JP6060308B2 - インシトゥプロファイル制御（ｉｓｐｃ）を用いた残留物クリアリングの動的制御 - Google Patents

インシトゥプロファイル制御（ｉｓｐｃ）を用いた残留物クリアリングの動的制御 Download PDF

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JP6060308B2
JP6060308B2 JP2016500309A JP2016500309A JP6060308B2 JP 6060308 B2 JP6060308 B2 JP 6060308B2 JP 2016500309 A JP2016500309 A JP 2016500309A JP 2016500309 A JP2016500309 A JP 2016500309A JP 6060308 B2 JP6060308 B2 JP 6060308B2
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polishing
substrate
zone
zones
time
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JP2016510953A5 (enExample
JP2016510953A (ja
Inventor
チュン チエン，
チュン チエン，
シヴァクマール ダンダパーニ，
シヴァクマール ダンダパーニ，
ベンジャミン シェリアン，
ベンジャミン シェリアン，
トーマス エイチ． オスターヘルド，
トーマス エイチ． オスターヘルド，
チャールズ シー． ギャレットソン，
チャールズ シー． ギャレットソン，
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Applied Materials Inc
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Applied Materials Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B35/00—Machines or devices designed for superfinishing surfaces on work, i.e. by means of abrading blocks reciprocating with high frequency
    • B24B35/005—Machines or devices designed for superfinishing surfaces on work, i.e. by means of abrading blocks reciprocating with high frequency for making three-dimensional objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
JP2016500309A 2013-03-15 2014-02-20 インシトゥプロファイル制御（ｉｓｐｃ）を用いた残留物クリアリングの動的制御 Active JP6060308B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361787221P 2013-03-15 2013-03-15
US61/787,221 2013-03-15
PCT/US2014/017277 WO2014149330A1 (en) 2013-03-15 2014-02-20 Dynamic residue clearing control with in-situ profile control (ispc)

Publications (3)

Publication Number Publication Date
JP2016510953A JP2016510953A (ja) 2016-04-11
JP2016510953A5 JP2016510953A5 (enExample) 2016-11-04
JP6060308B2 true JP6060308B2 (ja) 2017-01-11

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JP2016500309A Active JP6060308B2 (ja) 2013-03-15 2014-02-20 インシトゥプロファイル制御（ｉｓｐｃ）を用いた残留物クリアリングの動的制御

Country Status (5)

Country Link
US (1) US9242337B2 (enExample)
JP (1) JP6060308B2 (enExample)
KR (1) KR101699197B1 (enExample)
TW (1) TWI564946B (enExample)
WO (1) WO2014149330A1 (enExample)

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US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
JP6447472B2 (ja) 2015-11-26 2019-01-09 株式会社Sumco ウェーハ研磨方法
JP6406238B2 (ja) * 2015-12-18 2018-10-17 株式会社Sumco ウェーハ研磨方法および研磨装置
US10562148B2 (en) 2016-10-10 2020-02-18 Applied Materials, Inc. Real time profile control for chemical mechanical polishing
JP7140760B2 (ja) * 2016-10-21 2022-09-21 アプライド マテリアルズ インコーポレイテッド インシトゥ電磁誘導モニタシステムのコア構成
KR102525737B1 (ko) * 2016-11-16 2023-04-26 주식회사 케이씨텍 화학 기계적 연마장치 및 그 제어방법
US11989492B2 (en) * 2018-12-26 2024-05-21 Applied Materials, Inc. Preston matrix generator
US11850698B2 (en) * 2019-01-31 2023-12-26 The Hillman Group, Inc. Automatic knife sharpening machine with sharpness detection
JP7446714B2 (ja) * 2019-02-01 2024-03-11 株式会社荏原製作所 基板処理装置、および基板処理方法
JP7361637B2 (ja) * 2020-03-09 2023-10-16 株式会社荏原製作所 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体
TWI810069B (zh) * 2020-06-08 2023-07-21 美商應用材料股份有限公司 用於在拋光相鄰導電層的堆疊期間的輪廓控制的系統、方法及電腦程式產品
JP7560320B2 (ja) * 2020-10-29 2024-10-02 株式会社ディスコ ウェーハの研削方法
US11931853B2 (en) 2021-03-05 2024-03-19 Applied Materials, Inc. Control of processing parameters for substrate polishing with angularly distributed zones using cost function

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AU2001279126A1 (en) 2000-07-31 2002-02-13 Silicon Valley Group Inc In-situ method and apparatus for end point detection in chemical mechanical polishing
US6929531B2 (en) * 2002-09-19 2005-08-16 Lam Research Corporation System and method for metal residue detection and mapping within a multi-step sequence
US7063597B2 (en) 2002-10-25 2006-06-20 Applied Materials Polishing processes for shallow trench isolation substrates
WO2005123335A1 (en) * 2004-06-21 2005-12-29 Ebara Corporation Polishing apparatus and polishing method
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
JP5534672B2 (ja) * 2005-08-22 2014-07-02 アプライド マテリアルズ インコーポレイテッド 化学機械的研磨のスペクトルに基づく監視のための装置および方法
US8392012B2 (en) * 2008-10-27 2013-03-05 Applied Materials, Inc. Multiple libraries for spectrographic monitoring of zones of a substrate during processing
US20070108066A1 (en) * 2005-10-28 2007-05-17 Applied Materials, Inc. Voltage mode current control
US20070158201A1 (en) 2006-01-06 2007-07-12 Applied Materials, Inc. Electrochemical processing with dynamic process control
TWI286094B (en) * 2006-05-18 2007-09-01 United Microelectronics Corp Method for in-line controlling hybrid chemical mechanical polishing process
KR101278236B1 (ko) * 2006-09-12 2013-06-24 가부시키가이샤 에바라 세이사꾸쇼 연마장치 및 연마방법
JP5675617B2 (ja) * 2008-09-04 2015-02-25 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 加工時における基板の分光モニタリングを使用した研磨速度の調整
US8579675B2 (en) 2008-11-26 2013-11-12 Applied Materials, Inc. Methods of using optical metrology for feed back and feed forward process control
US9579767B2 (en) 2010-04-28 2017-02-28 Applied Materials, Inc. Automatic generation of reference spectra for optical monitoring of substrates
US8190285B2 (en) 2010-05-17 2012-05-29 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing
US8616935B2 (en) * 2010-06-02 2013-12-31 Applied Materials, Inc. Control of overpolishing of multiple substrates on the same platen in chemical mechanical polishing
US20120034844A1 (en) 2010-08-05 2012-02-09 Applied Materials, Inc. Spectrographic monitoring using index tracking after detection of layer clearing
TW201223702A (en) 2010-08-06 2012-06-16 Applied Materials Inc Techniques for matching measured spectra to reference spectra for in-situ optical monitoring
TW201223703A (en) * 2010-09-01 2012-06-16 Applied Materials Inc Feedback control of polishing using optical detection of clearance
US20120276817A1 (en) * 2011-04-27 2012-11-01 Iravani Hassan G Eddy current monitoring of metal residue or metal pillars
JP6050571B2 (ja) 2011-08-09 2016-12-21 株式会社荏原製作所 研磨監視方法および研磨装置
US9095952B2 (en) * 2013-01-23 2015-08-04 Applied Materials, Inc. Reflectivity measurements during polishing using a camera

Also Published As

Publication number Publication date
KR101699197B1 (ko) 2017-01-23
TWI564946B (zh) 2017-01-01
US9242337B2 (en) 2016-01-26
US20140273749A1 (en) 2014-09-18
JP2016510953A (ja) 2016-04-11
KR20150132524A (ko) 2015-11-25
WO2014149330A1 (en) 2014-09-25
TW201503244A (zh) 2015-01-16

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