JP6048471B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP6048471B2
JP6048471B2 JP2014203509A JP2014203509A JP6048471B2 JP 6048471 B2 JP6048471 B2 JP 6048471B2 JP 2014203509 A JP2014203509 A JP 2014203509A JP 2014203509 A JP2014203509 A JP 2014203509A JP 6048471 B2 JP6048471 B2 JP 6048471B2
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Japan
Prior art keywords
light
light emitting
substrate
reflecting resin
emitting element
Prior art date
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Application number
JP2014203509A
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English (en)
Japanese (ja)
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JP2014241456A (ja
JP2014241456A5 (enrdf_load_stackoverflow
Inventor
山田　元量
元量 山田
元孝 伊延
元孝 伊延
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2014203509A priority Critical patent/JP6048471B2/ja
Publication of JP2014241456A publication Critical patent/JP2014241456A/ja
Publication of JP2014241456A5 publication Critical patent/JP2014241456A5/ja
Application granted granted Critical
Publication of JP6048471B2 publication Critical patent/JP6048471B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
JP2014203509A 2014-10-01 2014-10-01 発光装置 Active JP6048471B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014203509A JP6048471B2 (ja) 2014-10-01 2014-10-01 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014203509A JP6048471B2 (ja) 2014-10-01 2014-10-01 発光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2012235723A Division JP5855554B2 (ja) 2012-10-25 2012-10-25 発光装置

Publications (3)

Publication Number Publication Date
JP2014241456A JP2014241456A (ja) 2014-12-25
JP2014241456A5 JP2014241456A5 (enrdf_load_stackoverflow) 2015-11-05
JP6048471B2 true JP6048471B2 (ja) 2016-12-21

Family

ID=52140517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014203509A Active JP6048471B2 (ja) 2014-10-01 2014-10-01 発光装置

Country Status (1)

Country Link
JP (1) JP6048471B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6458793B2 (ja) 2016-11-21 2019-01-30 日亜化学工業株式会社 発光装置の製造方法
KR102546556B1 (ko) * 2018-05-28 2023-06-22 엘지이노텍 주식회사 반도체 소자 패키지 및 이를 포함하는 광조사장치
WO2022114020A1 (ja) 2020-11-25 2022-06-02 シチズン電子株式会社 発光装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3985332B2 (ja) * 1998-04-02 2007-10-03 松下電器産業株式会社 半導体発光装置
JP4193446B2 (ja) * 2001-08-22 2008-12-10 日亜化学工業株式会社 発光装置
WO2007037339A1 (ja) * 2005-09-29 2007-04-05 Kabushiki Kaisha Toshiba 白色発光装置とその製造方法、およびそれを用いたバックライト並びに液晶表示装置
JP2007109908A (ja) * 2005-10-14 2007-04-26 Nichia Chem Ind Ltd 発光素子搭載用の支持体
JP4857735B2 (ja) * 2005-11-28 2012-01-18 日亜化学工業株式会社 発光装置

Also Published As

Publication number Publication date
JP2014241456A (ja) 2014-12-25

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