JP6019730B2 - Ultraviolet irradiation device and ultraviolet irradiation head - Google Patents

Description

  The present invention relates to an ultraviolet irradiation apparatus and an ultraviolet irradiation head for irradiating ultraviolet rays, and more particularly to an apparatus for improving a light amount by providing a plurality of LED (Light Emitting Diode) light sources in the ultraviolet irradiation head.

  Ultraviolet irradiation devices are used in many industrial fields. The ultraviolet irradiation apparatus cures an adhesive or a coating agent by, for example, an ultraviolet curing method (Ultra Violet Curing; hereinafter, “UV curing method”). The UV curing method has many advantages compared to a thermal curing method that uses thermal energy, such as not diffusing harmful substances into the atmosphere, shortening the curing time, and adapting to heat-sensitive products. Yes.

  The UV curing method is a technique in which a UV curing material is irradiated with ultraviolet rays to cause a photopolymerization reaction, thereby changing a monomer into a polymer. A typical UV curable material contains a monomer, a photopolymerization initiator, an additive, and the like. When this UV curable material is irradiated with ultraviolet rays by an ultraviolet irradiation device, the photopolymerization initiator is excited. Polymerization is started by this excitation energy, and the monomer is changed to a polymer.

  A UV-LED (Ultra Violet-Light Emitting Diode) that emits ultraviolet rays is used as a light source of an ultraviolet irradiation device. The performance of the ultraviolet irradiation device is evaluated by, for example, the productivity of UV curing. In order to improve the productivity of UV curing, for example, a technique has been developed to increase the irradiation efficiency of ultraviolet rays emitted from UV-LEDs in a predetermined irradiation region. By increasing the irradiation efficiency of ultraviolet rays, the irradiation time of ultraviolet rays can be shortened.

  In order to increase the irradiation efficiency of the ultraviolet irradiation device, a technique of disposing a plurality of light emitting elements in the irradiation head is disclosed. For example, Japanese Patent Laying-Open No. 2009-59883 (Patent Document 1) discloses a light emitting device capable of realizing a reduction in substrate size while allowing a plurality of light emitting elements to be mounted. Japanese Patent Laying-Open No. 2011-175950 (Patent Document 2) discloses a technique for improving the heat dissipation performance of generated heat in a semiconductor light emitting device.

  In the ultraviolet irradiation device, in order to increase the irradiation efficiency of the UV-LED with respect to the irradiation region, it is assumed that a plurality of UV-LEDs are densely arranged in the ultraviolet irradiation head. The ultraviolet irradiation device condenses the light emitted from the plurality of UV-LEDs arranged in this way using an optical lens or the like, and irradiates the condensed ultraviolet light onto the UV curable material.

  On the other hand, UV-LEDs that emit ultraviolet rays tend to rise in temperature relatively easily, and the light-emitting element tends to deteriorate due to temperature rise. In order to suppress the adverse effect due to this temperature rise, an ultraviolet irradiation device equipped with a UV-LED needs to have a structure for efficiently radiating heat.

JP 2009-59883 A JP 2011-175950 A

  In the ultraviolet irradiation apparatus, it is assumed that heat dissipation is enhanced by using, for example, copper having high thermal conductivity for a substrate on which a plurality of chips such as light emitting elements are mounted.

  However, when copper is used as the material of the substrate, the substrate becomes conductive, so that chip wiring cannot be performed on the back surface of the component surface of the substrate, but must be performed on the component surface of the substrate. That is, it is necessary to perform soldering on the component surface in order to join the chip to the substrate. Here, if a region for soldering is provided between chips in order to solder wirings or the like, the chips cannot be arranged at a high density. For this reason, for example, when UV-LEDs are arranged on the substrate, the arrangement density is lowered, which hinders miniaturization of the ultraviolet irradiation device and improvement of irradiation efficiency.

  Therefore, in order to solve the above-described problems, there is a need for a technique that contributes to miniaturization of the ultraviolet irradiation device and improvement of irradiation efficiency when a conductive substrate is used.

