JP6202202B2 - 圧電薄膜、圧電薄膜素子及びターゲット並びに圧電薄膜及び圧電薄膜素子の製造方法 - Google Patents
圧電薄膜、圧電薄膜素子及びターゲット並びに圧電薄膜及び圧電薄膜素子の製造方法 Download PDFInfo
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- 239000010409 thin film Substances 0.000 title claims description 153
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000203 mixture Substances 0.000 claims description 23
- 238000004544 sputter deposition Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 13
- 238000001312 dry etching Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000010408 film Substances 0.000 description 30
- 239000011734 sodium Substances 0.000 description 26
- 239000010410 layer Substances 0.000 description 19
- 239000000463 material Substances 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 9
- 239000013078 crystal Substances 0.000 description 9
- 229910004298 SiO 2 Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000005684 electric field Effects 0.000 description 6
- 238000001228 spectrum Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 241000877463 Lanio Species 0.000 description 1
- 229910004121 SrRuO Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical class [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- RLUCXJBHKHIDSP-UHFFFAOYSA-N propane-1,2-diol;propanoic acid Chemical compound CCC(O)=O.CC(O)CO RLUCXJBHKHIDSP-UHFFFAOYSA-N 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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Description
図1は、本発明の一実施形態に係る圧電薄膜素子の模式的正面断面図である。圧電薄膜素子1は、基板2を備える。基板2はSiにより形成されている。もっとも、基板2は、ガラスやSOI、その他の半導体材料や単結晶材料、ステンレスやチタンなどの金属材料により形成されていてもよい。
上述したように、本発明に係る圧電薄膜は、一般式:(1−n)(K1−xNax)mNbO3−nCaTiO3で表される組成物(KNN−CT)を含んでいる。上記一般式におけるm、n及びxは、0.87≦m≦0.97、0≦n≦0.065及び0≦x≦1の範囲にある。
n=Ca/Nb ・・・式(2)
x=Na/(K+Na) ・・・式(3)
圧電薄膜3は、本発明に係るターゲットを用いて製造される。本発明に係るターゲットは、一般式:(1−n)(K1−xNax)mNbO3−nCaTiO3で表される組成物を含む。本発明において、上記一般式におけるm、n及びxは、1≦m≦1.05、0≦n≦0.065及び0≦x≦1の範囲にある。
圧電薄膜素子1の製造方法では、まず基板2上にSiO2膜6を形成する。しかる後、SiO2膜6上に第1の密着層7及び第1の電極4をこの順に積層する。
2…基板
3…圧電薄膜
4,5…第1,第2の電極
6…SiO2膜
7,8…第1,第2の密着層
Claims (15)
- 一般式:(1−n)(K1−xNax)mNbO3−nCaTiO3で表される組成物を含む圧電薄膜であって、
前記一般式におけるm、n及びxが、0.87≦m≦0.97、0.005≦n≦0.065及び0≦x≦1の範囲にある、圧電薄膜。 - 前記一般式におけるxが、0.52≦x≦1の範囲にある、請求項1に記載の圧電薄膜。
- 前記一般式におけるxが、0.52≦x≦0.74の範囲にある、請求項2に記載の圧電薄膜。
- 前記一般式におけるxが、0.61≦x≦0.74の範囲にある、請求項3に記載の圧電薄膜。
- 前記一般式におけるnが、0.011≦n≦0.059の範囲にある、請求項3に記載の圧電薄膜。
- さらにMnを含む、請求項1〜5のいずれか1項に記載の圧電薄膜。
- 前記一般式:(1−n)(K1−xNax)mNbO3−nCaTiO3で表される組成物100モルに対する前記Mnの含有量が、0.1モルより大きく、10モル以下である、請求項6に記載の圧電薄膜。
- 基板と、
前記基板上に設けられた、請求項1〜7のいずれか1項に記載の圧電薄膜と、
前記圧電薄膜を挟むように設けられた第1,第2の電極とを備える、圧電薄膜素子。 - 一般式:(1−n)(K1−xNax)mNbO3−nCaTiO3で表される組成物を含むターゲットであって、
前記一般式におけるm、n及びxが、1≦m≦1.05、0.005≦n≦0.065及び0.43≦x≦0.74の範囲にある、ターゲット。 - 前記一般式におけるn及びxが、0.011≦n≦0.059及び0.52≦x≦0.74の範囲にある、請求項9に記載のターゲット。
- 請求項9または10に記載のターゲットを用い、スパッタリングすることにより圧電薄膜を得る、圧電薄膜の製造方法。
- 請求項9〜11のいずれか1項に記載のターゲットを用い、スパッタリングすることにより圧電薄膜を得る工程と、
前記圧電薄膜上に第1の電極を形成する工程と、
前記第1の電極とともに前記圧電薄膜を挟み込むように、第2の電極を形成する工程とを備える、圧電薄膜素子の製造方法。 - 前記圧電薄膜上に樹脂レジストを用いてマスク層を形成する工程と、
前記マスク層を介して、前記圧電薄膜をドライエッチングする工程とをさらに備える、請求項12に記載の圧電薄膜素子の製造方法。 - 請求項9〜11のいずれか1項に記載のターゲットを用いてスパッタリングするに際し、さらにMnを含むターゲットを用いてスパッタリングすることにより圧電薄膜を得る、請求項12又は13に記載の圧電薄膜素子の製造方法。
- 請求項9〜11のいずれか1項に記載のターゲットが、さらにMnを含む、請求項12又は13に記載の圧電薄膜素子の製造方法。
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