JP6094062B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

The present invention relates to a light emitting device including a light emitting element and a wavelength conversion member and a method for manufacturing the same .

  An LED (light emitting diode) chip using a nitride semiconductor, which is a light emitting element capable of emitting blue light with high brightness, is used, and a part of the blue light emitted from the LED chip is absorbed on the LED chip to produce yellow light. A light-emitting device that outputs white light by providing a resin layer containing a phosphor that emits light and mixing blue light emitted from an LED chip and yellow light from the resin layer is known.

  For example, in Patent Document 1 and Patent Document 2, a pillar having electrical contact with the contact of each LED is formed on a wafer having a plurality of LEDs formed on a substrate, and a phosphor is added. It is manufactured by embedding LEDs, contacts, and pedestals by coating, flattening and thinning the coating to expose the upper surface of the pedestal, and then dividing the wafer into individual LED chips. An LED chip is described.

  In Patent Document 3, an LED material plate having a large number of LED chips is attached to an expansion sheet, and then divided for each LED chip, and the expansion sheet is stretched to widen the intervals between the LED chips. An LED element manufactured by forming a synthetic resin layer containing a fluorescent substance and dicing a portion between the LED chips of the synthetic resin layer while leaving a part of the synthetic resin layer on the side surface of each LED chip. Is described.

  Further, in Patent Document 4, a large number of flip chip structure LED chips are arranged in a vertical and horizontal direction so that the n-electrode and p-electrode of the LED chip are in close contact with the upper surface of the sheet, and are peelably bonded. Filling the upper surface of the sheet with a light-transmitting synthetic resin containing powder of the substance in a liquid state so that the entire LED chip is embedded and curing it, forming a resin plate, between the LED chips of the resin plate The LED element manufactured by dicing a part with the cutting width narrower than the space | interval dimension between the side surfaces in each LED chip is described.

  In Patent Document 5, an optical element sheet including a plurality of optical elements (LED elements) is collectively bonded to a substrate sheet on which a wiring pattern is formed by flip chip mounting, and then the optical element sheet is diced. A light-transmitting resin layer made of a resin containing a phosphor that separates optical elements, forms a reflective resin layer that is laminated on a substrate sheet and covers a side surface of the optical element, and is further laminated on the optical element and the reflective resin layer An optical device manufactured by dicing the resin layer and the substrate sheet together after forming the substrate is described.

  In Patent Document 6, n-type and p-type nitride semiconductor layers are formed on a transparent substrate so that a plurality of LEDs can be formed, and an n-side electrode and a p-side electrode are formed on each semiconductor layer. An insulating layer having a through hole is formed in each electrode portion, a metal layer is formed in the through hole, and an external connection electrode connected to the metal layer is formed on the surface of the insulating layer, and then the transparent substrate is exposed. Is provided so as to surround the outer periphery of the LED, and the groove is filled with a reflective resin mixed with a white pigment, and further, a fluorescent resin mixed with YAG fluorescent particles is formed on the surface of the transparent substrate, and the groove is filled. There is described a flip-chip mounting type LED manufactured by separating individual LEDs from directly above the reflective resin with a blade having a width narrower than the groove width.

Special table 2010-517289 Special table 2010-517290 JP 2005-5604 A JP 2005-327786 A JP 2011-66193 A JP 2011-9572 A JP 2002-118293 A JP 2003-7929 A

  However, the LED chips described in Patent Document 1 and Patent Document 2 have different emission wavelengths depending on the in-plane part of the wafer, so that the coating with an adhesive added with a phosphor is uniformly applied to all LED chips. In the case where the LED chips are formed, there is a large variation in the emission colors of the LED chips that are finally separated.

  Further, in the LED elements described in Patent Document 3 and Patent Document 4, the gap between the LED chips on the sheet is greatly varied, thereby the thickness of the synthetic resin layer containing the fluorescent material formed on the side surface of the LED chip. Since there is a large variation in the thickness, the light emission color of the LED element varies greatly.

  In the optical device described in Patent Document 5, the optical sheet is diced in a state of being bonded to the substrate sheet, and an optical element having a specific emission wavelength is selected to form a light-transmitting resin layer containing a phosphor. I can't. For this reason, similarly to Patent Document 1 and Patent Document 2, due to the difference in the emission wavelength depending on the in-plane portion of the optical sheet, the light emission color of the optical device varies greatly. Further, this optical device is formed in a form in which an optical element having a light-transmitting resin layer containing a phosphor is mounted in advance on a wiring board.

  In the flip chip mounting type LED described in Patent Document 6, as in Patent Document 1 and Patent Document 2, the emission color of each LED is different depending on the emission wavelength depending on the in-plane portion of the semiconductor layer on the transparent substrate. Will result in large variations. Further, in this flip chip mounting type LED, a reflective resin layer is formed on the side surfaces of the transparent substrate and the insulating layer. On the lower surface side, light is emitted by the n-side electrode and the p-side electrode and the external connection electrode. Due to reflection, sufficient light extraction efficiency cannot always be obtained.

The present invention provides a light emitting device including a light emission element and a wavelength conversion member, and to provide a little variation emitting device emission color.

A light emitting device according to a first invention includes a light emitting element including a substrate and a light emitting element structure in which an n-type semiconductor layer and a p-side semiconductor layer are stacked on the substrate, and the light emission of the light emitting element. An n-side external connection electrode electrically connected to the n-type semiconductor layer and a p-side external connection electrode electrically connected to the p-type semiconductor layer are disposed on the surface side having the element structure. A plate-shaped wavelength converter that converts at least part of the light emitted from the light emitting element into light of a different wavelength and emits the light on one surface of the light emitting element, which is a light extraction surface from the light emitting element. e Bei member, said with covering the other surface of the light emitting element, a light reflectivity of the reflecting member provided so as to surround the entire side surface of the light emitting device, the n-side external connection electrode and said The connection surface for connecting to the outside of the p-side external connection electrode is Is exposed from the front Symbol reflecting member provided on the light emitting element side of the surface having a structure of a light-emitting element, the reflecting member on a side surface of the wavelength conversion member is configured not arranged.

According to such a configuration, the light emitting device, the connection surface of the n-side external connection electrode and the p-side external connection electrode was exposed from the reflection member provided on the surface on the side having the light emitting device structure, the mounting substrate It is a light emitting device that can be mounted on. In the light emitting device, when light (for example, blue light) emitted from the semiconductor light emitting element passes through a wavelength conversion member provided on the light extraction surface side, at least a part of light having a different wavelength (for example, yellow light) It is converted to and taken out to the outside. Further, the light traveling in the lateral direction or downward in the semiconductor light emitting element is reflected by the reflecting member, passes through the wavelength conversion member provided on the light extraction surface side, and is extracted outside. At this time, most, preferably substantially all of the light extracted to the outside passes through the wavelength conversion member. Then, light of a color tone (for example, white light) in which light extracted after wavelength conversion and light extracted without wavelength conversion when passing through the wavelength conversion member is output from the light emitting device.

  In the light emitting device according to the second invention, it is preferable that a reflecting member provided so as to surround the side surface of the light emitting element is provided in contact with the side surface of the light emitting element.

  According to such a configuration, the reflecting member provided in contact with the side surface of the light emitting element directly reflects the light that travels in the lateral direction in the light emitting element and reaches the interface with the light emitting element to the light extraction surface direction. Can lead.

The light emitting device according to the third invention is preferably configured such that the side surface of the wavelength conversion member and the side surface of the reflection member are the same surface .

In the light emitting device according to a fourth aspect of the invention, the wavelength conversion member is a resin containing a phosphor, and covers the one surface of the light emitting element and covers the side surface of the light emitting element of the reflecting member. contact with the upper surface of the portion, the reflecting member is a resin which is contained in the reflector, and Turkey to cover the side surface of the light emitting element is preferable.

In the light emitting device according to the fifth aspect of the invention, it is preferable that the thickness of the portion provided on the side surface of the light emitting element of the reflecting member is 5 μm or more and 1000 μm or less .

According to a sixth aspect of the present invention, there is provided a light emitting device manufacturing method having a light emitting element structure in which an n-type semiconductor layer and a p-type semiconductor layer are stacked on a substrate, and n electrically connected to the n-type semiconductor layer. Preparing a plurality of light emitting elements having a side external connection electrode and a p side external connection electrode electrically connected to the p-type semiconductor layer; and placing the plurality of light emitting elements on a flat jig. An arrangement step of arranging the substrate-side surface and the jig so as to face each other with a predetermined interval, and a light-emitting element arranged in the arrangement step on a surface and a side surface having the light-emitting element structure. At least a part of the light having a wavelength emitted by the light emitting element on the surface of the light emitting element on the substrate side, the step of peeling the light emitting element and the reflecting member from the jig, A wavelength conversion member that converts light into light of different wavelengths Including that a wavelength conversion member forming step, and a singulation step of the light emitting element singulated with the reflecting member and the wavelength conversion member.

According to the light emitting devices according to the first to fifth aspects of the invention, most of the light extracted to the outside, preferably substantially all of it, is configured to pass through the wavelength conversion member. For this reason, the thickness of the wavelength conversion member provided on the light extraction surface is manufactured with high accuracy and the variation of the light emitting elements can be reduced by suppressing the variation of the light emitting elements .
In addition, according to the method for manufacturing a light emitting device according to the sixth aspect of the invention, variations in the light emission color of the light emitting device can be reduced.

It is typical sectional drawing which shows the structure of the light-emitting device which concerns on 1st Embodiment of this invention, (a) shows the whole light-emitting device, (b) shows a semiconductor light-emitting device. It is a flowchart which shows the flow of the manufacturing method of the light-emitting device which concerns on 1st Embodiment of this invention. It is a figure for demonstrating the manufacturing process of the light-emitting device which concerns on 1st Embodiment of this invention, (a) to (j) is typical sectional drawing in each process. It is typical sectional drawing which shows the example of the bump of the light-emitting device which concerns on 1st Embodiment of this invention, (a) shows a mode that bump was formed, (b) shows a mode that the upper part of the bump extended | stretched by grinding | polishing. The light-emitting device which concerns on 1st Embodiment of this invention WHEREIN: The example of the extended electrode for external connection is shown, (a) is a schematic plan view, (b) is typical sectional drawing, (c) is a schematic of another example. A cross-sectional view is shown. It is typical sectional drawing which shows the modification of the manufacturing method of the light-emitting device which concerns on 1st Embodiment of this invention. It is typical sectional drawing which shows the other modification of the manufacturing method of the light-emitting device which concerns on 1st Embodiment of this invention, (a) is an example which provided the recessed part in the upper metal mold | die, (b) is an upper metal mold | die. The example which provided the micro recessed part, (c) shows the example which provided the partition part in the upper metal mold | die. It is typical sectional drawing which shows the structure of the light-emitting device which concerns on 2nd Embodiment of this invention. It is a flowchart which shows the flow of the manufacturing method of the light-emitting device which concerns on 2nd Embodiment of this invention. It is a figure for demonstrating the manufacturing process of the light-emitting device which concerns on 2nd Embodiment of this invention, (a) to (k) is typical sectional drawing in each process. It is typical sectional drawing which shows the structure of the light-emitting device which concerns on 3rd Embodiment of this invention. It is a flowchart which shows the flow of the manufacturing method of the light-emitting device which concerns on 3rd Embodiment of this invention. It is a figure for demonstrating the manufacturing process of the light-emitting device which concerns on 3rd Embodiment of this invention, (a) to (k) is typical sectional drawing in each process. It is typical sectional drawing which shows the structure of the light-emitting device which concerns on 4th Embodiment of this invention. It is a flowchart which shows the flow of the manufacturing method of the light-emitting device which concerns on 4th Embodiment of this invention. It is a figure for demonstrating the manufacturing process of the light-emitting device which concerns on 4th Embodiment of this invention, (a) to (j) is typical sectional drawing in each process. It is typical sectional drawing which shows the structure of the light-emitting device which concerns on 5th Embodiment of this invention. It is a flowchart which shows the flow of the manufacturing method of the light-emitting device which concerns on 5th Embodiment of this invention. It is a figure for demonstrating the manufacturing process of the light-emitting device which concerns on 5th Embodiment of this invention, (a) to (j) is typical sectional drawing in each process. It is typical sectional drawing which shows the structure of the light-emitting device concerning 6th Embodiment of this invention. It is a flowchart which shows the flow of the manufacturing method of the light-emitting device which concerns on 6th Embodiment of this invention. It is a figure for demonstrating the manufacturing process of the light-emitting device which concerns on 6th Embodiment of this invention, (a) to (k) is typical sectional drawing in each process. It is typical sectional drawing which shows the structure of the light-emitting device which concerns on 7th Embodiment of this invention. It is a flowchart which shows the flow of the manufacturing method of the light-emitting device which concerns on 7th Embodiment of this invention. It is a figure for demonstrating the manufacturing process of the light-emitting device which concerns on 7th Embodiment of this invention, (a) to (k) is typical sectional drawing in each process. It is typical sectional drawing which shows the structure of the light-emitting device which concerns on 8th Embodiment of this invention. It is a flowchart which shows the flow of the manufacturing method of the light-emitting device which concerns on 8th Embodiment of this invention. It is a figure for demonstrating the manufacturing process of the light-emitting device which concerns on 8th Embodiment of this invention, (a) to (j) is typical sectional drawing in each process. It is typical sectional drawing which shows the structure of the light-emitting device which concerns on the modification of embodiment of this invention. It is typical sectional drawing which shows the structure of the light-emitting device used for the simulation for demonstrating the effect of this invention, (a) is the light-emitting device based on the Example by which the semiconductor light-emitting element was arrange | positioned in the center, (b) is The light emitting device according to the comparative example in which the semiconductor light emitting element is arranged in the center, (c) is the light emitting device according to the example in which the semiconductor light emitting element is arranged on the left side, and (d) is the comparison in which the semiconductor light emitting element is arranged on the left side. The light-emitting device which concerns on an example is each shown. It is a figure which shows the simulation result for demonstrating the effect of this invention, (a) shows the case where a semiconductor light-emitting device is arrange | positioned in the center, (b) shows the case where a semiconductor light-emitting device is arrange | positioned on the left side, respectively. .

  Hereinafter, a light emitting device and a method for manufacturing the light emitting device according to the present invention will be described.

<First Embodiment>
[Structure of light-emitting element]
The structure of the light emitting device according to the first embodiment of the present invention will be described with reference to FIG. A light emitting device 10 according to the first embodiment of the present invention is an LED, and includes a substrate 1 and a semiconductor light emitting element structure (light emitting element structure) 2 stacked on the substrate 1 (lower side in FIG. 1). Light emitting element (light emitting element) 3, n-side electrode 2 _n and p-side electrode 2 _{p of} semiconductor light emitting element 3, and bump (external connection electrode) 4 _n (4) for electrically connecting to an external mounting substrate, 4 _p (4), the fluorescent layer 5 formed on the upper surface (substrate 1 side) of the semiconductor light emitting device 3 as the light extraction surface, and the side surfaces of the semiconductor light emitting device 3 (that is, the side surfaces of the substrate 1 and the semiconductor light emitting device structure) 2 side surface) and the lower surface (semiconductor light emitting element structure 2 side), and the reflective layer 6 which covers.

  As shown in FIG. 1, in the light emitting device 10, the reflective layer 6 is formed in a U shape whose opening is upward in a cross-sectional view, covers the lower surface that is the surface of the semiconductor light emitting element 3, and surrounds the side surface. It is coated as follows. Since the reflective layer 6 is in close contact with the lower surface and side surfaces of the semiconductor light emitting element 3, the reflective layer 6 has a structure that is difficult to peel from the light emitting device 10. The reflective layer 6 is formed as an integral resin layer. That is, the reflective layer 6 does not include an interface inside. Therefore, the reflective layer 6 is formed from the light emitting device 10 as compared with the case where the reflective layer 6 includes an interface between a region provided on the lower surface side of the semiconductor light emitting element 3 and a region provided around the side surface of the semiconductor light emitting element 3. Hard to peel. The fluorescent layer 5 is formed in a flat plate shape, and is in close contact with the upper surface of the semiconductor light emitting device 3 and the upper surface of the portion of the reflective layer 6 that covers the side surface of the semiconductor light emitting device 3.

  In the present embodiment, the “U-shape” is not limited to a U-shape in all cross sections, and as shown in FIG. 1A, bumps provided through the reflective layer 6 Even when a part of the reflective layer 6 is divided in a cross section including 4, when the other cross section is “U-shaped”, the reflective layer 6 is formed in “U-shaped” in a cross-sectional view. It shall be. The same applies to other embodiments described later, and the same applies to the case where the fluorescent layer 5 is partially cut off by the bumps 4 (see, for example, FIG. 20).

The light emitting device 10 is a face-down mounting type LED that is mounted with the surface on the semiconductor light emitting element structure 2 side facing the mounting substrate side.
Like the light emitting device according to the present embodiment, the n-side external connection electrode and the p-side external connection electrode are provided on the other surface side opposite to the light extraction surface of the light emitting element, and the connection surface is It is preferably exposed from the reflecting member.
According to this configuration, the light-emitting device is a face-down mounting type light-emitting device. For this reason, the light from the active layer is extracted outside from the substrate side, which is the light extraction surface, while being shielded by the n-side external connection electrode and the p-side external connection electrode. In addition, since the active layer is located on the other surface side of the light emitting device, light is easily incident uniformly on the wavelength conversion member via the substrate. Furthermore, since the connection surface of the external connection electrode is provided on the mounting surface of the light emitting device, the heat generated from the light emitting element can be efficiently radiated through the external connection electrode.
Further, according to the light emitting device according to the present embodiment, the light emitting device is a face-down mounting type light emitting device, and thus light can be efficiently extracted outside by avoiding light shielding by the external connection electrode on the light extraction surface side. it can. Further, since the heat is efficiently radiated through the external connection electrode, a light emitting device having excellent heat dissipation can be obtained.

In this specification, the “semiconductor light-emitting element structure” means that an n-type semiconductor layer 2a and a p-type semiconductor layer 2c are stacked (preferably, an active layer 2b is interposed between them as shown in FIG. 1B). A basic structure that functions as a light-emitting element including a stacked structure. In addition, the semiconductor light emitting element structure 2 includes an n-side electrode 2 _n electrically connected to the n-type semiconductor layer 2 a on the same surface side of the substrate 1 and a p-side electrode 2 electrically connected to the p-type semiconductor layer 2 b. and a structure having _p .

In the present specification, in the first embodiment and other embodiments, the vertical direction is basically as shown in the drawings explaining each embodiment. For example, the upper surface of the light emitting device 10 according to the first embodiment shown in FIG. 1A is the upper surface of the fluorescent layer 5, and the lower surface of the light emitting device 10 is the lower surface of the reflective layer 6 and the lower surface of the bump 4. Moreover, the upper surface of the light emitting device 10G according to the eighth embodiment shown in FIG. 25 is the upper surface of the fluorescent layer 5 and the upper surface of the bump 4, and the lower surface of the light emitting device 10G is the lower surface of the reflective layer 6.
Further, the shape in a bottom view means a shape seen from below, and the shape in a plan view means a shape seen from above.

  In the present specification, for the semiconductor light emitting element 3, the surface on which the semiconductor light emitting element structure 2 is formed is referred to as a front surface, and the substrate 1 side is referred to as a back surface. Similarly, for the substrate 1, the surface on which the semiconductor light emitting element structure 2 is formed is called a front surface, and the opposite surface is called a back surface. Further, in FIG. 1A, the light emitting device 10 of the present embodiment is a face-down mounting type LED, so the semiconductor light emitting element structure 2 is provided on the lower side with respect to the substrate 1, For convenience, in the description of the stacked structure of the semiconductor light emitting element structure 2, the direction away from the substrate surface may be referred to as “up”.

  In addition, the light emitting device 10 according to the present embodiment uses a blue light emitting diode in which a semiconductor light emitting element structure 2 made of a nitride semiconductor is stacked on a translucent substrate 1 as the semiconductor light emitting element 3. Using a resin layer containing a phosphor that absorbs blue light emitted from the semiconductor light emitting element 3 and emits yellow light, the blue light emitted from the semiconductor light emitting element 3 and the yellow light emitted from the fluorescent layer 5 are mixed. A white light emitting diode that outputs white light will be described as an example.

  Note that this embodiment does not limit the scope of application of the present invention. For example, the light emitted from the semiconductor light emitting element structure 2 is not limited to blue light, but violet light, ultraviolet light, and other light. It may be a color. Further, the fluorescent layer 5 is not limited to the one that converts to yellow light, and may be one that converts to red light or green light, and contains a plurality of types of phosphors that convert to red light and green light. It may be. The mixed output light is not limited to white light, and may be chromatic color light. Further, the semiconductor light emitting device structure 2 is not limited to a nitride semiconductor, and may be one using other semiconductor materials.

  Hereinafter, each component of the light emitting device 10 will be described in detail.

(substrate)
The substrate 1 only needs to be formed of a substrate material capable of epitaxially growing a nitride semiconductor, and the size and thickness are not particularly limited. As such a substrate material, an insulating substrate such as sapphire or spinel (MgA1 ₂ O ₄ ) whose main surface is any one of C-plane, R-plane, and A-plane, silicon carbide (SiC), silicon, ZnS ZnO, Si, GaAs, diamond, and oxide substrates such as lithium niobate and neodymium gallate that are lattice-bonded to a nitride semiconductor. In addition, since the light emitting device 10 according to the present embodiment is mounted face down, the back surface side (substrate 1 side) of the semiconductor light emitting element 3 that is the upper surface side of the light emitting device 10 is a light extraction surface. Accordingly, since the light emitted from the semiconductor light emitting element structure 2 is transmitted through the substrate 1 and emitted from the light extraction surface, the substrate 1 is preferably transparent at least with respect to the wavelength of the light.

(Semiconductor light emitting device structure (light emitting device structure))
The semiconductor light emitting device structure 2 is a basic structure that functions as a light emitting device including a stacked structure in which an n-type semiconductor layer 2a made of, for example, a gallium nitride-based compound semiconductor, an active layer 2b, and a p-type conductor layer 2c are stacked. It is the body. In the present embodiment, the semiconductor light emitting device structure 2 includes a full-surface electrode 2d and a cover electrode 2e laminated on the p-type semiconductor layer _2p (lower side in FIG. 1), and an n-type on the same plane side of the substrate 1. An LED having an n-side electrode 2 _n electrically connected to the semiconductor layer 2 a and a p-side electrode 2 _p on the upper surface of the cover electrode 2 e electrically connected to the p-type semiconductor layer 2 c is configured.

Incidentally, the whole surface electrode 2d is on the p-type semiconductor layer 2c, is provided so as to cover substantially the entire surface of the p-type semiconductor layer 2c, and current supplied through the p-side electrode 2 _p and the cover electrode 2e, p-type It is an electrode for uniformly diffusing over the entire surface of the semiconductor layer 2c. Further, in the light emitting device 10 according to the present embodiment that is mounted face down, a reflective layer for reflecting the light emitted from the active layer 2b to the upper surface side (the back surface side of the substrate 1) of the light emitting device 10 that is the light extraction surface. It also has the function as

  Further, the entire surface electrode 2d is preferably an ohmic electrode that can be electrically connected to the p-type semiconductor layer 2c, and has a good reflectance at least with respect to the wavelength of light emitted from the active layer 2b. It is preferable. Therefore, as the entire surface electrode 2d, a single layer film of Ag having a high light reflectivity and a multilayer film of Ni, Ti, etc. with Ag as the lowermost layer can be suitably used. More preferably, an Ag / Ni / Ti / Pt multilayer film with Ag as the lowermost layer (p-type semiconductor layer 2c side) can be used, and the film thickness of each multilayer film is, for example, about 1000 nm. Can do. The full-surface electrode 2d can be formed by sequentially laminating these materials by, for example, sputtering or vapor deposition.

Cover electrode 2e covers the upper and side surfaces of the entire electrode 2d, to shield the p-side electrode 2 _p from the entire surface electrode 2d, of the material of the entire electrode 2d, especially functions as a barrier layer for preventing the migration of Ag .

  As the cover electrode 2e, for example, a single layer film of a metal such as Ti, Au, or W or a multilayer film of these metals can be used. Preferably, a multilayer film of Ti (lowermost layer) / Au / W / Ti with Ti as the lowermost layer (entire electrode 2d side) can be used, and the film thickness of this multilayer film is, for example, 2 nm from the lower layer side. It can be set to 1700 nm, 120 nm, and 3 nm.

  In this embodiment, the full-surface electrode 2d and the cover electrode 2e are provided only on the p-type semiconductor layer 2c. However, the full-surface electrode 2d and the cover electrode 2e may be provided on the n-type semiconductor layer 2a. Good.

The n-side electrode 2 _n is electrically connected to the n-type semiconductor layer 2 a, and the p-side electrode 2 p is electrically connected to the p-type semiconductor layer 2 c via the cover electrode 2 e and the entire surface electrode 2 d, respectively. This is a pad electrode for supplying current from. The n-side electrode 2 _n is provided on the exposed surface of the n-type semiconductor layer 2 a of the semiconductor light emitting element structure 2. The p-side electrode 2 _p is provided on the upper surface of the cover electrode 2 e of the semiconductor light emitting element structure 2. Bumps 4 _n and bumps 4 _p are provided on the upper surfaces of the n-side electrode 2 _n and the p-side electrode 2 _p , respectively.

The n-side electrode 2 _n and the p-side electrode 2 _p are preferably made of a material having low electric resistance, and a single layer or a multilayer film of metals such as Au, Cu, Ni, Al, Pt, and alloys thereof can be used. . The n-side electrode 2 _n and the p-side electrode 2 _p are, for example, a multilayer film having a Cu single layer or a Cu / Ni laminated film as a lower layer (n-type semiconductor layer 2a, cover electrode 2e side) and an Au or AuSn alloy as an upper layer. It can be.

In order to obtain good electrical contact between the n-side electrode _2n and the n-type semiconductor layer 2a, the lowermost layer (n-type semiconductor layer 2a side) of the n-side electrode _2n is made of Ti, Al, AlCuSi alloy or the like. It is preferable to use a multilayer film such as Ti / Au, Al / Ti / Au, Al / Ti / Pt / Au, Ti / Pt / Au, AlCuSi / Ti / Pt / Au with the left end as the bottom layer. it can. Further, when an AlCuSi alloy is used as the lowermost layer and a multilayer film of AlCuSi / Ti / Pt / Au is used, the thickness of each layer can be set to, for example, 500 nm, 150 nm, 50 nm, and 700 nm, respectively.

(Bump (external connection electrode))
The bump (n-side external connection electrode) 4 _n and the bump (p-side external connection electrode) 4 _p are electrically connected to the n-side electrode 2 _n and the p-side electrode 2 _p , respectively. It is an electrode for external connection for connecting to an external circuit.
The bump 4 _n and the bump 4 _p are disposed on the same surface side of the substrate 1, penetrate the reflective layer 6, and the lower surface that is a connection surface with an external circuit is exposed.

As the bump 4 _n and the bump 4 _p (hereinafter abbreviated as “bump 4” as appropriate), a single layer film of Au, Cu, Ni, Ag, or an alloy containing these metals, or a multilayer film thereof can be used. Au is preferable because of its low electric resistance and contact resistance, but an AuSn alloy that is an inexpensive alloy with Sn can be used.

  In the case of a single layer structure, the bump 4 can be formed by a wire bonder using the wire material described above. In the case of a single layer structure or a multilayer structure, it can also be formed by a plating process such as electrolytic plating or electroless plating.

(Fluorescent layer (wavelength conversion member))
The fluorescent layer 5 is provided on the upper surface side of the light emitting device 10 that is the light extraction surface, that is, on the back surface side of the substrate 1, absorbs part of the light of the wavelength emitted by the semiconductor light emitting element structure 2, and converts it into light of different wavelengths It is a wavelength conversion member comprised by the resin layer containing the fluorescent substance which converts and light-emits.
The fluorescent layer 5 is formed by containing a fluorescent substance in a resin serving as a binder. In addition to the phosphor, a diffusing agent may be contained. Furthermore, the fluorescent layer 5 can have not only a single layer structure but also a multilayer structure, and may be composed of a plurality of layers containing different types of phosphors. Further, a light-transmitting member such as a layer containing a diffusing agent, a layer having unevenness on the surface, and / or a convex lens may be laminated on the fluorescent layer 5.

  The thickness of the fluorescent layer 5 can be determined by the phosphor content, the color tone after color mixing of the light emitted from the semiconductor light emitting device structure 2 and the light after wavelength conversion, etc., for example, 1 μm or more and 1000 μm Or less, preferably 5 μm or more and 500 μm or less, and more preferably 10 μm or more and 200 μm or less.

(Phosphor)
The phosphor contained in the phosphor layer 5 is an yttrium-aluminum oxide activated with Ce (cerium) and capable of emitting light when excited by the light emitted from the semiconductor light emitting device 3 having a nitride semiconductor as an active layer. Those based on phosphors can be used. Specific examples of the yttrium / aluminum oxide phosphor include YAlO ₃ : Ce, Y ₃ Al ₅ O ₁₂ Y: Ce (YAG: Ce), Y ₄ Al ₂ O ₉ : Ce, and a mixture thereof. Can be mentioned. The yttrium / aluminum oxide phosphor may contain at least one of Ba, Sr, Mg, Ca, and Zn. Moreover, by containing Si, the reaction of crystal growth can be suppressed and phosphor particles can be aligned.

Other phosphors that can absorb blue, blue-green, and green and emit red light are sapphire (aluminum oxide) phosphors activated with Eu and / or Cr, and activated with Eu and / or Cr. And nitrogen-containing Ca—Al ₂ O ₃ —SiO ₂ phosphor (oxynitride fluorescent glass). Using these phosphors, white light can also be obtained by mixing the light from the light emitting element and the light from the phosphor.

  Further, by combining the YAG phosphor activated with Ce and the nitrogen-containing Ca—Al—Si—O—N oxynitride fluorescent glass activated with Eu and / or Cr, a blue color can be obtained. By using the semiconductor light emitting element 3 capable of emitting light, a white light emitting diode having extremely high color rendering properties including RGB (red, green, blue) components with high luminance can be formed. For this reason, an arbitrary intermediate color can be formed very simply by adding a desired pigment.

(Diffusion agent)
The diffusing agent is added to efficiently diffuse the light emitted from the semiconductor light emitting element 3 and the phosphor. Specifically, titanium oxide, silicon oxide, hollow silicon oxide, aluminum oxide, potassium titanate, zinc oxide, and boron nitride can be used. Also, resin powder such as silicone powder may be used. The average particle diameter of the diffusing agent can be, for example, 0.001 μm or more and 100 μm or less, and preferably 0.005 μm or more and 50 μm or less.

(Binder (resin))
The binder is a resin for binding the above-described phosphor or diffusing agent to the light extraction surface of the semiconductor light emitting element 3 as the fluorescent layer 5. As the resin serving as the binder, a thermosetting resin is preferable. For example, dimethyl silicone resin, phenyl silicone resin, dimethyl / phenyl hybrid silicone resin, epoxy / silicone hybrid resin, fluorine resin, adamantane resin, alicyclic epoxy resin, hybrid epoxy resin, urethane resin, etc. may be used. it can. In particular, silicone resin and fluororesin having high heat resistance, light resistance, and high transmittance are preferable. Further, a glass component may be added to the binder in order to increase the hardness. Moreover, in order to improve the adhesiveness with the semiconductor light emitting element 3, an adhesiveness imparting agent may be added. As an adhesion imparting agent, for example, a silane coupling agent, a titanate coupling agent, an aluminum coupling agent, or the like can be used.

(Reflective layer (reflective member))
The reflective layer 6 is a member for reflecting the light emitted from the semiconductor light emitting element 3 and traveling in the lateral direction or the downward direction to the fluorescent layer 5 side that is the light extraction surface. In the present embodiment, the reflective layer 6 is a resin layer that covers the lower surface of the semiconductor light emitting element 3 (the semiconductor light emitting element structure 2 side), covers the side surface, and contains a reflective material. In addition to the reflective material, the resulting resin may contain a filler.

