JP6125101B2 - 電着可能コーティング組成物でコーティングされた電気伝導性複合基材およびそれらの調製方法 - Google Patents
電着可能コーティング組成物でコーティングされた電気伝導性複合基材およびそれらの調製方法 Download PDFInfo
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- JP6125101B2 JP6125101B2 JP2016525478A JP2016525478A JP6125101B2 JP 6125101 B2 JP6125101 B2 JP 6125101B2 JP 2016525478 A JP2016525478 A JP 2016525478A JP 2016525478 A JP2016525478 A JP 2016525478A JP 6125101 B2 JP6125101 B2 JP 6125101B2
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- electrically conductive
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- acid
- nickel
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- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- LLBIOIRWAYBCKK-UHFFFAOYSA-N pyranthrene-8,16-dione Chemical compound C12=CC=CC=C2C(=O)C2=CC=C3C=C4C5=CC=CC=C5C(=O)C5=C4C4=C3C2=C1C=C4C=C5 LLBIOIRWAYBCKK-UHFFFAOYSA-N 0.000 description 1
- IZMJMCDDWKSTTK-UHFFFAOYSA-N quinoline yellow Chemical compound C1=CC=CC2=NC(C3C(C4=CC=CC=C4C3=O)=O)=CC=C21 IZMJMCDDWKSTTK-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000010107 reaction injection moulding Methods 0.000 description 1
- 239000000985 reactive dye Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000000988 sulfur dye Substances 0.000 description 1
- 239000002426 superphosphate Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920002397 thermoplastic olefin Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- JOUDBUYBGJYFFP-FOCLMDBBSA-N thioindigo Chemical compound S\1C2=CC=CC=C2C(=O)C/1=C1/C(=O)C2=CC=CC=C2S1 JOUDBUYBGJYFFP-FOCLMDBBSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- 125000005627 triarylcarbonium group Chemical group 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 239000001226 triphosphate Substances 0.000 description 1
- 235000011178 triphosphate Nutrition 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 238000000108 ultra-filtration Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000001039 zinc pigment Substances 0.000 description 1
- XJUNLJFOHNHSAR-UHFFFAOYSA-J zirconium(4+);dicarbonate Chemical compound [Zr+4].[O-]C([O-])=O.[O-]C([O-])=O XJUNLJFOHNHSAR-UHFFFAOYSA-J 0.000 description 1
Classifications
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- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
