JP6045571B2 - 熱伝導体を有する発光モジュール、ランプ及び照明器具 - Google Patents
熱伝導体を有する発光モジュール、ランプ及び照明器具 Download PDFInfo
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/02—Combinations of only two kinds of elements
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- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/08—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material comprising photoluminescent substances
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
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- H—ELECTRICITY
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
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- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Description
Claims (13)
- 第1の側に光出口窓を有するとともに、前記第1の側とは異なる第2の側にベースを有する筐体であって、光を伝達するキャビティ材料を具備するキャビティを囲む筐体と、
前記キャビティ内に設けられ、前記ベースに結合される半導体発光体であって、前記キャビティ内へ第1の色範囲の光を発する前記半導体発光体と、
前記半導体発光体と前記光出口窓との間に光学的に配置される発光素子であって、前記第1の色範囲の光の少なくとも一部を前記第1の色範囲とは異なる第2の色範囲の光に変換するための発光材料を有する前記発光素子と、
前記キャビティ内に配置されるとともに、前記キャビティ材料の熱伝導率よりも高い熱伝導率を持つ熱伝導体であって、前記発光素子に熱的に結合されるとともに、前記ベースに熱的に結合される前記熱伝導体と、
を有する、発光モジュールにおいて、
前記熱伝導体は、不透明であり、前記キャビティを2つのサブキャビティに分割する壁を形成し、
前記熱伝導体は、光混合を可能とするために前記サブキャビティ間を光が透過できるようにするホールを有している、発光モジュール。 - 前記ベースは、前記発光モジュールをヒートシンクに熱的に結合するための熱結合面を有する、請求項1記載の発光モジュール。
- 前記熱伝導体は、銅、アルミニウム、アルミナセラミック、窒化ホウ素セラミック、窒化アルミニウム、酸化ベリリウム、酸化亜鉛、亜鉛、及び、銀のうちの少なくとも1つでできている、請求項1記載の発光モジュール。
- 前記キャビティに対向している前記熱伝導体の第1の表面が光反射性であるか、又は、光反射層が前記第1の表面上に設けられている、請求項1記載の発光モジュール。
- 前記発光素子の方を向いている前記熱伝導体の第2の表面が光反射性であるか、又は、光反射層が前記第2の表面上に設けられている、請求項1記載の発光モジュール。
- 前記ベースに平行な仮想平面に沿った前記熱伝導体の断面形状は、円、楕円、又は、六角形である、請求項1記載の発光モジュール。
- 前記ベースは、熱伝導性プリント回路基板である、請求項1記載の発光モジュール。
- 前記熱伝導体は、前記ベースに結合されており、及び/又は、前記熱伝導体と前記ベースとの間、及び/又は、前記熱伝導体と前記発光素子との間に熱的な結合を供給するための熱伝導性接着剤を具備する前記発光素子に結合されている、請求項1記載の発光モジュール。
- 前記キャビティ内での前記熱伝導体の位置が、以下の基準
(i)前記半導体発光体が動作中、且つ、前記熱伝導体が利用できない場合に、前記発光素子が最も高い温度を持つ特定の位置において、前記熱伝導体が前記発光素子と接触する、
(ii)前記位置において、前記熱伝導体の長さが最小となる、
(iii)前記キャビティ内の前記熱伝導体の他の位置と比較して光出力が極大である、
(iv)前記光出口窓に沿った光出力が、前記キャビティ内の熱伝導体の他の位置と比較して、最大限均一である、
の少なくとも1つによって定められる、請求項1記載の発光モジュール。 - 前記発光モジュールは、複数の熱伝導体を有し、各熱伝導体は、前記キャビティ内に配置されるとともに、前記キャビティ材料の熱伝導率よりも高い熱伝導率を持ち、前記発光素子に熱的に結合されるとともに、前記ベースに熱的に結合される、請求項1記載の発光モジュール。
- 前記筐体は、前記キャビティ材料の熱伝導率よりも高い熱伝導率を持つ材料の壁であって、前記光出口窓と前記ベースとの間に挿入され、前記発光素子及び前記ベースに熱的に結合されている前記壁を有する、請求項1記載の発光モジュール。
- 請求項1記載の発光モジュールを有する、ランプ。
- 請求項1記載の発光モジュールと、請求項12記載のランプとを有する、照明器具。
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EP11168348.8 | 2011-06-01 | ||
EP11168348 | 2011-06-01 | ||
PCT/IB2012/052427 WO2012164426A1 (en) | 2011-06-01 | 2012-05-15 | A light emitting module comprising a thermal conductor, a lamp and a luminaire |
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JP2014517527A5 JP2014517527A5 (ja) | 2015-06-25 |
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EP (1) | EP2715815B1 (ja) |
JP (1) | JP6045571B2 (ja) |
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GB2505214A (en) * | 2012-08-23 | 2014-02-26 | Thorpe F W Plc | Luminaire |
KR20150040414A (ko) * | 2013-10-07 | 2015-04-15 | 삼성디스플레이 주식회사 | 백라이트 어셈블리 및 그를 포함하는 표시장치 |
WO2015077369A1 (en) * | 2013-11-19 | 2015-05-28 | Qd Vision, Inc. | Light emitting device including quantum dots |
CN105179984B (zh) * | 2014-06-18 | 2019-03-12 | 欧司朗有限公司 | 发光装置和制造发光装置的方法 |
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WO2016093325A1 (ja) * | 2014-12-11 | 2016-06-16 | シチズン電子株式会社 | 発光装置 |
BR112017011466A2 (pt) * | 2014-12-22 | 2018-02-27 | Ge Lighting Solutions Llc | aparelho de gerenciamento de calor modular |
CN104966727B (zh) * | 2015-07-10 | 2018-10-02 | 京东方科技集团股份有限公司 | 封装方法、显示面板及显示装置 |
CN105470246B (zh) * | 2015-12-21 | 2016-09-28 | 福建中科芯源光电科技有限公司 | 固态荧光体集成光源的双通道导热封装结构及封装方法 |
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JP2014517527A (ja) | 2014-07-17 |
US8915619B2 (en) | 2014-12-23 |
US20140119024A1 (en) | 2014-05-01 |
EP2715815A1 (en) | 2014-04-09 |
WO2012164426A1 (en) | 2012-12-06 |
CN103563111B (zh) | 2017-09-12 |
KR20140040778A (ko) | 2014-04-03 |
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TW201303214A (zh) | 2013-01-16 |
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