  Since the reflective layer 6 is provided with the light extraction surface of the semiconductor light emitting element 3 exposed, the light emitted by the semiconductor light emitting element 3 is extracted outside through the fluorescent layer 5 provided on the light extraction surface.

  At this time, part of the light passing through the fluorescent layer 5 is converted into long-wavelength light by the phosphor contained in the fluorescent layer 5 and extracted outside, and other light is emitted from the semiconductor light emitting element 3. The emitted light having the same wavelength is transmitted through the fluorescent layer 5 and extracted outside. The light emitting device 10 outputs light (white light) in which light (yellow light) extracted after wavelength conversion by the phosphor and light (blue light) extracted without wavelength conversion are mixed.

  Here, the thickness of the fluorescent layer 5 is adjusted with high accuracy, and variation in thickness between chips is suppressed. Further, most, preferably substantially all of the light extracted from the light emitting device 10 to the outside passes through the fluorescent layer 5. At this time, a part of the light passing through the fluorescent layer 5 is wavelength-converted and extracted outside. For this reason, there is little dispersion | variation in the light emitting elements of the ratio of the color mixture of the light output from the light-emitting device 10. FIG. Therefore, variation in the emission color of the light emitting device 10 can be reduced.

  The thickness of the reflective layer 6 is preferably sufficient to reflect the light emitted from the semiconductor light emitting element 3. The thickness of the reflective layer 6 formed on the surface of the semiconductor light emitting element 3 (on the semiconductor light emitting element structure 2 side) can be, for example, 1 μm or more and 500 μm or less, and preferably 5 μm or more and 200 μm or less, More preferably, it is 10 μm or more and 100 μm or less. Further, the thickness of the reflective layer 6 on the side surface of the semiconductor light emitting element 3 can be, for example, 1 μm or more and 2000 μm or less, preferably 5 μm or more and 1000 μm or less, and preferably 10 μm or more and 500 μm or less. Is more preferable.

  In particular, it is preferable to adjust the addition amount of the reflective material in consideration of a certain degree of variation in the thickness of the reflective layer 6 on the side surface side of the semiconductor light emitting element 3. That is, when the thickness of the reflective layer 6 is the smallest within the range of the variation, the reflectance of the reflective layer 6 determined by the thickness, the amount of the reflective material added, etc. It is preferable to form the reflective layer 6 by adjusting the amount of the reflective material added so that the reflectance is sufficient to reflect substantially all.

(Binder (resin))
The binder is a resin for binding the above-described reflective material and filler to the side surface and the surface (semiconductor light emitting element structure 2 side) of the semiconductor light emitting element 3 as the reflective layer 6. As resin used as a binder, the same thing as the binder used for the above-mentioned fluorescent layer 5 can be used.

(Reflective material)
The reflective material is a member that reflects the light emitted from the semiconductor light emitting element 3. As the reflecting material, the same diffusing agent used for the fluorescent layer 5 described above can be used.

(filler)
The filler is added to increase the strength of the reflective layer 6 that is a resin layer and to increase the thermal conductivity of the reflective layer 6. As the filler, glass fiber, whisker, aluminum oxide, silicon oxide, boron nitride, zinc oxide, aluminum nitride, or the like can be used.

[Operation of light-emitting device]
The light emitting device 10 according to the first embodiment of the present invention shown in FIG. 1 includes a wiring electrode on a mounting substrate via a bump 4 _n and a bump 4 _p that are electrically connected to an n-side electrode and a p-side electrode, respectively. When a current is supplied through (not shown), the semiconductor light emitting element 3 emits blue light. The blue light emitted from the semiconductor light emitting element 3 is reflected directly or by the reflective layer 6, the n-side electrode 2 _n , the p-side electrode 2 _p , the full-surface electrode 2 d, etc., and the substrate 1 side (upward direction in FIG. 1). Is taken out through the fluorescent layer 5. At this time, a part of the blue light passing through the fluorescent layer 5 is absorbed by the phosphor contained in the fluorescent layer 5, converted into yellow light having a long wavelength, and extracted. The light emitting device 10 outputs white light in which blue light passing through the fluorescent layer 5 without wavelength conversion and yellow light wavelength-converted by the fluorescent layer 5 are mixed.

  At this time, the thickness of the fluorescent layer 5 covering the back surface of the substrate 1 is formed with high accuracy, and variation between the light emitting devices is suppressed. The light traveling in the lateral direction in the semiconductor light emitting element 3 is reflected by the reflective layer 6 in the light extraction surface direction. Here, even when the thickness of the reflective layer 6 is the smallest within the range of variation, the amount of reflection material added so that a reflectance sufficient to reflect substantially all of the light incident on the reflective layer 6 can be obtained. By adjusting the thickness and forming the reflective layer 6, variations in the thickness of the reflective layer 6 do not affect the emission color of the light emitting device 10. That is, most of the light emitted from the semiconductor light emitting element 3 and extracted to the outside, preferably substantially all of the light, passes through the fluorescent layer 5 whose thickness is accurately adjusted. Accordingly, since there is less variation between the light emitting devices in the ratio of the light that passes through the fluorescent layer 5 and the light that is not wavelength converted, the color tone of the white light that is mixed and output from the light emitting device 10 is reduced. Variations can be reduced.

[Method of manufacturing light emitting device]
The manufacturing method of the light-emitting device in 1st Embodiment of this invention is demonstrated with reference to FIG.

  As shown in FIG. 2, the manufacturing method of the light emitting device in the first embodiment includes a light emitting element structure forming step S100, a bump forming step S101, a first singulation step S102, a chip sorting step S103, Carrier sticking step S104, reflective layer forming step S105, reflective layer thickness adjusting step S106, cleaning step S107, second carrier sticking step S108, fluorescent layer forming step S109, and fluorescent layer thickness adjusting step S110 And the second singulation step S111 are sequentially performed.

Hereinafter, each step will be described in detail with reference to FIG. 3 (refer to FIGS. 1 and 2 as appropriate).
In the present embodiment, the semiconductor light emitting device 3 in a wafer state in which the semiconductor light emitting device structure 2 in which the nitride semiconductor is stacked on the substrate 1 is arranged in a matrix is manufactured by a known method. Processes after the manufacturing process of the semiconductor light emitting element 3 will be described with reference to the drawings.

(Light-emitting element structure forming step: S100)
The light emitting element structure forming step S100 for forming the semiconductor light emitting element structure 2 on the substrate 1 will be specifically described. First, the MOVPE method (metal organic vapor phase epitaxy) is used on the substrate 1 made of sapphire or the like. Each of the semiconductor layers constituting the n-type semiconductor layer 2a, the active layer 2b, and the p-type semiconductor layer 2c made of a compound semiconductor such as gallium nitride is grown.

Next, a part of the n-type semiconductor layer 2a is exposed in order to form the n-side electrode _2n . A mask having a predetermined shape is formed on the wafer with a photoresist, and p-type semiconductor layer 2c, active layer 2b, and a part of n-type semiconductor layer 2a are removed by RIE (reactive ion etching). The n-type semiconductor layer 2a is exposed. After the etching, the resist is removed.

Next, as a full-surface electrode 2d, for example, a multilayer film in which Ag / Ni / Ti / Pt is sequentially laminated is formed on the entire surface of the wafer by sputtering. Then, an entire surface electrode 2d having a predetermined shape is formed by photolithography. Thereafter, as the cover electrode 2e, for example, a multilayer film formed by sequentially laminating Ti / Au / W / Ti is formed by sputtering. Then, a cover electrode 2e having a predetermined shape that shields the entire surface electrode 2d is formed by photolithography.
As described above, the semiconductor light emitting device 3 in which the semiconductor light emitting device structure 2 is formed on the substrate 1 is obtained.

Further, a protective layer may be formed on the entire surface of the semiconductor light emitting element structure 2 by laminating insulating SiO ₂ or the like, for example, by sputtering.

(Bump forming step (external connection electrode forming step): S101)
Next, in the bump forming step S101, bumps 4 are formed on the upper surface of the semiconductor light emitting element structure 2 as shown in FIG. As the bump 4, the bump 4 _n and the bump 4 _p are formed on the n-side electrode 2 _n and the p-side electrode 2 _p (see FIG. 1B), respectively.

The bump 4 can be formed on the n-side electrode 2 _n and the p-side electrode 2 _p (see FIG. 1B) using a wire bonder. Here, with reference to FIG. 4, the formation method of the bump 4 using a wire bonder is demonstrated.

FIG. 4A shows a semiconductor light emitting device structure 2 (n-side electrode 2 _n or p-side electrode 2 _p (see FIG. 1B) using a wire bonder and a wire (bonding wire) such as Au (gold). 4 (a), a spherical metal lump is formed at the end of the bonding wire connected to the semiconductor light emitting element structure 2 by the wire bonder. The bonding wire is cut at the upper part of this metal lump, and the remaining metal lump becomes the bump 4. The metal lump can be laminated on the formed metal lump by the same operation.

  The method for forming the bumps 4 is not limited to this. For example, a mask pattern having an opening in the bump formation region can be formed using a photoresist, and metal bumps can be formed by electrolytic plating or electroless plating. .

(First piece separation step: S102)
Returning to FIG. 3, next, in the first singulation step S <b> 102, as shown in FIG. 3B, the semiconductor light emitting element 3 on which the bumps 4 are formed is attached to a dicing sheet (not shown), and dicing is performed. Cut along the boundary 20 of the element structure, and divide into chips 11.

(Chip selection process: S103)
Next, in the chip selection step S103, each chip 11 separated is formed on the n-side electrode _2n and the p-side electrode _2p (see FIG. 1B) of the semiconductor light emitting element structure 2. A power supply device is connected to the bump 4 to cause the chip 11 to emit light, and the emission wavelength is measured. Then, the chips 11 whose emission wavelengths are in a predetermined range are selected.

(First carrier pasting step (array step): S104)
Next, in the first carrier pasting step S104, the chips 11 sorted in the chip sorting step S103 are arranged on the carrier 30 to which the adhesive sheet 40 is pasted with a predetermined interval with the bumps 4 facing upward. The chips 11 arranged on the carrier 30 are affixed to the carrier 30 by the adhesive sheet 40 and the position thereof is maintained.

  In the first carrier sticking step S <b> 104, for example, the chips 11 can be adsorbed one by one using a collet and arranged on the carrier 30. At this time, the gap between the chips 11 is allowed to vary to some extent.

  Here, the carrier (flat jig) 30 is a plate-like jig that holds the arrangement of the chips 11. The carrier 30 can be a plate-shaped member such as ceramic, glass, metal, or plastic having rigidity.

(Reflective layer forming step (reflective member forming step): S105)
Next, in the reflective layer formation step S105, as shown in FIG. 3D, the reflective layer 6 is formed on the surface (semiconductor light emitting element structure 2 side) and side surfaces of the chip 11 attached to the carrier 30. Specifically, the carrier 30 is placed on the lower mold 50, a resin containing a reflective material is applied on the surface on which the chips 11 are arranged, and sandwiched by the upper mold 51. And it heats and hardens (primary hardening) until the intensity | strength which can be released from the upper metal mold | die 51 is obtained. Thereafter, the carrier 30 is taken out from the upper and lower molds 50 and 51 and put into an oven to sufficiently cure (secondary curing) the resin of the reflective layer 6.

  In the example described above, the resin is applied onto the chip 11 and then the upper mold 51 is lowered and compression molded. However, the molding method is not limited to this. For example, the upper and lower molds 50 and 51 may be installed at predetermined positions, and transfer molding in which resin is injected from the gap between the upper and lower molds 50 and 51 may be performed.

(Reflection layer thickness adjustment step: S106)
Next, in the reflective layer thickness adjusting step S106, as shown in FIG. 3E, the surface of the reflective layer 6 (the lower surface in FIG. 3E) is polished using a polishing machine 60 ( (Or grinding) to expose the bumps 4 and polish (or grind) to a predetermined polishing line 61 to adjust the reflective layer 6 to a predetermined thickness.

(Cleaning step: S107)
Next, in the cleaning step S107, as shown in FIG. 3F, the chip 11 integrated with the reflective layer 6 is peeled off from the carrier 30 to remove burrs, dust, and the like generated by polishing.

  As a cleaning method, a water jet can be used. As other cleaning methods, for example, plasma irradiation, laser irradiation, blasting, or the like can be used.

(Second carrier pasting step: S108)
Next, in 2nd carrier sticking process S108, as shown in FIG.3 (g), the adhesive sheet 40 was affixed so that the board | substrate 1 might become an upper side, as shown in FIG.3 (g). Affix to carrier 30. In addition, the carrier 30 and the adhesive sheet 40 used at this process can use the thing similar to what was used at 1st carrier sticking process S104.

(Fluorescent layer forming step (wavelength conversion member forming step): S109)
Next, in the fluorescent layer forming step S109, as shown in FIG. 3H, the fluorescent layer 5 is formed on the surface of the chip 11 on the substrate 1 side. Specifically, the carrier 30 can be placed on the lower mold 50, a phosphor-containing resin is applied on the back surface of the chip 11, and sandwiched by the upper mold 51 to be released from the upper mold 51. It is heated and cured (primary curing) until strength is obtained. Thereafter, the carrier 30 is taken out from the upper and lower molds 50 and 51 and put into an oven to sufficiently cure (secondary curing) the resin of the fluorescent layer 5.

  In addition, this process is not limited to compression molding similarly to the above-described reflective layer forming process S105, and other molding methods such as transfer molding may be used.

(Fluorescent layer thickness adjustment step: S110)
Next, in the fluorescent layer thickness adjusting step S110, as shown in FIG. 3 (i), the lower surface of the fluorescent layer 5 (the lower surface in FIG. 3 (i)) is determined in advance using a polishing machine 60. The phosphor layer 5 is adjusted to a predetermined thickness by polishing (or grinding) up to the polishing line 62 previously set. Thereby, the color tone of the luminescent color of the light-emitting device 10 can be adjusted.

(Second piece separation step: S111)
Finally, in the second singulation step S111, as shown in FIG. 3 (j), the light emitting device 10 integrated by the reflective layer 6 and the fluorescent layer 5 is attached to a dicing sheet (not shown), and the dicing is performed. By cutting along the boundary line 21 of the light emitting device 10, it is separated into individual pieces. Through the above steps, the light emitting device 10 shown in FIG. 1 can be manufactured.

<Modification of light emitting device>
Next, a modification of the light emitting device according to the first embodiment will be described with reference to FIG. 5 (refer to FIG. 1 as appropriate).

As shown in FIGS. 5A and 5B, the light emitting device 10 according to the first modified example has bumps 4 _n and 4 _p compared to the light emitting device 10 according to the first embodiment shown in FIG. The lead electrode 7 (lead electrode (n-side external connection expansion electrode) 7 _n , lead electrode (p-side external connection extension electrode) 7 _p ) electrically connected to (4) is further provided. As shown in FIG. 5A, the extraction electrode has a portion that is drawn wider than the interval between the bumps 4 _n and 4 _p (4) in the bottom view and has an area wider than the area of the lower surface of the bump 4. 7 _n and 7 _p (7) are provided on the surface of the reflective layer 6 so that the connection with the mounting substrate can be easily performed. In the present embodiment, since the extraction electrode 7 is provided via the reflective layer 6, it is possible to suppress or avoid the propagation and absorption of light emitted from the semiconductor light emitting element 3 to the extraction electrode 7. Can do. Therefore, even if the extraction electrode 7 having a large area is provided, high light extraction efficiency can be maintained.

  Further, as shown in FIG. 5C, the light emitting device 10 in the second modified example is formed so that the extraction electrode 7 is embedded in the reflection layer 6, and the lower surface of the reflection layer 6 and the extraction electrode 7 are formed. It is formed so as to be substantially the same surface as the lower surface of. Note that the shape of the light emitting device 10 in the second modified example viewed from the bottom is the same as the shape of the light emitting device 10 viewed from the bottom in the first modified example.

