JP6023206B2 - 1つのトランジスタを有するramメモリセル - Google Patents
1つのトランジスタを有するramメモリセル Download PDFInfo
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- JP6023206B2 JP6023206B2 JP2014533969A JP2014533969A JP6023206B2 JP 6023206 B2 JP6023206 B2 JP 6023206B2 JP 2014533969 A JP2014533969 A JP 2014533969A JP 2014533969 A JP2014533969 A JP 2014533969A JP 6023206 B2 JP6023206 B2 JP 6023206B2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000002073 nanorod Substances 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 4
- 239000002070 nanowire Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000005641 tunneling Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/775—Field effect transistors with one dimensional charge carrier gas channel, e.g. quantum wire FET
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
- G11C11/404—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
- H01L21/845—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body including field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
- H01L27/1211—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI combined with field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7841—Field effect transistors with field effect produced by an insulated gate with floating body, e.g. programmable transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/20—DRAM devices comprising floating-body transistors, e.g. floating-body cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Thin Film Transistor (AREA)
- Dram (AREA)
Description
ドレインとソース間の長さ(チャネル長):22nm
N型領域104の幅:20nm
P型領域105の厚さ:4nm
ゲート酸化膜の厚さ:2nm
合計幅(ゲートを含む):32nm
Claims (5)
- ソース及びドレイン領域(101, 102; 121, 122)を形成するために高ドープされた両端を有し、
前記ソース及びドレイン領域間に、準真性のP型領域(105, 125)であって、絶縁されたゲート(107, 127)により囲まれたP型領域によって外周のほとんどの部分が囲まれたN型領域(104, 124)を備える中心部を有する
半導体ナノロッドにより形成されたメモリセル。 - 前記N型領域(104, 124)のドーピングレベルが1cm3あたり2×1018から2×1019原子までの範囲であり、
前記P型領域のドーピングレベルが1cm3あたり1014から1016原子までの範囲である
請求項1に記載のメモリセル。 - 前記ナノロッドはシリコン・オン・インシュレータ(SOI)層に形成されたシリコン片により形成されている請求項1又は2に記載のメモリセル。
- 前記ナノロッドはシリコンナノワイヤ片により形成されている請求項1又は2に記載のメモリセル。
- 前記ゲート(107)の長さは、該ゲートが周囲を囲む前記P型領域(105)の長さより短い請求項1から4のいずれか一つに記載のメモリセル。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1158942 | 2011-10-04 | ||
FR1158942A FR2980918B1 (fr) | 2011-10-04 | 2011-10-04 | Point memoire ram a un transistor |
PCT/FR2012/052246 WO2013050707A1 (fr) | 2011-10-04 | 2012-10-04 | Point mémoire ram a un transistor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014535161A JP2014535161A (ja) | 2014-12-25 |
JP6023206B2 true JP6023206B2 (ja) | 2016-11-09 |
Family
ID=47089064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014533969A Active JP6023206B2 (ja) | 2011-10-04 | 2012-10-04 | 1つのトランジスタを有するramメモリセル |
Country Status (6)
Country | Link |
---|---|
US (1) | US9099544B2 (ja) |
EP (1) | EP2764550B1 (ja) |
JP (1) | JP6023206B2 (ja) |
KR (1) | KR101963845B1 (ja) |
FR (1) | FR2980918B1 (ja) |
WO (1) | WO2013050707A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101804666B1 (ko) * | 2016-04-06 | 2017-12-05 | 고려대학교 산학협력단 | 수직 반도체 컬럼을 구비한 메모리 소자 |
US10790008B2 (en) * | 2017-08-29 | 2020-09-29 | Micron Technology, Inc. | Volatile memory device with 3-D structure including vertical pillars and memory cells vertically stacked one over anoher in multiple levels |
FR3070788B1 (fr) | 2017-09-04 | 2021-07-30 | Commissariat Energie Atomique | Procede de programmation d’une cellule memoire dram a un transistor et dispositif memoire |
US10879469B1 (en) * | 2019-06-28 | 2020-12-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of manufacturing a field effect transistor using nanotube structures and a field effect transistor |
Family Cites Families (38)
