KR101670314B1 - 패터닝 디바이스 조작 시스템 및 리소그래피 장치 - Google Patents

패터닝 디바이스 조작 시스템 및 리소그래피 장치 Download PDF

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Publication number
KR101670314B1
KR101670314B1 KR1020157013660A KR20157013660A KR101670314B1 KR 101670314 B1 KR101670314 B1 KR 101670314B1 KR 1020157013660 A KR1020157013660 A KR 1020157013660A KR 20157013660 A KR20157013660 A KR 20157013660A KR 101670314 B1 KR101670314 B1 KR 101670314B1
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South Korea
Prior art keywords
actuator
plane
patterning device
holder
force
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Expired - Fee Related
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KR1020157013660A
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English (en)
Korean (ko)
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KR20150079785A (ko
Inventor
크리스티안 발렌틴
에릭 루프스트라
크리스토퍼 워드
대니얼 버뱅크
마크 슈스터
피터 그라페오
Original Assignee
에이에스엠엘 네델란즈 비.브이.
에이에스엠엘 홀딩 엔.브이.
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Publication of KR20150079785A publication Critical patent/KR20150079785A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G03F7/70266—Adaptive optics, e.g. deformable optical elements for wavefront control, e.g. for aberration adjustment or correction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Optics & Photonics (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
KR1020157013660A 2012-10-23 2013-09-20 패터닝 디바이스 조작 시스템 및 리소그래피 장치 Expired - Fee Related KR101670314B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261717208P 2012-10-23 2012-10-23
US61/717,208 2012-10-23
PCT/EP2013/069547 WO2014063871A1 (en) 2012-10-23 2013-09-20 Patterning device manipulating system and lithographic apparatuses

Publications (2)

Publication Number Publication Date
KR20150079785A KR20150079785A (ko) 2015-07-08
KR101670314B1 true KR101670314B1 (ko) 2016-11-09

Family

ID=49237199

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157013660A Expired - Fee Related KR101670314B1 (ko) 2012-10-23 2013-09-20 패터닝 디바이스 조작 시스템 및 리소그래피 장치

Country Status (4)

Country Link
US (1) US9910368B2 (enExample)
JP (1) JP6198837B2 (enExample)
KR (1) KR101670314B1 (enExample)
WO (1) WO2014063871A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160099737A (ko) 2012-08-29 2016-08-22 에이에스엠엘 홀딩 엔.브이. 실시간 레티클 만곡 감지
US10289007B2 (en) * 2014-07-10 2019-05-14 Nikon Corporation Lithography tool having a reticle stage capable of dynamic reticle bending to compensate for distortion
JP6656267B2 (ja) 2015-06-22 2020-03-04 エーエスエムエル ネザーランズ ビー．ブイ． 基板サポート、基板の上面の非平坦性を補償する方法、リソグラフィ装置及びデバイス製造方法
KR102653016B1 (ko) * 2018-09-18 2024-03-29 삼성전자주식회사 척 구동 장치 및 기판 처리 장치
JP7271978B2 (ja) * 2019-02-05 2023-05-12 株式会社ニューフレアテクノロジー ステージ装置及び荷電粒子ビーム処理装置
CN121039573A (zh) * 2023-04-10 2025-11-28 Asml荷兰有限公司 用于在光刻设备中夹持图案化装置的系统和方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3271760B2 (ja) * 1999-03-31 2002-04-08 株式会社ニコン 走査露光方法、走査型露光装置、及び前記方法を用いるデバイス製造方法
JP3626888B2 (ja) 1999-10-08 2005-03-09 日立ハイテク電子エンジニアリング株式会社 基板露光装置におけるマスク撓み補正機構及びマスク撓み補正方法並びにパターン形成方法
US7675607B2 (en) 2006-07-14 2010-03-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7675201B2 (en) * 2006-07-25 2010-03-09 Asml Netherlands B.V. Lithographic apparatus with planar motor driven support
NL1036511A1 (nl) 2008-02-13 2009-08-14 Asml Netherlands Bv Movable support, position control system, lithographic apparatus and method of controlling a position of an exchangeable object.
US8553207B2 (en) * 2008-12-31 2013-10-08 Asml Holdings N.V. Optically compensated unidirectional reticle bender
NL2006190A (en) 2010-03-11 2011-09-13 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US9946168B2 (en) 2012-04-27 2018-04-17 Asml Netherlands B.V. Lithographic apparatus

Also Published As

Publication number Publication date
JP2015537239A (ja) 2015-12-24
JP6198837B2 (ja) 2017-09-20
WO2014063871A1 (en) 2014-05-01
US9910368B2 (en) 2018-03-06
US20150277241A1 (en) 2015-10-01
KR20150079785A (ko) 2015-07-08

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