JP6031549B2 - 放熱部品用銅合金板 - Google Patents

放熱部品用銅合金板 Download PDF

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Publication number
JP6031549B2
JP6031549B2 JP2015066677A JP2015066677A JP6031549B2 JP 6031549 B2 JP6031549 B2 JP 6031549B2 JP 2015066677 A JP2015066677 A JP 2015066677A JP 2015066677 A JP2015066677 A JP 2015066677A JP 6031549 B2 JP6031549 B2 JP 6031549B2
Authority
JP
Japan
Prior art keywords
copper alloy
heat
mass
heat dissipation
alloy plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015066677A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016186107A (ja
Inventor
大輔 橋本
大輔 橋本
昌泰 西村
昌泰 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP2015066677A priority Critical patent/JP6031549B2/ja
Priority to KR1020177030339A priority patent/KR102075892B1/ko
Priority to PCT/JP2016/058177 priority patent/WO2016158390A1/ja
Priority to CN201680018115.0A priority patent/CN107429328B/zh
Priority to TW105109029A priority patent/TW201641700A/zh
Publication of JP2016186107A publication Critical patent/JP2016186107A/ja
Application granted granted Critical
Publication of JP6031549B2 publication Critical patent/JP6031549B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
JP2015066677A 2015-03-27 2015-03-27 放熱部品用銅合金板 Expired - Fee Related JP6031549B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015066677A JP6031549B2 (ja) 2015-03-27 2015-03-27 放熱部品用銅合金板
KR1020177030339A KR102075892B1 (ko) 2015-03-27 2016-03-15 방열 부품용 구리 합금판 및 방열 부품
PCT/JP2016/058177 WO2016158390A1 (ja) 2015-03-27 2016-03-15 放熱部品用銅合金板及び放熱部品
CN201680018115.0A CN107429328B (zh) 2015-03-27 2016-03-15 散热元件用铜合金板和散热元件
TW105109029A TW201641700A (zh) 2015-03-27 2016-03-23 放熱零件用銅合金板以及放熱零件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015066677A JP6031549B2 (ja) 2015-03-27 2015-03-27 放熱部品用銅合金板

Publications (2)

Publication Number Publication Date
JP2016186107A JP2016186107A (ja) 2016-10-27
JP6031549B2 true JP6031549B2 (ja) 2016-11-24

Family

ID=57005629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015066677A Expired - Fee Related JP6031549B2 (ja) 2015-03-27 2015-03-27 放熱部品用銅合金板

Country Status (5)

Country Link
JP (1) JP6031549B2 (zh)
KR (1) KR102075892B1 (zh)
CN (1) CN107429328B (zh)
TW (1) TW201641700A (zh)
WO (1) WO2016158390A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017089003A (ja) * 2015-11-03 2017-05-25 株式会社神戸製鋼所 放熱部品用銅合金板
WO2018066414A1 (ja) * 2016-10-05 2018-04-12 株式会社神戸製鋼所 放熱部品用銅合金板、放熱部品、及び放熱部品の製造方法
KR102437192B1 (ko) * 2017-08-10 2022-08-26 다나카 기킨조쿠 고교 가부시키가이샤 고강도·고도전성 구리 합금 판재 및 그 제조 방법
JP7215735B2 (ja) * 2019-10-03 2023-01-31 三芳合金工業株式会社 時効硬化型銅合金
WO2022092139A1 (ja) * 2020-10-29 2022-05-05 古河電気工業株式会社 銅合金板材、銅合金板材の製造方法及び接点部品
CN116157546A (zh) * 2020-10-29 2023-05-23 古河电气工业株式会社 铜合金板材、铜合金板材的制造方法及接点部件
CN113981264B (zh) * 2021-12-28 2022-03-29 宁波兴业盛泰集团有限公司 一种铜合金材料及其制备方法和应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09291325A (ja) * 1996-04-26 1997-11-11 Nikko Kinzoku Kk 半導体パッケージング用金属基板材料
JP2003277853A (ja) 2002-03-26 2003-10-02 Dowa Mining Co Ltd ヒートスプレッダ用銅合金
JP4112602B2 (ja) 2005-09-01 2008-07-02 株式会社渕上ミクロ ヒートパイプ
JP4878317B2 (ja) 2007-03-22 2012-02-15 株式会社コベルコ マテリアル銅管 銅または銅合金からなる銅管
JP5557761B2 (ja) * 2011-01-26 2014-07-23 株式会社神戸製鋼所 曲げ加工性及び耐応力緩和特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金
JP5534610B2 (ja) * 2011-03-31 2014-07-02 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系合金条
JP5773929B2 (ja) * 2012-03-28 2015-09-02 株式会社神戸製鋼所 曲げ加工性及び耐応力緩和特性に優れる電気電子部品用銅合金板
JP6176433B2 (ja) 2013-01-10 2017-08-09 株式会社Ｗｅｌｃｏｎ ベーパチャンバ
JP5467163B1 (ja) 2013-03-26 2014-04-09 Ｊｘ日鉱日石金属株式会社 銅合金板、それを備える放熱用電子部品および、銅合金板の製造方法
JP6223057B2 (ja) * 2013-08-13 2017-11-01 Ｊｘ金属株式会社 導電性及び曲げたわみ係数に優れる銅合金板

Also Published As

Publication number Publication date
KR20170130514A (ko) 2017-11-28
WO2016158390A1 (ja) 2016-10-06
KR102075892B1 (ko) 2020-02-11
TW201641700A (zh) 2016-12-01
JP2016186107A (ja) 2016-10-27
CN107429328B (zh) 2019-11-08
CN107429328A (zh) 2017-12-01

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