CN104344310B - 车辆用灯具 - Google Patents

车辆用灯具 Download PDF

Info

Publication number
CN104344310B
CN104344310B CN201410376817.9A CN201410376817A CN104344310B CN 104344310 B CN104344310 B CN 104344310B CN 201410376817 A CN201410376817 A CN 201410376817A CN 104344310 B CN104344310 B CN 104344310B
Authority
CN
China
Prior art keywords
light emitting
emitting element
light
terminal
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410376817.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN104344310A (zh
Inventor
安田雄治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Publication of CN104344310A publication Critical patent/CN104344310A/zh
Application granted granted Critical
Publication of CN104344310B publication Critical patent/CN104344310B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/321—Optical layout thereof the reflector being a surface of revolution or a planar surface, e.g. truncated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/39—Attachment thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CN201410376817.9A 2013-08-02 2014-08-01 车辆用灯具 Active CN104344310B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-161580 2013-08-02
JP2013161580A JP6209387B2 (ja) 2013-08-02 2013-08-02 車両用灯具

Publications (2)

Publication Number Publication Date
CN104344310A CN104344310A (zh) 2015-02-11
CN104344310B true CN104344310B (zh) 2017-09-01

Family

ID=52342155

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410376817.9A Active CN104344310B (zh) 2013-08-02 2014-08-01 车辆用灯具

Country Status (5)

Country Link
US (1) US9546769B2 (cg-RX-API-DMAC7.html)
JP (1) JP6209387B2 (cg-RX-API-DMAC7.html)
CN (1) CN104344310B (cg-RX-API-DMAC7.html)
DE (1) DE102014215063B4 (cg-RX-API-DMAC7.html)
FR (1) FR3009365B1 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX384352B (es) 2014-09-24 2025-03-11 Truck Lite Co Llc Faro delantero con subconjunto de lente reflector.
US10663139B2 (en) * 2015-09-14 2020-05-26 Koito Manufacturing Co., Ltd. Vehicular lamp
EP4257877A4 (en) * 2020-12-04 2024-12-25 Koito Manufacturing Co., Ltd. LIGHT SOURCE UNIT

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124508A (ja) * 1998-10-16 2000-04-28 Rohm Co Ltd 発光装置
JP4611721B2 (ja) * 2004-11-25 2011-01-12 株式会社小糸製作所 発光デバイス及び車両用灯具
US7705365B2 (en) * 2006-01-24 2010-04-27 Denso Corporation Lighting device and light emitting module for the same
JP4535453B2 (ja) * 2006-03-06 2010-09-01 株式会社小糸製作所 光源モジュール及び車輌用灯具
US20090059594A1 (en) * 2007-08-31 2009-03-05 Ming-Feng Lin Heat dissipating apparatus for automotive LED lamp
JP4523030B2 (ja) * 2007-12-28 2010-08-11 株式会社小糸製作所 車両用灯具
JP2009245643A (ja) * 2008-03-28 2009-10-22 Sharp Corp 照明装置
JP5231194B2 (ja) 2008-12-17 2013-07-10 株式会社小糸製作所 車両用灯具
JP2011081967A (ja) * 2009-10-05 2011-04-21 Koito Mfg Co Ltd 車両用前照灯
US8482015B2 (en) * 2009-12-03 2013-07-09 Toyoda Gosei Co., Ltd. LED light emitting apparatus and vehicle headlamp using the same
KR101761385B1 (ko) * 2010-07-12 2017-08-04 엘지이노텍 주식회사 발광 소자
JP5101715B2 (ja) * 2011-05-27 2012-12-19 株式会社三共 スロットマシン
CN202352720U (zh) * 2011-10-21 2012-07-25 西安重装渭南光电科技有限公司 白光led外延芯片封装结构
CN202564428U (zh) * 2012-03-31 2012-11-28 泉州市博泰半导体科技有限公司 半导体发光器件

Also Published As

Publication number Publication date
DE102014215063A1 (de) 2015-02-05
DE102014215063B4 (de) 2019-08-29
FR3009365B1 (fr) 2019-07-12
US20150036374A1 (en) 2015-02-05
CN104344310A (zh) 2015-02-11
JP6209387B2 (ja) 2017-10-04
FR3009365A1 (fr) 2015-02-06
JP2015032472A (ja) 2015-02-16
US9546769B2 (en) 2017-01-17

Similar Documents

Publication Publication Date Title
CN101852417B (zh) 发光元件模块化构件和灯具单元
CN103415738B (zh) 光源模块
CN101566301B (zh) 车辆用灯具
US9335022B2 (en) Automotive lamp module comprising laser diode and heat sinks
CN102016396A (zh) 光源模块以及车辆用灯具
CN102563481A (zh) 车辆用灯具的半导体型光源的光源单元、车辆用灯具
JP6179070B2 (ja) 車両用灯具
KR101533709B1 (ko) 차량용 led 램프 모듈
JP7470118B2 (ja) 発光モジュールおよび車両用灯具
JP2017112147A (ja) 発光モジュール、灯具および発光素子用回路基板
CN104344310B (zh) 车辆用灯具
CN104011884B (zh) 发光模块及车辆用灯具
JP5803811B2 (ja) 車両用前照灯
US8917749B2 (en) Laser diode mounting substrate for automotive lamp module
JP6074742B2 (ja) 光源ユニット及びこれを用いた車両用前照灯
CN109945128B (zh) 车辆用灯具用光源单元以及车辆用灯具
JP2019169358A (ja) 車両用灯具
CN109424907A (zh) 发光装置以及移动体
JP6251991B2 (ja) 車両用灯具の半導体型光源、車両用灯具
JP6981832B2 (ja) 車両用灯具
CN114517905B (zh) 车辆用灯具用光源单元和车辆用灯具
JP6243222B2 (ja) 車両用ランプ
JP6169455B2 (ja) 光源モジュールを用いた車両用灯具
JP2015179641A (ja) 車両用灯具
JP6442871B2 (ja) 車両用灯具

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant