JP6062106B1 - Method for manufacturing connection structure - Google Patents

Abstract

In the manufacturing method of the connection structure according to the present invention, the conductive material (11) is disposed between the first connection target member (2) and the second connection target member (3), and then the solder particles (11A). A first heating step of heating the conductive material from a temperature lower than the melting point of the solder to a temperature equal to or higher than the melting point of the solder particles (11A) and a temperature at which curing of the binder is not completed, and the first heating step And a second heating step of heating the conductive material (11) to a temperature higher than that of the first heating step. In the first heating step, the first electrode (2a) and the second heating step Before the solder particles (11A) that are not positioned between the electrodes (3a) are melted and deformed, the first particles (2a) and the second electrodes (3a) are moved toward the second electrodes (3a). Between one electrode (2a) and the second electrode (3a) To start movement of Ihanda particles (11A).

Description

  The present invention relates to a method for manufacturing a connection structure using a conductive material including a plurality of solder particles.

  Anisotropic conductive materials such as anisotropic conductive pastes and anisotropic conductive films are widely known. In the anisotropic conductive material, conductive particles are dispersed in a binder.

  In order to obtain various connection structures, the anisotropic conductive material is, for example, a connection between a flexible printed circuit board and a glass substrate (FOG (Film on Glass)) or a connection between a semiconductor chip and a flexible printed circuit board (COF ( Chip on Film)), connection between a semiconductor chip and a glass substrate (COG (Chip on Glass)), connection between a flexible printed circuit board and a glass epoxy substrate (FOB (Film on Board)), and the like.

  For example, when electrically connecting the electrode of the flexible printed circuit board and the electrode of the glass epoxy substrate by the anisotropic conductive material, an anisotropic conductive material containing conductive particles is disposed on the glass epoxy substrate. To do. Next, a flexible printed circuit board is laminated, and heated and pressurized. As a result, the anisotropic conductive material is cured, and the electrodes are electrically connected via the conductive particles to obtain a connection structure.

  As an example of the anisotropic conductive material, Patent Document 1 described below describes an anisotropic conductive material including conductive particles and a resin component that cannot be cured at the melting point of the conductive particles. Specifically, the conductive particles include tin (Sn), indium (In), bismuth (Bi), silver (Ag), copper (Cu), zinc (Zn), lead (Pb), cadmium (Cd ), Gallium (Ga), silver (Ag), thallium (Tl), and the like, and alloys made of these metals.

  In Patent Document 1, a resin heating step for heating the anisotropic conductive resin to a temperature higher than the melting point of the conductive particles and at which the curing of the resin component is not completed, and a resin component curing step for curing the resin component The electrical connection between the electrodes is described. Patent Document 1 describes that mounting is performed with the temperature profile shown in FIG. In Patent Document 1, the conductive particles melt in a resin component that is not completely cured at a temperature at which the anisotropic conductive resin is heated.

  Patent Document 2 below discloses an adhesive tape that includes a resin layer containing a thermosetting resin, solder powder, and a curing agent, and the solder powder and the curing agent are present in the resin layer. Yes. This adhesive tape is in the form of a film, not a paste.

  Patent Document 2 discloses an adhesion method using the adhesive tape. Specifically, a first substrate, an adhesive tape, a second substrate, an adhesive tape, and a third substrate are laminated in this order from the bottom to obtain a laminate. At this time, the first electrode provided on the surface of the first substrate is opposed to the second electrode provided on the surface of the second substrate. Moreover, the 2nd electrode provided in the surface of the 2nd board | substrate and the 3rd electrode provided in the surface of the 3rd board | substrate are made to oppose. Then, the laminate is heated and bonded at a predetermined temperature. Thereby, a connection structure is obtained.

  Further, in Patent Document 3 below, a semiconductor chip having a plurality of connection terminals is disposed so as to face a wiring board having a plurality of electrode terminals, and the electrode terminals of the wiring board and the above-mentioned semiconductor chip A flip chip mounting method for electrically connecting a connection terminal is disclosed. The flip chip mounting method includes (1) a step of supplying a resin containing solder powder and a convection additive onto the surface of the wiring board having the electrode terminals, and (2) the semiconductor chip on the resin surface. (3) a step of heating the wiring substrate to a temperature at which the solder powder melts, and (4) a step of curing the resin after the heating step. In the heating step (3) of the wiring board, a connection body for electrically connecting the electrode terminal and the connection terminal is formed, and in the resin curing step (4), the semiconductor chip is connected to the wiring board. To fix.

  Patent Document 4 discloses a method for mounting an electronic component. In this electronic component mounting method, a wiring board, an electronic component group, and a resin composition are used. The wiring board is provided with conductor wiring and connection terminals. The electronic component group includes a plurality of electronic components including at least one passive component. Each electronic component has an electrode terminal. The resin composition includes a solder powder, a convection additive, and a resin having fluidity at the melting temperature of the solder powder.

  The electronic component mounting method includes a first step of preparing the wiring board, the electronic component group, and the resin composition, and a second step of applying the resin composition to a main surface of the wiring board. The step of aligning the connection terminal and the electrode terminal, bringing the electronic component group into contact with the surface of the resin composition, heating at least the resin composition, and the solder A fourth step of melting the powder and growing the solder powder while self-assembling between the connection terminal and the electrode terminal by the convection additive, and solder-connecting the connection terminal and the electrode terminal; And a fifth step of curing the resin in the resin composition and bonding and fixing each of the electronic component groups and the wiring board with the resin.

JP 2004-260131 A WO2008 / 023452A1 JP 2006-114865 A WO2006 / 101155A1

  In the case of conventional anisotropic conductive paste containing solder powder or conductive particles having a solder layer on the surface, the solder powder or conductive particles may not be efficiently disposed on the electrodes (lines). In the conventional solder powder or conductive particles, the moving speed of the solder powder or conductive particles onto the electrode may be slow.

  Further, when the electrodes are electrically connected by the method described in Patent Document 1 using the anisotropic conductive material described in Patent Document 1, conductive particles including solder are efficiently formed on the electrodes (lines). May not be placed. Moreover, in the Example of patent document 1, in order to move a solder fully at the temperature more than melting | fusing point of solder, it is hold | maintained at fixed temperature, and the manufacturing efficiency of a connection structure becomes low. When mounting is performed with the temperature profile shown in FIG. 8 of Patent Document 1, the manufacturing efficiency of the connection structure is lowered.

  Moreover, the adhesive tape of patent document 2 is a film form, and is not a paste form. For this reason, it is difficult to efficiently arrange the solder powder on the electrodes (lines). For example, in the adhesive tape described in Patent Document 2, a part of the solder powder is easily placed in a region (space) where no electrode is formed. Solder powder disposed in a region where no electrode is formed does not contribute to conduction between the electrodes. Further, paragraph [0009] of Patent Document 2 describes that the solder powder is melted by heating, and the melted solder powder moves in the resin layer and moves to the surface of the conductor part in a self-aligned manner. The particles move in the resin layer after being melted and deformed.

  In Patent Document 2, there is no specific description of the conductive particles used for the anisotropic conductive material. Moreover, there is no description about starting the movement between the electrodes before the solder particles not positioned between the electrodes melt and deform.

  Moreover, in patent document 3, the convection additive is added in the electrically conductive paste containing solder powder. Patent Document 4 describes a resin composition containing solder powder, a convection additive, and a resin having fluidity at the melting temperature of the solder powder. However, when a convection additive as described in Patent Documents 3 and 4 is added, the convection additive may remain as a foreign substance in the cured product of the conductive paste. In addition, the properties of the conductive paste may change due to the addition of a convective additive. Furthermore, voids are likely to occur in the cured product of the conductive paste. As a result, conduction reliability between electrodes may be lowered. In addition, the conductive paste that can be used is limited.

  Moreover, in paragraph [0021] of Patent Document 3, the effect of the invention of Patent Document 3 is obtained in a state where both phenomena occur, regardless of which of the solder melting and the convective additive boiling occurs first. It is described that it can appear, and the solder particles move in the resin after being melted and deformed.

  In paragraph [0021] of Patent Document 3, when the convective additive boiled by heating is convected through the resin or the solder powder is convected through the resin, the movement of the solder powder is promoted. As described, the solder powder is only moving on the convection caused by the convection additive. That is, there is no description about starting the movement between the electrodes before the solder particles that are not located between the electrodes melt and deform.

  Further, paragraph [0056] of Patent Document 4 describes that at least the resin composition 3 is heated to a temperature at which the solder powder 5 melts. Also in paragraph [0057], the convective additive boils or decomposes at this temperature to release gas. It is described that the solder powder 5 moves vigorously in the resin composition 3 by the released gas. In this case, after the solder particles are melted and deformed, they are merely moved through the resin composition on the convection generated by the convection additive. Patent Document 4 does not describe anything about starting movement between the electrodes before the solder particles that are not positioned between the electrodes are melted and deformed.

  The objective of this invention is providing the manufacturing method of the connection structure which can arrange | position solder particles efficiently on an electrode and can improve the conduction | electrical_connection reliability between electrodes.

  According to a wide aspect of the present invention, a conductive material including a plurality of solder particles and a binder is used, a first connection target member having a plurality of first electrodes on its surface is used, and a plurality of second A second connection target member having a surface of the first connection target member is used, and the binder is not completely cured at the melting point of the solder particles. And disposing the conductive material on the surface of the conductive material opposite to the first connection target member, the second connection target member, the first electrode, and the second electrode. The conductive material is heated from a temperature lower than the melting point of the solder particles to a temperature equal to or higher than the melting point of the solder particles and a temperature at which the binder is not completely cured. A first heating step; After connecting the first connection target member and the second connection target member, the conductive material is heated to a temperature higher than that of the first heating step after the first heating step. A second heating step that is formed of the conductive material and electrically connects the first electrode and the second electrode by a solder portion in the connection portion, In the heating step, before the solder particles that are not located between the first electrode and the second electrode melt and deform, the gap between the first electrode and the second electrode, There is provided a method for manufacturing a connection structure, in which the movement of solder particles that are not located between the first electrode and the second electrode is started.

  In a specific aspect of the method for manufacturing a connection structure according to the present invention, in the first heating step, the first electrode and the second electrode are disposed between the first electrode and the second electrode. Before starting the movement of the solder particles that are not located between the second electrode, the solder particles that are not located between the first electrode and the second electrode are gathered together, and then The movement of the solder particles gathered toward the first electrode and the second electrode is started.

  On the specific situation with the manufacturing method of the connection structure which concerns on this invention, the said electrically-conductive material contains a flux, The active temperature of the said flux is located between the said 1st electrode and the said 2nd electrode. Above the temperature that causes no solder particles to gather together.

  In a specific aspect of the manufacturing method of the connection structure according to the present invention, the conductive material includes a flux, and the activation temperature of the flux is between the first electrode and the second electrode. The temperature is lower than the temperature at which the movement of solder particles that are not located between the first electrode and the second electrode is started.

  In a specific aspect of the manufacturing method of the connection structure according to the present invention, in the first heating step, after the solder particles located between the first electrode and the second electrode are melted and deformed, The movement of solder particles that are not located between the first electrode and the second electrode is started between the first electrode and the second electrode.

  On the specific situation with the manufacturing method of the connection structure which concerns on this invention, a said 2nd connection object member is a semiconductor chip, a resin film, a flexible printed circuit board, a rigid flexible substrate, or a flexible flat cable.

  In a specific aspect of the manufacturing method of the connection structure according to the present invention, in the step of arranging the second connection target member and the first heating step, no pressure is applied, and the conductive material includes The weight of the second connection target member is added, or pressure is applied in at least one of the step of arranging the second connection target member and the first heating step, and the second In both the step of arranging the connection target member and the first heating step, the pressure of the pressurization is less than 1 MPa.

  On the specific situation with the manufacturing method of the connection structure which concerns on this invention, the average particle diameter of the said solder particle is 0.5 micrometer or more and 100 micrometers or less.

  On the specific situation with the manufacturing method of the connection structure which concerns on this invention, content of the said solder particle in the said electrically-conductive material is 10 to 90 weight%.

  In a specific aspect of the method for manufacturing a connection structure according to the present invention, at least a carboxyl group is formed on the surface of the solder of the solder particles via an ether bond, an ester bond, or a group represented by the following formula (X). A group having one is covalently bonded.

  In a specific aspect of the manufacturing method of the connection structure according to the present invention, a group having at least one carboxyl group is shared on the surface of the solder of the solder particle via the group represented by the formula (X). Are connected.

  On the specific situation with the manufacturing method of the connection structure which concerns on this invention, the zeta potential of the surface of the said solder particle is positive.

  The method for manufacturing a connection structure according to the present invention includes a step of disposing the conductive material on a surface of the first connection target member, and a surface opposite to the first connection target member side of the conductive material. The melting point of the solder particles from the step of arranging the second connection target member so that the first electrode and the second electrode face each other, and a temperature lower than the melting point of the solder particles. The conductive material is heated to a temperature higher than that of the first heating step after the first heating step. By heating the material, a connection portion connecting the first connection target member and the second connection target member is formed of the conductive material, and the first electrode and the second electrode are formed. And the solder part in the connection part. A second heating step that is electrically connected, and in the first heating step, before solder particles that are not located between the first electrode and the second electrode are melt-deformed, Since the movement of the solder particles that are not located between the first electrode and the second electrode is started between the first electrode and the second electrode, the solder particles are moved to the electrode. It can arrange | position efficiently on the top and can improve the conduction | electrical_connection reliability between electrodes.

