating means. Therefore, the mounting pins for the mounting board can be efficiently arranged by a simple method.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of an electronic component mounting position of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 3 is a plan view of an arrangement device for support pins for a mounting board according to an embodiment of the present invention;

FIG. 4 is a side view of an apparatus for arranging support pins for a mounting board according to an embodiment of the present invention;

FIG. 5 (a) is an explanatory view of a step of a method of arranging underpins for a mounting board according to one embodiment of the present invention; and (b) a step of an arranging method of underpins of a mounting board according to one embodiment of the present invention. Explanatory drawing (c) Process explanatory drawing of the method of arranging the support pins for the mounting board according to one embodiment of the present invention

[Explanation of symbols]

 Reference Signs List 3 board 3 'mounted board 10 arraying device 11 board mounting part 13 lower receiving jig 15 moving table 17A, 17B arm 18 lower receiving pin 24A, 24B rack member 25 pinion 26A, 26B laser pointer

 ──────────────────────────────────────────────────の Continuing on the front page (72) Kunihiko Tokita 1006 Kadoma Kadoma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Yuji Otake 1006 Kadoma Kadoma, Kadoma City, Osaka Pref. Terms (reference) 5E313 AA01 AA11 AA15 CC03 CC04 DD05 DD13 DD31 EE24 FF11 FF24 FF28 FF31

Claims (5)

[Claims] 1. An electronic component mounting apparatus constituting an electronic component mounting line for mounting an electronic component on a board, wherein a position on a lower receiving jig corresponding to a lower supportable portion of an already mounted surface of the already mounted substrate. An electronic component mounting device, comprising: an arrangement device for an underpin for a mounting board for determining an arrangement of underpins for receiving the mounting surface by specifying the following. 2. An apparatus for arranging underpins for a mounting board for determining an arrangement of underpins in an underpinning jig for underpinning an already mounted surface in mounting an electronic component on a double-sided mounting board. A first position indicating means for indicating a lower supportable portion of the already mounted surface of the mounting board, and a second position indicating means for indicating a position on a lower receiving jig to which a lower receiving pin for receiving the already mounted surface is mounted. An arrangement device for a mounting pin for a mounting board, comprising: a position indexing means; and a position correspondence means for associating an index position by the first position indexing means with an indexing position by the second position indexing means. 3. The position indicating means is a laser pointer for irradiating a spot of a laser beam, and the position corresponding means is:
Arranging means for arranging the mounted board and the lower receiving jig in line symmetry, moving means for moving on the symmetrical line, a pinion provided in the moving means, and each of the mounted boards meshing with the pinion; 3. The arrangement device for lower support pins for a mounting board according to claim 2, further comprising two rack members extended on the upper and lower support jigs. 4. A method of arranging underpins for a mounting board for deciding an arrangement of underpins in an underpinning jig for underpinning an already mounted surface in mounting an electronic component on a double-sided mounting board. The first place where the lower surface of the mounting surface of the mounting board can be
Of the second position index means provided on the lower receiving jig by the position corresponding means, and the index position of the second position index means is lowered by the position index means. A method of arranging lower receiving pins for a mounting board, wherein the receiving pins are mounted. 5. The position indicating means is a laser pointer for irradiating a spot of a laser beam, and the position corresponding means is:
Arranging means for arranging the mounting board and the lower receiving jig line-symmetrically, moving means for moving on the symmetrical line, a pinion provided on the moving means, and each of the mounted boards meshing with the pinion; 5. The method according to claim 4, further comprising two rack members extended on the upper and lower receiving jigs.