JP6209387B2 - 車両用灯具 - Google Patents

車両用灯具 Download PDF

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Publication number
JP6209387B2
JP6209387B2 JP2013161580A JP2013161580A JP6209387B2 JP 6209387 B2 JP6209387 B2 JP 6209387B2 JP 2013161580 A JP2013161580 A JP 2013161580A JP 2013161580 A JP2013161580 A JP 2013161580A JP 6209387 B2 JP6209387 B2 JP 6209387B2
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JP
Japan
Prior art keywords
light emitting
emitting element
circuit board
terminal
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013161580A
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English (en)
Japanese (ja)
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JP2015032472A5 (cg-RX-API-DMAC7.html
JP2015032472A (ja
Inventor
雄治 安田
雄治 安田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Priority to JP2013161580A priority Critical patent/JP6209387B2/ja
Priority to DE102014215063.9A priority patent/DE102014215063B4/de
Priority to CN201410376817.9A priority patent/CN104344310B/zh
Priority to US14/450,013 priority patent/US9546769B2/en
Priority to FR1457543A priority patent/FR3009365B1/fr
Publication of JP2015032472A publication Critical patent/JP2015032472A/ja
Publication of JP2015032472A5 publication Critical patent/JP2015032472A5/ja
Application granted granted Critical
Publication of JP6209387B2 publication Critical patent/JP6209387B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/321—Optical layout thereof the reflector being a surface of revolution or a planar surface, e.g. truncated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/39—Attachment thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
JP2013161580A 2013-08-02 2013-08-02 車両用灯具 Active JP6209387B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013161580A JP6209387B2 (ja) 2013-08-02 2013-08-02 車両用灯具
DE102014215063.9A DE102014215063B4 (de) 2013-08-02 2014-07-31 Fahrzeugleuchte mit einem Lichtemissionselement mit zwei Leiterplatinen und einem Reflektor auf einer Schaltkreisstruktur
CN201410376817.9A CN104344310B (zh) 2013-08-02 2014-08-01 车辆用灯具
US14/450,013 US9546769B2 (en) 2013-08-02 2014-08-01 Vehicular lamp
FR1457543A FR3009365B1 (fr) 2013-08-02 2014-08-01 Lampe de vehicule

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013161580A JP6209387B2 (ja) 2013-08-02 2013-08-02 車両用灯具

Publications (3)

Publication Number Publication Date
JP2015032472A JP2015032472A (ja) 2015-02-16
JP2015032472A5 JP2015032472A5 (cg-RX-API-DMAC7.html) 2016-09-15
JP6209387B2 true JP6209387B2 (ja) 2017-10-04

Family

ID=52342155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013161580A Active JP6209387B2 (ja) 2013-08-02 2013-08-02 車両用灯具

Country Status (5)

Country Link
US (1) US9546769B2 (cg-RX-API-DMAC7.html)
JP (1) JP6209387B2 (cg-RX-API-DMAC7.html)
CN (1) CN104344310B (cg-RX-API-DMAC7.html)
DE (1) DE102014215063B4 (cg-RX-API-DMAC7.html)
FR (1) FR3009365B1 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX384352B (es) 2014-09-24 2025-03-11 Truck Lite Co Llc Faro delantero con subconjunto de lente reflector.
US10663139B2 (en) * 2015-09-14 2020-05-26 Koito Manufacturing Co., Ltd. Vehicular lamp
EP4257877A4 (en) * 2020-12-04 2024-12-25 Koito Manufacturing Co., Ltd. LIGHT SOURCE UNIT

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124508A (ja) * 1998-10-16 2000-04-28 Rohm Co Ltd 発光装置
JP4611721B2 (ja) * 2004-11-25 2011-01-12 株式会社小糸製作所 発光デバイス及び車両用灯具
US7705365B2 (en) * 2006-01-24 2010-04-27 Denso Corporation Lighting device and light emitting module for the same
JP4535453B2 (ja) * 2006-03-06 2010-09-01 株式会社小糸製作所 光源モジュール及び車輌用灯具
US20090059594A1 (en) * 2007-08-31 2009-03-05 Ming-Feng Lin Heat dissipating apparatus for automotive LED lamp
JP4523030B2 (ja) * 2007-12-28 2010-08-11 株式会社小糸製作所 車両用灯具
JP2009245643A (ja) * 2008-03-28 2009-10-22 Sharp Corp 照明装置
JP5231194B2 (ja) 2008-12-17 2013-07-10 株式会社小糸製作所 車両用灯具
JP2011081967A (ja) * 2009-10-05 2011-04-21 Koito Mfg Co Ltd 車両用前照灯
US8482015B2 (en) * 2009-12-03 2013-07-09 Toyoda Gosei Co., Ltd. LED light emitting apparatus and vehicle headlamp using the same
KR101761385B1 (ko) * 2010-07-12 2017-08-04 엘지이노텍 주식회사 발광 소자
JP5101715B2 (ja) * 2011-05-27 2012-12-19 株式会社三共 スロットマシン
CN202352720U (zh) * 2011-10-21 2012-07-25 西安重装渭南光电科技有限公司 白光led外延芯片封装结构
CN202564428U (zh) * 2012-03-31 2012-11-28 泉州市博泰半导体科技有限公司 半导体发光器件

Also Published As

Publication number Publication date
DE102014215063A1 (de) 2015-02-05
DE102014215063B4 (de) 2019-08-29
FR3009365B1 (fr) 2019-07-12
US20150036374A1 (en) 2015-02-05
CN104344310A (zh) 2015-02-11
CN104344310B (zh) 2017-09-01
FR3009365A1 (fr) 2015-02-06
JP2015032472A (ja) 2015-02-16
US9546769B2 (en) 2017-01-17

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