FIG. 1 is a partially cutaway front sectional view schematically showing a connection structure obtained by a method for manufacturing a connection structure according to an embodiment of the present invention. 2A to 2B are views for explaining each step of the method for manufacturing the connection structure according to the embodiment of the present invention. 3A to 3C are diagrams for explaining each step of the method for manufacturing the connection structure according to the embodiment of the present invention. FIG. 4 is a diagram for explaining each step of the manufacturing method of the connection structure according to the embodiment of the present invention. FIG. 5 is a partially cutaway front sectional view showing a modified example of the connection structure.

  Details of the present invention will be described below.

  In the method for manufacturing a connection structure according to the present invention, a conductive material including a plurality of solder particles and a binder is used. In the method for manufacturing a connection structure according to the present invention, a first connection target member having a plurality of first electrodes on the surface is used. In the method for manufacturing a connection structure according to the present invention, a second connection target member having a plurality of second electrodes on the surface is used.

  In the manufacturing method of the connection structure according to the present invention, the solder particles have solder on the outer surface of the conductive portion. In the method for manufacturing a connection structure according to the present invention, the binder is not completely cured at the melting point of the solder particles. The phrase “curing is not completed at the melting point of the solder particles” means that the binder has a fluidity at the melting point of the solder particles.

  The manufacturing method of the connection structure according to the present invention includes (1) a step of arranging the conductive material on the surface of the first connection target member, and (2) the first connection target member of the conductive material. A step of disposing the second connection target member on the surface opposite to the side so that the first electrode and the second electrode face each other; and (3) a melting point of the solder particles. A first heating step of heating the conductive material from a low temperature to a temperature equal to or higher than the melting point of the solder particles and a temperature at which the binder is not completely cured; and (4) after the first heating step, By heating the conductive material to a temperature higher than that in the first heating step, a connection portion connecting the first connection target member and the second connection target member is formed of the conductive material. And the first electrode and the second electrode are And a second heating step of electrically connecting the solder portion in the connection portion.

  In the manufacturing method of the connection structure according to the present invention, in the first heating step, the solder particles that are not positioned between the first electrode and the second electrode are melted and deformed before the first heating step. The movement of the solder particles that are not located between the first electrode and the second electrode is started between the first electrode and the second electrode.

  In the present invention, since the above-described configuration is provided, when the electrodes are electrically connected, the plurality of solder particles are likely to gather between the upper and lower electrodes, and the plurality of solder particles are separated into electrodes (lines). Can be efficiently placed on top. Moreover, it is difficult for some of the plurality of solder particles to be disposed in a region (space) where no electrode is formed, and the amount of solder particles disposed in a region where no electrode is formed can be considerably reduced. In the present invention, it is possible to efficiently move the solder particles that are not located between the opposing electrodes between the opposing electrodes. Therefore, the conduction reliability between the electrodes can be improved. In addition, it is possible to prevent electrical connection between laterally adjacent electrodes that should not be connected, and to improve insulation reliability.

  As the time when the solder particles that are not located between the first electrode and the second electrode melt, the solder particles move between the first electrode and the second electrode, or After moving to the vicinity.

  In the first heating step, before the solder particles that are not located between the first electrode and the second electrode melt and deform, the gap between the first electrode and the second electrode As a specific method for starting movement of solder particles that are not located between the first electrode and the second electrode, an electrode portion formed of metal and an organic material are used. A method of controlling the temperature of the electrode part to be higher when the temperature is raised due to a difference in heat capacity or specific heat with other parts, or a method of controlling the curing rate of the binder within the time required for the movement of the solder And a method of controlling the activation temperature of the flux lower than the melting point of the solder particles. By appropriately combining these methods, the above movement conditions can be obtained.

  From the viewpoint of further improving the conduction reliability, in the first heating step, the first electrode and the second electrode are arranged between the first electrode and the second electrode. Before starting the movement of the solder particles that are not positioned between them, the solder particles that are not positioned between the first electrode and the second electrode are gathered together, and then the first electrode It is preferable to start the movement of the solder particles gathered toward each other between the first electrode and the second electrode. For example, the entire solder particles may be formed in a net shape by collecting solder particles that are not positioned between the first electrode and the second electrode. Since the solder particles gathered close together and the solder particles arranged in a net shape are attracted in conjunction with each other when moving between the first electrode and the second electrode, the moving speed of the solder particles is increased. Preferably, solder particles that are not located between the first electrode and the second electrode are gathered together in a region that is not located between the first electrode and the second electrode. . The solder particles gathered together are preferably not melted and deformed, and are preferably in a solid state.

  In the solder particles gathered close together, the average distance between the surfaces of the solder particles is preferably not more than the average particle diameter of the solder particles, and preferably not more than 3 μm. The distance between the surfaces of the solder particles is the distance to the surface of the solder particle closest to the surface of a certain solder particle.

  From the viewpoint of further improving the conduction reliability between the electrodes, the conductive material contains a flux, and the active temperature of the flux is not a solder particle that is not located between the first electrode and the second electrode. It is preferable that the temperature is equal to or higher than the temperature at which the water is collected.

  From the viewpoint of further improving the conduction reliability between the electrodes, the conductive material contains a flux, and the activation temperature of the flux is increased between the first electrode and the second electrode. It is preferable that the temperature be lower than the temperature at which the movement of the solder particles not located between the second electrode and the second electrode starts.

  From the viewpoint of further improving the reliability of conduction between the electrodes, after the solder particles located between the first electrode and the second electrode are melted and deformed in the first heating step, the first heating step is performed. It is preferable to start the movement of the solder particles that are not located between the first electrode and the second electrode, between the first electrode and the second electrode.

  From the viewpoint of further improving the insulation reliability between the electrodes, in the first heating step, before the solder particles located between the first electrode and the second electrode melt and deform, It is preferable to move the solder particles that are not located between the first electrode and the second electrode between or near the second electrode and the vicinity thereof. If the solder particles are melted between the electrodes adjacent in the lateral direction, large solder particles in which a plurality of solder particles are integrated by melting are generated. As a result, a short circuit between adjacent electrodes occurs, and the insulation reliability tends to decrease.

  In the method for manufacturing a connection structure according to the present invention, in the step of arranging the second connection target member and the first heating step, no pressure is applied, and the conductive material includes the second connection target. The weight of the member is added, or at least one of the step of arranging the second connection target member and the first heating step is performed, and the second connection target member is arranged It is preferable that the pressure of pressurization is less than 1 MPa in both the step of performing and the first heating step. By not applying a pressure of 1 MPa or more, the aggregation of solder particles is considerably promoted. From the viewpoint of suppressing warpage of the connection target member, in the method for manufacturing a connection structure according to the present invention, pressure is applied in at least one of the step of arranging the second connection target member and the first heating step. And the pressure of pressurization may be less than 1 MPa in both the step of arranging the second connection target member and the first heating step. When pressurization is performed, the pressurization may be performed only in the step of arranging the second connection target member, the pressurization may be performed only in the first heating step, or the second Pressurization may be performed in both the step of arranging the connection target member and the first heating step. The case where the pressure is less than 1 MPa includes the case where no pressure is applied. When pressurizing, the pressure of pressurization is preferably 0.9 MPa or less, more preferably 0.8 MPa or less. When the pressure of the pressurization is 0.8 MPa or less, the aggregation of the solder particles is further promoted more remarkably than when the pressure of the pressurization exceeds 0.8 MPa.

  In the method for manufacturing a connection structure according to the present invention, in the step of arranging the second connection target member and the first heating step, no pressure is applied, and the conductive material includes the second connection target. Preferably, the weight of the member is applied, and in the step of arranging the second connection target member and the first heating step, the conductive material is pressurized exceeding the weight of the second connection target member. Preferably no pressure is applied. Further, in the second heating step, it is preferable that pressure is not applied and the weight of the second connection target member is added to the conductive material. In the second heating step, the conductive material is added to the conductive material. It is preferable that no pressurized pressure exceeding the weight force of the second connection target member is applied. In these cases, the uniformity of the amount of solder can be further enhanced in the plurality of solder portions. Furthermore, the thickness of the solder part can be increased more effectively, and a plurality of solder particles can be easily collected between the electrodes, and the plurality of solder particles can be arranged more efficiently on the electrodes (lines). it can. Moreover, it is difficult for some of the plurality of solder particles to be arranged in a region (space) where no electrode is formed, and the amount of solder particles arranged in a region where no electrode is formed can be further reduced. Therefore, the conduction reliability between the electrodes can be further enhanced. In addition, the electrical connection between the laterally adjacent electrodes that should not be connected can be further prevented, and the insulation reliability can be further improved.

  Thus, in order to efficiently arrange a plurality of solder particles on the electrode and to considerably reduce the amount of solder particles arranged in the region where the electrode is not formed, a conductive paste is used instead of a conductive film. It is preferable to use it. The present inventors have found that such an effect can be obtained by using a conductive paste.

  Furthermore, in the step of arranging the second connection target member and the first heating step, if no weight is applied and the weight of the second connection target member is added to the conductive paste, a connection portion is formed. Solder particles arranged in a region (space) where no electrode is formed before being formed are more likely to gather between the first electrode and the second electrode, and a plurality of solder particles are placed on the electrode (line). The present inventor has also found that it can be arranged more efficiently. In the present invention, a configuration in which a conductive paste is used instead of a conductive film and a configuration in which the weight of the second connection target member is added to the conductive paste without applying pressure are used in combination. This has a great meaning in order to obtain the effects of the present invention at a higher level.

  In JP-A-2004-260131, a resin heating step for heating the anisotropic conductive resin to a temperature higher than the melting point of the solder particles and at which the resin component is not completely cured, and a resin for curing the resin component. It is described that the electrodes are electrically connected through a component curing step. However, in the method specifically disclosed in Japanese Patent Application Laid-Open No. 2004-260131, solder particles are melted in a resin component that is not completely cured at a temperature at which the anisotropic conductive resin is heated. In this case, the solder particles do not move efficiently between the opposing electrodes.

  In addition, WO2008 / 023452A1 describes that it is preferable to pressurize with a predetermined pressure at the time of bonding from the viewpoint of efficiently moving the solder powder to the electrode surface, and the pressurizing pressure further ensures the solder area. For example, it is described that the pressure is set to 0 MPa or more, preferably 1 MPa or more. Further, even if the pressure intentionally applied to the adhesive tape is 0 MPa, the member disposed on the adhesive tape It is described that a predetermined pressure may be applied to the adhesive tape by its own weight. In WO2008 / 023452A1, it is described that the pressure applied intentionally to the adhesive tape may be 0 MPa, but there is no difference between the effect when the pressure exceeding 0 MPa is applied and when the pressure is set to 0 MPa. Not listed. In addition, WO2008 / 023452A1 recognizes nothing about the importance of using a paste-like conductive paste instead of a film.

  Moreover, if a conductive paste is used instead of a conductive film, it becomes easy to adjust the thickness of the connection part and the solder part depending on the amount of the conductive paste applied. On the other hand, in the conductive film, in order to change or adjust the thickness of the connection portion, it is necessary to prepare a conductive film having a different thickness or to prepare a conductive film having a predetermined thickness. There is. In addition, the conductive film has a problem that the melt viscosity of the conductive film cannot be sufficiently lowered at the melting temperature of the solder, and the aggregation of the solder particles tends to be hindered.

  Moreover, it is preferable that a conductive material does not contain a convection additive. By not adding a convective additive or the like to the conductive material, it is possible to suppress the deterioration of the quality of the conductive paste due to the convective additive, and it is possible to suppress the decrease in connection resistance between the electrodes due to the convective additive. Moreover, it can suppress that the basic performance of an electrically-conductive material falls by a convection additive.

  Hereinafter, the present invention will be clarified by describing specific embodiments and examples of the present invention with reference to the drawings.

  First, FIG. 1 schematically shows a connection structure obtained by the method for manufacturing a connection structure according to an embodiment of the present invention in a partially cutaway front sectional view.

  The connection structure 1 shown in FIG. 1 is a connection that connects a first connection target member 2, a second connection target member 3, and the first connection target member 2 and the second connection target member 3. Part 4. The connection part 4 is formed of a conductive material containing a plurality of solder particles and a binder. In the present embodiment, the binder includes a thermosetting component. In the present embodiment, a conductive paste is used as the conductive material.

  The connection portion 4 includes a solder portion 4A in which a plurality of solder particles are gathered and joined to each other, and a cured product portion 4B in which a thermosetting component is thermally cured. In the present embodiment, solder particles are used as the conductive particles in order to form the solder portion 4A. The solder particles are particles in which both the central portion and the outer surface of the conductive portion are solder. As for the said solder particle, both the center part and the outer surface of an electroconductive part are formed with the solder.

  The first connection target member 2 has a plurality of first electrodes 2a on the surface (upper surface). The second connection target member 3 has a plurality of second electrodes 3a on the surface (lower surface). The first electrode 2a and the second electrode 3a are electrically connected by the solder portion 4A. Therefore, the first connection target member 2 and the second connection target member 3 are electrically connected by the solder portion 4A. In the connection portion 4, no solder exists in a region (cured product portion 4B portion) different from the solder portion 4A gathered between the first electrode 2a and the second electrode 3a. In an area different from the solder part 4A (hardened product part 4B part), there is no solder separated from the solder part 4A. If the amount is small, the solder may be present in a region (cured product portion 4B portion) different from the solder portion 4A gathered between the first electrode 2a and the second electrode 3a.

  As shown in FIG. 1, in the connection structure 1, a plurality of solder particles gather between the first electrode 2 a and the second electrode 3 a, and after the plurality of solder particles melt, After the electrode surface wets and spreads, it solidifies to form the solder portion 4A. For this reason, the connection area of 4 A of solder parts and the 1st electrode 2a, and 4 A of solder parts, and the 2nd electrode 3a becomes large. That is, by using the solder particles, the solder portion 4A, the first electrode 2a, and the solder portion are compared with the case where the conductive outer surface is made of a metal such as nickel, gold or copper. The contact area between 4A and the second electrode 3a increases. This also increases the conduction reliability and connection reliability in the connection structure 1. In addition, when a flux is contained in the conductive material, the flux is generally gradually deactivated by heating.

  In addition, in the connection structure 1 shown in FIG. 1, all the solder parts 4A are located in the area | region which the 1st, 2nd electrodes 2a and 3a oppose. The connection structure 1X of the modification shown in FIG. 5 is different from the connection structure 1 shown in FIG. 1 only in the connection portion 4X. The connection part 4X has the solder part 4XA and the hardened | cured material part 4XB. As in the connection structure 1X, most of the solder portions 4XA are located in regions where the first and second electrodes 2a and 3a are opposed to each other, and a part of the solder portion 4XA is first and second. You may protrude to the side from the area | region which electrode 2a, 3a has opposed. The solder part 4XA protruding laterally from the region where the first and second electrodes 2a and 3a are opposed is a part of the solder part 4XA and is not a solder separated from the solder part 4XA. In the present embodiment, the amount of solder away from the solder portion can be reduced, but the solder away from the solder portion may exist in the cured product portion.

  If the amount of solder particles used is reduced, the connection structure 1 can be easily obtained. If the amount of the solder particles used is increased, it becomes easy to obtain the connection structure 1X.

  From the viewpoint of further improving the conduction reliability, the portion where the first electrode and the second electrode face each other in the stacking direction of the first electrode, the connection portion, and the second electrode is seen. In some cases, it is preferable that the solder portion in the connection portion is disposed in 50% or more of the area of 100% of the portion where the first electrode and the second electrode face each other.

  From the viewpoint of further improving the conduction reliability, the first electrode and the second electrode are opposed to each other in a direction orthogonal to the stacking direction of the first electrode, the connection portion, and the second electrode. It is preferable that 70% or more of the solder portion in the connection portion is disposed in a portion where the first electrode and the second electrode face each other when the matching portion is viewed.

  Next, the manufacturing method of the connection structure which concerns on one Embodiment of this invention is demonstrated.

  First, the 1st connection object member 2 which has the 1st electrode 2a on the surface (upper surface) is prepared. Next, as shown in FIG. 2A, a conductive paste 11 including a thermosetting component 11B and a plurality of solder particles 11A is disposed on the surface of the first connection target member 2 (first Process). The conductive paste 11 is disposed on the surface of the first connection target member 2 on which the first electrode 2a is provided. After the conductive paste 11 is disposed, the solder particles 11A are disposed both on the first electrode 2a (line) and on a region (space) where the first electrode 2a is not formed.

  The arrangement method of the conductive paste 11 is not particularly limited, and examples thereof include application with a dispenser, screen printing, and ejection with an inkjet device.

  Moreover, the 2nd connection object member 3 which has the 2nd electrode 3a on the surface (lower surface) is prepared. Next, as shown in FIG. 2B, in the conductive paste 11 on the surface of the first connection target member 2, on the surface of the conductive paste 11 opposite to the first connection target member 2 side, The 2nd connection object member 3 is arrange | positioned (2nd process). On the surface of the conductive paste 11, the second connection target member 3 is disposed from the second electrode 3a side. At this time, the first electrode 2a and the second electrode 3a are opposed to each other.

  Next, the conductive paste 11 is heated from a temperature lower than the melting point of the solder particles 11A to a temperature higher than the melting point of the solder particles 11A (conductive particles) and a temperature at which the curing of the thermosetting component 11B (binder) is not completed. (Third step / first heating step). In the said 1st heating process, it passes through each state of Fig.3 (a)-(c).

  3A to 3C, the solder on the outer surface of the solder particle 11A that is not located between the first electrode 2a and the second electrode 3a is melted and deformed. The movement of the solder particles 11A that are not positioned between the first electrode 2a and the second electrode 3a is started between the first electrode 2a and the second electrode 3a. That is, the movement of the solder particles 11A that are not located between the first electrode 2a and the second electrode 3a starts between the first electrode 2a and the second electrode 3a. It is not after the solder on the outer surface of the solder particles 11A not located between the first electrode 2a and the second electrode 3a is melted and deformed, but between the first electrode 2a and the second electrode 3a. This is before the solder on the outer surface of the solder particle 11A that is not positioned melts and deforms.

  In the present embodiment, in the first heating step, it is not located between the first electrode 2a and the second electrode 3a toward the space between the first electrode 2a and the second electrode 3a. Before the movement of the solder particles 11A is started, the solder particles 11A that are not positioned between the first electrode 2a and the second electrode 3a are gathered together (FIG. 3A).

  Furthermore, in the present embodiment, in the first heating step, the solder on the outer surface of the solder particles 11A located between the first electrode 2a and the second electrode 3a is melt-deformed (FIG. 3 ( b)).

  Next, the movement of the solder particles 11A that are not located between the first electrode 2a and the second electrode 3a is started between the first electrode 2a and the second electrode 3a. (FIG. 3C).

  Next, after the first heating step, the conductive paste 11 is heated to a temperature higher than that of the first heating step (fourth step / second heating step). In the second heating step, curing of the binder is preferably completed. As a result, as shown in FIG. 4, the connection portion 4 connecting the first connection target member 2 and the second connection target member 3 is formed by the conductive paste 11. The connection part 4 is formed by the conductive paste 11, the solder part 4A is formed by joining a plurality of solder particles 11A, and the cured part 4B is formed by thermosetting the thermosetting component 11B. If the solder particles 11A are sufficiently moved, the first electrode 2a and the second electrode are moved after the movement of the solder particles 11A not located between the first electrode 2a and the second electrode 3a starts. It is not necessary to keep the temperature constant until the movement of the solder particles 11A is completed.

  In the present embodiment, it is preferable not to apply pressure in the second step and the first heating step (the third step). In this case, in the present embodiment, the weight of the second connection target member 3 is added to the conductive paste 11. In this embodiment, a conductive paste is used instead of a conductive film. For this reason, when the connection part 4 is formed, the solder particles 11A are effectively collected between the first electrode 2a and the second electrode 3a. As a result, the thickness of the solder part 4A between the first electrode 2a and the second electrode 3a tends to increase. In addition, if pressurization is performed in at least one of the second step and the first heating step, the action of the solder particles trying to collect between the first electrode and the second electrode is hindered. The tendency to be higher. This has been found by the inventor. In the present embodiment, no pressure is applied even in the second heating step (the fourth step).

  However, pressurization may be performed as long as the interval between the first electrode and the second electrode can be secured. As a means for ensuring the gap between the electrodes, for example, a spacer corresponding to the desired gap between the electrodes may be added so that at least one, preferably three or more spacers are arranged between the electrodes. Examples of the spacer include inorganic particles and organic particles. The spacer is preferably an insulating particle.

  Moreover, in this embodiment, since pressurization is not performed, when the second connection target member is superimposed on the first connection target member on which the conductive material is arranged, the electrode of the first connection target member Even when the first connection target member and the second connection target member are overlapped in a state where the alignment with the electrode of the second connection target member is shifted, the shift is corrected and the first connection target is corrected. The electrode of the member can be connected to the electrode of the second connection target member (self-alignment effect). This is because the molten solder self-aggregated between the electrode of the first connection target member and the electrode of the second connection target member is the electrode of the first connection target member and the electrode of the second connection target member. As the area where the solder and the other components of the conductive material are in contact with each other is minimized, the energy becomes more stable. Therefore, the force that makes the connection structure with alignment, which is the connection structure with the smallest area, works. Because. At this time, it is desirable that the conductive material is not cured and that the viscosity of components other than the solder particles of the conductive material is sufficiently low at that temperature and time.

  The viscosity of the conductive material at the melting point temperature of the solder is preferably 50 Pa · s or less, more preferably 10 Pa · s or less, still more preferably 1 Pa · s or less, preferably 0.1 Pa · s or more, more preferably 0.2 Pa. -It is more than s. If the viscosity is below a predetermined viscosity, the solder particles can be efficiently aggregated.If the viscosity is above the predetermined viscosity, the void at the connection portion is suppressed, and the conductive paste is prevented from protruding beyond the connection portion. In addition, the uniformity of the solder amount can be further improved in the plurality of solder portions.

  In this way, the connection structure 1 shown in FIG. 1 is obtained. The second step and the third step may be performed continuously. Moreover, after performing the said 2nd process, the laminated body of the obtained 1st connection object member 2, the electrically conductive paste 11, and the 2nd connection object member 3 is moved to a heating part, and said 3rd said You may perform a process. In order to perform the heating, the laminate may be disposed on a heating member, or the laminate may be disposed in a heated space.

  The first heating step (third step) and the second heating step (fourth step) may be performed continuously or discontinuously. In the first heating step and the second heating step, the heating temperature may be continuous or discontinuous.

  In addition, after the first heating step or after the second heating step, the first connection target member or the second connection target member is peeled from the connection portion for the purpose of correcting the position or redoing the manufacturing. can do. The heating temperature for performing this peeling is preferably not lower than the melting point of the solder particles, more preferably not lower than the melting point (° C.) of the solder particles + 10 ° C. The heating temperature for performing this peeling may be the melting point (° C.) of the solder particles + 100 ° C. or less.

  As a heating method after the third step or in the fourth step, the entire connection structure is used by using a reflow furnace or an oven above the melting point of the solder particles and the curing temperature of the thermosetting component. And a method of locally heating only the connection part of the connection structure.

  As a tool used for the method of heating locally, a hot plate, a heat gun for applying hot air, a soldering iron, an infrared heater, and the like can be given.

  In addition, when heating locally with a hot plate, the metal directly under the connection is made of a metal with high thermal conductivity, and other places where heating is not preferred are made of a material with low thermal conductivity such as a fluororesin. The upper surface of the hot plate is preferably formed.

  The said 1st, 2nd connection object member is not specifically limited. Specifically as said 1st, 2nd connection object member, electronic components, such as a semiconductor chip, a semiconductor package, LED chip, LED package, a capacitor | condenser, a diode, and a resin film, a printed circuit board, a flexible printed circuit board, flexible Examples thereof include electronic components such as circuit boards such as flat cables, rigid flexible boards, glass epoxy boards, and glass boards. The first and second connection target members are preferably electronic components.

  At least one of the first connection target member and the second connection target member is preferably a semiconductor chip, a resin film, a flexible printed circuit board, a rigid flexible circuit board, or a flexible flat cable. A substrate, a flexible flat cable, or a rigid flexible substrate is more preferable. The second connection target member is preferably a semiconductor chip, a resin film, a flexible printed board, a rigid flexible board, or a flexible flat cable, and more preferably a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board. preferable. Resin films, flexible printed boards, flexible flat cables, and rigid flexible boards have the property of being highly flexible and relatively lightweight. When a conductive film is used for connection of such a connection object member, there exists a tendency for a solder particle not to gather on an electrode. On the other hand, by using a conductive paste, even if a resin film, a flexible printed circuit board, a flexible flat cable, or a rigid flexible circuit board is used, it is possible to efficiently collect the solder particles on the electrodes, thereby ensuring conduction reliability between the electrodes. The nature can be sufficiently enhanced. When using a resin film, a flexible printed circuit board, a flexible flat cable, or a rigid flexible circuit board, compared to the case of using other connection target members such as a semiconductor chip, the conduction reliability between the electrodes by not applying pressure is improved. The improvement effect can be obtained more effectively.

  Peripherals, area arrays, and the like exist in the form of the connection target member. As a feature of each member, in the peripheral substrate, the electrodes are present only on the outer peripheral portion of the substrate. In the area array substrate, there are electrodes in the plane.

  Examples of the electrodes provided on the connection target member include metal electrodes such as gold electrodes, nickel electrodes, tin electrodes, aluminum electrodes, copper electrodes, molybdenum electrodes, silver electrodes, SUS electrodes, and tungsten electrodes. When the connection object member is a flexible printed board, the electrode is preferably a gold electrode, a nickel electrode, a tin electrode, a silver electrode, or a copper electrode. When the connection target member is a glass substrate, the electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, a silver electrode, or a tungsten electrode. In addition, when the said electrode is an aluminum electrode, the electrode formed only with aluminum may be sufficient and the electrode by which the aluminum layer was laminated | stacked on the surface of the metal oxide layer may be sufficient. Examples of the material for the metal oxide layer include indium oxide doped with a trivalent metal element and zinc oxide doped with a trivalent metal element. Examples of the trivalent metal element include Sn, Al, and Ga.

  In order to more efficiently arrange the solder particles on the electrode, the viscosity (η25) at 25 ° C. of the conductive material is preferably 10 Pa · s or more, more preferably 20 Pa · s or more, and further preferably 50 Pa · s or more. , Preferably 800 Pa · s or less, more preferably 600 Pa · s or less, and even more preferably 500 Pa · s or less. When the viscosity is equal to or higher than the lower limit, the first connection target member and the second connection target member are bonded to the upper and lower electrodes immediately after the conductive material is bonded to the completion of the curing of the conductive material. Misalignment is even less likely to occur. When the viscosity is equal to or lower than the upper limit, the solder particles are more efficiently aggregated.

  The said viscosity can be suitably adjusted with the kind and compounding quantity of a compounding component. Further, the use of a filler can make the viscosity relatively high.

  The viscosity can be measured, for example, using an E-type viscometer (“TVE22L” manufactured by Toki Sangyo Co., Ltd.) and the like under conditions of 25 ° C. and 5 rpm.

  The conductive material and the binder preferably contain a thermoplastic component or a thermosetting component. The conductive material and the binder may contain a thermoplastic component or a thermosetting component. The conductive material and the binder preferably include a thermosetting component. The conductive material and the binder preferably include a thermosetting compound and a thermosetting agent.

  Hereinafter, other details of the present invention will be described.

(Solder particles)
From the viewpoint of effectively reducing the connection resistance in the connection structure and effectively suppressing the generation of voids, the solder surface of the solder particles is represented by an ether bond, an ester bond or the following formula (X). A group having at least one carboxyl group is preferably covalently bonded through the group. In the following formula (X), the right end and the left end represent a binding site.

  Hydroxyl groups exist on the surface of the solder. By covalently bonding this hydroxyl group and a group containing a carboxyl group, a stronger bond can be formed than in the case of bonding by other coordination bond (chelate coordination) or the like, so the connection resistance between the electrodes is reduced, And the solder particle which can suppress generation | occurrence | production of a void is obtained.

  In the solder particles, the bonding form between the surface of the solder and the group containing a carboxyl group may not include a coordination bond, and may not include a bond due to a chelate coordination.

  From the viewpoint of effectively reducing the connection resistance in the connection structure and effectively suppressing the generation of voids, the solder particles are compounds having a functional group capable of reacting with a hydroxyl group and a carboxyl group (hereinafter referred to as Compound X). Is preferably obtained by reacting a hydroxyl group on the surface of the solder with a functional group capable of reacting with the hydroxyl group. In the above reaction, a covalent bond is formed. By reacting a hydroxyl group on the surface of the solder with a functional group capable of reacting with the hydroxyl group in the compound X, solder particles in which a group containing a carboxyl group is covalently bonded to the surface of the solder can be easily obtained. It is also possible to obtain solder particles in which a group containing a carboxyl group is covalently bonded to the surface of the solder via an ether bond or an ester bond. By reacting a hydroxyl group on the surface of the solder with a functional group capable of reacting with the hydroxyl group, the compound X can be chemically bonded to the surface of the solder in the form of a covalent bond.

  Examples of the functional group capable of reacting with the hydroxyl group include a hydroxyl group, a carboxyl group, an ester group, and a carbonyl group. A hydroxyl group or a carboxyl group is preferred. The functional group capable of reacting with the hydroxyl group may be a hydroxyl group or a carboxyl group.

  Examples of the compound having a functional group capable of reacting with a hydroxyl group include levulinic acid, glutaric acid, glycolic acid, succinic acid, malic acid, oxalic acid, malonic acid, adipic acid, 5-ketohexanoic acid, 3-hydroxypropionic acid, 4- Aminobutyric acid, 3-mercaptopropionic acid, 3-mercaptoisobutyric acid, 3-methylthiopropionic acid, 3-phenylpropionic acid, 3-phenylisobutyric acid, 4-phenylbutyric acid, decanoic acid, dodecanoic acid, tetradecanoic acid, pentadecanoic acid, Hexadecanoic acid, 9-hexadecenoic acid, heptadecanoic acid, stearic acid, oleic acid, vaccenic acid, linoleic acid, (9,12,15) -linolenic acid, nonadecanoic acid, arachidic acid, decanedioic acid and dodecanedioic acid It is done. Glutaric acid or glycolic acid is preferred. Only 1 type may be used for the compound which has the functional group which can react with the said hydroxyl group, and 2 or more types may be used together. The compound having a functional group capable of reacting with the hydroxyl group is preferably a compound having at least one carboxyl group.

  The compound X preferably has a flux action, and the compound X preferably has a flux action in a state of being bonded to the solder surface. The compound having a flux action can remove the oxide film on the surface of the solder and the oxide film on the surface of the electrode. The carboxyl group has a flux action.

  Examples of the compound having a flux action include levulinic acid, glutaric acid, succinic acid, 5-ketohexanoic acid, 3-hydroxypropionic acid, 4-aminobutyric acid, 3-mercaptopropionic acid, 3-mercaptoisobutyric acid, and 3-methylthiopropionic acid. , 3-phenylpropionic acid, 3-phenylisobutyric acid and 4-phenylbutyric acid. Glutaric acid or glycolic acid is preferred. As for the compound which has the said flux effect | action, only 1 type may be used and 2 or more types may be used together.

  From the viewpoint of effectively reducing the connection resistance in the connection structure and effectively suppressing the generation of voids, the functional group capable of reacting with the hydroxyl group in the compound X is preferably a hydroxyl group or a carboxyl group. The functional group capable of reacting with the hydroxyl group in the compound X may be a hydroxyl group or a carboxyl group. When the functional group capable of reacting with the hydroxyl group is a carboxyl group, the compound X preferably has at least two carboxyl groups. By reacting a part of the carboxyl groups of the compound having at least two carboxyl groups with a hydroxyl group on the surface of the solder, solder particles in which a group containing a carboxyl group is covalently bonded to the surface of the solder can be obtained.

  The solder particle manufacturing method includes, for example, a step of using solder particles to mix the solder particles, a compound having a functional group capable of reacting with a hydroxyl group and a carboxyl group, a catalyst, and a solvent. In the method for producing solder particles, solder particles in which a group containing a carboxyl group is covalently bonded to the surface of the solder can be easily obtained by the mixing step.

  In the method for producing solder particles, it is preferable that the solder particles are used to mix and heat the solder particles, a compound having a functional group capable of reacting with the hydroxyl group and a carboxyl group, the catalyst, and the solvent. . By the mixing and heating process, solder particles in which a group containing a carboxyl group is covalently bonded to the surface of the solder can be obtained more easily.

  Examples of the solvent include alcohol solvents such as methanol, ethanol, propanol and butanol, acetone, methyl ethyl ketone, ethyl acetate, toluene and xylene. The solvent is preferably an organic solvent, and more preferably toluene. As for the said solvent, only 1 type may be used and 2 or more types may be used together.

  Examples of the catalyst include p-toluenesulfonic acid, benzenesulfonic acid and 10-camphorsulfonic acid. The catalyst is preferably p-toluenesulfonic acid. As for the said catalyst, only 1 type may be used and 2 or more types may be used together.

  It is preferable to heat at the time of the mixing. The heating temperature is preferably 90 ° C or higher, more preferably 100 ° C or higher, preferably 130 ° C or lower, more preferably 110 ° C or lower.

  From the viewpoint of effectively reducing the connection resistance in the connection structure and effectively suppressing the generation of voids, the solder particles are a step of reacting the isocyanate with a hydroxyl group on the surface of the solder using an isocyanate compound. It is preferable that it is obtained through this. In the above reaction, a covalent bond is formed. By reacting the hydroxyl group on the surface of the solder with the isocyanate compound, it is possible to easily obtain solder particles in which the nitrogen atom of the group derived from the above-mentioned formula isocyanate group is covalently bonded to the surface of the solder. By reacting the isocyanate compound with a hydroxyl group on the surface of the solder, a group derived from the isocyanate group can be chemically bonded to the surface of the solder in the form of a covalent bond.

  Moreover, a silane coupling agent can be easily reacted with a group derived from an isocyanate group. Since the solder particles can be easily obtained, the group having at least one carboxyl group is introduced by a reaction using a silane coupling agent having a carboxyl group, or a silane coupling agent is used. After the reaction, it is preferably introduced by reacting a group having at least one carboxyl group with a group derived from a silane coupling agent. The solder particles are preferably obtained by reacting the isocyanate compound with a hydroxyl group on the surface of the solder using the isocyanate compound and then reacting a compound having at least one carboxyl group.

  From the viewpoint of effectively reducing the connection resistance in the connection structure and effectively suppressing the generation of voids, the compound having at least one carboxyl group preferably has a plurality of carboxyl groups.

  Examples of the isocyanate compound include diphenylmethane-4,4'-diisocyanate (MDI), hexamethylene diisocyanate (HDI), toluene diisocyanate (TDI), and isophorone diisocyanate (IPDI). Isocyanate compounds other than these may be used. After reacting this compound on the surface of the solder, the residual isocyanate group, and a compound having reactivity with the residual isocyanate group and having a carboxyl group are reacted, and expressed on the solder surface by the formula (X). A carboxyl group can be introduced through the group.

  As said isocyanate compound, you may use the compound which has an unsaturated double bond and has an isocyanate group. Examples include 2-acryloyloxyethyl isocyanate and 2-isocyanatoethyl methacrylate. After reacting the isocyanate group of this compound on the surface of the solder, the surface of the solder is reacted with a compound having a functional group having reactivity with the remaining unsaturated double bond and having a carboxyl group. A carboxyl group can be introduced through the group represented by the formula (X).

  Examples of the silane coupling agent include 3-isocyanatopropyltriethoxysilane (“KBE-9007” manufactured by Shin-Etsu Chemical Co., Ltd.) and 3-isocyanatepropyltrimethoxysilane (“Y-5187” manufactured by MOMENTIVE). . As for the said silane coupling agent, only 1 type may be used and 2 or more types may be used together.

  Examples of the compound having at least one carboxyl group include levulinic acid, glutaric acid, succinic acid, malic acid, oxalic acid, malonic acid, adipic acid, 5-ketohexanoic acid, 3-hydroxypropionic acid, 4-aminobutyric acid, 3 -Mercaptopropionic acid, 3-mercaptoisobutyric acid, 3-methylthiopropionic acid, 3-phenylpropionic acid, 3-phenylisobutyric acid, 4-phenylbutyric acid, decanoic acid, dodecanoic acid, tetradecanoic acid, pentadecanoic acid, hexadecanoic acid, 9 -Hexadecenoic acid, heptadecanoic acid, stearic acid, oleic acid, vaccenic acid, linoleic acid, (9,12,15) -linolenic acid, nonadecanoic acid, arachidic acid, decanedioic acid and dodecanedioic acid. Glutaric acid, adipic acid or glycolic acid is preferred. As for the compound which has at least 1 said carboxyl group, only 1 type may be used and 2 or more types may be used together.

  After reacting the isocyanate compound with the hydroxyl group on the surface of the solder using the isocyanate compound, the carboxyl group of the compound having a plurality of carboxyl groups is reacted with the hydroxyl group on the surface of the solder. A group having at least one of can be left.

  In the method for producing solder particles, using the solder particles and using an isocyanate compound, after reacting the isocyanate compound with a hydroxyl group on the surface of the solder, reacting a compound having at least one carboxyl group. Solder particles in which a group having at least one carboxyl group is bonded to the surface of the solder via the group represented by the above formula (X) are obtained. In the method for producing solder particles, solder particles in which a group containing a carboxyl group is introduced on the surface of the solder can be easily obtained by the above-described steps.

  Specific methods for producing the solder particles include the following methods. Solder particles are dispersed in an organic solvent, and a silane coupling agent having an isocyanate group is added. Thereafter, a silane coupling agent is covalently bonded to the solder surface using a reaction catalyst between a hydroxyl group and an isocyanate group on the solder surface of the solder particles. Next, a hydroxyl group is generated by hydrolyzing the alkoxy group bonded to the silicon atom of the silane coupling agent. The produced hydroxyl group is reacted with a carboxyl group of a compound having at least one carboxyl group.

  Moreover, the following method is mentioned as a specific manufacturing method of the said solder particle. Solder particles are dispersed in an organic solvent, and a compound having an isocyanate group and an unsaturated double bond is added. Thereafter, a covalent bond is formed using a reaction catalyst between a hydroxyl group and an isocyanate group on the solder surface of the solder particles. Thereafter, the unsaturated double bond introduced is reacted with a compound having an unsaturated double bond and a carboxyl group.

  As reaction catalysts for hydroxyl groups and isocyanate groups on the solder surface of solder particles, tin-based catalysts (dibutyltin dilaurate, etc.), amine-based catalysts (triethylenediamine, etc.), carboxylate catalysts (lead naphthenate, potassium acetate, etc.), and And trialkylphosphine catalysts (triethylphosphine, etc.).

  From the viewpoint of effectively reducing the connection resistance in the connection structure and effectively suppressing the generation of voids, the compound having at least one carboxyl group is a compound represented by the following formula (1): Is preferred. The compound represented by the following formula (1) has a flux action. Moreover, the compound represented by following formula (1) has a flux effect | action in the state introduced into the surface of solder.

  In said formula (1), X represents the functional group which can react with a hydroxyl group, R represents a C1-C5 bivalent organic group. The organic group may contain a carbon atom, a hydrogen atom, and an oxygen atom. The organic group may be a divalent hydrocarbon group having 1 to 5 carbon atoms. The main chain of the organic group is preferably a divalent hydrocarbon group. In the organic group, a carboxyl group or a hydroxyl group may be bonded to a divalent hydrocarbon group. Examples of the compound represented by the above formula (1) include citric acid.

  The compound having at least one carboxyl group is preferably a compound represented by the following formula (1A) or the following formula (1B). The compound having at least one carboxyl group is preferably a compound represented by the following formula (1A), and more preferably a compound represented by the following formula (1B).

  In said formula (1A), R represents a C1-C5 bivalent organic group. R in the above formula (1A) is the same as R in the above formula (1).

  In said formula (1B), R represents a C1-C5 bivalent organic group. R in the above formula (1B) is the same as R in the above formula (1).

  A group represented by the following formula (2A) or the following formula (2B) is preferably bonded to the surface of the solder. A group represented by the following formula (2A) is preferably bonded to the surface of the solder, and more preferably a group represented by the following formula (2B) is bonded. In the following formula (2A), the left end represents a binding site.

  In said formula (2A), R represents a C1-C5 bivalent organic group. R in the above formula (2A) is the same as R in the above formula (1). In the following formula (2B), the left end represents a binding site.

  In said formula (2B), R represents a C1-C5 bivalent organic group. R in the above formula (2B) is the same as R in the above formula (1).

  From the viewpoint of improving the wettability of the solder surface, the molecular weight of the compound having at least one carboxyl group is preferably 10,000 or less, more preferably 1000 or less, and even more preferably 500 or less.

  The molecular weight means a molecular weight that can be calculated from the structural formula when the compound having at least one carboxyl group is not a polymer and when the structural formula of the compound having at least one carboxyl group can be specified. Further, when the compound having at least one carboxyl group is a polymer, it means a weight average molecular weight.

  From the viewpoint of efficiently collecting the solder particles on the electrode, the zeta potential on the surface of the solder particles is preferably positive. However, in the present invention, the zeta potential of the surface of the solder particle may not be positive.

  The zeta potential is measured as follows.

Zeta potential measurement method:
0.05 g of solder particles are put in 10 g of methanol and subjected to ultrasonic treatment or the like to uniformly disperse to obtain a dispersion. The zeta potential can be measured by electrophoretic measurement using this dispersion and “Delsamax PRO” manufactured by Beckman Coulter.

  The zeta potential of the solder particles is preferably 0 mV or more, more preferably more than 0 mV, preferably 10 mV or less, more preferably 5 mV or less, even more preferably 1 mV or less, still more preferably 0.7 mV or less, particularly preferably 0.5 mV. It is as follows. If the zeta potential is less than or equal to the above upper limit, solder particles tend to collect during conductive connection. When the zeta potential is less than 0 mV, the aggregation of solder particles on the electrode may be insufficient during mounting.

  Since it is easy to make the zeta potential of the surface positive, it is preferable that the solder particles have a solder particle main body and an anionic polymer disposed on the surface of the solder particle main body. The solder particles are preferably obtained by surface-treating the solder particle body with an anionic polymer or a compound that becomes an anionic polymer. The solder particles are preferably a surface treated product of an anion polymer or a compound that becomes an anion polymer. As for the said anion polymer and the compound used as the said anion polymer, only 1 type may respectively be used and 2 or more types may be used together. The anionic polymer is a polymer having an acidic group.

  As a method of surface-treating the solder particle body with an anionic polymer, as an anionic polymer, for example, a (meth) acrylic polymer copolymerized with (meth) acrylic acid, synthesized from a dicarboxylic acid and a diol and having carboxyl groups at both ends Polyester polymer, polymer obtained by intermolecular dehydration condensation reaction of dicarboxylic acid and having carboxyl groups at both ends, polyester polymer synthesized from dicarboxylic acid and diamine and having carboxyl groups at both ends, and modified poval having carboxyl groups ( A method of reacting a carboxyl group of an anionic polymer with a hydroxyl group on the surface of a solder particle body using “GOHSEX T” manufactured by Nippon Synthetic Chemical Co., Ltd., etc.

Examples of the anion portion of the anion polymer include the carboxyl group, and other than that, a tosyl group (p-H ₃ CC ₆ H ₄ S (═O) ₂ —), a sulfonate ion group (—SO ₃ ^— ), And phosphate ion groups (—PO ₄ ⁻ ) and the like.

  As another method of surface treatment, a compound having a functional group capable of reacting with a hydroxyl group on the surface of the solder particle body and further having a functional group capable of being polymerized by addition or condensation reaction is used to solder this compound. The method of polymerizing on the surface of a particle main body is mentioned. Examples of the functional group that reacts with the hydroxyl group on the surface of the solder particle body include a carboxyl group and an isocyanate group. Examples of the functional group that polymerizes by addition and condensation reactions include a hydroxyl group, a carboxyl group, an amino group, and (meth). An acryloyl group is mentioned.

  The weight average molecular weight of the anionic polymer is preferably 2000 or more, more preferably 3000 or more, preferably 10,000 or less, more preferably 8000 or less. When the weight average molecular weight is not less than the above lower limit and not more than the above upper limit, a sufficient amount of charge and flux properties can be introduced on the surface of the solder particles. Thereby, it is easy to control the zeta potential on the surface of the solder particles within a suitable range, and the oxide film on the surface of the electrode can be effectively removed when the connection target member is connected.

  When the weight average molecular weight is not less than the above lower limit and not more than the above upper limit, it is easy to dispose an anionic polymer on the surface of the solder particle body, and it is easy to make the zeta potential on the surface of the solder particle positive. The solder particles can be arranged on the electrodes even more efficiently.

  The weight average molecular weight indicates a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).

  The weight average molecular weight of the polymer obtained by surface-treating the solder particle body with a compound that becomes an anionic polymer is obtained by dissolving the solder in the solder particles and removing the solder particles with dilute hydrochloric acid or the like that does not cause decomposition of the polymer. It can be determined by measuring the weight average molecular weight of the remaining polymer.

  Regarding the introduction amount of the anionic polymer on the surface of the solder particles, the acid value per 1 g of the solder particles is preferably 1 mgKOH or more, more preferably 2 mgKOH or more, preferably 10 mgKOH or less, more preferably 6 mgKOH or less.

  The acid value can be measured as follows. 1 g of solder particles is added to 36 g of acetone and dispersed with an ultrasonic wave for 1 minute. Thereafter, phenolphthalein is used as an indicator and titrated with a 0.1 mol / L potassium hydroxide ethanol solution.

  The solder is preferably a metal (low melting point metal) having a melting point of 450 ° C. or lower. The solder particles are preferably metal particles (low melting point metal particles) having a melting point of 450 ° C. or lower. The low melting point metal particles are particles containing a low melting point metal. The low melting point metal is a metal having a melting point of 450 ° C. or lower. The melting point of the low melting point metal is preferably 300 ° C. or lower, more preferably 160 ° C. or lower. The solder particles include tin. In 100% by weight of the metal contained in the solder particles, the content of tin is preferably 30% by weight or more, more preferably 40% by weight or more, still more preferably 70% by weight or more, and particularly preferably 90% by weight or more. When the content of tin in the solder particles is equal to or higher than the lower limit, the connection reliability between the solder portion and the electrode is further enhanced.

  The tin content is determined using a high frequency inductively coupled plasma optical emission spectrometer (“ICP-AES” manufactured by Horiba, Ltd.) or a fluorescent X-ray analyzer (“EDX-800HS” manufactured by Shimadzu). It can be measured.

  By using the solder particles, the solder is melted and joined to the electrodes, and the solder portion conducts between the electrodes. For example, since the solder portion and the electrode are not in point contact but in surface contact, the connection resistance is lowered. In addition, the use of solder particles increases the bonding strength between the solder portion and the electrode. As a result, peeling between the solder portion and the electrode is further less likely to occur, and the conduction reliability and the connection reliability are effectively increased.

  The low melting point metal constituting the solder particles is not particularly limited. The low melting point metal is preferably tin or an alloy containing tin. Examples of the alloy include a tin-silver alloy, a tin-copper alloy, a tin-silver-copper alloy, a tin-bismuth alloy, a tin-zinc alloy, and a tin-indium alloy. The low melting point metal is preferably tin, a tin-silver alloy, a tin-silver-copper alloy, a tin-bismuth alloy, or a tin-indium alloy because of its excellent wettability with respect to the electrode. More preferred are a tin-bismuth alloy and a tin-indium alloy.

  The solder particles are preferably a filler material having a liquidus line of 450 ° C. or lower based on JIS Z3001: welding terms. Examples of the composition of the solder particles include metal compositions containing zinc, gold, silver, lead, copper, tin, bismuth, indium and the like. A tin-indium system (117 ° C eutectic) or a tin-bismuth system (139 ° C eutectic) that has a low melting point and is free of lead is preferable. That is, the solder particles preferably do not contain lead, and preferably contain tin and indium, or contain tin and bismuth.

  In order to further increase the bonding strength between the solder part and the electrode, the solder particles include nickel, copper, antimony, aluminum, zinc, iron, gold, titanium, phosphorus, germanium, tellurium, cobalt, bismuth, manganese, chromium. Further, it may contain a metal such as molybdenum and palladium. Moreover, from the viewpoint of further increasing the bonding strength between the solder portion and the electrode, the solder particles preferably contain nickel, copper, antimony, aluminum, or zinc. From the viewpoint of further increasing the bonding strength between the solder part and the electrode, the content of these metals for increasing the bonding strength is preferably 0.0001% by weight or more, preferably 1% by weight in 100% by weight of the solder particles. % Or less.

  The average particle diameter of the solder particles is preferably 0.5 μm or more, more preferably 1 μm or more, still more preferably 3 μm or more, particularly preferably 5 μm or more, preferably 100 μm or less, more preferably 40 μm or less, and even more preferably 30 μm. Hereinafter, it is more preferably 20 μm or less, particularly preferably 15 μm or less, and most preferably 10 μm or less. When the average particle diameter of the solder particles is not less than the above lower limit and not more than the above upper limit, the solder particles can be more efficiently arranged on the electrode. The average particle diameter of the solder particles is particularly preferably 3 μm or more and 30 μm or less.

  The “average particle diameter” of the solder particles indicates a number average particle diameter. The average particle diameter of the solder particles is obtained, for example, by observing 50 arbitrary solder particles with an electron microscope or an optical microscope, calculating an average value, or performing laser diffraction particle size distribution measurement.

  The coefficient of variation of the particle diameter of the solder particles is preferably 5% or more, more preferably 10% or more, preferably 40% or less, more preferably 30% or less. When the variation coefficient of the particle diameter is not less than the above lower limit and not more than the above upper limit, the solder particles can be more efficiently arranged on the electrode. However, the coefficient of variation of the particle diameter of the solder particles may be less than 5%.

  The coefficient of variation (CV value) is expressed by the following equation.

CV value (%) = (ρ / Dn) × 100
ρ: Standard deviation of particle diameter of solder particles Dn: Average value of particle diameter of solder particles

  The shape of the solder particles is not particularly limited. The solder particles may have a spherical shape or a shape other than a spherical shape such as a flat shape.

  The content of the solder particles in 100% by weight of the conductive material is preferably 1% by weight or more, more preferably 2% by weight or more, still more preferably 10% by weight or more, particularly preferably 20% by weight or more, and most preferably 30%. % By weight or more, preferably 90% by weight or less, more preferably 80% by weight or less, still more preferably 60% by weight or less, and particularly preferably 50% by weight or less. When the content of the solder particles is not less than the above lower limit and not more than the above upper limit, it is possible to more efficiently arrange the solder particles on the electrodes, and it is easy to arrange many solder particles between the electrodes, The conduction reliability is further increased. From the viewpoint of further improving the conduction reliability, it is preferable that the content of the solder particles is large.

(Thermoplastic component)
The thermoplastic component is preferably a thermoplastic compound. Examples of the thermoplastic compound include phenoxy resin, urethane resin, (meth) acrylic resin, polyester resin, polyimide resin, and polyamide resin. As for the said thermoplastic compound, only 1 type may be used and 2 or more types may be used together.

  The content of the thermoplastic compound in 100% by weight of the conductive material is preferably 20% by weight or more, more preferably 40% by weight or more, still more preferably 50% by weight or more, preferably 99% by weight or less, more preferably It is 98 weight% or less, More preferably, it is 90 weight% or less, Most preferably, it is 80 weight% or less. From the viewpoint of further improving the impact resistance, it is preferable that the content of the thermosetting component is large.

(Thermosetting compound: thermosetting component)
The thermosetting compound is a compound that can be cured by heating. Examples of the thermosetting compound include oxetane compounds, epoxy compounds, episulfide compounds, (meth) acrylic compounds, phenolic compounds, amino compounds, unsaturated polyester compounds, polyurethane compounds, silicone compounds, and polyimide compounds. Among these, an epoxy compound is preferable from the viewpoint of further improving the curability and viscosity of the conductive material and further improving the connection reliability.

  From the viewpoint of efficiently arranging the solder particles on the electrodes, effectively suppressing misalignment between the electrodes, and further improving the conduction reliability and insulation reliability between the electrodes, the thermosetting compound is crystalline. It is preferable that a thermosetting compound is included.

  From the viewpoint of arranging solder particles more efficiently on the electrodes, more effectively suppressing displacement between the electrodes, and further improving the conduction reliability and insulation reliability between the electrodes, the above crystalline thermosetting The active compound is preferably solid at 25 ° C.

  From the viewpoint of arranging solder particles more efficiently on the electrodes, more effectively suppressing displacement between the electrodes, and further improving the conduction reliability and insulation reliability between the electrodes, the above crystalline thermosetting The melting point of the functional compound is preferably 80 ° C. or higher, more preferably 85 ° C. or higher, preferably 150 ° C. or lower, more preferably 140 ° C. or lower.

  From the viewpoint of arranging solder particles more efficiently on the electrodes, more effectively suppressing misalignment between the electrodes, and further improving the conduction reliability and insulation reliability between the electrodes, the above crystalline thermosetting The molecular weight of the functional compound is preferably 300 or more, more preferably 350 or more, preferably 500 or less, more preferably 400 or less.

  The molecular weight means a molecular weight that can be calculated from the structural formula when the thermosetting compound is not a polymer and when the structural formula of the thermosetting compound can be specified. Moreover, when the said thermosetting compound is a polymer, a weight average molecular weight is meant.

  Examples of the crystalline thermosetting compound include epoxy compounds and (meth) acrylic compounds.

  An aromatic epoxy compound is mentioned as said epoxy compound. Crystalline epoxy compounds such as resorcinol-type epoxy compounds, naphthalene-type epoxy compounds, biphenyl-type epoxy compounds, and benzophenone-type epoxy compounds are preferred. In particular, 2,4-bis (glycidyloxy) benzophenone or 4,4'-bis (glycidyloxy) benzophenone is preferable. An epoxy compound that is solid at normal temperature (25 ° C.) and has a melting temperature equal to or lower than the melting point of the solder is preferable. By using the above-mentioned preferable epoxy compound, the first connection target member and the second connection are high when the connection target member is pasted and when the viscosity is high and acceleration is applied by impact such as conveyance. The positional deviation from the target member can be suppressed, and the viscosity of the conductive material can be greatly reduced by the heat at the time of curing, and the aggregation of the solder particles can be efficiently advanced.

  From the viewpoint of arranging solder particles more efficiently on the electrodes, more effectively suppressing displacement between the electrodes, and further improving the conduction reliability and insulation reliability between the electrodes, the above crystalline thermosetting The functional compound is particularly preferably a benzophenone type epoxy compound, and most preferably 2,4-bis (glycidyloxy) benzophenone or 4,4′-bis (glycidyloxy) benzophenone.

  The (meth) acrylic compound is a compound having a (meth) acryloyl group. Examples of the (meth) acrylic compound include epoxy (meth) acrylate compounds. A compound in which a (meth) acryloyl group is introduced into the epoxy compound with (meth) acrylic acid or the like is preferable.

  The content of the thermosetting compound in 100% by weight of the conductive material is preferably 20% by weight or more, more preferably 40% by weight or more, still more preferably 50% by weight or more, and preferably 99% by weight or less. Is 98% by weight or less, more preferably 90% by weight or less, and particularly preferably 80% by weight or less. From the viewpoint of further improving the impact resistance, it is preferable that the content of the thermosetting component is large.

  The content of the crystalline thermosetting compound in 100% by weight of the conductive material is preferably 20% by weight or more, more preferably 40% by weight or more, still more preferably 50% by weight or more, preferably 99% by weight or less. More preferably, it is 98 weight% or less, More preferably, it is 90 weight% or less, Most preferably, it is 80 weight% or less.

  The content of the crystalline thermosetting compound is preferably 10% by weight or more, more preferably 30% by weight or more, still more preferably 50% by weight or more, particularly preferably in 100% by weight of the total thermosetting compound. Is 70% by weight or more, preferably 100% by weight or less.

(Thermosetting agent: thermosetting component)
The thermosetting agent thermosets the thermosetting compound. Examples of the thermosetting agent include imidazole curing agents, amine curing agents, phenol curing agents, polythiol curing agents, and other thiol curing agents, acid anhydrides, thermal cation initiators (thermal cation curing agents), and thermal radical generators. It is done. As for the said thermosetting agent, only 1 type may be used and 2 or more types may be used together.

  Among these, an imidazole curing agent, a thiol curing agent, or an amine curing agent is preferable because the conductive material can be cured more rapidly at a low temperature. Moreover, since a storage stability becomes high when the curable compound curable by heating and the thermosetting agent are mixed, a latent curing agent is preferable. The latent curing agent is preferably a latent imidazole curing agent, a latent thiol curing agent, or a latent amine curing agent. In addition, the said thermosetting agent may be coat | covered with polymeric substances, such as a polyurethane resin or a polyester resin.

  The imidazole curing agent is not particularly limited, and 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2, 4-Diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine and 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s- Examples include triazine isocyanuric acid adducts.

  The thiol curing agent is not particularly limited, and examples thereof include trimethylolpropane tris-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, and dipentaerythritol hexa-3-mercaptopropionate. .

  The amine curing agent is not particularly limited, and hexamethylene diamine, octamethylene diamine, decamethylene diamine, 3,9-bis (3-aminopropyl) -2,4,8,10-tetraspiro [5.5]. Examples include undecane, bis (4-aminocyclohexyl) methane, metaphenylenediamine, and diaminodiphenylsulfone.

  Examples of the thermal cation initiator include iodonium cation curing agents, oxonium cation curing agents, and sulfonium cation curing agents. Examples of the iodonium-based cationic curing agent include bis (4-tert-butylphenyl) iodonium hexafluorophosphate. Examples of the oxonium-based cationic curing agent include trimethyloxonium tetrafluoroborate. Examples of the sulfonium-based cationic curing agent include tri-p-tolylsulfonium hexafluorophosphate.

  The thermal radical generator is not particularly limited, and examples thereof include azo compounds and organic peroxides. Examples of the azo compound include azobisisobutyronitrile (AIBN). Examples of the organic peroxide include di-tert-butyl peroxide and methyl ethyl ketone peroxide.

  The reaction initiation temperature of the thermosetting agent is preferably 50 ° C or higher, more preferably 70 ° C or higher, still more preferably 80 ° C or higher, preferably 250 ° C or lower, more preferably 200 ° C or lower, still more preferably 150 ° C or lower, Especially preferably, it is 140 degrees C or less. When the reaction start temperature of the thermosetting agent is not less than the above lower limit and not more than the above upper limit, the solder particles are more efficiently arranged on the electrode. The reaction initiation temperature of the thermosetting agent is particularly preferably 80 ° C. or higher and 140 ° C. or lower.

  From the viewpoint of more efficiently arranging the solder on the electrode, the reaction initiation temperature of the thermosetting agent is preferably higher than the melting point of the solder in the solder particles, more preferably 5 ° C. or more, more preferably 10 It is more preferable that the temperature is higher than ° C.

  The reaction start temperature of the thermosetting agent means a temperature at which the exothermic peak of DSC starts to rise.

  The content of the thermosetting agent is not particularly limited. The content of the thermosetting agent is preferably 0.01 parts by weight or more, more preferably 1 part by weight or more, preferably 200 parts by weight or less, more preferably 100 parts by weight with respect to 100 parts by weight of the thermosetting compound. Part or less, more preferably 75 parts by weight or less. When the content of the thermosetting agent is not less than the above lower limit, it is easy to sufficiently cure the conductive material. When the content of the thermosetting agent is not more than the above upper limit, it is difficult for an excess thermosetting agent that did not participate in curing after curing to remain, and the heat resistance of the cured product is further enhanced.

(flux)
The conductive material preferably contains a flux. By using flux, the solder can be more effectively placed on the electrode. The flux is not particularly limited. As the flux, a flux generally used for soldering or the like can be used. Examples of the flux include zinc chloride, a mixture of zinc chloride and an inorganic halide, a mixture of zinc chloride and an inorganic acid, a molten salt, phosphoric acid, a derivative of phosphoric acid, an organic halide, hydrazine, an organic acid, and pine resin. Etc. As for the said flux, only 1 type may be used and 2 or more types may be used together.

  From the viewpoint of effectively increasing the storage stability of the conductive material and making it difficult for components other than solder particles to flow during connection between the electrodes, the flux is preferably solid at 25 ° C.

  Examples of the molten salt include ammonium chloride. Examples of the organic acid include lactic acid, citric acid, stearic acid, glutamic acid, and glutaric acid. Examples of the pine resin include activated pine resin and non-activated pine resin. The flux is preferably an organic acid having two or more carboxyl groups, pine resin. The flux may be an organic acid having two or more carboxyl groups, or pine resin. By using an organic acid having two or more carboxyl groups, pine resin, the conduction reliability between the electrodes is further enhanced.

  The rosin is a rosin composed mainly of abietic acid. The flux is preferably rosins, and more preferably abietic acid. By using this preferable flux, the conduction reliability between the electrodes is further enhanced.

  The active temperature (melting point) of the flux is preferably 50 ° C. or higher, more preferably 70 ° C. or higher, further preferably 80 ° C. or higher, preferably 200 ° C. or lower, more preferably 190 ° C. or lower, even more preferably 160 ° C. or lower. More preferably, it is 150 ° C. or less, and still more preferably 140 ° C. or less. When the activation temperature of the flux is not less than the above lower limit and not more than the above upper limit, the flux effect is more effectively exhibited, and the solder particles are more efficiently arranged on the electrode. The active temperature (melting point) of the flux is preferably 80 ° C. or higher and 190 ° C. or lower. The activation temperature (melting point) of the flux is particularly preferably 80 ° C. or higher and 140 ° C. or lower.

  The flux having an active temperature (melting point) of 80 ° C. or higher and 190 ° C. or lower includes succinic acid (melting point 186 ° C.), glutaric acid (melting point 96 ° C.), adipic acid (melting point 152 ° C.), pimelic acid (melting point) 104 ° C.), dicarboxylic acids such as suberic acid (melting point 142 ° C.), benzoic acid (melting point 122 ° C.), malic acid (melting point 130 ° C.) and the like.

  The boiling point of the flux is preferably 200 ° C. or lower.

  From the viewpoint of more efficiently arranging the solder on the electrode, the melting point of the flux is preferably higher than the melting point of the solder in the solder particles, preferably 5 ° C or higher, more preferably 10 ° C or higher. Is more preferable.

  From the viewpoint of more efficiently arranging the solder on the electrode, the melting point of the flux is preferably higher than the reaction start temperature of the thermosetting agent, more preferably 5 ° C or higher, more preferably 10 ° C or higher. More preferably.

  The flux may be dispersed in the conductive material or may be attached on the surface of the solder particles.

  When the melting point of the flux is higher than the melting point of the solder, the solder particles can be efficiently aggregated on the electrode portion. This is because, when heat is applied at the time of joining, when the electrode formed on the connection target member is compared with the portion of the connection target member around the electrode, the thermal conductivity of the electrode portion is that of the connection target member portion around the electrode. Due to the fact that it is higher than the heat traditional rate, the temperature rise of the electrode part is fast. At the stage where the melting point of the solder particles is exceeded, the inside of the solder particles dissolves, but the oxide film formed on the surface does not reach the melting point (activation temperature) of the flux and is not removed. In this state, since the temperature of the electrode portion first reaches the melting point (activation temperature) of the flux, the oxide film on the surface of the solder particles preferentially removed on the electrode is removed or the activated flux Since the charge on the surface of the solder particles is neutralized, the solder particles can be spread on the surface of the electrode. Thereby, solder particles can be efficiently aggregated on the electrode.

  The flux is preferably a flux that releases cations by heating. By using a flux that releases cations upon heating, the solder particles can be arranged more efficiently on the electrode.

  Examples of the flux that releases cations by the heating include the thermal cation curing agent.

  The content of the flux in 100% by weight of the conductive material is preferably 0.5% by weight or more, preferably 30% by weight or less, and more preferably 25% by weight or less. The conductive material may not contain flux. When the flux content is not less than the above lower limit and not more than the above upper limit, it becomes more difficult to form an oxide film on the surface of the solder and the electrode, and the oxide film formed on the surface of the solder and the electrode is more effective. Can be removed.

