JP6031549B2 - 放熱部品用銅合金板 - Google Patents
放熱部品用銅合金板 Download PDFInfo
- Publication number
- JP6031549B2 JP6031549B2 JP2015066677A JP2015066677A JP6031549B2 JP 6031549 B2 JP6031549 B2 JP 6031549B2 JP 2015066677 A JP2015066677 A JP 2015066677A JP 2015066677 A JP2015066677 A JP 2015066677A JP 6031549 B2 JP6031549 B2 JP 6031549B2
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- heat
- mass
- heat dissipation
- alloy plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015066677A JP6031549B2 (ja) | 2015-03-27 | 2015-03-27 | 放熱部品用銅合金板 |
KR1020177030339A KR102075892B1 (ko) | 2015-03-27 | 2016-03-15 | 방열 부품용 구리 합금판 및 방열 부품 |
PCT/JP2016/058177 WO2016158390A1 (ja) | 2015-03-27 | 2016-03-15 | 放熱部品用銅合金板及び放熱部品 |
CN201680018115.0A CN107429328B (zh) | 2015-03-27 | 2016-03-15 | 散热元件用铜合金板和散热元件 |
TW105109029A TW201641700A (zh) | 2015-03-27 | 2016-03-23 | 放熱零件用銅合金板以及放熱零件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015066677A JP6031549B2 (ja) | 2015-03-27 | 2015-03-27 | 放熱部品用銅合金板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016186107A JP2016186107A (ja) | 2016-10-27 |
JP6031549B2 true JP6031549B2 (ja) | 2016-11-24 |
Family
ID=57005629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015066677A Expired - Fee Related JP6031549B2 (ja) | 2015-03-27 | 2015-03-27 | 放熱部品用銅合金板 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6031549B2 (zh) |
KR (1) | KR102075892B1 (zh) |
CN (1) | CN107429328B (zh) |
TW (1) | TW201641700A (zh) |
WO (1) | WO2016158390A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017089003A (ja) * | 2015-11-03 | 2017-05-25 | 株式会社神戸製鋼所 | 放熱部品用銅合金板 |
WO2018066414A1 (ja) * | 2016-10-05 | 2018-04-12 | 株式会社神戸製鋼所 | 放熱部品用銅合金板、放熱部品、及び放熱部品の製造方法 |
KR102437192B1 (ko) * | 2017-08-10 | 2022-08-26 | 다나카 기킨조쿠 고교 가부시키가이샤 | 고강도·고도전성 구리 합금 판재 및 그 제조 방법 |
JP7215735B2 (ja) * | 2019-10-03 | 2023-01-31 | 三芳合金工業株式会社 | 時効硬化型銅合金 |
WO2022092139A1 (ja) * | 2020-10-29 | 2022-05-05 | 古河電気工業株式会社 | 銅合金板材、銅合金板材の製造方法及び接点部品 |
CN116157546A (zh) * | 2020-10-29 | 2023-05-23 | 古河电气工业株式会社 | 铜合金板材、铜合金板材的制造方法及接点部件 |
CN113981264B (zh) * | 2021-12-28 | 2022-03-29 | 宁波兴业盛泰集团有限公司 | 一种铜合金材料及其制备方法和应用 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09291325A (ja) * | 1996-04-26 | 1997-11-11 | Nikko Kinzoku Kk | 半導体パッケージング用金属基板材料 |
JP2003277853A (ja) | 2002-03-26 | 2003-10-02 | Dowa Mining Co Ltd | ヒートスプレッダ用銅合金 |
JP4112602B2 (ja) | 2005-09-01 | 2008-07-02 | 株式会社渕上ミクロ | ヒートパイプ |
JP4878317B2 (ja) | 2007-03-22 | 2012-02-15 | 株式会社コベルコ マテリアル銅管 | 銅または銅合金からなる銅管 |
JP5557761B2 (ja) * | 2011-01-26 | 2014-07-23 | 株式会社神戸製鋼所 | 曲げ加工性及び耐応力緩和特性に優れたCu−Ni−Si系銅合金 |
JP5534610B2 (ja) * | 2011-03-31 | 2014-07-02 | Jx日鉱日石金属株式会社 | Cu−Co−Si系合金条 |
JP5773929B2 (ja) * | 2012-03-28 | 2015-09-02 | 株式会社神戸製鋼所 | 曲げ加工性及び耐応力緩和特性に優れる電気電子部品用銅合金板 |
JP6176433B2 (ja) | 2013-01-10 | 2017-08-09 | 株式会社Welcon | ベーパチャンバ |
JP5467163B1 (ja) | 2013-03-26 | 2014-04-09 | Jx日鉱日石金属株式会社 | 銅合金板、それを備える放熱用電子部品および、銅合金板の製造方法 |
JP6223057B2 (ja) * | 2013-08-13 | 2017-11-01 | Jx金属株式会社 | 導電性及び曲げたわみ係数に優れる銅合金板 |
-
2015
- 2015-03-27 JP JP2015066677A patent/JP6031549B2/ja not_active Expired - Fee Related
-
2016
- 2016-03-15 CN CN201680018115.0A patent/CN107429328B/zh not_active Expired - Fee Related
- 2016-03-15 WO PCT/JP2016/058177 patent/WO2016158390A1/ja active Application Filing
- 2016-03-15 KR KR1020177030339A patent/KR102075892B1/ko active IP Right Grant
- 2016-03-23 TW TW105109029A patent/TW201641700A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20170130514A (ko) | 2017-11-28 |
WO2016158390A1 (ja) | 2016-10-06 |
KR102075892B1 (ko) | 2020-02-11 |
TW201641700A (zh) | 2016-12-01 |
JP2016186107A (ja) | 2016-10-27 |
CN107429328B (zh) | 2019-11-08 |
CN107429328A (zh) | 2017-12-01 |
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Legal Events
Date | Code | Title | Description |
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A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160818 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20161011 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20161024 |
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R150 | Certificate of patent or registration of utility model |
Ref document number: 6031549 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
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LAPS | Cancellation because of no payment of annual fees |