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- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
- C09D5/4473—Mixture of polymers
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- C25D13/00—Electrophoretic coating characterised by the process
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- C25D13/06—Electrophoretic coating characterised by the process with organic material with polymers
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- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/12—Electrophoretic coating characterised by the process characterised by the article coated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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Description
本発明は、その上に電気泳動的に堆積したフィルム形成組成物を有する複合基材を含むコーティングされた基材に関する。
自動車メーカーは、現在、生産している車両の燃料経済性を増加させ、製造プロセスにおけるこれらのカーボンフットプリントを減少させることについて迫られている。品質を維持する一方で、経済的な様式でこの両方を遂行することにおいて難題が存在する。
本発明は、
A)繊維で強化された樹脂性マトリックスを含む電気伝導性複合基材、および
B)基材の少なくとも一つの表面上に電気泳動的に堆積した硬化コーティング層
を含むコーティングされた基材であって、硬化コーティング層は、
(1)アクリル、ポリエステル、ポリウレタンおよび/またはポリエポキシドポリマーを含む活性水素含有カチオン性またはアニオン性樹脂を含有する樹脂構成要素;ならびに
(2)硬化剤
を含む硬化可能電着可能コーティング組成物から堆積する、コーティングされた基材を対象とする。
任意の操作実施例における以外に、または他に示す場合、本明細書および特許請求の範囲において使用される成分の量、反応条件などを表す全ての数は、全ての場合において、用語「約」によって修飾されると理解される。したがって、逆に示さない限り、下記の明細書および添付の特許請求の範囲において記載した数的パラメーターは、本発明によって得られる所望の特性によって変化し得る近似値である。最低限でも、および特許請求の範囲への均等の原則の適用を制限する試みとしてではなく、各数的パラメーターは少なくとも、報告された有効桁の数に照らして、通常の丸め技術を適用することによって解釈すべきである。
(a)ハロゲン化ポリオレフィン;
(b)ポリオレフィン(a)とは異なるフィルム形成ポリマー;および
(c)電気伝導性顔料
を含む組成物を含む。
(A)樹脂性バインダー;および
(B)樹脂性バインダー中に分散した上述の電気伝導性顔料の少なくとも一つ
を含む組成物を含み、ここで、樹脂性バインダー(A)は、(1)反応性官能基を含有する少なくとも1種のポリマー、および(2)ポリマー(1)上の官能基と反応性の官能基を有する少なくとも1種の硬化剤を含む。
(1)アクリル、ポリエステル、ポリウレタンおよび/またはポリエポキシドポリマーを含む活性水素含有カチオン性またはアニオン性樹脂を含有する樹脂構成要素;ならびに
(2)硬化剤
を含む硬化可能電着可能コーティング組成物から堆積する。
エポキシド官能基(カチオン塩基への変換用の)は、官能性モノマー、例えば、アクリル酸グリシジルおよびメタクリル酸グリシジル、3,4−エポキシシクロヘキシルメチル(メタ)アクリレート、2−(3,4−エポキシシクロヘキシル)エチル(メタ)アクリレート、またはアリルグリシジルエーテルを使用することによってアクリルポリマー中に組み込まれ得る。代わりに、エポキシド官能基は、アクリルポリマー上のヒドロキシル基とエピハロヒドリンまたはジハロヒドリン、例えば、エピクロロヒドリンまたはジクロロヒドリンとをアルカリの存在下で反応させることによってアクリルポリマー中に組み込まれ得る。
アミン塩および第四級アンモニウム塩基を含有する樹脂に加えて、第三級スルホニウム基を含有するカチオン性樹脂を、カチオン塩基含有樹脂の形成において使用し得る。これらの樹脂およびこれらの調製方法の例は、参考として本明細書中に援用されるDeBonaへの米国特許第3,793,278号およびBossoらへの同第3,959,106号に記載されている。