  An ultraviolet irradiation device according to an embodiment includes a conductive substrate, a bonding pattern bonded on the component surface of the substrate with the insulating member interposed therebetween, and a plurality of ultraviolet light emitting elements bonded to the bonding pattern. . The bonding pattern includes a first bonding pattern bonded to a first group of light emitting elements including at least one of a plurality of ultraviolet light emitting elements, and a plurality of ultraviolet light emitting elements, and the periphery of the first group of light emitting elements. And a second bonding pattern to be bonded to the second group of light emitting elements disposed substantially concentrically, and on the component surface, the first bonding pattern includes the second group of light emitting elements. It is formed by extending to the outer peripheral portion of a region on a substantially concentric circle.

  Preferably, the first group of light emitting elements is composed of one ultraviolet light emitting element, and the substrate is secondly arranged such that the second group of light emitting elements are arranged substantially concentrically around the one ultraviolet light emitting element. The bonding pattern may be formed.

  Preferably, the second group of light emitting elements may include five ultraviolet light emitting elements arranged in a star shape on a substantially concentric circle.

  Preferably, the ultraviolet irradiation apparatus includes an ultraviolet irradiation head that accommodates the substrate, the substrate is formed in a circular shape, and lead wires bonded to the first and second bonding patterns are arranged on the component surface on the outer peripheral portion of the substrate. It is good also as a notch part for making it pass to the back surface of this.

  Preferably, the light emitting elements included in the first group and the light emitting elements included in the second group may be bonded to the substrate in series by the first and second bonding patterns.

  Preferably, the substrate may be bonded to the heat dissipation member on the component surface, and the at least one ultraviolet light emitting element may be disposed on the component surface of the substrate so as to sandwich the heat dissipation member.

  According to another embodiment, an ultraviolet irradiation head in an ultraviolet irradiation apparatus is provided. The ultraviolet irradiation head includes a conductive substrate mounted on the ultraviolet irradiation head, a bonding pattern bonded with the substrate and the insulating member on the component surface of the substrate, and a plurality of ultraviolet light emitting elements bonded to the bonding pattern. The substrate includes a first bonding pattern bonded to a first group of light emitting elements including at least one of the plurality of ultraviolet light emitting elements, and a plurality of ultraviolet light emitting elements, and the first group of light emitting elements. And a second bonding pattern to be bonded to a second group of light emitting elements disposed substantially concentrically around the element, and the second bonding group of light emitting elements is disposed on the first bonding pattern on the component surface. It is formed by being extended to the outer peripheral portion of a region on a substantially concentric circle.

  According to the above-described embodiment, the ultraviolet light emitting elements can be arranged on the substrate with high density, and the irradiation efficiency of the ultraviolet irradiation device can be improved and the ultraviolet irradiation head can be downsized.

  The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the present invention taken in conjunction with the accompanying drawings.

It is a schematic block diagram of the ultraviolet irradiation device 100 according to embodiment of this invention. It is a perspective view of the ultraviolet irradiation head 2 according to embodiment of this invention. It is a side view of the ultraviolet irradiation head 2 according to embodiment of this invention. It is an exploded perspective view of ultraviolet irradiation head 2 according to an embodiment of the invention. It is a figure which shows the component surface of the board | substrate 13 for light sources. It is a figure which shows the board | substrate 13 for light sources of the state in which UV-LED was joined. It is a figure which shows the cross section of the board | substrate 13 for light sources. It is a figure which shows the process of joining in the board | substrate 13 for light sources.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same parts are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated.

<1 configuration>
FIG. 1 is a schematic configuration diagram of an ultraviolet irradiation device 100 according to an embodiment of the present invention.

<1.1 Configuration of UV irradiation apparatus 100>
As shown in FIG. 1, the ultraviolet irradiation device 100 includes an ultraviolet irradiation head 2 and a main body 1. FIG. 1 shows a UV curable material 24 to be irradiated with ultraviolet rays. The UV curable material 24 includes a monomer, a photopolymerization initiator, an additive, and the like, and a polymerization reaction is started by ultraviolet irradiation.

