JP5029600B2 - カーボンナノチューブを用いた電界効果トランジスタとその製造方法及びセンサ - Google Patents
カーボンナノチューブを用いた電界効果トランジスタとその製造方法及びセンサ Download PDFInfo
- Publication number
- JP5029600B2 JP5029600B2 JP2008502628A JP2008502628A JP5029600B2 JP 5029600 B2 JP5029600 B2 JP 5029600B2 JP 2008502628 A JP2008502628 A JP 2008502628A JP 2008502628 A JP2008502628 A JP 2008502628A JP 5029600 B2 JP5029600 B2 JP 5029600B2
- Authority
- JP
- Japan
- Prior art keywords
- inner layer
- carbon nanotube
- insulating film
- outer layer
- gate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims description 74
- 239000002041 carbon nanotube Substances 0.000 title claims description 71
- 229910021393 carbon nanotube Inorganic materials 0.000 title claims description 70
- 230000005669 field effect Effects 0.000 title claims description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 4
- 239000003463 adsorbent Substances 0.000 claims description 2
- 239000002079 double walled nanotube Substances 0.000 description 24
- 239000000126 substance Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- 238000002161 passivation Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000002048 multi walled nanotube Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000004044 response Effects 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000002071 nanotube Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 102000036639 antigens Human genes 0.000 description 1
- 108091007433 antigens Proteins 0.000 description 1
- 239000012620 biological material Substances 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002109 single walled nanotube Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1606—Graphene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/481—Insulated gate field-effect transistors [IGFETs] characterised by the gate conductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
- Y10S977/742—Carbon nanotubes, CNTs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
- Y10S977/742—Carbon nanotubes, CNTs
- Y10S977/752—Multi-walled
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Thin Film Transistor (AREA)
Description
基板上に内層と外層を有する2層以上のカーボンナノチューブを形成する工程と,
前記カーボンナノチューブのゲート形成領域における前記外層を除去して内層を露出する工程と,
前記露出された内層上に絶縁膜を介してまたはショットキー接合を介してゲート電極を形成する工程と,
前記カーボンナノチューブの両側にソース及びドレイン電極を形成する工程とを有することを特徴とする。
3a:外層チューブ 3b:内層チューブ 5:ゲート絶縁膜
6:ゲート電極 7,8:ソース,ドレイン電極
図1は,本実施の形態における電界効果トランジスタの構成図である。図1には,電界トランジスタの断面図と,その断面図の破線部分の拡大斜視図とが示されている。この斜視図に示されるとおり,本実施の形態の電界効果トランジスタは,2層以上の多層カーボンナノチューブ3を用いている。多層のカーボンナノチューブ3は,例えば,1層からなる内層3bと1層からなる外層3aの2層ナノチューブ(Double Wall Nano Tube : DWNT)を使用する。ただし,内層及び外層のいずれか一方または両方が多層であっても良い。但し,カーボンナノチューブの層数をあまり増やすとバンドギャップが狭くなり半金属性を有することになるので,半導体性が得られる広いバンドギャップになる程度の少ない層数に限定される必要がある。
次に,本実施の形態における電界効果トランジスタの製造方法について説明する。
上記の実施の形態では,チャネル上にゲート絶縁膜を介してゲート電極を形成した電界効果トランジスタを説明した。その変形例として,チャネルの内層チューブ上にショットキー接合を介してゲート電極を形成した例を説明する。
図5は,本実施の形態におけるセンサの構成を示す断面図である。このセンサの構成は,図1のゲート絶縁膜を有する電界効果トランジスタのゲート電極6に代えて,被検出物質を吸着する吸着物質層16を絶縁膜5の上に有する。それ以外の構成は,図1と同じである。
