JP6158737B2 - 基板処理装置及び基板処理方法 - Google Patents
基板処理装置及び基板処理方法 Download PDFInfo
- Publication number
- JP6158737B2 JP6158737B2 JP2014072791A JP2014072791A JP6158737B2 JP 6158737 B2 JP6158737 B2 JP 6158737B2 JP 2014072791 A JP2014072791 A JP 2014072791A JP 2014072791 A JP2014072791 A JP 2014072791A JP 6158737 B2 JP6158737 B2 JP 6158737B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- degrees
- path bending
- nozzle
- processing liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/26—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with means for mechanically breaking-up or deflecting the jet after discharge, e.g. with fixed deflectors; Breaking-up the discharged liquid or other fluent material by impinging jets
- B05B1/262—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with means for mechanically breaking-up or deflecting the jet after discharge, e.g. with fixed deflectors; Breaking-up the discharged liquid or other fluent material by impinging jets with fixed deflectors
- B05B1/265—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with means for mechanically breaking-up or deflecting the jet after discharge, e.g. with fixed deflectors; Breaking-up the discharged liquid or other fluent material by impinging jets with fixed deflectors the liquid or other fluent material being symmetrically deflected about the axis of the nozzle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
- B05B13/0235—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the movement of the objects being a combination of rotation and linear displacement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
- B05B3/02—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements
- B05B3/04—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements driven by the liquid or other fluent material discharged, e.g. the liquid actuating a motor before passing to the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
- B05B3/02—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements
- B05B3/04—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements driven by the liquid or other fluent material discharged, e.g. the liquid actuating a motor before passing to the outlet
- B05B3/0417—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements driven by the liquid or other fluent material discharged, e.g. the liquid actuating a motor before passing to the outlet comprising a liquid driven rotor, e.g. a turbine
- B05B3/0425—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements driven by the liquid or other fluent material discharged, e.g. the liquid actuating a motor before passing to the outlet comprising a liquid driven rotor, e.g. a turbine actuated downstream of the outlet elements
- B05B3/0426—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements driven by the liquid or other fluent material discharged, e.g. the liquid actuating a motor before passing to the outlet comprising a liquid driven rotor, e.g. a turbine actuated downstream of the outlet elements the liquid driven rotor being a deflecting rotating element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
- B05B3/02—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements
- B05B3/10—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements discharging over substantially the whole periphery of the rotating member
- B05B3/1064—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements discharging over substantially the whole periphery of the rotating member the liquid or other fluent material to be sprayed being axially supplied to the rotating member through a hollow rotating shaft