  The extraction electrode 7 in these modified examples is obtained by pasting a metal foil patterned in the shape of the extraction electrode 7 on the carrier 30 in advance in the step shown in FIG. The integrated chip 11 (see FIG. 3 (f)) is stacked on the carrier 30, and the bump 4 and the extraction electrode 7 are formed by ultrasonic bonding, room temperature bonding, bonding using eutectic or silver paste, and the like. Can be joined together.

  Further, the extraction electrode 7 is formed by laminating and patterning a metal layer on the back surface of the light emitting device 10 before separation into individual pieces in the step shown in FIG. 3J by a known photolithography method. You can also

  The extraction electrode 7 can also be applied to face-down mounting type light emitting elements according to other embodiments described later.

  Next, a modification of the bump 4 in the light emitting device 10 according to the first embodiment will be described with reference to FIG. 4 (refer to FIG. 1 as appropriate).

  As described above, the bump 4 shown in FIG. 4A is a bump made of a spherical metal lump formed using a wire bonder. The bump 4 shown in FIG. 4A has a width A in a cross-sectional view of the lower surface (connection surface with the semiconductor light emitting element structure 2) smaller than the width B of the most bulged portion of the bump 4. For this reason, by forming the bumps 4 in a spherical shape, the reflective layer 6 formed so as to surround the side surfaces of the bumps 4 is difficult to peel due to the anchor effect of the bumps 4.

  Further, by forming the reflective layer 6 up to the position where the width of the side surface of the bump 4 becomes the width B (for example, the position where the width C is (where C <B)), the bumps are formed. 4 becomes difficult to peel off due to the anchor effect of the reflective layer 6.

Also, the bump 4 shown in FIG. 4B is obtained by extending the upper portion 4a by the polishing machine 60 in the reflective layer thickness adjusting step S106 shown in FIG. This is particularly noticeable when a highly ductile material such as Au is used for the bump 4.
The upper portion 4a extends in the direction of polishing by the polishing machine 60, that is, in the lateral direction. Further, the reflection layer 6 is also polished together with the bumps 4 by the polishing machine 60. Since the resin constituting the reflective layer 6 is softer than the metal constituting the bump 4, the bump 4 becomes approximately the same height as the upper surface of the reflective layer 6 while its upper portion 4 a extends by polishing. That is, the upper surface of the reflective layer 6 and the upper surface of the bump 4 after polishing are substantially the same surface.

  Thus, when the upper part 4a of the bump 4 extends, the reflective layer 6 can be made difficult to peel off due to the anchor effect.

<Modification of manufacturing method>
Next, a modification of the reflective layer forming step S105 shown in FIG. 3D will be described with reference to FIG. As shown in FIG. 6, in this modification, a release sheet 70 having elasticity is attached to the lower surface side of the upper mold 51, and the upper surface of the bump 4 is in contact with the surface of the release sheet 70 or is separated. The upper mold 51 is arranged so as to bite into the mold sheet 70. Then, the reflective layer 6 is formed by injecting a resin to be the reflective layer 6 into the upper and lower molds 50 and 51. Thus, the reflective layer 6 can be formed by exposing the upper surface of the bump 4 from the reflective layer 6, so that the polishing step (reflective layer height adjusting step S <b> 106) for exposing the upper surface of the bump 4 is omitted. Can do.

  In addition, the formation method using the release sheet 70 is applied to the step of forming the resin layer (the reflective layer 6 or the fluorescent layer 5) on the surface of the semiconductor light emitting element 3 on which the bumps 4 are formed in other embodiments described later. be able to.

  Next, a modified example of the fluorescent layer forming step S109 shown in FIG. 3 (h) will be described with reference to FIGS. 7 (a) and 7 (b). In the modification shown in FIG. 7A, the fluorescent layer 5 is formed using an upper mold 52 having one recess 52a corresponding to each element instead of the upper mold 51. Examples of the shape of the recess 52a include a hemispherical shape in addition to the bullet shape of the illustrated example. If the outer shape of the fluorescent layer 5 is bullet-shaped, a light-emitting device with high front brightness can be easily obtained. If the outer shape of the fluorescent layer 5 is hemispherical, a light emitting device with high light extraction efficiency can be easily obtained.

  In the modification shown in FIG. 7B, the fluorescent layer 5 is formed using an upper mold 53 having a plurality of recesses 53a corresponding to each element instead of the upper mold 51. . The plurality of recesses 53a may be arranged irregularly, but are preferably arranged regularly in order to obtain preferable light distribution characteristics. Examples of the shape of the recess 53a include a hemispherical shape, a conical shape, a pyramid shape, and a truncated pyramid shape. By using such an upper mold 53, for example, the surface of the fluorescent layer 5 can be used as a light scattering surface, and the light emission chromaticity and light intensity distribution can be made uniform. Thus, the fluorescent layer 5 having various outer shapes can be formed by changing the shape of the upper mold 51 (52, 53).

  In addition, in the fluorescent layer forming step S109, instead of forming the fluorescent layer 5 by resin molding using a mold, a plate-like or sheet-like resin member containing a phosphor is prepared in advance. The member can also be formed by sticking to the back side of the semiconductor light emitting element 3. At this time, by pressing between the resin member and the semiconductor light emitting element 3, chips and bumps can be embedded in the resin member or pierced as necessary.

  Furthermore, in the phosphor layer forming step S109, a phosphor-containing resin is applied to the back surface side of the semiconductor light emitting element 3 with a predetermined thickness without using a mold, and is cured by heating, whereby the phosphor layer 5 may be formed.

  Note that these modifications can be applied to the step of forming the fluorescent layer 5 in other embodiments described later.

  Next, another embodiment of the present invention will be described. In addition, in the light emitting element which concerns on other embodiment, about the structure which has the same function as the light-emitting device 10 which concerns on 1st Embodiment, it attaches | subjects and shows the same code | symbol, About detailed structure about common structures, such as a material to be used Is omitted as appropriate. Moreover, also about a manufacturing method, about the same process, the same process name is attached | subjected and detailed description is abbreviate | omitted suitably.

Second Embodiment
[Structure of light emitting device]
Next, a light emitting device according to a second embodiment of the present invention will be described with reference to FIG. The light emitting device 10A according to the second embodiment illustrated in FIG. 8 is the top surface of the semiconductor light emitting element 3 in which the fluorescent layer 5 is a light extraction surface, compared to the light emitting device 10 according to the first embodiment illustrated in FIG. In addition to (the substrate 1 side), the side surface of the reflective layer 6 is covered. Further, the light emitting device 10A is a face-down mounting type LED, similarly to the light emitting device 10 shown in FIG.

  As shown in FIG. 8, in the light emitting device 10 </ b> A, the reflection layer 6 is formed in a U shape with an opening facing upward in a cross-sectional view, covers the lower surface, which is the surface of the semiconductor light emitting element 3, and surrounds the side surface. Is covered. Since the reflective layer 6 is in close contact with the lower surface and side surfaces of the semiconductor light emitting element 3, it has a structure that is difficult to peel off from the light emitting device 10A. The reflective layer 6 is formed as an integral resin layer. That is, the reflective layer 6 does not include an interface inside. Therefore, the reflective layer 6 is separated from the light emitting device 10 </ b> A as compared with the case where the reflective layer 6 includes an interface between a region provided on the lower surface side of the semiconductor light emitting element 3 and a region provided around the side surface of the semiconductor light emitting element 3. Hard to peel. In addition, the fluorescent layer 5 is formed in an inverted U-shape with an opening facing downward in a cross-sectional view, and the lower surface, which is the surface of the semiconductor light emitting element 3, and the side surface of the semiconductor light emitting element 3 of the reflective layer 6 are formed as an integral resin layer. The upper surface of the portion to be coated is covered, and the side surface of the reflective layer 6 is covered. The fluorescent layer 5 is in close contact with the side surface of the reflective layer 6 in addition to planar contact between the back surface of the substrate 1 that is the upper surface of the semiconductor light emitting element 3 and the upper surface of the portion of the reflective layer 6 that covers the side surface of the semiconductor light emitting element 3. Therefore, the structure is difficult to peel off from the light emitting device 10A.

  The fluorescent layer 5 formed on the side surface of the reflective layer 6 is outside the reflective layer 6 and does not function as a wavelength conversion member because the light emitted by the semiconductor light emitting element 3 does not substantially pass therethrough.

[Operation of light-emitting device]
The light emitting device 10A according to a second embodiment of the present invention shown in FIG. 8, and the n-side electrode and the p-side electrode, respectively, through the bumps 4 _n and the bumps 4 _p are electrically connected, the mounting board wiring electrodes When a current is supplied through (not shown), the semiconductor light emitting element 3 emits blue light. The blue light emitted from the semiconductor light emitting element 3 is reflected directly or by the reflective layer 6, the n-side electrode, the p-side electrode, the full-surface electrode, etc., and covers the back side (upward direction in FIG. 8) of the substrate 1. It passes through the fluorescent layer 5 and is taken out. At this time, a part of the blue light passing through the fluorescent layer 5 is absorbed by the phosphor contained in the fluorescent layer 5, converted into yellow light having a long wavelength, and extracted. The light emitting device 10A outputs white light in which blue light passing through the fluorescent layer 5 without wavelength conversion and yellow light wavelength-converted by the fluorescent layer 5 are mixed.

  At this time, the thickness of the fluorescent layer 5 covering the back surface of the substrate 1 is formed with high accuracy, and variation between the light emitting devices is suppressed. Moreover, since the fluorescent layer 5 on the side surface is outside the reflective layer 6, it does not function as a wavelength conversion member. For this reason, the variation in the thickness of the side surface of the fluorescent layer 5 does not affect the color tone of the output light of the light emitting device 10A. The light traveling in the lateral direction in the semiconductor light emitting element 3 is reflected by the reflective layer 6 in the light extraction surface direction. Here, even when the thickness of the reflective layer 6 is the smallest within the range of variation, the amount of reflection material added so that a reflectance sufficient to reflect substantially all of the light incident on the reflective layer 6 can be obtained. By adjusting the thickness of the reflective layer 6, the variation in the thickness of the reflective layer 6 does not affect the color tone of the output light of the light emitting device 10A. That is, most of the light emitted from the semiconductor light emitting element 3 and extracted to the outside, preferably substantially all of the light, passes through the fluorescent layer 5 whose thickness is accurately adjusted. Accordingly, the variation in the ratio of the light that passes through the fluorescent layer 5 between the light that is wavelength-converted and the light that is not wavelength-converted is reduced, so the color tone of the white light that is mixed and output from the light-emitting device 10A Variations can be reduced.

[Method of manufacturing light emitting device]
A method for manufacturing a light emitting device according to the second embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 9, the manufacturing method of the light emitting device according to the second embodiment includes a light emitting element structure forming step S200, a bump forming step S201, a first singulation step S202, a chip sorting step S203, 1 carrier sticking process S204, reflective layer forming process S205, reflective layer thickness adjusting process S206, cleaning process S207, second singulation process S208, second carrier sticking process S209, and fluorescent layer forming process S210, the fluorescent layer thickness adjusting step S211 and the third singulation step S212 are sequentially performed.

  Here, from the light emitting element structure forming step S200 to the cleaning step S207 in the method for manufacturing the light emitting device according to the second embodiment, the light emitting element structure forming in the method for manufacturing the light emitting device according to the first embodiment shown in FIG. Since it is the same as that from process S100 to cleaning process S107, description is abbreviate | omitted.

  Hereinafter, each step will be described with reference to FIG. 10 (see FIGS. 8 and 9 as appropriate).

(Second piece separation step: S208)
As in the method for manufacturing the light emitting device according to the first embodiment, after the cleaning step S207 (see FIG. 10F), in the second singulation step S208, as shown in FIG. The chip 11 integrated by the reflective layer 6 (see FIG. 10F) is diced and cut along the boundary line 21 of the element structure to which the reflective layer 6 is added, and is separated into chips 12.

(Second carrier pasting step (second arranging step): S209)
Next, in the second carrier affixing step S209, as shown in FIG. 10 (h), the separated chips 12 are applied to the carrier 30 to which the adhesive sheet 40 is affixed so that the bumps 4 are on the lower side. Affix it. At this time, the chips 12 are arranged so as to be arranged at a predetermined interval.

(Fluorescent layer forming step (wavelength converting member forming step): S210)
Next, in the fluorescent layer forming step S210, as shown in FIG. 10 (i), the fluorescent layer 5 is formed on the surface and the side surface of the chip 11 on the substrate 1 side.

(Fluorescent layer thickness adjustment step: S211)
Next, in the fluorescent layer thickness adjusting step S211, as shown in FIG. 10 (j), the lower surface of the fluorescent layer 5 (the lower surface in FIG. 10 (j)) is determined in advance using the polishing machine 60. The phosphor layer 5 is adjusted to a predetermined thickness by polishing (or grinding) up to the polishing line 62 previously set. Thereby, the color tone of the luminescent color of 10 A of light-emitting devices can be adjusted.

(Third piece separation step: S212)
Finally, in the third singulation step S212, as shown in FIG. 10 (k), the light emitting device 10A is cut along the boundary line 22 of the light emitting device 10A by dicing to be singulated. Through the above steps, the light emitting device 10A shown in FIG. 8 can be manufactured.

<Third Embodiment>
[Structure of light emitting device]
Next, a light-emitting device according to a third embodiment of the present invention will be described with reference to FIG. The light emitting device 10B according to the third embodiment shown in FIG. 11 is different from the light emitting device 10 according to the first embodiment shown in FIG. 1 in that the fluorescent layer 5 is the back surface of the semiconductor light emitting element 3 that is a light extraction surface. In addition to the side, it is configured to be covered with a resin layer integrated up to the side surface, and the reflective layer 6 further includes a lower surface of the semiconductor light emitting element 3 (semiconductor light emitting element structure 2 side), a side surface of the fluorescent layer 5 and The difference is that the lower surface of the portion covering the side surface of the semiconductor light emitting element 3 is coated from the outside. The light emitting device 10B is a face-down mounting type LED, similar to the light emitting device 10 shown in FIG.

  As shown in FIG. 11, in the light emitting device 10 </ b> B, the fluorescent layer 5 is formed in an inverted U shape with an opening facing downward in a sectional view, and covers the upper surface, which is the back surface of the semiconductor light emitting element 3, as an integral resin layer. At the same time, it covers the side surface. Since the fluorescent layer 5 is in close contact with the upper surface and side surfaces of the semiconductor light emitting element 3, the fluorescent layer 5 has a structure that is difficult to peel off from the light emitting device 10B. The reflective layer 6 is formed in a U-shape with an opening upward in a cross-sectional view, and the lower surface that is the surface of the semiconductor light emitting element 3, and the lower surface of the portion that covers the side surface of the fluorescent layer 5 and the side surface of the semiconductor light emitting device 3 And covering. Since the reflective layer 6 is in close contact with the lower surface of the semiconductor light emitting element 3 and the lower surface of the portion covering the side surface of the fluorescent layer 5 and the side surface of the semiconductor light emitting element 3, the reflective layer 6 has a structure that is difficult to peel off from the light emitting device 10B. . The reflective layer 6 is formed as an integral resin layer. That is, the reflective layer 6 does not include an interface inside. Accordingly, the reflective layer 6 is separated from the light emitting device 10B as compared with the case where the reflective layer 6 includes an interface between a region provided on the lower surface side of the semiconductor light emitting element 3 and a region provided around the side surface of the semiconductor light emitting element 3. Hard to peel.

[Operation of light-emitting device]
The light emitting device 10B according to a third embodiment of the present invention shown in FIG. 11, the n-side electrode and the p-side electrode, respectively, through the bumps 4 _n and the bumps 4 _p are electrically connected, the mounting board wiring electrodes When a current is supplied through (not shown), the semiconductor light emitting element 3 emits blue light. The blue light emitted from the semiconductor light emitting element 3 is reflected directly or by the reflective layer 6, the n-side electrode, the p-side electrode, the entire surface electrode, etc., and covers the back side (upward direction in FIG. 11) of the substrate 1. It passes through the fluorescent layer 5 and is taken out. At this time, a part of the blue light passing through the fluorescent layer 5 is absorbed by the phosphor contained in the fluorescent layer 5, converted into yellow light having a long wavelength, and extracted. Further, the light traveling in the lateral direction in the semiconductor light emitting element 3 is reflected by the reflective layer 6 formed on the side surface, and passes through the fluorescent layer 5 formed on the side surface before and after the reflection, thereby blue light. A part of the light is wavelength-converted to yellow light. The light emitting device 10B outputs white light in which blue light transmitted through the fluorescent layer 5 and yellow light whose wavelength has been converted by the fluorescent layer 5 are mixed.