Claims (10)
- 内層と外層を有する2層以上のカーボンナノチューブと,
前記カーボンナノチューブの両側に形成されたソース及びドレイン電極と,
前記カーボンナノチューブのゲート形成領域に形成されたゲート電極とを有し,
前記ゲート形成領域で前記カーボンナノチューブの前記外層が除去されて前記内層が露出され,当該露出された内層上に前記ゲート電極が形成され,前記ソース及びドレイン電極とゲート電極との間の前記カーボンナノチューブは前記外層により被覆されていることを特徴とする電界効果トランジスタ。 - 請求項1において,前記露出された内層の少なくとも一部又は全部を被覆する絶縁膜が形成されていることを特徴とする電界効果トランジスタ。
- 請求項1において,前記露出された内層の少なくとも一部または全部を被覆し,更に前記外層上に延在する絶縁膜が形成されていることを特徴とする電界効果トランジスタ。
- 請求項2又は3において,前記ゲート電極が前記絶縁膜上に形成され,前記外層及び内層と電気的に絶縁されていることを特徴とする電界効果トランジスタ。
- 請求項2又は3において,前記絶縁膜が前記ゲート形成領域で一部除去されて前記内層が露出され,当該絶縁膜が一部除去された内層上にショットキー接合を介して前記ゲート電極が形成されていることを特徴とする電界効果トランジスタ。
- 請求項1において,前記ソース及びドレイン電極は前記内層と外層とに接続されていることを特徴とする電界効果トランジスタ。
- 内層と外層を有する2層以上のカーボンナノチューブと,
前記カーボンナノチューブの両側に形成されたソース及びドレイン電極と,
前記カーボンナノチューブのゲート形成領域に形成されたゲート電極とを有し,
前記ゲート形成領域で前記カーボンナノチューブの前記外層が除去されて前記内層が露出され,当該露出された内層上に絶縁膜が形成され,前記露出された内層上に前記絶縁膜を介して又はショットキー接合を介して前記ゲート電極が形成され,前記ソース及びドレイン電極が前記外層と内層とに接触して形成され,前記ソース及びドレイン電極と前記絶縁膜との間の前記カーボンナノチューブは前記外層により被覆されていることを特徴とする電界効果トランジスタ。 - カーボンナノチューブを有する電界効果トランジスタの製造方法において,
基板上に内層と外層を有する2層以上のカーボンナノチューブを形成する工程と,
前記カーボンナノチューブのゲート電極形成領域とソース及びドレイン電極形成領域との間の領域における前記外層を除去することなく,前記ゲート電極形成領域における前記外層を除去して内層を露出する工程と,
前記露出された内層上に絶縁膜を介してまたはショットキー接合を介してゲート電極を形成する工程と,
前記カーボンナノチューブの両側の前記ソース及びドレイン電極形成領域にソース及びドレイン電極を形成する工程とを有することを特徴とする電界効果トランジスタの製造方法。 - 請求項8において,
さらに,前記カーボンナノチューブ上に前記ゲート形成領域に開口を有するマスク膜を形成する工程を有し,
前記外層の除去工程と,前記ゲート電極形成工程とが前記マスク膜を用いて行われることを特徴とする電界効果トランジスタの製造方法。 - 内層と外層を有する2層以上のカーボンナノチューブと,
前記カーボンナノチューブの両側に形成された第1及び第2の電極と,
前記カーボンナノチューブの前記第1及び第2の電極間の領域に形成された絶縁膜と,
前記絶縁膜上に形成された被検出物を吸着する吸着物質層とを有し,
前記電極間領域で前記カーボンナノチューブの前記外層が除去されて前記内層が露出され,当該露出された内層上に前記絶縁膜が形成され,前記第1及び第2の電極と前記絶縁膜との間の前記カーボンナノチューブは前記外層により被覆されていることを特徴とするセンサ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/304145 WO2007099642A1 (ja) | 2006-03-03 | 2006-03-03 | カーボンナノチューブを用いた電界効果トランジスタとその製造方法及びセンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007099642A1 JPWO2007099642A1 (ja) | 2009-07-16 |
JP5029600B2 true JP5029600B2 (ja) | 2012-09-19 |
Family
ID=38458767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008502628A Expired - Fee Related JP5029600B2 (ja) | 2006-03-03 | 2006-03-03 | カーボンナノチューブを用いた電界効果トランジスタとその製造方法及びセンサ |
Country Status (3)
Country | Link |
---|---|
US (1) | US7755115B2 (ja) |
JP (1) | JP5029600B2 (ja) |
WO (1) | WO2007099642A1 (ja) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7454295B2 (en) | 1998-12-17 | 2008-11-18 | The Watereye Corporation | Anti-terrorism water quality monitoring system |
US9056783B2 (en) | 1998-12-17 | 2015-06-16 | Hach Company | System for monitoring discharges into a waste water collection system |
US8958917B2 (en) | 1998-12-17 | 2015-02-17 | Hach Company | Method and system for remote monitoring of fluid quality and treatment |
JP4251268B2 (ja) * | 2002-11-20 | 2009-04-08 | ソニー株式会社 | 電子素子及びその製造方法 |
US8920619B2 (en) | 2003-03-19 | 2014-12-30 | Hach Company | Carbon nanotube sensor |
