JP6210679B2 - 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム - Google Patents

半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム Download PDF

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JP6210679B2
JP6210679B2 JP2012271703A JP2012271703A JP6210679B2 JP 6210679 B2 JP6210679 B2 JP 6210679B2 JP 2012271703 A JP2012271703 A JP 2012271703A JP 2012271703 A JP2012271703 A JP 2012271703A JP 6210679 B2 JP6210679 B2 JP 6210679B2
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support member
ultrasonic
semiconductor device
connection structure
device connection
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JP2012271703A
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Japanese (ja)
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JP2014116904A5 (enExample
JP2014116904A (ja
Inventor
淳也 山田
淳也 山田
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Olympus Corp
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Olympus Corp
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Priority to JP2012271703A priority Critical patent/JP6210679B2/ja
Priority to CN201380064710.4A priority patent/CN104838671A/zh
Priority to PCT/JP2013/082506 priority patent/WO2014091970A1/ja
Priority to EP13861652.9A priority patent/EP2934024A4/en
Publication of JP2014116904A publication Critical patent/JP2014116904A/ja
Priority to US14/738,334 priority patent/US9997449B2/en
Publication of JP2014116904A5 publication Critical patent/JP2014116904A5/ja
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A61B8/445—Details of catheter construction
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Animal Behavior & Ethology (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • General Health & Medical Sciences (AREA)
  • Surgery (AREA)
  • Molecular Biology (AREA)
  • Medical Informatics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biomedical Technology (AREA)
  • Gynecology & Obstetrics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Geometry (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Endoscopes (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Transducers For Ultrasonic Waves (AREA)
JP2012271703A 2012-12-12 2012-12-12 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム Active JP6210679B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012271703A JP6210679B2 (ja) 2012-12-12 2012-12-12 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム
CN201380064710.4A CN104838671A (zh) 2012-12-12 2013-12-03 半导体器件连接构造、超声波模块以及搭载有超声波模块的超声波内视镜系统
PCT/JP2013/082506 WO2014091970A1 (ja) 2012-12-12 2013-12-03 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム
EP13861652.9A EP2934024A4 (en) 2012-12-12 2013-12-03 CONNECTING STRUCTURE FOR A SEMICONDUCTOR COMPONENT, ULTRASOUND MODULE AND ULTRASONIC DOCKING SYSTEM WITH THE BUILT-IN ULTRASOUND MODULE
US14/738,334 US9997449B2 (en) 2012-12-12 2015-06-12 Semiconductor device connection structure, ultrasonic module, and ultrasonic endoscope system having ultrasonic module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012271703A JP6210679B2 (ja) 2012-12-12 2012-12-12 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム

Publications (3)

Publication Number Publication Date
JP2014116904A JP2014116904A (ja) 2014-06-26
JP2014116904A5 JP2014116904A5 (enExample) 2016-02-04
JP6210679B2 true JP6210679B2 (ja) 2017-10-11

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JP2012271703A Active JP6210679B2 (ja) 2012-12-12 2012-12-12 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム

Country Status (5)

Country Link
US (1) US9997449B2 (enExample)
EP (1) EP2934024A4 (enExample)
JP (1) JP6210679B2 (enExample)
CN (1) CN104838671A (enExample)
WO (1) WO2014091970A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016208631A1 (ja) * 2015-06-23 2016-12-29 オリンパス株式会社 超音波振動子および超音波プローブ
KR102666748B1 (ko) * 2015-11-25 2024-05-16 후지필름 소노사이트, 인크. 고주파 초음파 트랜스듀서 어레이를 포함하는 의료 기기
JP6581302B2 (ja) * 2016-05-20 2019-09-25 オリンパス株式会社 超音波振動子モジュールおよび超音波内視鏡
CN110915076B (zh) * 2017-06-21 2021-11-16 阿尔卑斯阿尔派株式会社 旋转连接器
WO2022208807A1 (ja) * 2021-03-31 2022-10-06 オリンパス株式会社 超音波振動子アレイ、内視鏡および超音波振動子アレイの製造方法

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
US4385255A (en) * 1979-11-02 1983-05-24 Yokogawa Electric Works, Ltd. Linear array ultrasonic transducer
CA2139151A1 (en) * 1994-01-14 1995-07-15 Amin M. Hanafy Two-dimensional acoustic array and method for the manufacture thereof
JP3628048B2 (ja) * 1994-09-08 2005-03-09 株式会社日立メディコ 超音波探触子
US5810009A (en) * 1994-09-27 1998-09-22 Kabushiki Kaisha Toshiba Ultrasonic probe, ultrasonic probe device having the ultrasonic probe, and method of manufacturing the ultrasonic probe
JPH10201759A (ja) * 1997-01-21 1998-08-04 Olympus Optical Co Ltd 超音波プローブ
NL1014175C2 (nl) * 2000-01-25 2001-07-26 Oldelft B V Ultrageluid probe.
JP4100965B2 (ja) 2001-06-13 2008-06-11 キヤノン株式会社 半導体装置の製造方法
US6788620B2 (en) * 2002-05-15 2004-09-07 Matsushita Electric Industrial Co Ltd Acoustic matching member, ultrasound transducer, ultrasonic flowmeter and method for manufacturing the same
US6994674B2 (en) * 2002-06-27 2006-02-07 Siemens Medical Solutions Usa, Inc. Multi-dimensional transducer arrays and method of manufacture
JP2004363746A (ja) * 2003-06-03 2004-12-24 Fuji Photo Film Co Ltd 超音波用探触子及びその製造方法
US20050225210A1 (en) * 2004-04-01 2005-10-13 Siemens Medical Solutions Usa, Inc. Z-axis electrical connection and methods for ultrasound transducers
US20070187844A1 (en) * 2006-02-10 2007-08-16 Wintec Industries, Inc. Electronic assembly with detachable components
US7449821B2 (en) * 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
JP2007068918A (ja) * 2005-09-09 2007-03-22 Fujifilm Corp 超音波プローブ、および超音波診断装置
JP4669449B2 (ja) * 2006-07-18 2011-04-13 アロカ株式会社 超音波探触子及びその製造方法
JP2009188802A (ja) 2008-02-07 2009-08-20 Olympus Corp 撮像モジュール
JP2010022931A (ja) * 2008-07-18 2010-02-04 Fujifilm Corp 接着剤はみ出し防止構造を有する超音波探触子
JP5355452B2 (ja) * 2010-03-02 2013-11-27 富士フイルム株式会社 超音波診断装置
JP5611645B2 (ja) * 2010-04-13 2014-10-22 株式会社東芝 超音波トランスデューサおよび超音波プローブ
JP6205704B2 (ja) * 2012-10-25 2017-10-04 セイコーエプソン株式会社 超音波測定装置、ヘッドユニット、プローブ及び診断装置
CN106105407A (zh) * 2014-03-20 2016-11-09 奥林巴斯株式会社 缆线连接构造和内窥镜装置

Also Published As

Publication number Publication date
US9997449B2 (en) 2018-06-12
EP2934024A1 (en) 2015-10-21
WO2014091970A1 (ja) 2014-06-19
US20150279764A1 (en) 2015-10-01
EP2934024A4 (en) 2016-08-03
CN104838671A (zh) 2015-08-12
JP2014116904A (ja) 2014-06-26

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