  At this time, the thickness of the fluorescent layer 5 covering the back surface of the substrate 1 is formed with high accuracy, and variation between the light emitting devices is suppressed. Here, if the thickness of the fluorescent layer 5 on the side surface varies, the ratio of the light whose wavelength is converted to yellow light changes. However, since the outer side of the fluorescent layer 5 formed on the side surface is covered with the reflective layer 6, light is not extracted from the side surface. For this reason, as for the light extracted from the back surface side of the substrate 1 which is the light extraction surface, blue light and yellow light are mixed on average. Therefore, color unevenness due to a difference in the observation direction of the light emitting device 10B can be reduced. In addition, even when the thickness of the reflective layer 6 is the smallest within the range of variation, the addition amount of the reflective material is set so that a reflectance sufficient to reflect substantially all of the light incident on the reflective layer 6 can be obtained. By adjusting and forming the reflective layer 6, the variation in the thickness of the reflective layer 6 does not affect the color tone of the output light of the light emitting device 10B.

  Note that the upper surface of the reflective layer 6 that covers the side surface of the fluorescent layer 5 is preferably provided so as to be substantially flush with the upper surface of the fluorescent layer 5. As a result, light can be prevented from being emitted from the side surface of the fluorescent layer 5, and light can be extracted only from the upper surface of the fluorescent layer 5 formed with a substantially accurate thickness. Color unevenness due to the difference in direction can be further reduced.

[Method of manufacturing light emitting device]
A method for manufacturing a light emitting device according to the third embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 12, the manufacturing method of the light emitting device according to the third embodiment includes a light emitting element structure forming step S300, a first singulation step S301, a chip sorting step S302, and a first carrier pasting step S303. , Phosphor layer forming step S304, phosphor layer thickness adjusting step S305, cleaning step S306, bump forming step S307, second singulation step S308, second carrier attaching step S309, and reflecting layer forming step S310, reflective layer thickness adjusting step S311 and third singulation step S312 are sequentially performed.

  Here, the light emitting element structure forming step S300 in the light emitting device manufacturing method according to the third embodiment is the same as the light emitting element structure forming step S100 in the light emitting device manufacturing method according to the first embodiment shown in FIG. Therefore, the description is omitted.

  Hereinafter, each step will be described with reference to FIG. 13 (see FIGS. 11 and 12 as appropriate).

(First piece separation step: S301)
After the light emitting element structure forming step S300, in the first singulation step S301, as shown in FIG. 13A, the chip 11 is diced along the boundary line 20 of the element structure by dicing.

(Chip selection process: S302)
Next, in the chip selection step S302, for each chip 11 separated into pieces, the power supply device is connected to the n-side electrode and the p-side electrode of the semiconductor light emitting element structure 2 to cause the chip 11 to emit light, and the emission wavelength is measured. . Then, the chips 11 whose emission wavelengths are in a predetermined range are selected.

(First carrier pasting step (arrangement step): S303)
Next, in the first carrier sticking step S303, as shown in FIG. 13B, the chips 11 sorted in the chip sorting step S302 are adhered with the semiconductor light emitting element structure 2 on the lower side at a predetermined interval. The sheet 40 is arranged on the carrier 30 to which the sheet 40 is attached. The chips 11 arranged on the carrier 30 are affixed to the carrier 30 by the adhesive sheet 40 and the position thereof is maintained.

(Fluorescent layer forming step (wavelength conversion member forming step): S304)
Next, in the fluorescent layer forming step S304, as shown in FIG. 13C, the fluorescent layer 5 is formed on the surface and the side surface of the chip 11 attached to the carrier 30 on the substrate 1 side.

(Fluorescent layer thickness adjustment step: S305)
Next, in the fluorescent layer thickness adjusting step S305, as shown in FIG. 13D, the upper surface of the fluorescent layer 5 (the lower surface in FIG. 13D) is polished using a polishing machine 60 ( Or grinding) to a predetermined polishing line 61 (or grinding) to adjust the phosphor layer 5 to a predetermined thickness. Thereby, the color tone of the luminescent color of the light-emitting device 10B can be adjusted.

(Cleaning step: S306)
Next, in the cleaning step S306, as shown in FIG. 13E, the chip 11 integrated with the fluorescent layer 5 is peeled off from the carrier 30, and burrs, dust, and the like generated by polishing are removed.

(Bump formation step (external connection electrode formation step): S307)
Next, in bump formation step S307, bumps 4 are formed on the upper surface of the semiconductor light emitting element structure 2 as shown in FIG. As the bump 4, a bump _4n and a bump _4p are formed on an n-side electrode and a p-side electrode (not shown), respectively.

(Second piece separation step: S308)
Next, in the second singulation step S308, as shown in FIG. 13G, an element structure in which the chip 11 integrated with the fluorescent layer 5 (see FIG. 13F) is added with the fluorescent layer 5 is added. Are diced and cut along the boundary line 21 to divide into chips 12.

(Second carrier pasting step (second arranging step): S309)
Next, in the second carrier affixing step S309, as shown in FIG. 13 (h), the separated chips 12 are affixed to the carrier 30 affixed with the adhesive sheet 40 so that the bumps 4 are on the upper side. To do. At this time, the chips 12 are arranged so as to be arranged at a predetermined interval.

(Reflective layer forming step (reflective member forming step): S310)
Next, in the reflective layer forming step S310, as shown in FIG. 13 (i), the reflective layer 6 is formed on the surface of the chip 12 (the surface side of the semiconductor light emitting element 3) and the side surface.

(Reflection layer thickness adjustment step: S311)
Next, in the reflective layer thickness adjusting step S311, as shown in FIG. 13 (j), the upper surface of the reflective layer 6 (the lower surface in FIG. 13 (j)) is bumped 4 using a polishing machine 60. And the polishing layer 62 is polished (or ground) to a predetermined polishing line 62 to adjust the reflective layer 6 to a predetermined thickness.

(Third piece separation step: S312)
Finally, in the third singulation step S312, as shown in FIG. 13 (k), the light emitting device 10B is cut along the boundary line 22 of the light emitting device 10B by dicing to be singulated. Through the above steps, the light emitting device 10B shown in FIG. 11 can be manufactured.

<Modification of manufacturing method>
Next, with reference to FIG. 7C (refer to FIGS. 12 and 13 as appropriate), a modification of the reflective layer forming step S310 in the method for manufacturing the light emitting device according to the present embodiment will be described.

  In the reflective layer forming step S310, instead of the upper mold 51 (see FIG. 13 (i)), a partition portion is formed on the boundary line 22 (see FIG. 13 (k)) of the element structure as shown in FIG. 7 (c). By forming the reflective layer 6 using the upper mold 54 having 54a, the chips 12 (see FIG. 13 (i)) are formed in a state where they are separated from each other or separated from each other by a recess. . Therefore, by separating the chip 12 from the carrier 30 after the reflective layer thickness adjustment step S311, the individualization step by dicing can be omitted or simplified, and the individualized light emitting device 10B can be obtained. In addition, in FIG.7 (c), description of the fluorescent layer 5 is abbreviate | omitted.

  Moreover, the process of forming the resin layer (the reflective layer 6 or the fluorescent layer 5) using the upper mold 54 having the partitioning portion 54a described above is the reflection in the fourth embodiment, the fifth embodiment, and the seventh embodiment described later. The present invention can be applied to the layer forming step, the fluorescent layer forming step in the sixth embodiment, and the like.

<Fourth embodiment>
[Structure of light emitting device]
Next, a light emitting device according to a fourth embodiment of the invention will be described with reference to FIG. The light emitting device 10C according to the fourth embodiment shown in FIG. 14 is different from the light emitting device 10 according to the first embodiment shown in FIG. 1 in that the fluorescent layer 5 is an upper surface of the semiconductor light emitting element 3 that is a light extraction surface. It differs in that it is provided so as to cover (the substrate 1 side), and the reflective layer 6 covers the side surface of the fluorescent layer 5 in addition to the lower surface (the semiconductor light emitting device structure 2 side) and the side surface of the semiconductor light emitting device 3. The light emitting device 10 </ b> C is a face-down mounting type LED, similarly to the light emitting device 10 illustrated in FIG. 1.

  As shown in FIG. 14, in the light emitting device 10 </ b> C, the fluorescent layer 5 is formed in a flat plate shape, is in close contact with the upper surface (substrate 1 side) of the semiconductor light emitting element 3, and the side surface is in close contact with the reflective layer 6. Yes. That is, since the fluorescent layer 5 is in close contact with other members on its lower surface and side surfaces, it has a structure that is difficult to peel off from the light emitting device 10C. Further, the reflective layer 6 is formed in a U shape in a cross-sectional view and covers the lower surface of the semiconductor light emitting element 3 and covers the side surface of the semiconductor light emitting element 3 and the side surface of the fluorescent layer 5. ing. Since the reflective layer 6 is in close contact with the lower surface and side surface of the semiconductor light emitting element 3 and the side surface of the fluorescent layer 5, the reflective layer 6 has a structure that is difficult to peel off from the light emitting device 10C. The reflective layer 6 is formed as an integral resin layer. That is, the reflective layer 6 does not include an interface inside. Therefore, the reflective layer 6 is separated from the light emitting device 10 </ b> C as compared with the case where the reflective layer 6 includes an interface between a region provided on the lower surface side of the semiconductor light emitting element 3 and a region provided around the side surface of the semiconductor light emitting element 3. Hard to peel.

[Operation of light-emitting device]
The light emitting device 10C according to a third embodiment of the present invention shown in FIG. 14, the n-side electrode and the p-side electrode, respectively, through the bumps 4 _n and the bumps 4 _p are electrically connected, the mounting board wiring electrodes When a current is supplied through (not shown), the semiconductor light emitting element 3 emits blue light. The blue light emitted from the semiconductor light emitting element 3 is reflected directly or by the reflective layer 6, the n-side electrode, the p-side electrode, the full-surface electrode, etc., and covers the back surface side (upward direction in FIG. 14) of the substrate 1. It passes through the fluorescent layer 5 and is taken out. At this time, a part of the blue light passing through the fluorescent layer 5 is absorbed by the phosphor contained in the fluorescent layer 5, converted into yellow light having a long wavelength, and extracted. The light emitting device 10C outputs white light in which blue light passing through the fluorescent layer 5 without wavelength conversion and yellow light wavelength-converted by the fluorescent layer 5 are mixed.

  At this time, the thickness of the fluorescent layer 5 covering the back surface of the substrate 1 is formed with high accuracy, and variation between the light emitting devices is suppressed. Further, the fluorescent layer 5 is not provided on the side surface, and light traveling in the lateral direction in the semiconductor light emitting element 3 is reflected by the reflective layer 6 in the light extraction surface direction. Here, even when the thickness of the reflective layer 6 is the smallest within the range of variation, the amount of reflection material added so that a reflectance sufficient to reflect substantially all of the light incident on the reflective layer 6 can be obtained. By adjusting the thickness and forming the reflective layer 6, variations in the thickness of the reflective layer 6 do not affect the emission color of the light emitting device 10. That is, most of the light emitted from the semiconductor light emitting element 3 and extracted to the outside, preferably substantially all of the light, passes through the fluorescent layer 5 whose thickness is accurately adjusted. Accordingly, variation in the ratio of light that passes through the fluorescent layer 5 between light that is wavelength-converted and light that is not wavelength-converted is reduced, so the color tone of the white light that is mixed and output from the light-emitting device 10C is reduced. Variations can be reduced.

  The upper surface of the reflective layer 6 that covers the side surface of the fluorescent layer 5 is preferably provided so as to be substantially flush with the upper surface of the fluorescent layer 5 as in the third embodiment. As a result, light can be prevented from being emitted from the side surface of the fluorescent layer 5, and light can be extracted only from the upper surface of the fluorescent layer 5 formed with a substantially accurate thickness. Color unevenness due to the difference in direction can be further reduced.

[Method of manufacturing light emitting device]
A method for manufacturing a light emitting device according to the fourth embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 15, the manufacturing method of the light emitting device according to the fourth embodiment includes a light emitting element structure forming step S400, a first carrier pasting step S401, a fluorescent layer forming step S402, and a fluorescent layer thickness adjusting step S403. Cleaning step S404, bump forming step S405, first singulation step S406, chip sorting step S407, second carrier attaching step S408, reflective layer forming step S409, and reflective layer thickness adjusting step S410 and the second singulation step S411 are sequentially performed.

  Here, the light emitting element structure forming step S400 in the method for manufacturing the light emitting device according to the fourth embodiment is the same as the light emitting element structure forming step S100 in the method for manufacturing the light emitting device according to the first embodiment shown in FIG. Therefore, the description is omitted.

  Hereinafter, each step will be described with reference to FIG. 16 (see FIGS. 14 and 15 as appropriate).

(First carrier pasting step: S401)
After the light emitting element structure forming step S400, in the first carrier sticking step S401, as shown in FIG. 16A, the wafer-like semiconductor light emitting element 3 is stuck with the substrate 1 facing upward. Affixed to the carrier 30.

(Fluorescent layer forming step (wavelength conversion member forming step): S402)
Next, in the fluorescent layer forming step S402, as shown in FIG. 16B, the fluorescent layer 5 is formed on the back surface (substrate 1 side) of the semiconductor light emitting element 3 attached to the carrier 30.

(Fluorescent layer thickness adjustment step: S403)
Next, in the fluorescent layer thickness adjusting step S403, as shown in FIG. 16C, the lower surface of the fluorescent layer 5 (the lower surface in FIG. 16C) is polished using a polishing machine 60 ( Or grinding) to a predetermined polishing line 61 (or grinding) to adjust the phosphor layer 5 to a predetermined thickness. Thereby, the color tone of the luminescent color of the light-emitting device 10C can be adjusted.

(Cleaning step: S404)
Next, in the cleaning step S404, as shown in FIG. 16D, the chip 11 integrated with the fluorescent layer 5 is peeled off from the carrier 30, and burrs, dust, and the like generated by polishing are removed.

(Bump forming step (external connection electrode forming step): S405)
Next, in bump formation step S405, bumps 4 are formed on the upper surface of the semiconductor light emitting element structure 2 as shown in FIG. As the bump 4, a bump _4n and a bump _4p are formed on an n-side electrode and a p-side electrode (not shown), respectively.

(First piece separation step: S406)
Next, in the first singulation step S406, as shown in FIG. 16 (f), dicing and cutting are performed along the boundary line 20 of the element structure, and the chip 11 is singulated.

(Chip selection process: S407)
Next, in the chip selection step S407, for each chip 11 separated into individual pieces, the power supply device is connected to the bumps 4 formed on the n-side electrode and the p-side electrode of the semiconductor light emitting element structure 2, and the chip 11 is connected. Light is emitted and the emission wavelength is measured. Then, the chips 11 whose emission wavelengths are in a predetermined range are selected.

(Second carrier pasting step (array step): S408)
Next, in the second carrier sticking step S408, as shown in FIG. 16 (g), the adhesive sheet 40 is stuck on the chip 11 sorted in the chip sorting step S407 with the bumps 4 facing upward at a predetermined interval. Arranged on the carrier 30 formed. The chips 11 arranged on the carrier 30 are affixed to the carrier 30 by the adhesive sheet 40 and the position thereof is maintained.

(Reflective layer forming step (reflective member forming step): S409)
Next, in the reflective layer forming step S409, as shown in FIG. 16 (h), the reflective layer 6 is formed on the upper surface (semiconductor light emitting element structure 2 side) and side surfaces of the chip 11.

(Reflection layer thickness adjustment step: S410)
Next, in the reflective layer thickness adjusting step S410, as shown in FIG. 16I, the lower surface of the reflective layer 6 (the lower surface in FIG. And the polishing layer 62 is polished (or ground) to a predetermined polishing line 62 to adjust the reflective layer 6 to a predetermined thickness.