US7858918B2 (en) * | 2007-02-05 | 2010-12-28 | Ludwig Lester F | Molecular transistor circuits compatible with carbon nanotube sensors and transducers |
US7838809B2 (en) * | 2007-02-17 | 2010-11-23 | Ludwig Lester F | Nanoelectronic differential amplifiers and related circuits having carbon nanotubes, graphene nanoribbons, or other related materials |
US8297351B2 (en) * | 2007-12-27 | 2012-10-30 | Schlumberger Technology Corporation | Downhole sensing system using carbon nanotube FET |
CN101582450B (zh) * | 2008-05-16 | 2012-03-28 | 清华大学 | 薄膜晶体管 |
CN101582451A (zh) * | 2008-05-16 | 2009-11-18 | 清华大学 | 薄膜晶体管 |
CN101599495B (zh) * | 2008-06-04 | 2013-01-09 | 清华大学 | 薄膜晶体管面板 |
CN101587839B (zh) * | 2008-05-23 | 2011-12-21 | 清华大学 | 薄膜晶体管的制备方法 |
CN101582449B (zh) * | 2008-05-14 | 2011-12-14 | 清华大学 | 薄膜晶体管 |
CN101593699B (zh) * | 2008-05-30 | 2010-11-10 | 清华大学 | 薄膜晶体管的制备方法 |
CN101582445B (zh) * | 2008-05-14 | 2012-05-16 | 清华大学 | 薄膜晶体管 |
CN101582446B (zh) * | 2008-05-14 | 2011-02-02 | 鸿富锦精密工业(深圳)有限公司 | 薄膜晶体管 |
EP2289106A4 (en) * | 2008-06-13 | 2014-05-21 | Qunano Ab | CAPACITOR MOS NANOSTRUCTURE |
US8963118B2 (en) | 2009-07-31 | 2015-02-24 | Agency For Science, Technology And Research | Transistor arrangement and a method of forming a transistor arrangement |
US8497499B2 (en) * | 2009-10-12 | 2013-07-30 | Georgia Tech Research Corporation | Method to modify the conductivity of graphene |
US8471249B2 (en) * | 2011-05-10 | 2013-06-25 | International Business Machines Corporation | Carbon field effect transistors having charged monolayers to reduce parasitic resistance |
FR2980918B1 (fr) * | 2011-10-04 | 2014-03-07 | Univ Granada | Point memoire ram a un transistor |
US9501738B1 (en) * | 2012-08-16 | 2016-11-22 | Sandia Corporation | Cellular computational platform and neurally inspired elements thereof |
CN104143513B (zh) * | 2013-05-09 | 2016-12-28 | 中芯国际集成电路制造(上海)有限公司 | 纳米真空场效应电子管及其形成方法 |
US9203041B2 (en) * | 2014-01-31 | 2015-12-01 | International Business Machines Corporation | Carbon nanotube transistor having extended contacts |
CN105097913B (zh) * | 2014-05-05 | 2018-12-04 | 中芯国际集成电路制造(上海)有限公司 | 场效应晶体管及其制造方法 |
CN105097904B (zh) | 2014-05-05 | 2019-01-25 | 中芯国际集成电路制造(上海)有限公司 | 隧穿碳纳米管场效应晶体管及其制造方法 |
US9741811B2 (en) | 2014-12-15 | 2017-08-22 | Samsung Electronics Co., Ltd. | Integrated circuit devices including source/drain extension regions and methods of forming the same |
US9401488B2 (en) | 2014-12-18 | 2016-07-26 | Northrop Grumman Systems Corporation | Cobalt-carbon eutectic metal alloy ohmic contact for carbon nanotube field effect transistors |
CN105810734B (zh) * | 2014-12-29 | 2018-09-11 | 中芯国际集成电路制造(上海)有限公司 | 半导体装置及其制造方法 |
JP2016225354A (ja) * | 2015-05-27 | 2016-12-28 | 猛英 白土 | 半導体装置及びその製造方法 |
CN106910771B (zh) * | 2015-12-23 | 2019-11-26 | 上海新昇半导体科技有限公司 | 全密封真空纳米管场效应晶体管及其制造方法 |
CN108336150B (zh) * | 2017-01-20 | 2020-09-29 | 清华大学 | 肖特基二极管、肖特基二极管阵列及肖特基二极管的制备方法 |
