JP6107024B2 - 発光装置およびその製造方法 - Google Patents

発光装置およびその製造方法 Download PDF

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Publication number
JP6107024B2
JP6107024B2 JP2012212434A JP2012212434A JP6107024B2 JP 6107024 B2 JP6107024 B2 JP 6107024B2 JP 2012212434 A JP2012212434 A JP 2012212434A JP 2012212434 A JP2012212434 A JP 2012212434A JP 6107024 B2 JP6107024 B2 JP 6107024B2
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Japan
Prior art keywords
light
led chip
light emitting
phosphor layer
emitting device
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JP2012212434A
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English (en)
Japanese (ja)
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JP2014067876A5 (enExample
JP2014067876A (ja
Inventor
大湯　孝寛
孝寛 大湯
忠明 宮田
忠明 宮田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
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Nichia Corp
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Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2012212434A priority Critical patent/JP6107024B2/ja
Publication of JP2014067876A publication Critical patent/JP2014067876A/ja
Publication of JP2014067876A5 publication Critical patent/JP2014067876A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Led Device Packages (AREA)
JP2012212434A 2012-09-26 2012-09-26 発光装置およびその製造方法 Active JP6107024B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012212434A JP6107024B2 (ja) 2012-09-26 2012-09-26 発光装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012212434A JP6107024B2 (ja) 2012-09-26 2012-09-26 発光装置およびその製造方法

Publications (3)

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JP2014067876A JP2014067876A (ja) 2014-04-17
JP2014067876A5 JP2014067876A5 (enExample) 2015-10-15
JP6107024B2 true JP6107024B2 (ja) 2017-04-05

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JP2012212434A Active JP6107024B2 (ja) 2012-09-26 2012-09-26 発光装置およびその製造方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10361351B2 (en) 2017-08-22 2019-07-23 Samsung Electronics Co., Ltd. Semiconductor light emitting element package including solder bump

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10149248B2 (en) * 2014-05-12 2018-12-04 Qualcomm Incorporated Reporting device statistics in wireless communications
JP6308025B2 (ja) * 2014-05-30 2018-04-11 日亜化学工業株式会社 発光装置及び発光装置の製造方法
JP6582382B2 (ja) 2014-09-26 2019-10-02 日亜化学工業株式会社 発光装置の製造方法
CN107210335B (zh) 2015-01-30 2019-07-05 欧司朗光电半导体有限公司 用于制造半导体组件的方法及半导体组件
KR102534245B1 (ko) * 2016-05-04 2023-05-18 삼성전자주식회사 칩 스케일 렌즈를 포함한 발광장치
US10971663B2 (en) 2016-11-08 2021-04-06 Stanley Electric Co., Ltd. Semiconductor light emitting device
JP6800702B2 (ja) * 2016-11-08 2020-12-16 スタンレー電気株式会社 半導体発光装置、および、その製造方法
JP6515940B2 (ja) * 2017-03-17 2019-05-22 日亜化学工業株式会社 発光装置及びその製造方法
DE102017128717B4 (de) * 2017-12-04 2023-03-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Bauteils
KR102675863B1 (ko) * 2019-01-29 2024-06-17 삼성전자주식회사 발광 소자 패키지 및 이의 제조 방법
US11692699B2 (en) * 2019-07-16 2023-07-04 Ngk Spark Plug Co., Ltd. Wavelength conversion member, light source device, and method for manufacturing wavelength conversion member
JP7189451B2 (ja) * 2020-06-30 2022-12-14 日亜化学工業株式会社 発光モジュール、液晶表示装置
CN118867085B (zh) * 2024-07-11 2025-10-03 佛山市国星光电股份有限公司 一种led模组的制备方法及led模组

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JP3022049B2 (ja) * 1993-05-14 2000-03-15 シャープ株式会社 チップ部品型の発光ダイオードの実装方法
DE10214210B4 (de) * 2002-03-28 2011-02-10 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip zur Flip-Chip-Montage auf einen lotbedeckten Träger und Verfahren zu dessen Herstellung
JP3904210B2 (ja) * 2003-04-28 2007-04-11 株式会社リコー 光学電子デバイスの接合方法及び接合構造
JP5177186B2 (ja) * 2003-10-30 2013-04-03 日亜化学工業株式会社 半導体素子用の支持体及びその製造方法並びに半導体装置
JP4516337B2 (ja) * 2004-03-25 2010-08-04 シチズン電子株式会社 半導体発光装置
JP2006073618A (ja) * 2004-08-31 2006-03-16 Toyoda Gosei Co Ltd 光学素子およびその製造方法
WO2010035206A1 (en) * 2008-09-25 2010-04-01 Koninklijke Philips Electronics N.V. Coated light emitting device and method for coating thereof
JP2010098044A (ja) * 2008-10-15 2010-04-30 Toyota Motor Corp 半導体装置の実装方法
JP5278023B2 (ja) * 2009-02-18 2013-09-04 日亜化学工業株式会社 発光装置の製造方法
JP2011009572A (ja) * 2009-06-26 2011-01-13 Citizen Electronics Co Ltd フリップチップ実装型ｌｅｄ及びフリップチップ実装型ｌｅｄの製造方法。
JP5555038B2 (ja) * 2010-04-13 2014-07-23 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置
JP5325834B2 (ja) * 2010-05-24 2013-10-23 株式会社東芝 半導体発光装置及びその製造方法
JP5553741B2 (ja) * 2010-12-22 2014-07-16 スタンレー電気株式会社 発光装置およびその製造方法
JP5537446B2 (ja) * 2011-01-14 2014-07-02 株式会社東芝 発光装置、発光モジュール、発光装置の製造方法
JP5747527B2 (ja) * 2011-01-28 2015-07-15 日亜化学工業株式会社 発光装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10361351B2 (en) 2017-08-22 2019-07-23 Samsung Electronics Co., Ltd. Semiconductor light emitting element package including solder bump

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JP2014067876A (ja) 2014-04-17

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