(1)(i)上記のようなイオン性樹脂構成要素と(ii)硬化剤とを合わせ、反応性混合物を形成させる;
(2)触媒組成物を必要に応じて上記反応性混合物に加える;
(3)上記反応性混合物の全重量に対して10〜30重量パーセントの固形物含量まで、上記反応性混合物を水で希釈する。
本発明の好ましい実施形態によれば、例えば、以下が提供される。
(項1)
A)繊維で強化された樹脂性マトリックスを含む電気伝導性複合基材、および
B)前記基材の表面の少なくとも一部上に電気泳動的に堆積した硬化コーティング層
を含むコーティングされた基材であって、前記硬化コーティング層は、
(1)アクリル、ポリエステル、ポリウレタンおよび/またはポリエポキシドポリマーを含む活性水素含有カチオン性またはアニオン性樹脂を含有する樹脂構成要素;ならびに
(2)硬化剤
を含む硬化可能電着可能コーティング組成物から堆積する、コーティングされた基材。
(項2)
前記樹脂性マトリックスが、ポリスチレン、ポリアニリン、ポリピロール、ポリエポキシド、ポリ(メタクリル酸メチル)、ポリウレタン、および/またはポリカーボネートを含む、上記項1に記載のコーティングされた基材。
(項3)
前記繊維が、電気伝導性である、上記項1に記載のコーティングされた基材。
(項4)
前記繊維が、ステンレス鋼繊維、銅繊維、ニッケル繊維、銀繊維、アルミニウム繊維、金属メッキしたガラス繊維、および/または炭素繊維を含む、上記項3に記載のコーティングされた基材。
(項5)
前記電気伝導性複合基材が、前記樹脂性マトリックスの至る所に分布しており、かつ亜鉛、フェロホスホル、タングステン、炭素、ニッケル、アルミニウム、銅、鉄、鋼、二硫化モリブデン、酸化鉄、アンチモンをドープした二酸化チタン、ニッケルをドープした二酸化チタン、黒鉛、銀、および/またはアルミニウム粒子の一つまたは一つより多くを含む電気伝導性粒子性充填剤をさらに含む、上記項3に記載のコーティングされた基材。
(項6)
前記電気伝導性複合基材が、前記基材の前記表面上に堆積した電気伝導性コーティング層を含む、上記項3に記載のコーティングされた基材。
(項7)
前記電気伝導性コーティング層が、
(I)(a)ハロゲン化ポリオレフィン;
(b)前記ポリオレフィン(a)とは異なるフィルム形成ポリマー;および
(c)電気伝導性顔料
を含む組成物;または
(II)(A)樹脂性バインダー;および
(B)前記樹脂性バインダー中に分散した少なくとも1種の電気伝導性顔料
を含む組成物
から堆積し、前記樹脂性バインダー(A)が、(1)反応性官能基を含有するポリマー、および(2)前記ポリマー(1)上の前記官能基と反応性の官能基を有する硬化剤を含む、上記項6に記載のコーティングされた基材。
(項8)
前記電気伝導性複合基材が、前記樹脂性マトリックスの至る所に分布しており、かつ亜鉛、フェロホスホル、タングステン、炭素、ニッケル、アルミニウム、銅、鉄、鋼、二硫化モリブデン、酸化鉄、アンチモンをドープした二酸化チタン、ニッケルをドープした二酸化チタン、黒鉛、銀、および/またはアルミニウム粒子の一つまたは一つより多くを含む電気伝導性粒子性充填剤をさらに含む、上記項1に記載のコーティングされた基材。
(項9)
前記電気伝導性複合基材が、前記基材の前記表面上に堆積した電気伝導性コーティング層を含む、上記項1に記載のコーティングされた基材。
(項10)
前記電気伝導性コーティング層が、
(I)(a)ハロゲン化ポリオレフィン;
(b)前記ポリオレフィン(a)とは異なるフィルム形成ポリマー;および
(c)電気伝導性顔料
を含む組成物;または
(II)(A)樹脂性バインダー;および
(B)前記樹脂性バインダー中に分散した少なくとも1種の電気伝導性顔料
を含む組成物
から堆積し、前記樹脂性バインダー(A)が、(1)反応性官能基を含有する少なくとも1種のポリマー、および(2)前記ポリマー(1)上の前記官能基と反応性の官能基を有する少なくとも1種の硬化剤を含む、上記項9に記載のコーティングされた基材。
(項11)
プラスチック電気伝導性基材をコーティングするプロセスであって、
(a)前記基材上に硬化可能電着可能コーティング組成物を電気泳動的に堆積させ、前記基材の少なくとも一部上に電着したコーティングを形成するステップであって、前記電着可能コーティング組成物は、水性媒体中に分散した樹脂相を含み、前記樹脂相は、
(1)アクリル、ポリエステル、ポリウレタンおよび/またはポリエポキシドポリマーを含む活性水素含有カチオン性またはアニオン性樹脂を含有する樹脂構成要素;ならびに
(2)硬化剤
を含むステップと、
(b)250°F未満の温度に前記基材上の前記電着したコーティングを硬化させるのに十分な時間、コーティングされた前記基材を加熱するステップと
を含む、プロセス。
(項12)
ステップ(b)において、前記コーティングされた基材が、225°F未満の温度に加熱される、上記項11に記載のプロセス。
(項13)