CN108336151B (zh) * | 2017-01-20 | 2020-12-04 | 清华大学 | 肖特基二极管、肖特基二极管阵列及肖特基二极管的制备方法 |
JP6538892B2 (ja) * | 2017-01-20 | 2019-07-03 | ツィンファ ユニバーシティ | ショットキーダイオード、ショットキーダイオードアレイ及びショットキーダイオードの製造方法 |
CN108336142B (zh) * | 2017-01-20 | 2020-09-25 | 清华大学 | 薄膜晶体管 |
CN112786755B (zh) * | 2019-11-08 | 2023-03-17 | 清华大学 | 发光二极管 |
CN112786715B (zh) * | 2019-11-08 | 2022-11-22 | 清华大学 | 太阳能电池 |
CN112786714B (zh) * | 2019-11-08 | 2022-11-22 | 清华大学 | 光电探测器 |
CN113223961B (zh) * | 2020-01-21 | 2023-03-24 | 中芯国际集成电路制造(天津)有限公司 | 半导体结构及其形成方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003086796A (ja) * | 2001-09-11 | 2003-03-20 | Fujitsu Ltd | 円筒状多層構造体による半導体装置 |
JP2005064452A (ja) * | 2003-08-19 | 2005-03-10 | Hitachi Ltd | ナノチューブトランジスタデバイスおよびその製造方法 |
JP2005116618A (ja) * | 2003-10-03 | 2005-04-28 | Fujitsu Ltd | 半導体装置およびその製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6423583B1 (en) * | 2001-01-03 | 2002-07-23 | International Business Machines Corporation | Methodology for electrically induced selective breakdown of nanotubes |
JP4512176B2 (ja) | 2001-02-08 | 2010-07-28 | 株式会社日立製作所 | カーボンナノチューブ電子素子および電子源 |
JP3731486B2 (ja) * | 2001-03-16 | 2006-01-05 | 富士ゼロックス株式会社 | トランジスタ |
US7084507B2 (en) * | 2001-05-02 | 2006-08-01 | Fujitsu Limited | Integrated circuit device and method of producing the same |
US7135728B2 (en) * | 2002-09-30 | 2006-11-14 | Nanosys, Inc. | Large-area nanoenabled macroelectronic substrates and uses therefor |
JP4251268B2 (ja) * | 2002-11-20 | 2009-04-08 | ソニー株式会社 | 電子素子及びその製造方法 |
US7180107B2 (en) * | 2004-05-25 | 2007-02-20 | International Business Machines Corporation | Method of fabricating a tunneling nanotube field effect transistor |
KR100682925B1 (ko) * | 2005-01-26 | 2007-02-15 | 삼성전자주식회사 | 멀티비트 비휘발성 메모리 소자 및 그 동작 방법 |
KR20070015260A (ko) * | 2005-07-30 | 2007-02-02 | 삼성전자주식회사 | 선형나노선재의 제조방법 및 이에 의한 선형나노선재그리고 선형나노선재를 이용한 박막트랜지스터 기판 |
US7492015B2 (en) * | 2005-11-10 | 2009-02-17 | International Business Machines Corporation | Complementary carbon nanotube triple gate technology |
KR100668355B1 (ko) * | 2006-02-16 | 2007-01-12 | 삼성전자주식회사 | 캐리어 트래핑 물질을 구비한 유니폴라 탄소나노튜브 및유니폴라 전계효과 트랜지스터 |
US7714386B2 (en) * | 2006-06-09 | 2010-05-11 | Northrop Grumman Systems Corporation | Carbon nanotube field effect transistor |
US7786024B2 (en) * | 2006-11-29 | 2010-08-31 | Nanosys, Inc. | Selective processing of semiconductor nanowires by polarized visible radiation |
US7482652B1 (en) * | 2008-01-02 | 2009-01-27 | International Business Machines Corporation | Multiwalled carbon nanotube memory device |
-
2006
- 2006-03-03 JP JP2008502628A patent/JP5029600B2/ja not_active Expired - Fee Related
- 2006-03-03 WO PCT/JP2006/304145 patent/WO2007099642A1/ja active Application Filing
-
2008
- 2008-09-02 US US12/202,770 patent/US7755115B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003086796A (ja) * | 2001-09-11 | 2003-03-20 | Fujitsu Ltd | 円筒状多層構造体による半導体装置 |
