JPWO2023189776A1 - - Google Patents

Info

Publication number
JPWO2023189776A1
JPWO2023189776A1 JP2024511844A JP2024511844A JPWO2023189776A1 JP WO2023189776 A1 JPWO2023189776 A1 JP WO2023189776A1 JP 2024511844 A JP2024511844 A JP 2024511844A JP 2024511844 A JP2024511844 A JP 2024511844A JP WO2023189776 A1 JPWO2023189776 A1 JP WO2023189776A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511844A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023189776A1 publication Critical patent/JPWO2023189776A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/26—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2024511844A 2022-03-29 2023-03-17 Pending JPWO2023189776A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022054690 2022-03-29
PCT/JP2023/010752 WO2023189776A1 (ja) 2022-03-29 2023-03-17 温度調節モジュール

Publications (1)

Publication Number Publication Date
JPWO2023189776A1 true JPWO2023189776A1 (enrdf_load_stackoverflow) 2023-10-05

Family

ID=88200983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511844A Pending JPWO2023189776A1 (enrdf_load_stackoverflow) 2022-03-29 2023-03-17

Country Status (3)

Country Link
JP (1) JPWO2023189776A1 (enrdf_load_stackoverflow)
TW (1) TW202403488A (enrdf_load_stackoverflow)
WO (1) WO2023189776A1 (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104086929A (zh) * 2008-10-21 2014-10-08 日立化成工业株式会社 导热片材、其制造方法以及使用了该导热片材的散热装置
JP6178389B2 (ja) * 2014-12-25 2017-08-09 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
WO2021201065A1 (ja) * 2020-03-31 2021-10-07 日東電工株式会社 複合材料

Also Published As

Publication number Publication date
WO2023189776A1 (ja) 2023-10-05
TW202403488A (zh) 2024-01-16

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20240408