(Second piece separation step: S411)
Finally, in the second singulation step S411, as shown in FIG. 16 (j), the light emitting device 10C is cut along the boundary line 21 of the light emitting device 10C by dicing and is singulated. Through the above steps, the light emitting device 10C shown in FIG. 14 can be manufactured.

<Fifth Embodiment>
[Structure of light emitting device]
Next, a light emitting device according to a fifth embodiment of the invention will be described with reference to FIG. In the light emitting device 10D according to the fifth embodiment shown in FIG. 17, the light emitting device 10 according to the first embodiment shown in FIG. This is a face-up mounting type LED in which the formed surface is a light extraction surface. Since this embodiment is a face-up mounting type LED, the entire surface electrode formed on the p-side semiconductor layer of the semiconductor light emitting element 3 is a light-transmitting conductive material such as ITO (indium tin oxide). It is formed using a material so that light is extracted from the surface of the semiconductor light emitting element 3.

  As shown in FIG. 17, in the light emitting device 10D, the fluorescent layer 5 is formed in a flat plate shape on the upper surface (the semiconductor light emitting element structure 2 side) of the semiconductor light emitting element 3 on which the bumps 4 are provided. Further, the bump 4 penetrates the fluorescent layer 5 and its upper surface is exposed. The reflective layer 6 is formed in a U shape in a cross-sectional view and covers the lower surface (substrate 1 side) of the semiconductor light emitting element 3 and surrounds the side surface of the semiconductor light emitting element 3 and the side surface of the fluorescent layer 5. It is covered so that

  The fluorescent layer 5 is in close contact with the upper surface of the semiconductor light emitting element 3 (on the side of the semiconductor light emitting element structure 2) and the side surface thereof is in close contact with the reflective layer 6, so that the fluorescent layer 5 is not easily peeled off from the light emitting device 10D. In addition, since the reflective layer 6 is in close contact with the side surface of the fluorescent layer 5 as well as the lower surface and side surface of the semiconductor light emitting element 3, it has a structure that is difficult to peel off from the light emitting device 10D. The reflective layer 6 is formed as an integral resin layer. That is, the reflective layer 6 does not include an interface inside. Accordingly, the reflective layer 6 is separated from the light emitting device 10D as compared with the case where the reflective layer 6 includes an interface between a region provided on the lower surface side of the semiconductor light emitting element 3 and a region provided around the side surface of the semiconductor light emitting element 3. Hard to peel.

[Operation of light-emitting device]
Emitting device 10D according to a fifth embodiment of the present invention shown in FIG. 17, the n-side electrode and the p-side electrode, via the bumps 4 _n and the bumps 4 _p is electrically connected, further bonding wires (not shown When a current is supplied through a wiring electrode (not shown) of the mounting substrate via), the semiconductor light emitting element 3 emits blue light. The blue light emitted by the semiconductor light emitting element 3 is reflected directly or by the reflection layer 6 and passes through the fluorescent layer 5 covering the surface side (upward direction in FIG. 17) of the semiconductor light emitting element 3 which is the light extraction surface. And then taken out. At this time, a part of the blue light passing through the fluorescent layer 5 is absorbed by the phosphor contained in the fluorescent layer 5, converted into yellow light having a long wavelength, and extracted. The light emitting device 10D outputs white light in which the blue light that is transmitted without being converted in wavelength by the fluorescent layer 5 and the yellow light that is converted in wavelength by the fluorescent layer 5 are mixed.

  At this time, the thickness of the fluorescent layer 5 covering the surface of the semiconductor light emitting element 3 is formed with high accuracy, and variation between the light emitting devices is suppressed. Further, the fluorescent layer 5 is not provided on the side surface, and light traveling in the lateral direction in the semiconductor light emitting element 3 is reflected by the reflective layer 6 in the light extraction surface direction. Here, even when the thickness of the reflective layer 6 is the smallest within the range of variation, the amount of reflection material added so that a reflectance sufficient to reflect substantially all of the light incident on the reflective layer 6 can be obtained. By adjusting the thickness of the reflective layer 6, the variation in the thickness of the reflective layer 6 does not affect the color tone of the output light of the light emitting device 10D. That is, most of the light emitted from the semiconductor light emitting element 3 and extracted to the outside, preferably substantially all of the light, passes through the fluorescent layer 5 whose thickness is accurately adjusted. Therefore, the variation in the ratio of the light that passes through the fluorescent layer 5 between the light that is wavelength-converted and the light that is not wavelength-converted is reduced, so the color tone of the white light that is mixed and output from the light-emitting device 10D Variations can be reduced.

  The upper surface of the reflective layer 6 that covers the side surface of the fluorescent layer 5 is preferably provided so as to be substantially flush with the upper surface of the fluorescent layer 5 as in the third embodiment. As a result, light can be prevented from being emitted from the side surface of the fluorescent layer 5, and light can be extracted only from the upper surface of the fluorescent layer 5 formed with a substantially accurate thickness. Color unevenness due to the difference in direction can be further reduced.

[Method of manufacturing light emitting device]
A method for manufacturing a light emitting device according to the fifth embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 18, the manufacturing method of the light emitting device according to the fifth embodiment includes a light emitting element structure forming step S500, a bump forming step S501, a first carrier pasting step S502, a fluorescent layer forming step S503, and a fluorescent light. Layer thickness adjusting step S504, cleaning step S505, first singulation step S506, chip sorting step S507, second carrier pasting step S508, reflecting layer forming step S509, and reflecting layer thickness adjusting step S510 and the second singulation step S511 are sequentially performed.

  Here, the light emitting element structure forming step S500 in the light emitting device manufacturing method according to the fifth embodiment is different from the light emitting element structure forming step S100 in the light emitting device manufacturing method according to the first embodiment shown in FIG. Since the entire surface electrode provided on the type semiconductor layer is the same except that it is formed using a transparent electrode made of ITO or the like, detailed description thereof is omitted.

  Hereinafter, each step will be described with reference to FIG. 19 (see FIGS. 17 and 18 as appropriate).

(Bump forming step (external connection electrode forming step): S501)
After the light emitting element structure forming step S500, bumps 4 are formed on the upper surface of the semiconductor light emitting element structure 2 in the bump forming step S501 as shown in FIG. As the bump 4, a bump _4n and a bump _4p are formed on an n-side electrode and a p-side electrode (not shown), respectively.

(First carrier pasting step: S502)
Next, in the first carrier pasting step S502, as shown in FIG. 19B, the wafer-like semiconductor light emitting device 3 on which the bumps 4 are formed is pasted with the adhesive sheet 40 so that the bumps 4 are on the upper side. Affixed to the carrier 30.

(Fluorescent layer forming step (wavelength conversion member forming step): S503)
Next, in the fluorescent layer forming step S503, as shown in FIG. 19C, the fluorescent layer 5 is formed on the surface of the semiconductor light emitting device 3 attached to the carrier 30.

(Fluorescent layer thickness adjustment step: S504)
Next, in the fluorescent layer thickness adjusting step S504, as shown in FIG. 19D, the lower surface of the fluorescent layer 5 (the lower surface in FIG. 19D) is polished using a polishing machine 60 ( (Or grinding) to expose the bumps 4 and polish (or grind) to a predetermined polishing line 61 to adjust the phosphor layer 5 to a predetermined thickness. Thereby, the color tone of the luminescent color of light-emitting device 10D can be adjusted.

(Cleaning step: S505)
Next, in the cleaning step S505, as shown in FIG. 19 (e), the semiconductor light emitting element 3 in the wafer state on which the fluorescent layer 5 is formed is peeled off from the carrier 30, and burrs, dust, etc. generated by polishing are removed. Remove.

(First piece separation step: S506)
Next, in the first singulation step S506, as shown in FIG. 19F, the semiconductor light emitting element 3 in the wafer state is diced along the boundary line 20 of the element structure and cut into chips 11. Divide into pieces.

(Chip selection process: S507)
Next, in the chip selection step S507, for each chip 11 separated into individual pieces, the power supply device is connected to the bumps 4 formed on the n-side electrode and the p-side electrode of the semiconductor light-emitting element structure 2, and the chip 11 is connected. Light is emitted and the emission wavelength is measured. Then, the chips 11 whose emission wavelengths are in a predetermined range are selected.

(Second carrier pasting step (arrangement step): S508)
Next, in the second carrier sticking step S508, as shown in FIG. 19 (g), the adhesive sheet 40 is stuck on the chip 11 sorted in the chip sorting step S507 with a predetermined interval with the substrate 1 facing upward. Arranged on the carrier 30 formed. The chips 11 arranged on the carrier 30 are affixed to the carrier 30 by the adhesive sheet 40 and the position thereof is maintained.

(Reflective layer forming step (reflective member forming step): S509)
Next, in the reflective layer forming step S509, as shown in FIG. 19H, the reflective layer 6 is formed on the surface and the side surface of the chip 11 on the substrate 1 side.

(Reflection layer thickness adjustment step: S510)
Next, in the reflective layer thickness adjusting step S510, as shown in FIG. 19 (i), the lower surface of the reflective layer 6 (the lower surface in FIG. 19 (i)) is determined in advance using the polishing machine 60. The reflection line 6 is adjusted to a predetermined thickness by polishing (or grinding) the polishing line 62 that has been set.

(Second piece separation step: S511)
Finally, in the second singulation step S511, as shown in FIG. 19 (j), the light emitting device 10D is cut along the boundary line 21 of the light emitting device 10D by dicing and is singulated. Through the above steps, the light-emitting device 10D shown in FIG. 17 can be manufactured.

<Sixth Embodiment>
[Structure of light emitting device]
Next, with reference to FIG. 20, the light-emitting device which concerns on 6th Embodiment of this invention is demonstrated. A light-emitting device 10E according to the sixth embodiment shown in FIG. 20 is a face-up mounting type LED, similarly to the light-emitting device 10D according to the fifth embodiment shown in FIG. Since this embodiment is a face-up mounting type LED, the entire surface electrode formed on the p-side semiconductor layer of the semiconductor light emitting element 3 is formed using a light-transmitting conductive material such as ITO, Light is extracted from the surface of the semiconductor light emitting element 3.

  As shown in FIG. 20, in the light emitting device 10 </ b> E, the reflective layer 6 is formed in a U shape whose opening is upward in a cross-sectional view, covers the lower surface (substrate 1 side) of the semiconductor light emitting element 3, and surrounds the side surface. It is covered so that In addition, the fluorescent layer 5 is formed in an inverted U shape with a downward opening in a cross-sectional view, and on the upper surface side (semiconductor light emitting element structure 2 side) of the semiconductor light emitting element 3 provided with the bumps 4 as an integral resin layer. In addition, the upper surface of the portion formed on the side surface of the semiconductor light emitting element 3 of the reflective layer 6 is covered and the side surface of the reflective layer 6 is covered. Further, the bump 4 penetrates the fluorescent layer 5 and its upper surface is exposed.

  The fluorescent layer 5 formed on the side surface of the reflective layer 6 is outside the reflective layer 6 and does not function as a wavelength conversion member because the light emitted from the semiconductor light emitting element 3 does not pass through.

  Since the reflective layer 6 is in close contact with the lower surface and the side surface of the semiconductor light emitting element 3, it has a structure that is difficult to peel off from the light emitting device 10E. The reflective layer 6 is formed as an integral resin layer. That is, the reflective layer 6 does not include an interface inside. Therefore, the reflective layer 6 is separated from the light emitting device 10E as compared with the case where the reflective layer 6 includes an interface between a region provided on the lower surface side of the semiconductor light emitting element 3 and a region provided around the side surface of the semiconductor light emitting element 3. Hard to peel. In addition, the fluorescent layer 5 is in close contact with the upper surface of the semiconductor light emitting element 3 and also in close contact with the side surface of the reflective layer 6 and the upper surface of the portion formed on the side surface of the semiconductor light emitting element 3. The structure is difficult to peel off from the light emitting device 10E.

[Operation of light-emitting device]
Emitting device 10E according to a sixth embodiment of the present invention shown in FIG. 20, the n-side electrode and the p-side electrode, via the bumps 4 _n and the bumps 4 _p is electrically connected, further bonding wires (not shown When a current is supplied through a wiring electrode (not shown) of the mounting substrate via), the semiconductor light emitting element 3 emits blue light. The blue light emitted by the semiconductor light emitting element 3 is reflected directly or by the reflection layer 6 and passes through the fluorescent layer 5 covering the surface side (upward direction in FIG. 20) of the semiconductor light emitting element 3 which is the light extraction surface. And then taken out. At this time, a part of the blue light passing through the fluorescent layer 5 is absorbed by the phosphor contained in the fluorescent layer 5, converted into yellow light having a long wavelength, and extracted. The light emitting device 10E outputs white light in which blue light that passes through the fluorescent layer 5 without wavelength conversion and yellow light that has undergone wavelength conversion in the fluorescent layer 5 are mixed.

  At this time, the thickness of the fluorescent layer 5 covering the surface of the semiconductor light emitting element 3 is formed with high accuracy, and variation between the light emitting devices is suppressed. Moreover, since the fluorescent layer 5 on the side surface is outside the reflective layer 6, it does not function as a wavelength conversion member. For this reason, the variation in the thickness of the side surface of the fluorescent layer 5 does not affect the color tone of the output light of the light emitting device 10A. The light traveling in the lateral direction in the semiconductor light emitting element 3 is reflected by the reflective layer 6 in the light extraction surface direction. Here, even when the thickness of the reflective layer 6 is the smallest within the range of variation, the amount of reflection material added so that a reflectance sufficient to reflect substantially all of the light incident on the reflective layer 6 can be obtained. By adjusting the thickness of the reflective layer 6, the variation in the thickness of the reflective layer 6 does not affect the color tone of the output light of the light emitting device 10E. That is, most of the light emitted from the semiconductor light emitting element 3 and extracted to the outside, preferably substantially all of the light, passes through the fluorescent layer 5 whose thickness is accurately adjusted. Accordingly, the variation in the ratio of the light that passes through the fluorescent layer 5 between the light that is wavelength-converted and the light that is not wavelength-converted is reduced, so the color tone of the white light that is mixed and output from the light-emitting device 10E Variations can be reduced.

[Method of manufacturing light emitting device]
A method for manufacturing a light emitting device according to the sixth embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 21, the manufacturing method of the light emitting device according to the sixth embodiment includes a light emitting element structure forming step S600, a first singulation step S601, a chip sorting step S602, and a first carrier pasting step S603. , Reflective layer forming step S604, reflective layer thickness adjusting step S605, cleaning step S606, bump forming step S607, second singulation step S608, second carrier attaching step S609, and fluorescent layer forming step S610, fluorescent layer thickness adjustment step S611, and third singulation step S612 are sequentially performed.

  Here, the light emitting element structure forming step S600 in the light emitting device manufacturing method according to the sixth embodiment is similar to the light emitting element structure forming step S500 in the light emitting device manufacturing method according to the fifth embodiment shown in FIG. Since the entire surface electrode provided on the p-type semiconductor layer is formed using a transparent electrode made of ITO or the like, detailed description thereof is omitted.

  Hereinafter, each step will be described with reference to FIG. 22 (see FIGS. 20 and 21 as appropriate).

(First piece separation step: S601)
After the light emitting element structure forming step S600, in the first singulation step S601, as shown in FIG. 22A, the semiconductor light emitting element 3 in the wafer state is diced along the boundary line 20 of the element structure. Cut and divide into chips 11.

(Chip selection process: S602)
Next, in the chip selection step S602, for each chip 11 separated, the power supply device is connected to the n-side electrode and the p-side electrode of the semiconductor light emitting element structure 2 to cause the chip 11 to emit light, and the emission wavelength is measured. . Then, the chips 11 whose emission wavelengths are in a predetermined range are selected.

(First carrier pasting step (first arranging step): S603)
Next, in the first carrier attaching step S603, as shown in FIG. 22B, the adhesive sheet 40 is attached to the chip 11 selected in the chip selecting step S602 with a predetermined interval with the substrate 1 facing upward. Arranged on the carrier 30 formed. The chips 11 arranged on the carrier 30 are affixed to the carrier 30 by the adhesive sheet 40 and the position thereof is maintained.