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FR1052612A (fr) | 1952-03-19 | 1954-01-26 | Procédé de construction des murs | |
WO1988008617A1 (en) * | 1987-04-20 | 1988-11-03 | Research Corporation Technologies, Inc. | Buried well dram |
CA2372707C (en) * | 1999-07-02 | 2014-12-09 | President And Fellows Of Harvard College | Nanoscopic wire-based devices, arrays, and method of their manufacture |
JP4104836B2 (ja) * | 2001-05-17 | 2008-06-18 | 株式会社東芝 | 半導体メモリ装置及びその製造方法 |
US7135728B2 (en) * | 2002-09-30 | 2006-11-14 | Nanosys, Inc. | Large-area nanoenabled macroelectronic substrates and uses therefor |
KR100790859B1 (ko) * | 2002-11-15 | 2008-01-03 | 삼성전자주식회사 | 수직 나노튜브를 이용한 비휘발성 메모리 소자 |
US7355216B2 (en) * | 2002-12-09 | 2008-04-08 | The Regents Of The University Of California | Fluidic nanotubes and devices |
US6855606B2 (en) * | 2003-02-20 | 2005-02-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor nano-rod devices |
ITTO20030425A1 (it) * | 2003-06-06 | 2004-12-07 | St Microelectronics Srl | Dispositivo interruttore elettrico a comando ottico basato su nanotubi di carbonio e sistema interruttore elettrico utilizzante tale dispositivo interruttore. |
US7164181B2 (en) * | 2003-07-30 | 2007-01-16 | Hewlett-Packard Development Company, L.P. | Spin injection devices |
EP1508926A1 (en) * | 2003-08-19 | 2005-02-23 | Hitachi, Ltd. | Nanotube transistor device |
US7382648B2 (en) * | 2004-09-30 | 2008-06-03 | California Institute Of Technology | Nanomechanical switching device |
US20060092739A1 (en) * | 2004-10-28 | 2006-05-04 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
US7544978B2 (en) * | 2005-01-24 | 2009-06-09 | Lawrence Livermore National Security, Llc | Lipid nanotube or nanowire sensor |
KR100594327B1 (ko) * | 2005-03-24 | 2006-06-30 | 삼성전자주식회사 | 라운드 형태의 단면을 가지는 나노와이어를 구비한 반도체소자 및 그 제조 방법 |
KR100755367B1 (ko) * | 2005-06-08 | 2007-09-04 | 삼성전자주식회사 | 실린더형 게이트를 갖는 나노-라인 반도체 소자 및 그제조방법 |
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JP5029600B2 (ja) * | 2006-03-03 | 2012-09-19 | 富士通株式会社 | カーボンナノチューブを用いた電界効果トランジスタとその製造方法及びセンサ |
US7646071B2 (en) * | 2006-05-31 | 2010-01-12 | Intel Corporation | Asymmetric channel doping for improved memory operation for floating body cell (FBC) memory |
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FR2944641B1 (fr) * | 2009-04-15 | 2011-04-29 | Centre Nat Rech Scient | Point memoire ram a un transistor. |
US8143113B2 (en) * | 2009-12-04 | 2012-03-27 | International Business Machines Corporation | Omega shaped nanowire tunnel field effect transistors fabrication |
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FR2958779B1 (fr) * | 2010-04-07 | 2015-07-17 | Centre Nat Rech Scient | Point memoire ram a un transistor |
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-
2011
- 2011-10-04 FR FR1158942A patent/FR2980918B1/fr not_active Expired - Fee Related
-
2012
- 2012-10-04 WO PCT/FR2012/052246 patent/WO2013050707A1/fr active Application Filing
- 2012-10-04 JP JP2014533969A patent/JP6023206B2/ja active Active
- 2012-10-04 KR KR1020147012167A patent/KR101963845B1/ko active IP Right Grant
- 2012-10-04 US US14/349,852 patent/US9099544B2/en active Active
- 2012-10-04 EP EP12779113.5A patent/EP2764550B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
EP2764550A1 (fr) | 2014-08-13 |
FR2980918A1 (fr) | 2013-04-05 |
KR101963845B1 (ko) | 2019-03-29 |
JP2014535161A (ja) | 2014-12-25 |
US20140299835A1 (en) | 2014-10-09 |
WO2013050707A1 (fr) | 2013-04-11 |
FR2980918B1 (fr) | 2014-03-07 |
EP2764550B1 (fr) | 2016-08-31 |
KR20140109362A (ko) | 2014-09-15 |
US9099544B2 (en) | 2015-08-04 |
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