JP2005064452A (ja) * | 2003-08-19 | 2005-03-10 | Hitachi Ltd | ナノチューブトランジスタデバイスおよびその製造方法 |
JP2005116618A (ja) * | 2003-10-03 | 2005-04-28 | Fujitsu Ltd | 半導体装置およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2007099642A1 (ja) | 2007-09-07 |
JPWO2007099642A1 (ja) | 2009-07-16 |
US20090072223A1 (en) | 2009-03-19 |
US7755115B2 (en) | 2010-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5029600B2 (ja) | カーボンナノチューブを用いた電界効果トランジスタとその製造方法及びセンサ | |
Franklin et al. | Variability in carbon nanotube transistors: Improving device-to-device consistency | |
Chai et al. | Low-resistance electrical contact to carbon nanotubes with graphitic interfacial layer | |
Zhang et al. | Mechanism of NO2 detection in carbon nanotube field effect transistor chemical sensors | |
Wind et al. | Fabrication and electrical characterization of top gate single-wall carbon nanotube field-effect transistors | |
JP5371453B2 (ja) | 電界効果トランジスタおよびその製造方法 | |
JP4493344B2 (ja) | カーボン・ナノチューブ電界効果トランジスタ半導体デバイス及びこれの製造方法 | |
JP2006114912A (ja) | キャリヤトラッピング物質を含む単極性ナノチューブトランジスタ及びその製造方法 | |
WO2012119125A2 (en) | High performance graphene transistors and fabrication processes thereof | |
US9735362B2 (en) | Tunneling nanotube field effect transistor and manufacturing method thereof | |
Ghodrati et al. | Carbon nanotube field effect transistors–based gas sensors | |
Won Lee et al. | Passivation effect on gate-bias stress instability of carbon nanotube thin film transistors | |
JP4501339B2 (ja) | pn接合素子の製造方法 | |
Ramaraj et al. | Carbon molecular sieve-functionalized graphene sensors for highly sensitive detection of ethanol | |
Aïssa et al. | The channel length effect on the electrical performance of suspended-single-wall-carbon-nanotube-based field effect transistors | |
Liu et al. | Study of random telegraph signals in single-walled carbon nanotube field effect transistors | |
Passi et al. | Contact resistance Study of “edge-contacted” metal-graphene interfaces | |
US20080149970A1 (en) | Multi-gated carbon nanotube field effect transistor | |
JP4935808B2 (ja) | カーボンナノチューブデバイス及びその製造方法 | |
KR100873800B1 (ko) | 탄소나노튜브를 이용한 반도체 소자의 실리사이드 형성방법 | |
Lee et al. | Ammonia Gas Sensing Properties of 6, 13-Bis (tri-Isopropylsilyethynyl) Pentacene Based Field-Effect Transistor | |
Sato | Application of graphene to electronic devices | |
JP5706077B2 (ja) | 半導体素子とその製造及び動作方法 | |
El-Naggar et al. | Comparative review of carbon nanotube FETs | |
JP4488815B2 (ja) | 素子、集積回路及びそれらの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111213 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120127 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120529 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120611 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5029600 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150706 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |