JP6198837B2 - パターニングデバイス操作システム及びリソグラフィ装置 - Google Patents

パターニングデバイス操作システム及びリソグラフィ装置 Download PDF

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Publication number
JP6198837B2
JP6198837B2 JP2015537177A JP2015537177A JP6198837B2 JP 6198837 B2 JP6198837 B2 JP 6198837B2 JP 2015537177 A JP2015537177 A JP 2015537177A JP 2015537177 A JP2015537177 A JP 2015537177A JP 6198837 B2 JP6198837 B2 JP 6198837B2
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JP
Japan
Prior art keywords
actuator
patterning device
plane
bending moment
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015537177A
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English (en)
Japanese (ja)
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JP2015537239A (ja
JP2015537239A5 (enExample
Inventor
ヴァレンティン，クリスティアーン
ループストラ，エリック
ワード，クリストファー
バーバンク，ダニエル
シュスター，マーク
グラフェオ，ピーター
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Holding NV
ASML Netherlands BV
Original Assignee
ASML Holding NV
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Holding NV, ASML Netherlands BV filed Critical ASML Holding NV
Publication of JP2015537239A publication Critical patent/JP2015537239A/ja
Publication of JP2015537239A5 publication Critical patent/JP2015537239A5/ja
Application granted granted Critical
Publication of JP6198837B2 publication Critical patent/JP6198837B2/ja
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Optics & Photonics (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2015537177A 2012-10-23 2013-09-20 パターニングデバイス操作システム及びリソグラフィ装置 Expired - Fee Related JP6198837B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261717208P 2012-10-23 2012-10-23
US61/717,208 2012-10-23
PCT/EP2013/069547 WO2014063871A1 (en) 2012-10-23 2013-09-20 Patterning device manipulating system and lithographic apparatuses

Publications (3)

Publication Number Publication Date
JP2015537239A JP2015537239A (ja) 2015-12-24
JP2015537239A5 JP2015537239A5 (enExample) 2016-06-16
JP6198837B2 true JP6198837B2 (ja) 2017-09-20

Family

ID=49237199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015537177A Expired - Fee Related JP6198837B2 (ja) 2012-10-23 2013-09-20 パターニングデバイス操作システム及びリソグラフィ装置

Country Status (4)

Country Link
US (1) US9910368B2 (enExample)
JP (1) JP6198837B2 (enExample)
KR (1) KR101670314B1 (enExample)
WO (1) WO2014063871A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160099737A (ko) 2012-08-29 2016-08-22 에이에스엠엘 홀딩 엔.브이. 실시간 레티클 만곡 감지
US10289007B2 (en) * 2014-07-10 2019-05-14 Nikon Corporation Lithography tool having a reticle stage capable of dynamic reticle bending to compensate for distortion
JP6656267B2 (ja) 2015-06-22 2020-03-04 エーエスエムエル ネザーランズ ビー．ブイ． 基板サポート、基板の上面の非平坦性を補償する方法、リソグラフィ装置及びデバイス製造方法
KR102653016B1 (ko) * 2018-09-18 2024-03-29 삼성전자주식회사 척 구동 장치 및 기판 처리 장치
JP7271978B2 (ja) * 2019-02-05 2023-05-12 株式会社ニューフレアテクノロジー ステージ装置及び荷電粒子ビーム処理装置
CN121039573A (zh) * 2023-04-10 2025-11-28 Asml荷兰有限公司 用于在光刻设备中夹持图案化装置的系统和方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3271760B2 (ja) * 1999-03-31 2002-04-08 株式会社ニコン 走査露光方法、走査型露光装置、及び前記方法を用いるデバイス製造方法
JP3626888B2 (ja) 1999-10-08 2005-03-09 日立ハイテク電子エンジニアリング株式会社 基板露光装置におけるマスク撓み補正機構及びマスク撓み補正方法並びにパターン形成方法
US7675607B2 (en) 2006-07-14 2010-03-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7675201B2 (en) * 2006-07-25 2010-03-09 Asml Netherlands B.V. Lithographic apparatus with planar motor driven support
NL1036511A1 (nl) 2008-02-13 2009-08-14 Asml Netherlands Bv Movable support, position control system, lithographic apparatus and method of controlling a position of an exchangeable object.
US8553207B2 (en) * 2008-12-31 2013-10-08 Asml Holdings N.V. Optically compensated unidirectional reticle bender
NL2006190A (en) 2010-03-11 2011-09-13 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US9946168B2 (en) 2012-04-27 2018-04-17 Asml Netherlands B.V. Lithographic apparatus

Also Published As

Publication number Publication date
JP2015537239A (ja) 2015-12-24
WO2014063871A1 (en) 2014-05-01
KR101670314B1 (ko) 2016-11-09
US9910368B2 (en) 2018-03-06
US20150277241A1 (en) 2015-10-01
KR20150079785A (ko) 2015-07-08

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