前記電気伝導性基材が、繊維で強化された樹脂性マトリックスを含む、上記項11に記載のプロセス。
(項14)
前記繊維が、電気伝導性である、上記項13に記載のプロセス。
(項15)
前記電気伝導性複合基材が、前記樹脂性マトリックスの至る所に分布しており、かつ亜鉛、フェロホスホル、タングステン、炭素、ニッケル、アルミニウム、銅、鉄、鋼、二硫化モリブデン、酸化鉄、アンチモンをドープした二酸化チタン、ニッケルをドープした二酸化チタン、黒鉛、銀、および/またはアルミニウム粒子の一つまたは一つより多くを含む電気伝導性粒子性充填剤をさらに含む、上記項14に記載のプロセス。
(項16)
前記電気伝導性複合基材が、前記基材の前記表面上に堆積した電気伝導性コーティング層を含む、上記項14に記載のプロセス。
(項17)
前記電気伝導性コーティング層が、
(I)(a)ハロゲン化ポリオレフィン;
(b)前記ポリオレフィン(a)とは異なるフィルム形成ポリマー;および
(c)電気伝導性顔料
を含む組成物;または
(II)(A)樹脂性バインダー;および
(B)前記樹脂性バインダー中に分散した少なくとも1種の電気伝導性顔料
を含む組成物
から堆積し、前記樹脂性バインダー(A)が、(1)反応性官能基を含有する少なくとも1種のポリマー、および(2)前記ポリマー(1)上の前記官能基と反応性の官能基を有する少なくとも1種の硬化剤を含む、上記項16に記載のプロセス。
(項18)
前記電気伝導性複合基材が、前記樹脂性マトリックスの至る所に分布しており、かつ亜鉛、フェロホスホル、タングステン、炭素、ニッケル、アルミニウム、銅、鉄、鋼、二硫化モリブデン、酸化鉄、アンチモンをドープした二酸化チタン、ニッケルをドープした二酸化チタン、黒鉛、銀、および/またはアルミニウム粒子の一つまたは一つより多くを含む電気伝導性粒子性充填剤を含む、上記項11に記載のプロセス。
(項19)
前記電気伝導性複合基材が、前記基材の前記表面上に堆積した電気伝導性コーティング層を含む、上記項11に記載のプロセス。
(項20)
前記電気伝導性コーティング層が、
(I)(a)ハロゲン化ポリオレフィン;
(b)前記ポリオレフィン(a)とは異なるフィルム形成ポリマー;および
(c)電気伝導性顔料
を含む組成物;または
(II)(A)樹脂性バインダー;および
(B)前記樹脂性バインダー中に分散した少なくとも1種の電気伝導性顔料
を含む組成物
から堆積し、前記樹脂性バインダー(A)が、(1)反応性官能基を含有する少なくとも1種のポリマー、および(2)前記ポリマー(1)上の前記官能基と反応性の官能基を有する少なくとも1種の硬化剤を含む、上記項19に記載のプロセス。
Claims (12)
- A)電気伝導性繊維で強化された樹脂性マトリックスを含む電気伝導性複合基材、および
B)前記基材の表面の少なくとも一部上に電気泳動的に堆積した硬化コーティング層
を含むコーティングされた基材であって、前記硬化コーティング層は、
(1)アクリル、ポリエステル、ポリウレタンおよび/またはポリエポキシドポリマーを含む活性水素含有カチオン性またはアニオン性樹脂を含有する樹脂構成要素;ならびに
(2)硬化剤
を含む硬化可能電着可能コーティング組成物から堆積する、コーティングされた基材。 - 前記樹脂性マトリックスが、ポリスチレン、ポリアニリン、ポリピロール、ポリエポキシド、ポリ(メタクリル酸メチル)、ポリウレタン、および/またはポリカーボネートを含む、請求項1に記載のコーティングされた基材。
- 前記繊維が、ステンレス鋼繊維、銅繊維、ニッケル繊維、銀繊維、アルミニウム繊維、金属メッキしたガラス繊維、および/または炭素繊維を含む、請求項1に記載のコーティングされた基材。
- 前記電気伝導性複合基材が、前記樹脂性マトリックスの至る所に分布しており、かつ亜鉛、フェロホスホル、タングステン、炭素、ニッケル、アルミニウム、銅、鉄、鋼、二硫化モリブデン、酸化鉄、アンチモンをドープした二酸化チタン、ニッケルをドープした二酸化チタン、黒鉛、銀、および/またはアルミニウム粒子の一つまたは一つより多くを含む電気伝導性粒子性充填剤をさらに含む、請求項1に記載のコーティングされた基材。
- A)繊維で強化された樹脂性マトリックスを含む電気伝導性複合基材、および
B)前記基材の表面の少なくとも一部上に電気泳動的に堆積した硬化コーティング層
を含むコーティングされた基材であって、前記硬化コーティング層は、
(1)アクリル、ポリエステル、ポリウレタンおよび/またはポリエポキシドポリマーを含む活性水素含有カチオン性またはアニオン性樹脂を含有する樹脂構成要素;ならびに
(2)硬化剤
を含む硬化可能電着可能コーティング組成物から堆積し、
前記電気伝導性複合基材が、前記樹脂性マトリックスの至る所に分布しており、かつ亜鉛、フェロホスホル、タングステン、炭素、ニッケル、アルミニウム、銅、鉄、鋼、二硫化モリブデン、酸化鉄、アンチモンをドープした二酸化チタン、ニッケルをドープした二酸化チタン、黒鉛、銀、および/またはアルミニウム粒子の一つまたは一つより多くを含む電気伝導性粒子性充填剤をさらに含む、コーティングされた基材。 - 前記基材がプラスチックである、請求項1〜5のいずれかに記載のコーティングされた基材。
