JP6110310B2 - 発光装置及び発光装置の製造方法 - Google Patents
発光装置及び発光装置の製造方法 Download PDFInfo
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- JP6110310B2 JP6110310B2 JP2013549902A JP2013549902A JP6110310B2 JP 6110310 B2 JP6110310 B2 JP 6110310B2 JP 2013549902 A JP2013549902 A JP 2013549902A JP 2013549902 A JP2013549902 A JP 2013549902A JP 6110310 B2 JP6110310 B2 JP 6110310B2
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- light emitting
- insulating layer
- conductive material
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- electrodes
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- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
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| US201161435368P | 2011-01-24 | 2011-01-24 | |
| US61/435,368 | 2011-01-24 | ||
| PCT/IB2011/056010 WO2012101489A1 (en) | 2011-01-24 | 2011-12-29 | Light emitting device chip scale package |
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| JP2014503124A JP2014503124A (ja) | 2014-02-06 |
| JP2014503124A5 JP2014503124A5 (enExample) | 2015-01-29 |
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| DE102013100470A1 (de) * | 2013-01-17 | 2014-07-17 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| US9577172B2 (en) * | 2013-02-19 | 2017-02-21 | Koninklijke Philips N.V. | Light emitting die component formed by multilayer structures |
| KR102345751B1 (ko) | 2015-01-05 | 2022-01-03 | 삼성전자주식회사 | 반도체 발광소자 패키지 및 그 제조 방법 |
| KR102587215B1 (ko) | 2016-12-21 | 2023-10-12 | 삼성디스플레이 주식회사 | 발광 장치 및 이를 구비한 표시 장치 |
| KR102457271B1 (ko) * | 2021-03-03 | 2022-10-21 | 웨이브로드 주식회사 | 반도체 발광소자용 지지 기판을 제조하는 방법 |
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| JP2000244012A (ja) * | 1998-12-22 | 2000-09-08 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体素子の製造方法 |
| JP3589187B2 (ja) * | 2000-07-31 | 2004-11-17 | 日亜化学工業株式会社 | 発光装置の形成方法 |
| JP4996463B2 (ja) | 2004-06-30 | 2012-08-08 | クリー インコーポレイテッド | 発光デバイスをパッケージするためのチップスケール方法およびチップスケールにパッケージされた発光デバイス |
| TWI294694B (en) * | 2005-06-14 | 2008-03-11 | Ind Tech Res Inst | Led wafer-level chip scale packaging |
| JP2010021261A (ja) * | 2008-07-09 | 2010-01-28 | Toshiba Corp | 光半導体素子の製造方法、光半導体素子及び光半導体装置の製造方法 |
| JP4799606B2 (ja) * | 2008-12-08 | 2011-10-26 | 株式会社東芝 | 光半導体装置及び光半導体装置の製造方法 |
| JP4724222B2 (ja) * | 2008-12-12 | 2011-07-13 | 株式会社東芝 | 発光装置の製造方法 |
| KR101047801B1 (ko) * | 2008-12-29 | 2011-07-07 | 엘지이노텍 주식회사 | 발광 디바이스 패키지 및 그 제조방법 |
| JP5759790B2 (ja) * | 2010-06-07 | 2015-08-05 | 株式会社東芝 | 半導体発光装置の製造方法 |
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| TWI553912B (zh) | 2016-10-11 |
| KR20140004739A (ko) | 2014-01-13 |
| CN103314457A (zh) | 2013-09-18 |
| US8951817B2 (en) | 2015-02-10 |
| EP2668675A1 (en) | 2013-12-04 |
| JP2014503124A (ja) | 2014-02-06 |
| WO2012101489A1 (en) | 2012-08-02 |
| KR101875247B1 (ko) | 2018-07-05 |
| TW201244182A (en) | 2012-11-01 |
| EP2668675B1 (en) | 2019-03-20 |
| US20130292716A1 (en) | 2013-11-07 |
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