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/64—Wet etching of semiconductor materials
- H10P50/642—Chemical etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0418—Apparatus for fluid treatment for etching
- H10P72/0422—Apparatus for fluid treatment for etching for wet etching
- H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
第1の実施形態について図1乃至図6を参照して説明する。
第2の実施形態について図7乃至図11を参照して説明する。なお、第2の実施形態では、第1の実施形態との相違点(進路屈曲部6cやノズル11など)について説明し、その他の説明は省略する。
図12に示すように、進路屈曲部6cの傾斜面15は、湾曲形状に形成されても良く、ノズル11により吐出された処理液の進行方向を曲げることが可能であれば、その形状は特に限定されるものではなく、さらに、その湾曲度合いも特に限定されるものではない。例えば、傾斜面15がノズルブロック6a側にせり出して湾曲するように形成されても良い。なお、傾斜面15の傾斜角度、すなわち湾曲形状や湾曲度合いを調整することで、基板Wの裏面に対する処理液の入射位置(衝突位置)を容易に制御することができる。
6c 進路屈曲部
7 回転機構
7b 屈曲回転機構
7c ノズル回転機構
11 ノズル
15 傾斜面
W 基板
Claims (8)
- 基板の被処理面に処理液を吐出するノズルと、
前記ノズルにより吐出された前記処理液をその進行方向を曲げて前記被処理面に入射させる環状の傾斜面であって、その環状に延びる方向に沿って傾斜角度が変化する進路屈曲面を有する進路屈曲部と、
前記進路屈曲面に対する前記処理液の入射位置を前記進路屈曲面が環状に延びる方向に移動させる位置変更部と、
を備えることを特徴とする基板処理装置。 - 前記位置変更部は、前記進路屈曲面に対する前記処理液の入射位置を前記進路屈曲面が環状に延びる方向に移動させるように前記ノズル及び前記進路屈曲部のどちらか一方又は両方を前記被処理面に交差する軸を回転中心として前記進路屈曲面が環状に延びる方向に回転させる回転機構であることを特徴とする請求項1に記載の基板処理装置。
- 前記回転機構は、前記ノズル及び前記進路屈曲部の両方を回転させる場合、前記ノズル及び前記進路屈曲部の互いの回転方向を逆方向とすることを特徴とする請求項2に記載の基板処理装置。
- 前記進路屈曲面は、前記傾斜角度が連続して変化する連続面であることを特徴とする請求項1乃至請求項3のいずれか一項に記載の基板処理装置。
- 前記進路屈曲面は、前記傾斜角度が変化する段差を有する非連続面であることを特徴とする請求項1乃至請求項3のいずれか一項に記載の基板処理装置。
- 基板の被処理面に処理液をノズルにより吐出する工程と、
前記ノズルにより吐出された前記処理液を、その進行方向を進路屈曲部の環状の傾斜面であってその環状に延びる方向に沿って傾斜角度が変化する進路屈曲面により曲げて前記被処理面に入射させる工程と、
前記進路屈曲面に対する前記処理液の入射位置を前記進路屈曲面が環状に延びる方向に移動させる工程と、
を有することを特徴とする基板処理方法。 - 前記移動させる工程では、前記進路屈曲面に対する前記処理液の入射位置を前記進路屈曲面が環状に延びる方向に移動させるように前記ノズル及び前記進路屈曲部のどちらか一方又は両方を前記被処理面に交差する軸を回転中心として前記進路屈曲面が環状に延びる方向に回転機構により回転させることを特徴とする請求項6に記載の基板処理方法。
- 前記移動させる工程では、前記回転機構により前記ノズル及び前記進路屈曲部の両方を回転させる場合、前記ノズル及び前記進路屈曲部の互いの回転方向を逆方向とすることを特徴とする請求項7に記載の基板処理方法。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014072791A JP6158737B2 (ja) | 2014-03-31 | 2014-03-31 | 基板処理装置及び基板処理方法 |
| KR1020150036655A KR101618001B1 (ko) | 2014-03-31 | 2015-03-17 | 기판 처리 장치 및 기판 처리 방법 |
| US14/670,983 US9694371B2 (en) | 2014-03-31 | 2015-03-27 | Substrate treatment apparatus and substrate treatment method |
| TW104110239A TWI537062B (zh) | 2014-03-31 | 2015-03-30 | A substrate processing apparatus and a substrate processing method |
| CN201510147942.7A CN104952772B (zh) | 2014-03-31 | 2015-03-31 | 基板处理装置及基板处理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014072791A JP6158737B2 (ja) | 2014-03-31 | 2014-03-31 | 基板処理装置及び基板処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015195284A JP2015195284A (ja) | 2015-11-05 |
| JP6158737B2 true JP6158737B2 (ja) | 2017-07-05 |
Family
ID=54167337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014072791A Active JP6158737B2 (ja) | 2014-03-31 | 2014-03-31 | 基板処理装置及び基板処理方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9694371B2 (ja) |
| JP (1) | JP6158737B2 (ja) |
| KR (1) | KR101618001B1 (ja) |
| CN (1) | CN104952772B (ja) |
| TW (1) | TWI537062B (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6804325B2 (ja) * | 2017-02-09 | 2020-12-23 | 東京エレクトロン株式会社 | 液処理装置 |
| CN109309025A (zh) * | 2017-07-27 | 2019-02-05 | 无锡华润华晶微电子有限公司 | 晶圆划片设备及晶圆划片方法 |
| CN112090660B (zh) * | 2020-08-20 | 2021-11-30 | 塔里木大学 | 一种基于计算机视觉的机械自动化喷涂装置 |
| JP7556328B2 (ja) * | 2021-05-21 | 2024-09-26 | 株式会社Sumco | 半導体ウェーハの洗浄装置、半導体ウェーハの洗浄方法およびシリコンウェーハの製造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT407312B (de) * | 1996-11-20 | 2001-02-26 | Sez Semiconduct Equip Zubehoer | Rotierbarer träger für kreisrunde, scheibenförmige gegenstände, insbesondere halbleiterwafer oder -substrate |