(Reflective layer forming step (reflective member forming step): S604)
Next, in the reflective layer forming step S604, as shown in FIG. 22C, the reflective layer 6 is formed on the surface and the side surface of the chip 11 on the substrate 1 side.

(Reflection layer thickness adjustment step: S605)
Next, in the reflective layer thickness adjusting step S605, as shown in FIG. 22D, the lower surface of the reflective layer 6 (the lower surface in FIG. 22D) is determined in advance using the polishing machine 60. The reflection line 6 is adjusted to a predetermined thickness by polishing (or grinding) to the polishing line 61 that has been set.

(Cleaning step: S606)
Next, in the cleaning step S606, as shown in FIG. 22E, the chip 11 integrated by the reflective layer 6 is peeled off from the carrier 30, and burrs, dust, and the like generated by polishing are removed.

(Bump forming step (external connection electrode forming step): S607)
Next, in bump formation step S607, bumps 4 are formed on the upper surface of the semiconductor light emitting element structure 2 as shown in FIG. As the bump 4, a bump _4n and a bump _4p are formed on an n-side electrode and a p-side electrode (not shown), respectively.

(Second piece separation step: S608)
Next, in the second singulation step S608, as shown in FIG. 22G, the element structure integrated by the reflective layer 6 is moved along the boundary line 21 of the element structure to which the reflective layer 6 is added. Then, the wafer is diced and cut to be separated into chips 12.

(Second carrier pasting step (second arranging step): S609)
Next, in 2nd carrier sticking process S609, as shown in FIG.22 (h), the chip | tip 12 is stuck on the carrier 30 to which the adhesive sheet 40 was stuck so that the bump 4 may become an upper side.

(Fluorescent layer forming step (wavelength conversion member forming step): S610)
Next, in the fluorescent layer forming step S610, the fluorescent layer 5 is formed on the surface and side surfaces of the chip 12 affixed to the carrier 30, as shown in FIG.

(Fluorescent layer thickness adjustment step: S611)
Next, in the fluorescent layer thickness adjusting step S611, as shown in FIG. 22 (j), the lower surface of the fluorescent layer 5 (the lower surface in FIG. 22 (j)) is polished using the polishing machine 60 ( (Or grinding) to expose the bumps 4 and polish (or grind) to a predetermined polishing line 62 to adjust the phosphor layer 5 to a predetermined thickness. Thereby, the color tone of the luminescent color of the light-emitting device 10E can be adjusted.

(Third piece separation step: S612)
Finally, in the third singulation step S612, as shown in FIG. 22 (k), the light emitting device 10E is cut along the boundary line 22 of the light emitting device 10E by dicing, and is singulated. Through the above steps, the light emitting device 10E shown in FIG. 20 can be manufactured.

<Seventh embodiment>
[Structure of light emitting device]
Next, with reference to FIG. 23, the light-emitting device based on 7th Embodiment of this invention is demonstrated. The light emitting device 10F according to the seventh embodiment shown in FIG. 23 is a face-up mounting type LED, similarly to the light emitting device 10D according to the fifth embodiment shown in FIG. Since this embodiment is a face-up mounting type LED, the entire surface electrode formed on the p-side semiconductor layer of the semiconductor light emitting element 3 is formed using a light-transmitting conductive material such as ITO, Light is extracted from the surface of the semiconductor light emitting element 3.

  As shown in FIG. 23, in the light emitting device 10F, the fluorescent layer 5 is formed in an inverted U shape with an opening facing downward in a cross-sectional view, and covers the upper surface of the semiconductor light emitting element 3 as an integral resin layer. It is covered so as to surround. Further, the bump 4 penetrates the fluorescent layer 5 and its upper surface is exposed. The reflective layer 6 is formed in a U shape with an opening upward in a cross-sectional view, and covers the lower surface of the semiconductor light emitting element 3 and the lower surface of the portion of the fluorescent layer 5 that covers the side surface of the semiconductor light emitting element 3. The fluorescent layer 5 is covered so as to surround the side surface.

  Since the fluorescent layer 5 is in close contact with the upper surface and side surfaces of the semiconductor light emitting element 3, the fluorescent layer 5 has a structure that is difficult to peel off from the light emitting device 10F. In addition, the reflective layer 6 is in close contact with the lower surface of the semiconductor light emitting element 3, and is also in close contact with the lower surface of the portion covering the side surface of the fluorescent layer 5 and the side surface of the semiconductor light emitting element 3, and thus is peeled from the light emitting device 10F. The structure is difficult to do. The reflective layer 6 is formed as an integral resin layer. That is, the reflective layer 6 does not include an interface inside. Therefore, the reflective layer 6 is separated from the light emitting device 10F as compared with the case where the reflective layer 6 includes an interface between a region provided on the lower surface side of the semiconductor light emitting element 3 and a region provided around the side surface of the semiconductor light emitting element 3. Hard to peel.

  The upper surface of the reflective layer 6 that covers the side surface of the fluorescent layer 5 is preferably provided so as to be substantially flush with the upper surface of the fluorescent layer 5 as in the third embodiment. As a result, light can be prevented from being emitted from the side surface of the fluorescent layer 5, and light can be extracted only from the upper surface of the fluorescent layer 5 formed with a substantially accurate thickness. Color unevenness due to the difference in direction can be further reduced.

[Operation of light-emitting device]
Emitting device 10F according to a seventh embodiment of the present invention shown in FIG. 23, the n-side electrode and the p-side electrode, via the bumps 4 _n and the bumps 4 _p is electrically connected, further bonding wires (not shown When a current is supplied through a wiring electrode (not shown) of the mounting substrate via), the semiconductor light emitting element 3 emits blue light. The blue light emitted from the semiconductor light emitting element 3 is reflected directly or by the reflection layer 6 and passes through the fluorescent layer 5 that covers the surface side of the semiconductor light emitting element 3 that is the light extraction surface (upward direction in FIG. 23). And then taken out. Further, the light traveling in the lateral direction in the semiconductor light emitting element 3 is reflected by the reflective layer 6 formed on the side surface, and passes through the fluorescent layer 5 formed on the side surface before and after the reflection, thereby blue light. A part of the light is wavelength-converted to yellow light. At this time, a part of the blue light passing through the fluorescent layer 5 is absorbed by the phosphor contained in the fluorescent layer 5, converted into yellow light having a long wavelength, and extracted. The light emitting device 10F outputs white light in which blue light that passes through the fluorescent layer 5 without being wavelength-converted and yellow light that has been wavelength-converted by the fluorescent layer 5 are mixed.

  At this time, the thickness of the fluorescent layer 5 covering the surface of the semiconductor light emitting element 3 is formed with high accuracy, and variation between the light emitting devices is suppressed. Here, if the thickness of the fluorescent layer 5 on the side surface varies, the ratio of the light whose wavelength is converted to yellow light changes. However, since the outer side of the fluorescent layer 5 formed on the side surface is covered with the reflective layer 6, light is not extracted from the side surface. For this reason, as for the light extracted from the surface of the fluorescent layer 5 which is a light extraction surface, blue light and yellow light are mixed on average. Therefore, color unevenness due to a difference in observation direction of the light emitting device 10F can be reduced. In addition, even when the thickness of the reflective layer 6 is the smallest within the range of variation, the addition amount of the reflective material is set so that a reflectance sufficient to reflect substantially all of the light incident on the reflective layer 6 can be obtained. By adjusting and forming the reflective layer 6, the variation in the thickness of the reflective layer 6 does not affect the color tone of the output light of the light emitting device 10F.

[Method of manufacturing light emitting device]
A method for manufacturing a light emitting device according to the seventh embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 24, the light emitting device manufacturing method according to the seventh embodiment includes a light emitting element structure forming step S700, a bump forming step S701, a first singulation step S702, a chip sorting step S703, 1 carrier sticking process S704, fluorescent layer forming process S705, fluorescent layer thickness adjusting process S706, cleaning process S707, second singulation process S708, second carrier sticking process S709, and reflective layer forming process S710, the reflective layer thickness adjusting step S711, and the third singulation step S712 are sequentially performed.

  Here, the light emitting element structure forming step S700 in the method for manufacturing the light emitting device according to the seventh embodiment is similar to the light emitting element structure forming step S500 in the method for manufacturing the light emitting device according to the fifth embodiment shown in FIG. Since the entire surface electrode provided on the p-type semiconductor layer is formed using a transparent electrode made of ITO or the like, detailed description thereof is omitted.

  Hereinafter, each step will be described with reference to FIG. 25 (see FIGS. 23 and 24 as appropriate).

(Bump formation step (external connection electrode formation step): S701)
After the light emitting element structure forming step S700, bumps 4 are formed on the upper surface of the semiconductor light emitting element structure 2 in a bump forming step S701 as shown in FIG. As the bump 4, a bump _4n and a bump _4p are formed on an n-side electrode and a p-side electrode (not shown), respectively.

(First piece separation step: S702)
Next, in the first singulation step S702, as shown in FIG. 25B, the wafer-shaped semiconductor light emitting device 3 on which the bumps 4 are formed is diced along the boundary line 20 of the device structure. Cut and divide into chips 11.

(Chip selection process: S703)
Next, in the chip selection step S703, for each chip 11 separated into individual pieces, the power supply device is connected to the bumps 4 formed on the n-side electrode and the p-side electrode of the semiconductor light emitting element structure 2, and the chip 11 is connected. Light is emitted and the emission wavelength is measured. Then, the chips 11 whose emission wavelengths are in a predetermined range are selected.

(First carrier pasting step (array step): S704)
Next, in the first carrier sticking step S704, as shown in FIG. 25C, the adhesive sheet 40 is separated from the chip 11 sorted in the chip sorting step S703 with a predetermined interval so that the bumps 4 are on the upper side. Are arranged on the carrier 30 to which is attached. The chips 11 arranged on the carrier 30 are affixed to the carrier 30 by the adhesive sheet 40 and the position thereof is maintained.

(Fluorescent layer forming step (wavelength conversion member forming step): S705)
Next, in the fluorescent layer forming step S705, as shown in FIG. 25D, the fluorescent layer 5 is formed on the surface and the side surface of the chip 11 on the semiconductor light emitting element structure 2 side.

(Fluorescent layer thickness adjustment step: S706)
Next, in the fluorescent layer thickness adjusting step S706, as shown in FIG. 25 (e), the lower surface of the fluorescent layer 5 (the lower surface in FIG. 25 (e)) is bumped using the polishing machine 60. And the polishing layer 61 is polished (or ground) to a predetermined polishing line 61 to adjust the phosphor layer 5 to a predetermined thickness. Thereby, the color tone of the luminescent color of the light-emitting device 10F can be adjusted.

(Cleaning step: S707)
Next, in the cleaning step S707, as shown in FIG. 25 (f), the chip 11 integrated by the fluorescent layer 5 is peeled off from the carrier 30, and burrs, dust, and the like generated by polishing are removed.

(Second piece separation step: S708)
Next, in the second singulation step S708, as shown in FIG. 25G, the element structure integrated by the fluorescent layer 5 is moved along the boundary line 21 of the element structure to which the fluorescent layer 5 is added. Then, the wafer is diced and cut to be separated into chips 12.

(Second carrier pasting step (second arranging step): S709)
Next, in the second carrier pasting step S709, as shown in FIG. 25 (h), the chip 12 is placed on the carrier 30 on which the adhesive sheet 40 is pasted at a predetermined interval so that the substrate 1 is on the upper side. Array. The chips 11 arranged on the carrier 30 are affixed to the carrier 30 by the adhesive sheet 40 and the position thereof is maintained.

(Reflective layer forming step (reflective member forming step): S710)
Next, in the reflective layer forming step S710, as shown in FIG. 25 (i), the reflective layer 6 is formed on the surface and the side surface of the chip 12 attached to the carrier 30 on the substrate 1 side.

(Reflection layer thickness adjustment step: S711)
Next, in the phosphor layer thickness adjusting step S711, as shown in FIG. 25 (j), the lower surface of the reflective layer 6 (the lower surface in FIG. 25 (j)) is polished using a polishing machine 60 ( (Or grinding), and polishing (or grinding) to a predetermined polishing line 62 to adjust the reflective layer 6 to a predetermined thickness.

(Third piece separation step: S712)
Finally, in the third singulation step S712, as shown in FIG. 25 (k), the light emitting device 10F is cut along the boundary line 22 of the light emitting device 10F by dicing and is singulated. Through the above steps, the light emitting device 10F shown in FIG. 23 can be manufactured.

<Eighth Embodiment>
[Structure of light emitting device]
Next, with reference to FIG. 26, the light-emitting device based on 8th Embodiment of this invention is demonstrated. The light emitting device 10G according to the eighth embodiment illustrated in FIG. 26 is a face-up mounting type LED, similar to the light emitting device 10D according to the fifth embodiment illustrated in FIG. Since this embodiment is a face-up mounting type LED, the entire surface electrode formed on the p-side semiconductor layer of the semiconductor light emitting element 3 is formed using a light-transmitting conductive material such as ITO, Light is extracted from the surface of the semiconductor light emitting element 3.

  As shown in FIG. 26, in the light emitting device 10G, the reflective layer 6 is formed in a U shape in a cross-sectional view, covers the lower surface (substrate 2 side) of the semiconductor light emitting element 3, and covers the side surface. doing. The fluorescent layer 5 is formed in a flat plate shape, and the upper surface of the semiconductor light emitting device 3 (on the semiconductor light emitting device structure 2 side) provided with the bumps 4 and the upper surface of the portion of the reflective layer 6 that covers the side surface of the semiconductor light emitting device 3. Is covered. Further, the bump 4 penetrates the fluorescent layer 5 and its upper surface is exposed.

  Since the reflective layer 6 is in close contact with the lower surface and side surfaces of the semiconductor light emitting element 3, the reflective layer 6 has a structure that is difficult to peel off from the light emitting device 10G. The reflective layer 6 is formed as an integral resin layer. That is, the reflective layer 6 does not include an interface inside. Therefore, the reflective layer 6 is separated from the light emitting device 10G as compared with the case where the reflective layer 6 includes an interface between a region provided on the lower surface side of the semiconductor light emitting element 3 and a region provided around the side surface of the semiconductor light emitting element 3. Hard to peel. In addition, the fluorescent layer 5 is in close contact with the upper surface of the semiconductor light emitting element 3, and is also in close contact with the upper surface of the portion of the reflective layer 6 that covers the side surface of the semiconductor light emitting element 3, so that it is difficult to peel off from the light emitting device 10E. .

[Operation of light-emitting device]
Emitting device 10G according to the eighth embodiment of the present invention shown in FIG. 26, the n-side electrode and the p-side electrode, via the bumps 4 _n and the bumps 4 _p is electrically connected, further bonding wires (not shown When a current is supplied through a wiring electrode (not shown) of the mounting substrate via), the semiconductor light emitting element 3 emits blue light. The blue light emitted by the semiconductor light emitting element 3 is reflected directly or by the reflection layer 6 and passes through the fluorescent layer 5 covering the surface side (upward direction in FIG. 20) of the semiconductor light emitting element 3 which is the light extraction surface. And then taken out. At this time, a part of the blue light passing through the fluorescent layer 5 is absorbed by the phosphor contained in the fluorescent layer 5, converted into yellow light having a long wavelength, and extracted. The light emitting device 10G outputs white light in which blue light that passes through the fluorescent layer 5 without wavelength conversion and yellow light that has undergone wavelength conversion in the fluorescent layer 5 are mixed.

  At this time, the thickness of the fluorescent layer 5 covering the surface of the semiconductor light emitting element 3 is formed with high accuracy, and variation between the light emitting devices is suppressed. Further, the fluorescent layer 5 is not provided on the side surface, and light traveling in the lateral direction in the semiconductor light emitting element 3 is reflected by the reflective layer 6 in the light extraction surface direction. Here, even when the thickness of the reflective layer 6 is the smallest within the range of variation, the amount of reflection material added so that a reflectance sufficient to reflect substantially all of the light incident on the reflective layer 6 can be obtained. By adjusting the thickness of the reflective layer 6, the variation in the thickness of the reflective layer 6 does not affect the color tone of the output light of the light emitting device 10G. That is, most of the light emitted from the semiconductor light emitting element 3 and extracted to the outside, preferably substantially all of the light, passes through the fluorescent layer 5 whose thickness is accurately adjusted. Accordingly, since there is less variation between the light emitting elements of the ratio of the light that passes through the fluorescent layer 5 and the light that is not wavelength-converted, the color tone of the white light that is mixed and output from the light emitting device 10G is reduced. Variations can be reduced.

[Method of manufacturing light emitting device]
A method for manufacturing a light-emitting device according to the eighth embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 27, the light emitting device manufacturing method according to the eighth embodiment includes a light emitting element structure forming step S800, a first singulation step S801, a chip sorting step S802, and a first carrier pasting step S803. , Reflective layer forming step S804, reflective layer thickness adjusting step S805, cleaning step S806, bump forming step S807, second carrier attaching step S808, fluorescent layer forming step S809, and fluorescent layer thickness adjusting step S810 and the second singulation step S811 are sequentially performed.

  Here, the steps from the light emitting element structure forming step S800 to the bump forming step S807 in the method for manufacturing the light emitting device according to the eighth embodiment are the light emitting elements in the method for manufacturing the light emitting device according to the sixth embodiment shown in FIG. Since it is the same as the process from structure formation process S600 to bump formation process S607, description is abbreviate | omitted.

  Hereinafter, with reference to FIG. 28 (refer to FIGS. 26 and 27 as appropriate), each step after the second carrier sticking step S808 will be described.

(Second carrier pasting step: S808)
After the bump 4 is formed on the chip 11 integrated by the reflective layer 6 in the bump forming step S807 (see FIG. 28F), in the second carrier pasting step S808, as shown in FIG. 11 is attached to the carrier 30 to which the adhesive sheet 40 is attached so that the bumps 4 are on the upper side.

(Fluorescent layer forming step (wavelength conversion member forming step): S809)
Next, in the fluorescent layer forming step S809, as shown in FIG. 28 (h), the fluorescent layer 5 is formed on the surface of the chip 11 attached to the carrier 30 and the upper surface of the reflective layer 6.

(Fluorescent layer thickness adjustment step: S810)
Next, in the fluorescent layer thickness adjusting step S810, as shown in FIG. 28 (i), the lower surface of the fluorescent layer 5 (the lower surface in FIG. 28 (i)) is polished using a polishing machine 60 ( (Or grinding) to expose the bumps 4 and polish (or grind) to a predetermined polishing line 62 to adjust the phosphor layer 5 to a predetermined thickness. Thereby, the color tone of the luminescent color of the light-emitting device 10G can be adjusted.

(Second piece separation step: S811)
Finally, in the second singulation step S811, as shown in FIG. 28 (j), the light-emitting device 10G is cut along the boundary line 21 of the light-emitting device 10G by dicing and is singulated. Through the above steps, the light emitting device 10G shown in FIG. 26 can be manufactured.

<Modification of light emitting device>
Next, a modification of the light emitting device according to the present invention will be described.
The light-emitting device according to this modification is the same as the light-emitting device 10 to the light-emitting device 10G according to each of the embodiments described above, with respect to the substrate 1, the fluorescent layer 5, and / or the reflective layer 6, the fluorescent layer 5 or the reflective layer 6 that is a covering member. Concavities and convexities are formed on the surface to be covered with the above. Thereby, the adhesiveness of the fluorescent layer 5 or the reflective layer 6 which is a covering member formed on the surface on which the unevenness is formed can be improved, and the peeling can be made difficult. Such unevenness can be formed by blasting, laser irradiation, plasma irradiation or the like, and it is easy to easily form unevenness particularly effective for blasting.

Further, in the face-down mounting type light emitting device 10 to the light emitting device 10C according to the first to fourth embodiments, color unevenness is caused by the light diffusion effect due to the unevenness of the surface covered by the fluorescent layer 5 of the substrate 2. Can be reduced.
In addition, although unevenness | corrugation may be formed in all the surfaces coat | covered with a coating | coated member, you may make it form unevenness | corrugation in a part of them.

  Furthermore, in the light emitting device 10 to the light emitting device 10G according to each embodiment, irregularities may be formed on the surface of the fluorescent layer 5 serving as a light extraction surface. Thereby, the light extraction efficiency to the outside can be improved.

  Here, an example of a light-emitting device in which unevenness is formed on the substrate, the fluorescent layer, and the reflective layer will be described with reference to FIG.

  A light emitting device 10H illustrated in FIG. 29 is the back surface 1a and side surface 1b of the substrate 1, the top surface 6a of the reflective layer 6, and the light extraction surface in the light emitting device 10 of the first embodiment illustrated in FIG. In this example, irregularities are formed on the upper surface 5 a of the fluorescent layer 5. In this example, irregularities are also formed on the side surface of the semiconductor light emitting element structure 2 in addition to the side surface 1 b of the substrate 1.

  The light emitting device 10 </ b> H according to this modification can be manufactured by adding an unevenness forming process as follows in the method for manufacturing the light emitting device according to the first embodiment.

  The unevenness formation of the side surface 1b of the substrate 1 can be performed in the state shown in FIG. 3C in the first carrier sticking step S104 (see FIG. 2) in the method for manufacturing the light emitting device according to the first embodiment. In the unevenness forming process, the upper surface of the semiconductor light emitting element structure 2 that should avoid the formation of unevenness is appropriately masked.

Moreover, the unevenness | corrugation formation of the back surface 1a of the board | substrate 1 and the upper surface 6a of the reflection layer 6 can be performed in the state shown in FIG.3 (g) in 2nd carrier sticking process S108 (refer FIG. 2).
Further, the unevenness formation of the upper surface 5a of the fluorescent layer 5 is performed after adjusting the thickness of the fluorescent layer 5 in the state shown in FIG. 3I in the fluorescent layer thickness adjusting step S110 (see FIG. 2). be able to.

  Also in the light emitting device according to another embodiment, before performing the reflective layer forming step and before performing the fluorescent layer forming step, the reflective layer 6 or the fluorescent layer 5 which is a covering member formed in each step is appropriately coated. The process which forms an unevenness | corrugation in the area | region to perform can be added.

  Next, in order to confirm the effect of reducing the color unevenness of the light emitting device according to the present invention, the light emitting device 10 having the configuration shown in FIG. 30A and the light emitting device 10L having the configuration shown in FIG. The light distribution characteristics of the luminescent color were simulated. In addition, as a comparative example, a simulation of light distribution characteristics of emission colors was performed for the light emitting device 110 having the configuration illustrated in FIG. 30B and the light emitting device 110L having the configuration illustrated in FIG.

As shown in FIG. 30A, the light emitting device 10 according to the example includes the semiconductor light emitting element 3 mounted face down, and is the same as the light emitting device 10 according to the first embodiment shown in FIG. It has a configuration. In the light emitting device 10 shown in FIG. 30A, the width of the light emitting device 10 is W1, and the width of the semiconductor light emitting element 3 is W3. 30A, the thickness (width) on the left side of the reflective layer 6 from the semiconductor light emitting element 3 is W2L, and the thickness (width) on the right side of the reflective layer 6 from the semiconductor light emitting element 3 is W2R. is there. In the horizontal direction in FIG. 30A, the semiconductor light emitting element 3 is disposed at the center of the light emitting device 10, and W2L = W2R. In addition, the planar view shape of the light-emitting device 10 and the semiconductor light-emitting element 3 is a square.
Moreover, the vertical thickness of the reflective layer 6 is H2, the vertical thickness of the semiconductor light emitting element 3 is H3, and the upper surface of the reflective layer 6 and the upper surface of the semiconductor light emitting element 3 are the same surface. The fluorescent layer 5 is provided so as to cover the entire top surfaces of the semiconductor light emitting element 3 and the reflective layer 6 and has a thickness of H1.

As shown in FIG. 30B, in the light emitting device 110 according to the comparative example, the width of the light emitting device 110 is W1, and the thickness of the semiconductor light emitting element 3 is H3. The fluorescent layer 105 is provided so as to cover the upper surface and side surfaces of the semiconductor light emitting element 3. 30B, the thickness (width) on the left side of the phosphor layer 105 from the semiconductor light emitting element 3 is W2L, and the thickness (width) on the right side of the phosphor layer 105 from the semiconductor light emitting element 3 is W2R. It is. In the horizontal direction in FIG. 30B, the semiconductor light emitting element 3 is disposed in the center of the light emitting device 110, and W2L = W2R. In addition, the planar view shape of the light-emitting device 110 and the semiconductor light-emitting element 3 is a square.
Further, the thickness of the fluorescent layer 5 on the upper surface of the semiconductor light emitting element 3 is H1, and the upper surface of the fluorescent layer 5 is a plane parallel to the upper surface of the reflective layer 105.

  A light emitting device 10L shown in FIG. 30C is obtained by arranging the semiconductor light emitting element 3 on the left side in the light emitting device 10 shown in FIG. Therefore, in the light emitting device 10L, W2L <W2R. Except that the semiconductor light emitting element 3 is arranged on the left side, it is the same as the light emitting device 10 shown in FIG.

  A light emitting device 110L illustrated in FIG. 30D is obtained by arranging the semiconductor light emitting element 3 on the left side in the light emitting device 110 illustrated in FIG. 30B. Therefore, in the light emitting device 110L, W2L <W2R. Except that the semiconductor light emitting element 3 is arranged on the left side, it is the same as the light emitting device 110 shown in FIG.

Here, the semiconductor light emitting element 3 emits blue light having a center wavelength of 442 [nm] and an optical output of 1 [W]. Note that an Ag reflection film having a reflectance of 92% is provided in the lowermost layer of the semiconductor light emitting element 3.
The fluorescent layers 5 and 105 are configured using a silicone resin containing a YAG phosphor, and the reflective layer 6 is configured using a silicone resin containing TiO ₂ as a diffusing material. Further, this phosphor is assumed to emit yellow light having a particle diameter of 7 [μm], a light absorption of 95% at a maximum excitation wavelength of 450 [nm], and a central wavelength of 555 [nm]. In order to compare the light emitting devices of the example and the comparative example with substantially the same emission chromaticity, the density of the phosphor is set to 2 × 10 ⁶ [pieces / mm ³ ] in the fluorescent layer 5 according to the example. In the fluorescent layer 105 according to the example, it was set to 1 × 10 ⁶ [pieces / mm ³ ]. The diffusing agent had an average particle diameter of 0.2 [μm] and a density of 1.5 × 10 ¹¹ [pieces / mm ³ ].

  In the light emitting devices 10 and 10L, H2 = 170 [nm]. In each light emitting device, the width W1 of the light emitting device, the width W3, the thickness H3 of the semiconductor light emitting element, and the thickness H1 of the fluorescent layers 5 and 105 are the same, and W1 = 1000 [μm] and W3 = 500 [μm. ], H3 = 120 [μm], and H1 = 50 [μm].

  In the light emitting device 10 and the light emitting device 110, W2L = W2R = 250 [μm], and in the light emitting device 10L and the light emitting device 110L, W2L = 150 [μm] and W2R = 350 [μm].

FIG. 31 shows the simulation result.
FIG. 31A shows a simulation result of the light emitting device 10 and the light emitting device 110 in which the semiconductor light emitting element 3 is disposed in the center of the light emitting device. Here, A indicated by a solid line is the light distribution characteristic of the light emitting device 10 according to the example of the present invention, and B indicated by a broken line is the light distribution characteristic of the light emitting device 110 according to the comparative example. In FIG. 31 (a), the horizontal axis is the central position in the lateral direction of the light emitting device 10 and the light emitting device 110, with the upward direction (perpendicular to the surface of the fluorescent layer 5) being 0 °, and the right lateral direction on the right side being 90 °. Denotes the observation direction in which the right lateral direction on the left is −90 °. In FIG. 31A, the horizontal axis represents the color temperature of the output light that is white light.
Note that since almost no light is output in the lateral direction of the light emitting device, the simulation results are shown in the range of −75 ° to + 75 °.

  As shown in FIG. 31A, since the semiconductor light emitting element 3 is disposed at the center of the light emitting devices 10 and 110, both the light emitting devices show substantially symmetrical light distribution characteristics. In addition, it can be seen that the light-emitting device has little change in color temperature due to a difference in observation direction and little color unevenness.

  FIG. 31B shows a simulation result of the light emitting device 10L and the light emitting device 110L in which the semiconductor light emitting element 3 is disposed on the left side. Here, A indicated by a solid line is the light distribution characteristic of the light emitting device 10L according to the example of the present invention, and B indicated by a broken line is the light distribution characteristic of the light emitting device 110L according to the comparative example. In FIG. 31B, the horizontal axis and the vertical axis indicate the observation direction and the color temperature, as in FIG.

As shown in FIG. 31B, the light distribution characteristics of the light emitting device 10L according to the example are substantially bilaterally symmetric, and are not significantly different from the light distribution characteristics of the light emitting device 10 shown in FIG.
On the other hand, the light distribution characteristic of the light emitting device 110L according to the comparative example is greatly lost in left-right symmetry, and the color temperature on the left side is very high. In the light emitting device 110L, the thickness on the left side of the phosphor layer 105 from the semiconductor light emitting element 3 is small, and the blue light is emitted without being sufficiently color-converted by the phosphor layer 105. It can be seen that light with a high temperature is output.
In addition, although illustration is abbreviate | omitted, the light distribution characteristic of the brightness | luminance of the light-emitting devices 10 and 10L which concern on an Example becomes substantially Lambertian.

As shown in FIGS. 31A and 31B, according to the light emitting device according to the present invention, even when there is a difference in the left and right thicknesses of the fluorescent layer 5 viewed from the semiconductor light emitting element 3, It can be seen that the light distribution characteristics of the apparatus do not change greatly, and that the color temperature changes due to the difference in the viewing direction, that is, the color unevenness is small.
That is, it can be seen that the light emitting device according to the present invention reduces color unevenness due to a difference in observation direction in one light emitting device, and also reduces a difference in light distribution characteristics between the light emitting devices.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Semiconductor light emitting element structure (light emitting element structure)
2a n-type semiconductor layer 2b active layer 2c p-type semiconductor layer 2d full surface electrode 2e cover electrode 2 _n n-side electrode 2 _p p-side electrode 3 semiconductor light emitting device (light emitting device)
4 Bump (electrode for external connection)
4a Upper part 4 _n bump (n side external connection electrode)
4 _p bump (P side external connection electrode)
5 Fluorescent layer (wavelength conversion member)
6 Reflective layer 7 Lead electrode (Extended electrode for external connection)
7 _n Lead electrode (Extended electrode for n-side external connection)
7 _p lead electrode (extended electrode for p side external connection)
10 Light-emitting device 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H Light-emitting device 11, 12 Chip (piece)
20, 21, 22 Boundary line 30 Carrier (flat jig)
40 Adhesive Sheet 50 Lower Mold 51 Upper Mold 52, 53, 54 Upper Mold 52a Recess 53a Recess 54a Partition 60 Polishing Machine 61, 62 Polishing Wire 70 Release Sheet

Claims (1)

A spherical n-side external connection electrode having a light emitting element structure in which an n-type semiconductor layer and a p-type semiconductor layer are stacked on a substrate and electrically connected to the n-type semiconductor layer, and the p-type semiconductor layer Preparing a plurality of light emitting elements having a spherical p-side external connection electrode electrically connected to
An arraying step of arranging the plurality of light emitting elements on a flat plate-like jig with a predetermined interval so that the substrate-side surface and the jig face each other;
The light emitting elements arranged in the arranging step cover the surfaces and side surfaces having the light emitting element structure, the side surfaces of the n- side external connection electrode and the p-side external connection electrode, and the n-side external connection electrodes and a reflecting member forming step of forming a reflecting member so that a connection surface for connection to the outside of the p-side external connection electrode is exposed ;
Peeling the light emitting element and the reflecting member from the jig;
A wavelength conversion member forming step of forming a wavelength conversion member that converts at least a part of light of a wavelength emitted by the light emitting element into light of a different wavelength on the substrate-side surface of the light emitting element;
A singulation process for separating a light emitting element including the reflection member and the wavelength conversion member;
A method for manufacturing a light-emitting device, comprising:

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