(Filler)
A filler may be added to the conductive material. The filler may be an organic filler or an inorganic filler. By adding the filler, the distance at which the solder particles aggregate can be suppressed, and the solder particles can be uniformly aggregated on all the electrodes of the substrate.

  The content of the filler in 100% by weight of the conductive material is preferably 0% by weight or more, preferably 5% by weight or less, more preferably 2% by weight or less, and further preferably 1% by weight or less. When the content of the filler is not less than the above lower limit and not more than the above upper limit, the solder particles are more efficiently arranged on the electrode.

(Other ingredients)
The conductive material may be, for example, a filler, an extender, a softener, a plasticizer, a polymerization catalyst, a curing catalyst, a colorant, an antioxidant, a heat stabilizer, a light stabilizer, an ultraviolet absorber, and a lubricant as necessary. In addition, various additives such as an antistatic agent and a flame retardant may be included.

  Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples. The present invention is not limited only to the following examples.

Polymer A:
Synthesis of reaction product (polymer A) of bisphenol F with 1,6-hexanediol diglycidyl ether and bisphenol F type epoxy resin:
Bisphenol F (containing 4,4′-methylene bisphenol, 2,4′-methylene bisphenol and 2,2′-methylene bisphenol in a weight ratio of 2: 3: 1) 100 parts by weight, 1,6-hexanediol Three parts by weight of 130 parts by weight of glycidyl ether, 5 parts by weight of bisphenol F type epoxy resin (“EPICLON EXA-830CRP” manufactured by DIC), and 10 parts by weight of resorcinol type epoxy compound (“EX-201” manufactured by Nagase ChemteX) The flask was placed in a neck flask and dissolved at 100 ° C. under nitrogen flow. Thereafter, 0.15 part by weight of triphenylbutylphosphonium bromide, which is a catalyst for addition reaction of hydroxyl group and epoxy group, was added and subjected to an addition polymerization reaction at 140 ° C. for 4 hours under a nitrogen flow to obtain a reaction product (Polymer A). )

  By confirming that the addition polymerization reaction has progressed by NMR, the reaction product (polymer A) is a hydroxyl group derived from bisphenol F, 1,6-hexanediol diglycidyl ether, bisphenol F type epoxy resin, and resorcinol type epoxy compound. It was confirmed that the structural unit bonded to the epoxy group in the main chain has an epoxy group at both ends.

  The reaction product (polymer A) obtained by GPC had a weight average molecular weight of 28,000 and a number average molecular weight of 8,000.

Thermosetting compound 1: Resorcinol type epoxy compound, “EX-201” manufactured by Nagase ChemteX Corporation
Thermosetting compound 2: Epoxy compound, “EXA-4850-150” manufactured by DIC, molecular weight 900, epoxy equivalent 450 g / eq

  Thermosetting compound 3: 2,4-bis (glycidyloxy) benzophenone (crystalline thermosetting compound, melting point: 94 ° C., molecular weight 362)

Synthesis of 2,4-bis (glycidyloxy) benzophenone:
In a three-necked flask, 27 g of 2,4-dihydroxybenzophenone, 230 g of epichlorohydrin, 70 g of n-butanol and 1 g of tetraethylbenzylammonium chloride were added and stirred and dissolved at room temperature. Thereafter, the temperature was raised to 70 ° C. under stirring in a nitrogen atmosphere, and 45 g of an aqueous sodium hydroxide solution (concentration: 48 wt%) was added dropwise under reduced pressure. The dropping was performed over 4 hours. Then, it was made to react at 70 degreeC for 2 hours, using a Dean-Stark tube, removing a water | moisture content. Thereafter, unreacted epichlorohydrin was removed under reduced pressure.

  The obtained reaction product was dissolved in 400 g of a mixed solvent of MEK (methyl ethyl ketone): n-butanol = 3: 1 (weight ratio), and 5 g of an aqueous sodium hydroxide solution (concentration: 10% by weight) was added at 80 ° C. Heated for 2 hours.

  Then, it cooled to room temperature and wash | cleaned with the pure water until the washing | cleaning liquid became neutral. The organic layer was collected by filtration, and the remaining water and the mixed solvent were removed under reduced pressure to obtain a reaction product.

  Using n-hexane, 34 g of the reaction product was purified by recrystallization, and the residual solvent was removed by vacuum drying.

  Obtained epoxy compound: melting point by DSC was 94 ° C., epoxy equivalent was 176 g / eq. According to the mass spectrum, the molecular weight was 362, and the melt viscosity at 150 ° C. was 5 mPa · s.

-Differential scanning calorimetry (DSC) measuring device and measuring conditions Device: “X-DSC7000” manufactured by Hitachi High-Tech Science Co., sample amount: 3 mg, temperature condition: 10 ° C./min

  -Melt viscosity at 150 ° C .: Measured using an ICI cone plate viscometer manufactured by MST Engineering in accordance with ASTM D4287

  ・ Measurement of epoxy equivalent: Measured according to JIS K7236: 2001

Measurement of molecular weight: Measured using a GC-MS apparatus (“JMS K-9” manufactured by JEOL Ltd.) Thermosetting compound 4: 4,4′-bis (glycidyloxy) benzophenone (crystalline thermosetting compound, melting point) : 132 ° C., molecular weight 362)

Synthesis of 4,4′-bis (glycidyloxy) benzophenone:
In a three-necked flask, 27 g of 4,4′-dihydroxybenzophenone, 230 g of epichlorohydrin, 70 g of n-butanol, and 1 g of tetraethylbenzylammonium chloride were stirred and dissolved at room temperature. Thereafter, the temperature was raised to 70 ° C. under stirring in a nitrogen atmosphere, and 45 g of an aqueous sodium hydroxide solution (concentration: 48 wt%) was added dropwise under reduced pressure. The dropping was performed over 4 hours. after that. The reaction was carried out at 70 ° C. for 2 hours using a Dean-Stark tube while removing moisture. Thereafter, unreacted epichlorohydrin was removed under reduced pressure.

  The obtained reaction product was dissolved in 400 g of a mixed solvent of MEK (methyl ethyl ketone): n-butanol = 3: 1 (weight ratio), and 5 g of an aqueous sodium hydroxide solution (concentration: 10% by weight) was added at 80 ° C. Heated for 2 hours.

  Then, it cooled to room temperature and wash | cleaned with the pure water until the washing | cleaning liquid became neutral. The organic layer was collected by filtration, and the remaining water and the mixed solvent were removed under reduced pressure to obtain a reaction product.

  Using n-hexane, 34 g of the reaction product was purified by recrystallization, and the residual solvent was removed by vacuum drying.

  Obtained epoxy compound: melting point by DSC: 135 ° C., epoxy equivalent: 176 g / eq. According to the mass spectrum, the molecular weight was 362, and the melt viscosity at 150 ° C. was 12 mPa · s.

  Thermosetting agent 1: Trimethylolpropane tris (3-mercaptopropinate), “TMMP” manufactured by SC Organic Chemical Co., Ltd.

  Latent epoxy thermosetting agent 1: “Fujicure 7000” manufactured by T & K TOKA

  Flux 1: Adipic acid, manufactured by Wako Pure Chemical Industries, Ltd., melting point (activation temperature) 152 ° C.

Method for producing solder particles 1-3:
Solder particles having anionic polymer 1: 200 g of solder particle main body, 40 g of adipic acid, and 70 g of acetone are weighed in a three-necked flask, and then dehydration condensation between the hydroxyl group on the surface of the solder particle main body and the carboxyl group of adipic acid 0.3 g of dibutyltin oxide as a catalyst was added and reacted at 60 ° C. for 4 hours. Thereafter, the solder particles were collected by filtration.

  The collected solder particles, 50 g of adipic acid, 200 g of toluene, and 0.3 g of paratoluenesulfonic acid were weighed in a three-necked flask and reacted at 120 ° C. for 3 hours while evacuating and refluxing. . At this time, the reaction was carried out while removing water produced by dehydration condensation using a Dean-Stark extraction device.

  Thereafter, the solder particles were collected by filtration, washed with hexane, and dried. Thereafter, the obtained solder particles were pulverized with a ball mill and then sieved to a predetermined CV value.

(Zeta potential measurement)
Moreover, 0.05 g of solder particles having the anion polymer 1 were put in 10 g of methanol and the resulting solder particles were uniformly dispersed by ultrasonic treatment to obtain a dispersion. The zeta potential was measured by electrophoretic measurement using this dispersion and “Delsamax PRO” manufactured by Beckman Coulter.

(Weight average molecular weight of anionic polymer)
The weight average molecular weight of the anionic polymer 1 on the surface of the solder particles was obtained by dissolving the solder using 0.1N hydrochloric acid, collecting the polymer by filtration, and determining by GPC.

(CV value of particle diameter of solder particles)
The CV value was measured with a laser diffraction particle size distribution analyzer (“LA-920” manufactured by Horiba, Ltd.).

  Solder particles 1 (SnBi solder particles, melting point 139 ° C., solder particles main body selected from Mitsui Kinzoku “ST-3”), surface-treated solder particles having anionic polymer 1, average particle diameter 4 μm, CV value 7%, zeta potential on the surface: +0.65 mV, polymer molecular weight Mw = 6500)

  Solder particle 2 (SnBi solder particle, melting point 139 ° C., solder particle body selected from Mitsui Kinzoku “DS10”, surface-treated solder particle having anionic polymer 1, average particle diameter 13 μm, CV value 20% Surface zeta potential: +0.48 mV, polymer molecular weight Mw = 7000)

  Solder particle 3 (SnBi solder particle, melting point 139 ° C., solder particle body selected from “10-25” manufactured by Mitsui Kinzoku Co., Ltd., surface-treated anionic polymer 1 solder particle, average particle diameter 25 μm, CV value 15%, surface zeta potential: +0.4 mV, polymer molecular weight Mw = 8000)

  Solder particles A (SnBi solder particles, melting point 139 ° C., “DS10” manufactured by Mitsui Kinzoku Co., Ltd.)

  Solder particles B (resin core solder-coated particles, prepared by the following procedure)

  Divinylbenzene resin particles (“Micropearl SP-210” manufactured by Sekisui Chemical Co., Ltd., average particle size 10 μm, softening point 330 ° C., 10% K value (23 ° C.) 3.8 GPa) are electroless nickel plated, A base nickel plating layer having a thickness of 0.1 μm was formed on the surface. Next, the resin particles on which the base nickel plating layer was formed were subjected to electrolytic copper plating to form a 1 μm thick copper layer. Further, electrolytic plating was performed using an electrolytic plating solution containing tin and bismuth to form a 2 μm thick solder layer. In this way, a 1 μm thick copper layer is formed on the surface of the resin particles, and a 2 μm thick solder layer (tin: bismuth = 43 wt%: 57 wt%) is formed on the surface of the copper layer. Conductive particles (average particle size 16 μm, CV value 20%, resin core solder-coated particles) were prepared.

(Examples 1-7 and Comparative Examples 1-3)
(1) Preparation of anisotropic conductive paste The components shown in Table 1 below were blended in the blending amounts shown in Table 1 to obtain anisotropic conductive paste.

  In Examples 1 to 5 and Comparative Examples 1 to 3, connection structures of the type shown in Table 1 below were produced as follows.

(2) Production of first connection structure (L / S = 50 μm / 50 μm) (type 1 of connection structure) Copper electrode pattern with L / S of 50 μm / 50 μm and electrode length of 3 mm (copper electrode thickness 12 μm) ) On the upper surface (FR-4 substrate, thickness 0.6 mm) (first connection target member) was prepared. Further, a flexible printed circuit board (a second connection target member formed of polyimide, having a thickness of 0.1 μm) having a copper electrode pattern (copper electrode thickness 12 μm) having a L / S of 50 μm / 50 μm and an electrode length of 3 mm on the lower surface. 1 mm) was prepared.

  The overlapping area of the glass epoxy substrate and the flexible printed circuit board was 1.5 cm × 3 mm, and the number of connected electrodes was 75 pairs.

  On the upper surface of the glass epoxy substrate, the anisotropic conductive paste immediately after production is applied by screen printing using a metal mask so that the thickness is 100 μm on the electrode of the glass epoxy substrate, and anisotropic conductive A paste layer was formed. Next, the flexible printed circuit board was laminated on the upper surface of the anisotropic conductive paste layer so that the electrodes face each other. At this time, no pressure was applied. The weight of the flexible printed board is added to the anisotropic conductive paste layer.

  Thereafter, the anisotropic conductive paste layer was heated so that the temperature became 139 ° C. (melting point of solder) after 5 seconds from the start of the temperature increase. In Example 4, when the temperature reached 139 ° C., the solder particles between the lateral electrodes were not melted, and the solder particles between the upper and lower electrodes were melted. The location where the temperature was measured was on the surface of the upper and lower electrodes facing each other. Since the electrode is a metal, only the solder particles on the electrode were dissolved when the surface temperature of the electrode first reached the melting point of the solder.

  Further, 15 seconds after the start of temperature increase, the anisotropic conductive paste layer was heated to 160 ° C. to cure the anisotropic conductive paste, thereby obtaining a first connection structure.

(3) Production of second connection structure (L / S = 75 μm / 75 μm) (type 2 of connection structure) Copper electrode pattern with L / S of 75 μm / 75 μm and electrode length of 3 mm (copper electrode thickness 12 μm) ) On the upper surface (FR-4 substrate, thickness 0.6 mm) (first connection target member) was prepared. Further, a flexible printed circuit board (a second connection target member formed of polyimide, having a thickness of 0.1 μm) having a copper electrode pattern (copper electrode thickness 12 μm) having an L / S of 75 μm / 75 μm and an electrode length of 3 mm on the lower surface. 1 mm) was prepared.

  The overlapping area of the glass epoxy substrate and the flexible printed circuit board was 1.5 cm × 3 mm, and the number of connected electrodes was 75 pairs.

  On the upper surface of the glass epoxy substrate, the anisotropic conductive paste immediately after production is applied by screen printing using a metal mask so that the thickness is 100 μm on the electrode of the glass epoxy substrate, and anisotropic conductive A paste layer was formed. Next, the flexible printed circuit board was laminated on the upper surface of the anisotropic conductive paste layer so that the electrodes face each other. At this time, no pressure was applied. The weight of the flexible printed board is added to the anisotropic conductive paste layer.

  Thereafter, the anisotropic conductive paste layer was heated so that the temperature became 139 ° C. (melting point of solder) after 5 seconds from the start of the temperature increase. In Examples 1-3, 6, 7, and Comparative Examples 2 and 3, when reaching 139 ° C., the solder particles between the lateral electrodes are not melted, and the solder particles between the upper and lower electrodes are melted. It was. The location where the temperature was measured was on the surface of the upper and lower electrodes facing each other. Since the electrode is a metal, only the solder particles on the electrode were dissolved when the surface temperature of the electrode first reached the melting point of the solder.

  Further, 15 seconds after the start of temperature increase, the anisotropic conductive paste layer was heated to 160 ° C. to cure the anisotropic conductive paste, and a second connection structure was obtained.

(4) Production of third connection structure (L / S = 100 μm / 100 μm) (type 3 of connection structure) Copper electrode pattern with L / S of 100 μm / 100 μm and electrode length of 3 mm (copper electrode thickness 12 μm) ) On the upper surface (FR-4 substrate, thickness 0.6 mm) (first connection target member) was prepared. In addition, a flexible printed circuit board (a second connection target member formed of polyimide, having a thickness of 0.1 μm) having a copper electrode pattern (copper electrode thickness 12 μm) having an L / S of 100 μm / 100 μm and an electrode length of 3 mm on the lower surface. 1 mm) was prepared.

  The overlapping area of the glass epoxy substrate and the flexible printed circuit board was 1.5 cm × 3 mm, and the number of connected electrodes was 75 pairs.

  On the upper surface of the glass epoxy substrate, the anisotropic conductive paste immediately after production is applied by screen printing using a metal mask so that the thickness is 100 μm on the electrode of the glass epoxy substrate, and anisotropic conductive A paste layer was formed. Next, the flexible printed circuit board was laminated on the upper surface of the anisotropic conductive paste layer so that the electrodes face each other. At this time, no pressure was applied. The weight of the flexible printed board is added to the anisotropic conductive paste layer.

  Thereafter, the anisotropic conductive paste layer was heated so that the temperature became 139 ° C. (melting point of solder) after 5 seconds from the start of the temperature increase. In Example 5, when the temperature reached 139 ° C., the solder particles between the lateral electrodes were not melted, and the solder particles between the upper and lower electrodes were melted. The location where the temperature was measured was on the surface of the upper and lower electrodes facing each other. Since the electrode is a metal, only the solder particles on the electrode were dissolved by first reaching the melting point of the solder.

  Further, 15 seconds after the start of temperature increase, the anisotropic conductive paste layer was heated to 160 ° C. to cure the anisotropic conductive paste, and a third connection structure was obtained.

(5) Production of fourth connection structure (L / S = 100 μm / 100 μm) (type 4 of connection structure) Glass substrate having an ITO electrode pattern with L / S of 100 μm / 100 μm and electrode length of 3 mm on the upper surface (Thickness 0.6 mm) (first connection target member) was prepared. In addition, a flexible printed circuit board (a second connection target member formed of polyimide, having a thickness of 0.1 μm) having a copper electrode pattern (copper electrode thickness 12 μm) having an L / S of 100 μm / 100 μm and an electrode length of 3 mm on the lower surface. 1 mm) was prepared.

  The overlapping area of the glass substrate and the flexible printed board was 1.5 cm × 3 mm, and the number of connected electrodes was 75 pairs.

  An anisotropic conductive paste layer was applied on the upper surface of the glass substrate by screen printing using a metal mask so that the anisotropic conductive paste immediately after the production had a thickness of 100 μm on the electrode of the glass substrate. Formed. Next, the flexible printed circuit board was laminated on the upper surface of the anisotropic conductive paste layer so that the electrodes face each other. At this time, no pressure was applied. The weight of the flexible printed board is added to the anisotropic conductive paste layer.

  Thereafter, the anisotropic conductive paste layer was heated so that the temperature became 139 ° C. (melting point of solder) after 5 seconds from the start of the temperature increase. In Comparative Example 1, when the temperature reached 139 ° C., the solder particles between the lateral electrodes were not melted, and the solder particles between the upper and lower electrodes were not melted. This is because the solder particles did not get wet with the ITO electrode, so that the solder particles melted between the upper and lower electrodes did not aggregate. The location where the temperature was measured was on the surface of the upper and lower electrodes facing each other.

  Further, 15 seconds after the start of temperature increase, the anisotropic conductive paste layer was heated to 160 ° C. to cure the anisotropic conductive paste, thereby obtaining a fourth connection structure.

(Evaluation)
(1) Viscosity The viscosity (η25) at 25 ° C. of the anisotropic conductive paste was measured using an E-type viscometer (“TVE22L” manufactured by Toki Sangyo Co., Ltd.) at 25 ° C. and 5 rpm.

(2) Thickness of solder part By observing a cross section of the obtained connection structure, the thickness of the solder part located between the upper and lower electrodes was evaluated.

(3) Solder placement accuracy on electrode 1
In the obtained connection structure, when the portion where the first electrode and the second electrode face each other in the stacking direction of the first electrode, the connection portion, and the second electrode is viewed, the first electrode The ratio X of the area where the solder part in the connection part is arranged in the area of 100% of the part where the part and the second electrode face each other was evaluated. The solder placement accuracy 1 on the electrode was determined according to the following criteria.

[Criteria for solder placement accuracy 1 on electrode]
○○: Ratio X is 70% or more ○: Ratio X is 60% or more and less than 70% Δ: Ratio X is 50% or more and less than 60% X: Ratio X is less than 50%

(4) Solder placement accuracy on electrode 2
In the obtained connection structure, when the portion where the first electrode and the second electrode face each other in the direction orthogonal to the stacking direction of the first electrode, the connection portion, and the second electrode is seen, The ratio Y of the solder part in the connection part arrange | positioned in the part which the 1st electrode and 2nd electrode oppose in 100% of solder parts in a part was evaluated. The solder placement accuracy 2 on the electrode was determined according to the following criteria.

[Criteria for solder placement accuracy 2 on electrode]
◯: Ratio Y is 99% or more ○: Ratio Y is 90% or more and less than 99% △: Ratio Y is 70% or more and less than 90% X: Ratio Y is less than 70%

(5) Electrical connection reliability between upper and lower electrodes In the obtained connection structure (n = 15), the connection resistance per connection portion between the upper and lower electrodes was measured by a four-terminal method. The average value of connection resistance was calculated. Note that the connection resistance can be obtained by measuring the voltage when a constant current is passed from the relationship of voltage = current × resistance. The conduction reliability was determined according to the following criteria.

[Judgment criteria for conduction reliability]
◯: Average connection resistance is 50 mΩ or less ○: Average connection resistance exceeds 50 mΩ, 70 mΩ or less △: Average connection resistance exceeds 70 mΩ, 100 mΩ or less ×: Average connection resistance exceeds 100 mΩ Or there is a bad connection

(6) Insulation reliability between electrodes adjacent in the horizontal direction In the obtained connection structure (n = 15), after leaving in an atmosphere of 85 ° C. and 85% humidity for 100 hours, between the electrodes adjacent in the horizontal direction 5V was applied and the resistance value was measured at 25 locations. Insulation reliability was judged according to the following criteria.

[Criteria for insulation reliability]
○○: Average connection resistance is 107Ω or more ○: Average connection resistance is 106Ω or more and less than 107Ω Δ: Average connection resistance is 105Ω or more and less than 106Ω ×: Average connection resistance is less than 105Ω

(7) Position shift between upper and lower electrodes In the obtained connection structure, a portion where the first electrode and the second electrode face each other in the stacking direction of the first electrode, the connection portion, and the second electrode The center line of the first electrode and the center line of the second electrode were aligned, and the distance of the displacement was evaluated. The positional deviation between the upper and lower electrodes was determined according to the following criteria.

[Criteria for misregistration between upper and lower electrodes]
○: Misalignment is less than 15 μm ○: Misalignment is 15 μm or more and less than 25 μm Δ: Misalignment is 25 μm or more and less than 40 μm ×: Misalignment is 40 μm or more

  Details and results are shown in Table 1 below.

  The same tendency was observed when a resin film, a flexible flat cable, and a rigid flexible board were used instead of the flexible printed board.

DESCRIPTION OF SYMBOLS 1,1X ... Connection structure 2 ... 1st connection object member 2a ... 1st electrode 3 ... 2nd connection object member 3a ... 2nd electrode 4, 4X ... Connection part 4A, 4XA ... Solder part 4B, 4XB ... Cured part 11 ... Conductive paste 11A ... Solder particle 11B ...

Claims (11)

A conductive material containing a plurality of solder particles and a binder is used, a first connection target member having a plurality of first electrodes on the surface is used, and a second having a plurality of second electrodes on the surface The connection target member is used,
The binder does not complete curing at the melting point of the solder particles,
The method for manufacturing a connection structure includes a step of disposing the conductive material on a surface of the first connection target member, and a surface of the conductive material opposite to the first connection target member side, The step of arranging the second connection target member so that the first electrode and the second electrode face each other, and a temperature lower than the melting point of the solder particles, the melting point of the solder particles is equal to or higher than A first heating step for heating the conductive material to a temperature at which the binder is not completely cured; and after the first heating step, the conductive material is heated to a temperature higher than that of the first heating step. Thus, a connection portion connecting the first connection target member and the second connection target member is formed of the conductive material, and the first electrode and the second electrode are formed. , Electrically connected by the solder part in the connection part And a second heating step that,
In the first heating step, before the solder particles that are not located between the first electrode and the second electrode melt and deform, the gap between the first electrode and the second electrode The movement of the solder particles that are not located between the first electrode and the second electrode is started , and is located between the first electrode and the second electrode. After the solder particles are melted and deformed, the movement of the solder particles that are not located between the first electrode and the second electrode is moved between the first electrode and the second electrode. Ru is started, the manufacturing method of the connection structure.   In the first heating step, movement of solder particles that are not located between the first electrode and the second electrode is performed between the first electrode and the second electrode. Before starting, solder particles that are not located between the first electrode and the second electrode are gathered together, and then directed between the first electrode and the second electrode. The manufacturing method of the connection structure according to claim 1, wherein movement of the solder particles gathered together is started. The conductive material includes a flux;
3. The method for manufacturing a connection structure according to claim 2, wherein the activation temperature of the flux is equal to or higher than a temperature at which solder particles that are not positioned between the first electrode and the second electrode are gathered together. The conductive material includes a flux;
The activation temperature of the flux starts to move the solder particles that are not located between the first electrode and the second electrode, between the first electrode and the second electrode. The manufacturing method of the connection structure of any one of Claims 1-3 lower than the temperature to make. The manufacturing method of the connection structure of any one of Claims 1-4 whose said 2nd connection object member is a semiconductor chip, a resin film, a flexible printed circuit board, a rigid flexible substrate, or a flexible flat cable. In the step of arranging the second connection target member and the first heating step, pressure is not applied, and the weight of the second connection target member is added to the conductive material, or
In at least one of the step of disposing the second connection target member and the first heating step, pressurizing and disposing the second connection target member and the first heating step In both, the manufacturing method of the connection structure of any one of Claims 1-5 whose pressure of pressurization is less than 1 Mpa. The manufacturing method of the connection structure of any one of Claims 1-6 whose average particle diameter of the said solder particle is 0.5 micrometer or more and 100 micrometers or less. The method for manufacturing a connection structure according to any one of claims 1 to 7 , wherein a content of the solder particles in the conductive material is 10 wt% or more and 90 wt% or less. The surface of the solder of the solder particles, an ether bond, via a group represented by the ester bond or the following formula (X), the group having at least one carboxyl group is covalently bonded, according to claim 1-8 The manufacturing method of the connection structure of any one.

The method for producing a connection structure according to claim 9 , wherein a group having at least one carboxyl group is covalently bonded to a surface of the solder of the solder particle via a group represented by the formula (X). . The manufacturing method of the connection structure of any one of Claims 1-10 whose zeta potential of the surface of the said solder particle is positive.

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