| JP4801853B2 (ja) * | 2001-07-31 | 2011-10-26 | 芝浦メカトロニクス株式会社 | スピン処理装置およびスピン処理方法 |
| FR2836638B1 (fr) * | 2002-03-01 | 2004-12-10 | Sames Technologies | Dispositif de pulverisation de produit de revetement liquide |
| US7531039B2 (en) * | 2002-09-25 | 2009-05-12 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing system |
| EP1502653B1 (de) * | 2003-08-01 | 2008-09-17 | Lechler GmbH | Düse zum Besprühen einer Fläche |
| JP4364659B2 (ja) | 2004-01-29 | 2009-11-18 | 芝浦メカトロニクス株式会社 | スピン処理装置及びスピン処理方法 |
| JP2005259874A (ja) * | 2004-03-10 | 2005-09-22 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
| JP2006255532A (ja) * | 2005-03-15 | 2006-09-28 | Sharp Corp | 基板洗浄ノズルおよびそれを用いる基板洗浄方法ならびに基板洗浄装置 |
| KR20080072230A (ko) * | 2007-02-01 | 2008-08-06 | 세메스 주식회사 | 스캔 분사형 노즐 구동부를 가진 기판 처리 장치 |
| JP5012651B2 (ja) | 2008-05-14 | 2012-08-29 | 東京エレクトロン株式会社 | 塗布装置、塗布方法、塗布、現像装置及び記憶媒体 |
| JP2010073849A (ja) | 2008-09-18 | 2010-04-02 | Shibaura Mechatronics Corp | 基板処理装置および基板処理方法 |
| JP5198223B2 (ja) | 2008-11-18 | 2013-05-15 | 芝浦メカトロニクス株式会社 | 基板処理装置および基板処理方法 |
| JP5630808B2 (ja) * | 2010-03-26 | 2014-11-26 | 住友精密工業株式会社 | 搬送式基板処理装置における節水型洗浄システム |
| KR101394456B1 (ko) * | 2011-09-30 | 2014-05-15 | 세메스 주식회사 | 기판처리장치 및 기판처리방법 |
-
2014
- 2014-03-31 JP JP2014072791A patent/JP6158737B2/ja active Active
-
2015
- 2015-03-17 KR KR1020150036655A patent/KR101618001B1/ko active Active
- 2015-03-27 US US14/670,983 patent/US9694371B2/en not_active Expired - Fee Related
- 2015-03-30 TW TW104110239A patent/TWI537062B/zh active
- 2015-03-31 CN CN201510147942.7A patent/CN104952772B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20150273491A1 (en) | 2015-10-01 |
| TW201536432A (zh) | 2015-10-01 |
| US9694371B2 (en) | 2017-07-04 |
| JP2015195284A (ja) | 2015-11-05 |
| CN104952772B (zh) | 2018-01-30 |
| CN104952772A (zh) | 2015-09-30 |
| KR101618001B1 (ko) | 2016-05-03 |
| KR20150113845A (ko) | 2015-10-08 |
| TWI537062B (zh) | 2016-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6020271B2 (ja) | 液処理装置 | |
| JP6158737B2 (ja) | 基板処理装置及び基板処理方法 | |
| US10279368B2 (en) | Coating method and coating apparatus | |
| JP5941023B2 (ja) | 基板洗浄装置、基板洗浄方法、及びコンピュータ読み取り可能な記録媒体 | |
| JP5454203B2 (ja) | 塗布方法及び塗布装置 | |
| US20150343495A1 (en) | Apparatus and methods for treating substrates | |
| CN107393846B (zh) | 基板清洗装置、基板清洗方法及基板处理装置 | |
| JP7519244B2 (ja) | 液処理装置及び液処理装置の運転方法 | |
| CN107230653B (zh) | 基板处理装置、基板处理方法以及存储介质 | |
| CN109698145B (zh) | 喷嘴待机装置、液处理装置及其运转方法和存储介质 | |
| JP6496186B2 (ja) | 基板処理装置 | |
| TWI745830B (zh) | 液處理裝置及液處理方法 | |
| KR102186415B1 (ko) | 현상 방법, 현상 장치 및 기억 매체 | |
| JP4357225B2 (ja) | 基板処理装置 | |
| TW201803651A (zh) | 塗布方法 | |
| JP2016115785A (ja) | 現像装置および現像方法 | |
| TWI690008B (zh) | 自碟形物品的表面移除液體之裝置與方法 | |
| JP2010153474A (ja) | 基板処理装置および基板処理方法 | |
| JP6925185B2 (ja) | 基板処理装置 | |
| JPH09122558A (ja) | 回転式塗布装置 | |
| TWI406108B (zh) | 顯影裝置及顯影方法 | |
| KR20160125167A (ko) | 스핀 코터 및 그 코팅 방법 | |
| JP2015109372A (ja) | 基板洗浄装置 | |
| KR102869894B1 (ko) | 기판처리장치 및 기판처리방법 | |
| JP2009200331A (ja) | 基板洗浄装置および基板洗浄方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160808 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170529 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170606 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170608 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6158737 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |