JP6164721B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6164721B2
JP6164721B2 JP2012247764A JP2012247764A JP6164721B2 JP 6164721 B2 JP6164721 B2 JP 6164721B2 JP 2012247764 A JP2012247764 A JP 2012247764A JP 2012247764 A JP2012247764 A JP 2012247764A JP 6164721 B2 JP6164721 B2 JP 6164721B2
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JP
Japan
Prior art keywords
pattern
component
semiconductor device
wiring
semiconductor chip
Prior art date
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Active
Application number
JP2012247764A
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English (en)
Japanese (ja)
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JP2014096497A (ja
JP2014096497A5 (enExample
Inventor
典宏 由村
典宏 由村
宇井　範彦
範彦 宇井
渡辺　直樹
直樹 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Device Innovations Inc
Original Assignee
Sumitomo Electric Device Innovations Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Device Innovations Inc filed Critical Sumitomo Electric Device Innovations Inc
Priority to JP2012247764A priority Critical patent/JP6164721B2/ja
Publication of JP2014096497A publication Critical patent/JP2014096497A/ja
Publication of JP2014096497A5 publication Critical patent/JP2014096497A5/ja
Application granted granted Critical
Publication of JP6164721B2 publication Critical patent/JP6164721B2/ja
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Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H01L2924/30111—Impedance matching

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  • Filters And Equalizers (AREA)
JP2012247764A 2012-11-09 2012-11-09 半導体装置 Active JP6164721B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012247764A JP6164721B2 (ja) 2012-11-09 2012-11-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012247764A JP6164721B2 (ja) 2012-11-09 2012-11-09 半導体装置

Publications (3)

Publication Number Publication Date
JP2014096497A JP2014096497A (ja) 2014-05-22
JP2014096497A5 JP2014096497A5 (enExample) 2015-12-24
JP6164721B2 true JP6164721B2 (ja) 2017-07-19

Family

ID=50939346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012247764A Active JP6164721B2 (ja) 2012-11-09 2012-11-09 半導体装置

Country Status (1)

Country Link
JP (1) JP6164721B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6569417B2 (ja) * 2015-09-16 2019-09-04 三菱電機株式会社 増幅器
JP6316512B1 (ja) * 2017-03-28 2018-04-25 三菱電機株式会社 半導体装置
JP2022138983A (ja) * 2021-03-11 2022-09-26 住友電気工業株式会社 半導体装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54134976A (en) * 1978-04-12 1979-10-19 Nec Corp High-frequency transistor
JPS5648156A (en) * 1979-09-26 1981-05-01 Nec Corp Transistor
JPS5877052U (ja) * 1981-11-17 1983-05-24 株式会社東芝 トランジスタ外囲器
US6177834B1 (en) * 1998-12-02 2001-01-23 Ericsson, Inc. Output matched LDMOS power transistor device
JP2003115732A (ja) * 2001-10-03 2003-04-18 Hitachi Ltd 半導体装置
US6734728B1 (en) * 2002-12-19 2004-05-11 Infineon Technologies North America Corp. RF power transistor with internal bias feed
JP2005110119A (ja) * 2003-10-01 2005-04-21 Mitsubishi Electric Corp 高周波トランジスタ装置

Also Published As

Publication number Publication date
JP2014096497A (ja) 2014-05-22

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