JP6171613B2 - 発光装置の製造方法及び発光装置 - Google Patents

発光装置の製造方法及び発光装置 Download PDF

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Publication number
JP6171613B2
JP6171613B2 JP2013130077A JP2013130077A JP6171613B2 JP 6171613 B2 JP6171613 B2 JP 6171613B2 JP 2013130077 A JP2013130077 A JP 2013130077A JP 2013130077 A JP2013130077 A JP 2013130077A JP 6171613 B2 JP6171613 B2 JP 6171613B2
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adhesive
light emitting
stamp
emitting element
emitting device
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JP2013130077A
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Japanese (ja)
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JP2015005625A5 (https=
JP2015005625A (ja
Inventor
智紀 田村
智紀 田村
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Nichia Corp
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Nichia Corp
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Priority to JP2013130077A priority Critical patent/JP6171613B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

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  • Application Of Or Painting With Fluid Materials (AREA)
  • Led Device Packages (AREA)
JP2013130077A 2013-06-21 2013-06-21 発光装置の製造方法及び発光装置 Active JP6171613B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013130077A JP6171613B2 (ja) 2013-06-21 2013-06-21 発光装置の製造方法及び発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013130077A JP6171613B2 (ja) 2013-06-21 2013-06-21 発光装置の製造方法及び発光装置

Publications (3)

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JP2015005625A JP2015005625A (ja) 2015-01-08
JP2015005625A5 JP2015005625A5 (https=) 2016-08-04
JP6171613B2 true JP6171613B2 (ja) 2017-08-02

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102311727B1 (ko) * 2019-05-29 2021-10-13 서울대학교산학협력단 전자 장치 및 스탬핑과 자기장 정렬을 이용한 전자 소자의 전사 방법
JP7060809B2 (ja) * 2019-11-12 2022-04-27 日亜化学工業株式会社 半導体装置の製造方法
US12009339B2 (en) 2020-08-18 2024-06-11 Seoul National University R&Db Foundation Electronic device and method of transferring electronic element using stamping and magnetic field alignment
JP2024014061A (ja) * 2022-07-21 2024-02-01 新光電気工業株式会社 塗布装置、塗布方法及び積層体の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650746B2 (ja) * 1986-08-06 1994-06-29 三菱電機株式会社 樹脂ボンデイング装置におけるボンデイング樹脂面の調整装置
JPH0645658A (ja) * 1992-07-24 1994-02-18 Ricoh Co Ltd 半導体素子接着基板
JP3393708B2 (ja) * 1994-07-06 2003-04-07 イビデン株式会社 半導体パッケージの製造方法
JP2004146698A (ja) * 2002-10-25 2004-05-20 Ueno Seiki Kk ペースト材料の転写装置及び転写方法
JP2007258324A (ja) * 2006-03-22 2007-10-04 Matsushita Electric Ind Co Ltd 発光装置の製造方法および発光装置
JP4867548B2 (ja) * 2006-09-22 2012-02-01 ソニー株式会社 塗布装置、実装装置及び電子部品の製造方法
KR101438826B1 (ko) * 2008-06-23 2014-09-05 엘지이노텍 주식회사 발광장치
JP2011077164A (ja) * 2009-09-29 2011-04-14 Sanken Electric Co Ltd 半導体発光装置
JP2013062337A (ja) * 2011-09-13 2013-04-04 Toshiba Corp 発光装置

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