JP6178389B2 - 熱伝導シートの製造方法、熱伝導シート、及び半導体装置 - Google Patents

熱伝導シートの製造方法、熱伝導シート、及び半導体装置 Download PDF

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Publication number
JP6178389B2
JP6178389B2 JP2015239317A JP2015239317A JP6178389B2 JP 6178389 B2 JP6178389 B2 JP 6178389B2 JP 2015239317 A JP2015239317 A JP 2015239317A JP 2015239317 A JP2015239317 A JP 2015239317A JP 6178389 B2 JP6178389 B2 JP 6178389B2
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JP
Japan
Prior art keywords
heat conductive
sheet
heat
conductive sheet
molded body
Prior art date
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Active
Application number
JP2015239317A
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English (en)
Japanese (ja)
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JP2016121341A5 (enrdf_load_stackoverflow
JP2016121341A (ja
Inventor
荒巻　慶輔
慶輔 荒巻
麻紗子 菅原
麻紗子 菅原
俊介 内田
俊介 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to PCT/JP2015/084665 priority Critical patent/WO2016104169A1/ja
Priority to CN201580067250.XA priority patent/CN107004651B/zh
Publication of JP2016121341A publication Critical patent/JP2016121341A/ja
Publication of JP2016121341A5 publication Critical patent/JP2016121341A5/ja
Application granted granted Critical
Publication of JP6178389B2 publication Critical patent/JP6178389B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2015239317A 2014-12-25 2015-12-08 熱伝導シートの製造方法、熱伝導シート、及び半導体装置 Active JP6178389B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2015/084665 WO2016104169A1 (ja) 2014-12-25 2015-12-10 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
CN201580067250.XA CN107004651B (zh) 2014-12-25 2015-12-10 导热片的制造方法、导热片和半导体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014262740 2014-12-25
JP2014262740 2014-12-25

Publications (3)

Publication Number Publication Date
JP2016121341A JP2016121341A (ja) 2016-07-07
JP2016121341A5 JP2016121341A5 (enrdf_load_stackoverflow) 2016-08-18
JP6178389B2 true JP6178389B2 (ja) 2017-08-09

Family

ID=56327161

Family Applications (1)

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JP2015239317A Active JP6178389B2 (ja) 2014-12-25 2015-12-08 熱伝導シートの製造方法、熱伝導シート、及び半導体装置

Country Status (2)

Country Link
JP (1) JP6178389B2 (enrdf_load_stackoverflow)
CN (1) CN107004651B (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11987686B2 (en) 2018-06-22 2024-05-21 Sekisui Polymatech Co., Ltd. Thermally conductive sheet
US11987687B2 (en) 2018-09-26 2024-05-21 Sekisui Polymatech Co., Ltd. Heat conductive sheet

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102449343B1 (ko) * 2016-01-26 2022-10-04 데쿠세리아루즈 가부시키가이샤 열전도 시트, 열전도 시트의 제조 방법, 방열 부재 및 반도체 장치
JP6294951B2 (ja) 2016-01-26 2018-03-14 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
JP6753745B2 (ja) * 2016-09-12 2020-09-09 デクセリアルズ株式会社 熱伝導シート、及び半導体装置
WO2019117244A1 (ja) * 2017-12-15 2019-06-20 千住金属工業株式会社 摺動部材及び軸受
JP6807355B2 (ja) * 2018-07-18 2021-01-06 デクセリアルズ株式会社 熱伝導性シート及びその製造方法、熱伝導性シートの実装方法
JP6739478B2 (ja) * 2018-07-18 2020-08-12 デクセリアルズ株式会社 熱伝導性シートの製造方法
JP2020116873A (ja) * 2019-01-25 2020-08-06 デクセリアルズ株式会社 熱伝導性シートの製造方法
JP7384560B2 (ja) * 2019-02-09 2023-11-21 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの実装方法、電子機器の製造方法
JP7531602B2 (ja) * 2020-10-20 2024-08-09 デンカ株式会社 シートの製造方法
JP2021050350A (ja) * 2020-12-07 2021-04-01 デクセリアルズ株式会社 熱伝導性シート及びその製造方法、熱伝導性シートの実装方法
JP6999054B1 (ja) 2021-02-10 2022-01-18 デクセリアルズ株式会社 熱伝導シートの供給形態及び熱伝導シート
JPWO2023189776A1 (enrdf_load_stackoverflow) * 2022-03-29 2023-10-05
US11615999B1 (en) 2022-07-22 2023-03-28 GuangDong Suqun New Material Co., Ltd Oriented heat conducting sheet and preparation method thereof, and semiconductor heat dissipating device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3182257B2 (ja) * 1993-02-02 2001-07-03 電気化学工業株式会社 放熱シート
JP3092699B2 (ja) * 1996-04-30 2000-09-25 電気化学工業株式会社 放熱スペーサーとその用途およびシリコーン組成物
JP3434678B2 (ja) * 1997-09-12 2003-08-11 電気化学工業株式会社 ゴムシートの製造方法
JP4101391B2 (ja) * 1999-03-31 2008-06-18 電気化学工業株式会社 電子部品の放熱部材
JP5696325B2 (ja) * 2009-10-01 2015-04-08 日立化成株式会社 樹脂シート、その製造方法およびこれを用いたサーマルモジュール
CN102971365B (zh) * 2010-06-17 2015-07-01 迪睿合电子材料有限公司 导热性片和其制造方法
JP5740864B2 (ja) * 2010-08-03 2015-07-01 日立化成株式会社 熱伝導シート、熱伝導シートの製造方法、及び熱伝導シートを用いた放熱装置
JP6034562B2 (ja) * 2011-12-20 2016-11-30 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法
TWI686434B (zh) * 2012-07-07 2020-03-01 日商迪睿合股份有限公司 導熱性片
JP6069112B2 (ja) * 2013-06-19 2017-02-01 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法
JP5752299B2 (ja) * 2013-07-01 2015-07-22 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び放熱部材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11987686B2 (en) 2018-06-22 2024-05-21 Sekisui Polymatech Co., Ltd. Thermally conductive sheet
US11987687B2 (en) 2018-09-26 2024-05-21 Sekisui Polymatech Co., Ltd. Heat conductive sheet

Also Published As

Publication number Publication date
CN107004651A (zh) 2017-08-01
CN107004651B (zh) 2019-07-12
JP2016121341A (ja) 2016-07-07

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