JP6141969B2 - 大面積を有する基板のテクスチャ加工方法 - Google Patents

大面積を有する基板のテクスチャ加工方法 Download PDF

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Publication number
JP6141969B2
JP6141969B2 JP2015512106A JP2015512106A JP6141969B2 JP 6141969 B2 JP6141969 B2 JP 6141969B2 JP 2015512106 A JP2015512106 A JP 2015512106A JP 2015512106 A JP2015512106 A JP 2015512106A JP 6141969 B2 JP6141969 B2 JP 6141969B2
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JP
Japan
Prior art keywords
substrate
pouch
minutes
mold
deformable layer
Prior art date
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Expired - Fee Related
Application number
JP2015512106A
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English (en)
Japanese (ja)
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JP2015522443A (ja
Inventor
シュマン ニコラ
シュマン ニコラ
テセール ジェレミー
テセール ジェレミー
ゾンデルガルト エリン
ゾンデルガルト エリン
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Saint Gobain Glass France SAS
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Saint Gobain Glass France SAS
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Publication of JP2015522443A publication Critical patent/JP2015522443A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/10—Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies
    • B29C43/12—Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies using bags surrounding the moulding material or using membranes contacting the moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/0227—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using pressure vessels, e.g. autoclaves, vulcanising pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
    • B29C2043/3644—Vacuum bags; Details thereof, e.g. fixing or clamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Surface Treatment Of Glass (AREA)
JP2015512106A 2012-05-14 2013-05-14 大面積を有する基板のテクスチャ加工方法 Expired - Fee Related JP6141969B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1254373A FR2990384B1 (fr) 2012-05-14 2012-05-14 Procede de texturation sur un substrat de grande surface
FR1254373 2012-05-14
PCT/FR2013/051048 WO2013171420A1 (fr) 2012-05-14 2013-05-14 Procede de texturation sur un substrat de grande surface

Publications (2)

Publication Number Publication Date
JP2015522443A JP2015522443A (ja) 2015-08-06
JP6141969B2 true JP6141969B2 (ja) 2017-06-07

Family

ID=48577122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015512106A Expired - Fee Related JP6141969B2 (ja) 2012-05-14 2013-05-14 大面積を有する基板のテクスチャ加工方法

Country Status (9)

Country Link
US (1) US9296132B2 (OSRAM)
EP (1) EP2850493A1 (OSRAM)
JP (1) JP6141969B2 (OSRAM)
KR (1) KR20150010726A (OSRAM)
CN (1) CN104272187A (OSRAM)
EA (1) EA201492087A1 (OSRAM)
FR (1) FR2990384B1 (OSRAM)
IN (1) IN2014MN02198A (OSRAM)
WO (1) WO2013171420A1 (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11133118B2 (en) 2012-05-22 2021-09-28 University Of Massachusetts Patterned nanoparticle structures
US10088110B2 (en) * 2016-05-17 2018-10-02 Hexagon Technology As Pressure vessel liner venting via nanotextured surface
EP3481562A4 (en) * 2016-07-08 2019-06-26 University of Massachusetts STRUCTURING OF NANOSTRUCTURES WITH IMPRINT LITHOGRAPHY
FR3065723B1 (fr) * 2017-04-28 2021-09-03 Saint Gobain Article protege par une couche de protection temporaire rugueuse
KR102870782B1 (ko) * 2019-08-06 2025-10-13 엘지전자 주식회사 디스플레이 장치의 제조 방법 및 디스플레이 장치 제조를 위한 전사 기판
US12044963B2 (en) 2020-01-22 2024-07-23 Applied Materials, Inc. High refractive index imprint compositions and materials and processes for making the same
US20210325777A1 (en) 2020-04-20 2021-10-21 Applied Materials, Inc. Methods for increasing the refractive index of high-index nanoimprint lithography films
FR3122523B1 (fr) * 2021-04-30 2023-06-09 Commissariat Energie Atomique Procede de structuration de surface hybride par gravure plasma
CN116875091B (zh) * 2023-07-12 2024-08-30 东方绿色能源(河北)有限公司华中分公司 一种不锈钢基体表面超疏水薄膜及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1493348A (en) * 1973-10-30 1977-11-30 Ft Projects Ltd Thermal treatment of heat fusible materials
US4360266A (en) 1979-08-24 1982-11-23 Dai Nippon Insatsu Kabushiki Kaisha Contact printing method and apparatus
JPS6172529A (ja) * 1984-09-17 1986-04-14 Mitsui Toatsu Chem Inc 複合材料の製法
US5393365A (en) * 1993-11-19 1995-02-28 E. I. Du Pont De Nemours And Company Embossed glass/plastic laminate and process for preparing the same
US6482742B1 (en) * 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
SE515607C2 (sv) * 1999-12-10 2001-09-10 Obducat Ab Anordning och metod vid tillverkning av strukturer
US7635262B2 (en) * 2000-07-18 2009-12-22 Princeton University Lithographic apparatus for fluid pressure imprint lithography
US7211214B2 (en) * 2000-07-18 2007-05-01 Princeton University Laser assisted direct imprint lithography
US20050084613A1 (en) * 2003-08-19 2005-04-21 Jian Wang Sub-micron-scale patterning method and system
US7682545B2 (en) 2003-11-17 2010-03-23 Dow Corning Corporation Embossing toughened silicone resin substrates
JP4146817B2 (ja) * 2004-04-16 2008-09-10 サカイオーベックス株式会社 繊維強化積層材の製造方法
JP2008507114A (ja) * 2004-04-27 2008-03-06 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ ソフトリソグラフィ用複合パターニングデバイス
US7186367B2 (en) * 2004-05-13 2007-03-06 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Double vacuum bag process for resin matrix composite manufacturing
FR2893610B1 (fr) * 2005-11-23 2008-07-18 Saint Gobain Procede de structuration de surface d'un produit verrier, produit verrier a surface structuree et utilisations
JP2012061820A (ja) * 2010-09-17 2012-03-29 Dainippon Printing Co Ltd 繊維強化複合材料の賦型方法

Also Published As

Publication number Publication date
EA201492087A1 (ru) 2015-02-27
US20150140837A1 (en) 2015-05-21
CN104272187A (zh) 2015-01-07
US9296132B2 (en) 2016-03-29
JP2015522443A (ja) 2015-08-06
IN2014MN02198A (OSRAM) 2015-09-11
WO2013171420A1 (fr) 2013-11-21
EP2850493A1 (fr) 2015-03-25
FR2990384A1 (fr) 2013-11-15
KR20150010726A (ko) 2015-01-28
FR2990384B1 (fr) 2015-05-15

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