JP6062106B1 - 接続構造体の製造方法 - Google Patents

接続構造体の製造方法 Download PDF

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Publication number
JP6062106B1
JP6062106B1 JP2016510332A JP2016510332A JP6062106B1 JP 6062106 B1 JP6062106 B1 JP 6062106B1 JP 2016510332 A JP2016510332 A JP 2016510332A JP 2016510332 A JP2016510332 A JP 2016510332A JP 6062106 B1 JP6062106 B1 JP 6062106B1
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JP
Japan
Prior art keywords
electrode
solder
solder particles
connection
target member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016510332A
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English (en)
Japanese (ja)
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JPWO2016133114A1 (ja
Inventor
仁志 山際
仁志 山際
石澤　英亮
英亮 石澤
伸也 上野山
伸也 上野山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Application granted granted Critical
Publication of JP6062106B1 publication Critical patent/JP6062106B1/ja
Publication of JPWO2016133114A1 publication Critical patent/JPWO2016133114A1/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83886—Involving a self-assembly process, e.g. self-agglomeration of a material dispersed in a fluid

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP2016510332A 2015-02-19 2016-02-17 接続構造体の製造方法 Expired - Fee Related JP6062106B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015031010 2015-02-19
JP2015031010 2015-02-19
PCT/JP2016/054566 WO2016133114A1 (ja) 2015-02-19 2016-02-17 接続構造体の製造方法

Publications (2)

Publication Number Publication Date
JP6062106B1 true JP6062106B1 (ja) 2017-01-18
JPWO2016133114A1 JPWO2016133114A1 (ja) 2017-04-27

Family

ID=56692246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016510332A Expired - Fee Related JP6062106B1 (ja) 2015-02-19 2016-02-17 接続構造体の製造方法

Country Status (5)

Country Link
JP (1) JP6062106B1 (ko)
KR (1) KR20170118678A (ko)
CN (1) CN107004975B (ko)
TW (1) TW201643893A (ko)
WO (1) WO2016133114A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101696347B1 (ko) 2016-08-30 2017-01-13 (주)아이피아이테크 반도체 패키지 리플로우 공정용 폴리이미드 필름 및 그 제조 방법
CN110961831B (zh) * 2018-09-28 2022-08-19 株式会社田村制作所 成形软钎料及成形软钎料的制造方法
CN113534511B (zh) * 2021-07-30 2024-02-06 Tcl华星光电技术有限公司 绑定结构及其制作方法、显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006095602A1 (ja) * 2005-03-07 2006-09-14 Matsushita Electric Industrial Co., Ltd. 実装体及びその製造方法
WO2007099866A1 (ja) * 2006-03-03 2007-09-07 Matsushita Electric Industrial Co., Ltd. 電子部品実装体、ハンダバンプ付き電子部品、ハンダ樹脂混合物、電子部品の実装方法、および電子部品の製造方法
JP4084834B2 (ja) * 2005-03-29 2008-04-30 松下電器産業株式会社 フリップチップ実装方法およびバンプ形成方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006022415A2 (en) * 2004-08-25 2006-03-02 Matsushita Electric Industrial Co., Ltd. Solder composition, connecting process with soldering, and connection structure with soldering
JP4591399B2 (ja) * 2006-04-03 2010-12-01 パナソニック株式会社 部品接合方法ならびに部品接合構造
JPWO2008023452A1 (ja) * 2006-08-25 2010-01-07 住友ベークライト株式会社 接着テープ、接合体および半導体パッケージ
CN102144432B (zh) * 2008-09-05 2015-09-30 住友电木株式会社 导电连接材料、使用该导电连接材料的端子之间的连接方法以及连接端子的制造方法
CN103443869B (zh) * 2012-02-21 2015-10-21 积水化学工业株式会社 导电性粒子、导电性粒子的制造方法、导电材料及连接结构体
WO2016088664A1 (ja) * 2014-12-04 2016-06-09 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006095602A1 (ja) * 2005-03-07 2006-09-14 Matsushita Electric Industrial Co., Ltd. 実装体及びその製造方法
JP4084834B2 (ja) * 2005-03-29 2008-04-30 松下電器産業株式会社 フリップチップ実装方法およびバンプ形成方法
WO2007099866A1 (ja) * 2006-03-03 2007-09-07 Matsushita Electric Industrial Co., Ltd. 電子部品実装体、ハンダバンプ付き電子部品、ハンダ樹脂混合物、電子部品の実装方法、および電子部品の製造方法

Also Published As

Publication number Publication date
CN107004975A (zh) 2017-08-01
TW201643893A (zh) 2016-12-16
JPWO2016133114A1 (ja) 2017-04-27
CN107004975B (zh) 2018-12-21
KR20170118678A (ko) 2017-10-25
WO2016133114A1 (ja) 2016-08-25

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