JP6080379B2 - 半導体欠陥分類装置及び半導体欠陥分類装置用のプログラム - Google Patents

半導体欠陥分類装置及び半導体欠陥分類装置用のプログラム Download PDF

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JP6080379B2
JP6080379B2 JP2012097793A JP2012097793A JP6080379B2 JP 6080379 B2 JP6080379 B2 JP 6080379B2 JP 2012097793 A JP2012097793 A JP 2012097793A JP 2012097793 A JP2012097793 A JP 2012097793A JP 6080379 B2 JP6080379 B2 JP 6080379B2
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JP2013225618A5 (enExample
JP2013225618A (ja
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裕 丹代
裕 丹代
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Priority to JP2012097793A priority Critical patent/JP6080379B2/ja
Priority to PCT/JP2013/060939 priority patent/WO2013161577A1/ja
Priority to KR1020147029475A priority patent/KR101760559B1/ko
Priority to US14/395,999 priority patent/US9881365B2/en
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/241—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/12—Circuits of general importance; Signal processing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2200/00—Indexing scheme for image data processing or generation, in general
    • G06T2200/24—Indexing scheme for image data processing or generation, in general involving graphical user interfaces [GUIs]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10004—Still image; Photographic image
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Data Mining & Analysis (AREA)
  • Artificial Intelligence (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Signal Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
JP2012097793A 2012-04-23 2012-04-23 半導体欠陥分類装置及び半導体欠陥分類装置用のプログラム Active JP6080379B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012097793A JP6080379B2 (ja) 2012-04-23 2012-04-23 半導体欠陥分類装置及び半導体欠陥分類装置用のプログラム
PCT/JP2013/060939 WO2013161577A1 (ja) 2012-04-23 2013-04-11 半導体欠陥分類装置及び半導体欠陥分類装置用のプログラム
KR1020147029475A KR101760559B1 (ko) 2012-04-23 2013-04-11 반도체 결함 분류 장치 및 반도체 결함 분류 장치용 프로그램을 기록한 비일시적인 컴퓨터 판독 가능 기록 매체
US14/395,999 US9881365B2 (en) 2012-04-23 2013-04-11 Semiconductor defect categorization device and program for semiconductor defect categorization device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012097793A JP6080379B2 (ja) 2012-04-23 2012-04-23 半導体欠陥分類装置及び半導体欠陥分類装置用のプログラム

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JP2013225618A JP2013225618A (ja) 2013-10-31
JP2013225618A5 JP2013225618A5 (enExample) 2015-02-26
JP6080379B2 true JP6080379B2 (ja) 2017-02-15

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US (1) US9881365B2 (enExample)
JP (1) JP6080379B2 (enExample)
KR (1) KR101760559B1 (enExample)
WO (1) WO2013161577A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6244329B2 (ja) * 2015-05-12 2017-12-06 東京エレクトロン株式会社 基板の検査方法、基板処理システム及びコンピュータ記憶媒体
JP6771495B2 (ja) * 2015-08-12 2020-10-21 ケーエルエー コーポレイション 設計を利用する先行層欠陥箇所の点検
US11205119B2 (en) 2015-12-22 2021-12-21 Applied Materials Israel Ltd. Method of deep learning-based examination of a semiconductor specimen and system thereof
US11580375B2 (en) * 2015-12-31 2023-02-14 Kla-Tencor Corp. Accelerated training of a machine learning based model for semiconductor applications
JP6833366B2 (ja) * 2016-07-06 2021-02-24 キヤノン株式会社 情報処理装置、情報処理装置の制御方法及びプログラム
US10650509B2 (en) 2016-09-08 2020-05-12 Synopsys, Inc. Video overlay
KR102357310B1 (ko) * 2017-01-18 2022-01-28 에이에스엠엘 네델란즈 비.브이. 결함 검토를 위한 정보 추천
KR101753686B1 (ko) * 2017-02-16 2017-07-19 강무성 회로 해석 및 검증이 가능한 시뮬레이션 시스템
US10402963B2 (en) * 2017-08-24 2019-09-03 Kla-Tencor Corporation Defect detection on transparent or translucent wafers
WO2019115426A1 (en) * 2017-12-13 2019-06-20 Asml Netherlands B.V. Prediction of out of specification physical items
CN108318495A (zh) * 2018-04-11 2018-07-24 广东理工学院 瓷砖检测系统
DK3801932T3 (da) * 2018-06-07 2023-10-02 Wilco Ag Inspektionsproces og system
JP6767432B2 (ja) * 2018-06-11 2020-10-14 ファナック株式会社 縫い目検査装置
JP7053417B2 (ja) * 2018-09-13 2022-04-12 キオクシア株式会社 欠陥検査装置および欠陥検査方法
US10902620B1 (en) * 2019-04-18 2021-01-26 Applied Materials Israel Ltd. Registration between an image of an object and a description
CN112308816B (zh) * 2019-07-23 2024-02-06 纬创资通股份有限公司 影像辨识装置、影像辨识方法及其存储介质
CN113804244B (zh) * 2020-06-17 2024-06-25 富联精密电子(天津)有限公司 缺陷分析方法及装置、电子装置及计算机可读存储介质
CN112036514B (zh) * 2020-11-04 2021-07-13 腾讯科技（深圳）有限公司 一种图像分类方法、装置、服务器及计算机可读存储介质

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Publication number Priority date Publication date Assignee Title
JP4916116B2 (ja) * 2005-02-01 2012-04-11 株式会社ホロン パターン特定方法およびパターン特定装置
US20070053583A1 (en) 2005-09-08 2007-03-08 Advanced Mask Inspection Technology Inc. Image correcting apparatus, pattern inspection apparatus, and image correcting method, and reticle
JP2007102153A (ja) * 2005-09-08 2007-04-19 Advanced Mask Inspection Technology Kk 画像補正装置、パターン検査装置、画像補正方法、及びレチクル
JP5068591B2 (ja) 2007-06-29 2012-11-07 株式会社日立ハイテクノロジーズ 半導体欠陥分類方法、半導体欠陥分類装置、半導体欠陥分類装置のプログラム、半導体欠陥検査方法、および、半導体欠陥検査システム
WO2011004534A1 (ja) * 2009-07-09 2011-01-13 株式会社 日立ハイテクノロジーズ 半導体欠陥分類方法，半導体欠陥分類装置，半導体欠陥分類プログラム
US8980651B2 (en) * 2011-09-30 2015-03-17 Tokyo Electron Limited Overlay measurement for a double patterning

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Publication number Publication date
KR20140147850A (ko) 2014-12-30
US9881365B2 (en) 2018-01-30
JP2013225618A (ja) 2013-10-31
WO2013161577A1 (ja) 2013-10-31
US20150213596A1 (en) 2015-07-30
KR101760559B1 (ko) 2017-07-21

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