- プラスチック電気伝導性基材をコーティングするプロセスであって、
(a)前記基材上に硬化可能電着可能コーティング組成物を電気泳動的に堆積させ、前記基材の少なくとも一部上に電着したコーティングを形成するステップであって、前記電着可能コーティング組成物は、水性媒体中に分散した樹脂相を含み、前記樹脂相は、
(1)アクリル、ポリエステル、ポリウレタンおよび/またはポリエポキシドポリマーを含む活性水素含有カチオン性またはアニオン性樹脂を含有する樹脂構成要素;ならびに
(2)硬化剤
を含むステップと、
(b)250°F未満の温度に前記基材上の前記電着したコーティングを硬化させるのに十分な時間、コーティングされた前記基材を加熱するステップと
を含む、プロセス。 - ステップ(b)において、前記コーティングされた基材が、225°F未満の温度に加熱される、請求項7に記載のプロセス。
- 前記電気伝導性基材が、繊維で強化された樹脂性マトリックスを含む、請求項7に記載のプロセス。
- 前記繊維が、電気伝導性である、請求項9に記載のプロセス。
- 前記電気伝導性複合基材が、前記樹脂性マトリックスの至る所に分布しており、かつ亜鉛、フェロホスホル、タングステン、炭素、ニッケル、アルミニウム、銅、鉄、鋼、二硫化モリブデン、酸化鉄、アンチモンをドープした二酸化チタン、ニッケルをドープした二酸化チタン、黒鉛、銀、および/またはアルミニウム粒子の一つまたは一つより多くを含む電気伝導性粒子性充填剤をさらに含む、請求項10に記載のプロセス。
- 前記電気伝導性複合基材が、前記樹脂性マトリックスの至る所に分布しており、かつ亜鉛、フェロホスホル、タングステン、炭素、ニッケル、アルミニウム、銅、鉄、鋼、二硫化モリブデン、酸化鉄、アンチモンをドープした二酸化チタン、ニッケルをドープした二酸化チタン、黒鉛、銀、および/またはアルミニウム粒子の一つまたは一つより多くを含む電気伝導性粒子性充填剤を含む、請求項7に記載のプロセス。
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CN103733277B (zh) * | 2011-08-03 | 2017-03-01 | 日立化成株式会社 | 组合物套剂、导电性基板及其制造方法以及导电性粘接材料组合物 |
US9150736B2 (en) * | 2012-11-27 | 2015-10-06 | Ppg Industries Ohio, Inc. | Methods of coating an electrically conductive substrate and related electrodepositable compositions |
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KR101876144B1 (ko) * | 2017-11-14 | 2018-07-06 | 김종현 | 전기전도도가 개선된 에폭시수지 전착도장 방법 및 장치 |
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RU2627867C1 (ru) | 2017-08-14 |
KR20160019518A (ko) | 2016-02-19 |
US20150017447A1 (en) | 2015-01-15 |
ES2644779T3 (es) | 2017-11-30 |
KR101825851B1 (ko) | 2018-02-05 |
US20170058421A1 (en) | 2017-03-02 |
HK1217027A1 (zh) | 2016-12-16 |
SA516370385B1 (ar) | 2017-07-02 |
AU2014287157A1 (en) | 2016-02-04 |
CA2917502A1 (en) | 2015-01-15 |
US9970123B2 (en) | 2018-05-15 |
CN105473670B (zh) | 2017-08-29 |
PL3019564T3 (pl) | 2018-03-30 |
WO2015006534A1 (en) | 2015-01-15 |
CN105473670A (zh) | 2016-04-06 |
AU2014287157B2 (en) | 2017-02-16 |
SG11201600187XA (en) | 2016-02-26 |
MX2016000327A (es) | 2016-07-15 |
JP2016534218A (ja) | 2016-11-04 |
EP3019564B1 (en) | 2017-09-06 |
CA2917502C (en) | 2017-08-29 |
EP3019564A1 (en) | 2016-05-18 |
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