TWI564946B - 利用原位輪廓控制（ｉｓｐｃ）之動態殘留物清除控制法 - Google Patents

利用原位輪廓控制（ｉｓｐｃ）之動態殘留物清除控制法 Download PDF

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Publication number
TWI564946B
TWI564946B TW103107921A TW103107921A TWI564946B TW I564946 B TWI564946 B TW I564946B TW 103107921 A TW103107921 A TW 103107921A TW 103107921 A TW103107921 A TW 103107921A TW I564946 B TWI564946 B TW I564946B
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Taiwan
Prior art keywords
substrate
region
regions
grinding
index value
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TW103107921A
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English (en)
Chinese (zh)
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TW201503244A (zh
Inventor
錢隽
迪漢達潘尼席維庫瑪
傑瑞安班傑明
歐斯特海德湯瑪士Ｈ
蓋瑞森查爾斯Ｃ
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應用材料股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B35/00—Machines or devices designed for superfinishing surfaces on work, i.e. by means of abrading blocks reciprocating with high frequency
    • B24B35/005—Machines or devices designed for superfinishing surfaces on work, i.e. by means of abrading blocks reciprocating with high frequency for making three-dimensional objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW103107921A 2013-03-15 2014-03-07 利用原位輪廓控制（ｉｓｐｃ）之動態殘留物清除控制法 TWI564946B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201361787221P 2013-03-15 2013-03-15

Publications (2)

Publication Number Publication Date
TW201503244A TW201503244A (zh) 2015-01-16
TWI564946B true TWI564946B (zh) 2017-01-01

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TW103107921A TWI564946B (zh) 2013-03-15 2014-03-07 利用原位輪廓控制（ｉｓｐｃ）之動態殘留物清除控制法

Country Status (5)

Country Link
US (1) US9242337B2 (enExample)
JP (1) JP6060308B2 (enExample)
KR (1) KR101699197B1 (enExample)
TW (1) TWI564946B (enExample)
WO (1) WO2014149330A1 (enExample)

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US10562148B2 (en) 2016-10-10 2020-02-18 Applied Materials, Inc. Real time profile control for chemical mechanical polishing
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KR102525737B1 (ko) * 2016-11-16 2023-04-26 주식회사 케이씨텍 화학 기계적 연마장치 및 그 제어방법
US11989492B2 (en) * 2018-12-26 2024-05-21 Applied Materials, Inc. Preston matrix generator
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JP7446714B2 (ja) * 2019-02-01 2024-03-11 株式会社荏原製作所 基板処理装置、および基板処理方法
JP7361637B2 (ja) * 2020-03-09 2023-10-16 株式会社荏原製作所 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体
TWI809389B (zh) 2020-06-08 2023-07-21 美商應用材料股份有限公司 用於在拋光相鄰導電層的堆疊期間的輪廓控制的系統、方法及電腦程式產品
JP7560320B2 (ja) * 2020-10-29 2024-10-02 株式会社ディスコ ウェーハの研削方法
WO2022187105A1 (en) 2021-03-05 2022-09-09 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
US20240278380A1 (en) * 2021-06-22 2024-08-22 Ebara Corporation Polishing method and polishing apparatus
CN116230572B (zh) * 2023-03-09 2026-02-17 长鑫存储技术有限公司 一种半导体制程的材料残余状态检测方法
CN121018396B (zh) * 2025-10-22 2026-03-10 合肥晶合集成电路股份有限公司 研磨的控制方法、研磨的控制系统及研磨方法

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TW201223703A (en) * 2010-09-01 2012-06-16 Applied Materials Inc Feedback control of polishing using optical detection of clearance

Also Published As

Publication number Publication date
US20140273749A1 (en) 2014-09-18
JP6060308B2 (ja) 2017-01-11
KR101699197B1 (ko) 2017-01-23
KR20150132524A (ko) 2015-11-25
US9242337B2 (en) 2016-01-26
TW201503244A (zh) 2015-01-16
JP2016510953A (ja) 2016-04-11
WO2014149330A1 (en) 2014-09-25

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