  The ultraviolet irradiation head 2 incorporates a UV light source, drives the UV light source with the electric power received from the main body 1, generates ultraviolet rays and irradiates them. In the description of this embodiment, the UV light source is composed of an LED that generates ultraviolet rays, and the amount of light emission changes according to the power supplied from the main body 1.

The main body unit 1 includes a display unit 8 and an input unit 9.
The main body 1 includes a power source, an MCU (Micro Control Unit), and the like, and controls the operation of the ultraviolet irradiation head 2 according to a program and supplies power to the ultraviolet irradiation head 2.

The display unit 8 is disposed on the surface of the main body unit 1 and displays information to the user.
The input unit 9 is arranged on the surface of the main body unit 1 and receives settings for irradiating ultraviolet rays from the user.

<1.2 Configuration of UV irradiation head 2>
Next, the ultraviolet irradiation head 2 will be described in detail with reference to the drawings.

FIG. 2 is a perspective view of ultraviolet irradiation head 2 according to the embodiment of the present invention.
FIG. 3 is a side view of ultraviolet irradiation head 2 according to the embodiment of the present invention.

  As shown in FIGS. 2 and 3, the ultraviolet irradiation head 2 has a cylindrical casing and irradiates the UV curable material 24 with light emitted from a plurality of UV-LEDs (not shown).

FIG. 4 is an exploded perspective view of ultraviolet irradiation head 2 according to the embodiment of the present invention.
As shown in FIG. 4, the ultraviolet irradiation head 2 includes a second lens holder 11, a first lens holder 12, a light source substrate 13, a substrate holder 14, a heat dissipation holder 15, a fixing portion 16, and a metal fitting 17. A cord storage portion 18, a machine screw 19, a lens fixing screw 20, and a substrate fixing screw 21.

  The light source substrate 13 is bonded to a plurality of UV-LEDs, and supplies power to the UV-LEDs according to the control of the main body 1 to cause the UV-LEDs to emit light.

  The first lens holder 12 and the second lens holder 11 are lenses for converging ultraviolet rays emitted from the UV-LED in the light source substrate 13.

  The first lens holder 12 is mounted on the light source substrate 13 and is fixed to the substrate holder 14 using lens fixing screws 20. The light source substrate 13 is fixed to the substrate holder 14 using substrate fixing screws 21.

  The substrate holder 14 fixes the first lens holder 12 and the light source substrate 13 and accommodates lead wires bonded to the component surface of the light source substrate 13. The second lens holder 11 is attached to the substrate holder 14.

  The heat dissipation holder 15 is attached to the substrate holder 14 and accommodates lead wires. The heat dissipation holder 15 has a rib structure and releases heat to the outside of the ultraviolet irradiation head 2.

  The fixing portion 16 is a member for fixing the heat dissipation holder 15 to the metal fitting 17, and is fixed to the metal fitting 17 using a small screw 19.

  The cord storage unit 18 connects the ultraviolet irradiation head 2 and the main body 1, stores the wiring, and supplies power from the main body 1 to the ultraviolet irradiation head 2.

<1.3 Configuration of Light Source Substrate 13>
Next, details of the light source substrate 13 will be described with reference to the drawings.

  FIG. 5 is a diagram illustrating a component surface of the light source substrate 13. In addition, in FIG. 5, the state which UV-LED is not joined is shown.

  As shown in FIG. 5, the light source substrate 13 has a bonding pattern 31 formed on a conductive substrate 32. The bonding pattern 31 is a portion indicated by hatching in FIG. The bonding pattern 31 includes a first bonding pattern for bonding with a first group of UV-LEDs arranged near the center (shown as the central portion 41 in FIG. 5) of the conductive substrate 32, And a second bonding pattern for bonding with the second group of UV-LEDs arranged concentrically around the UV-LEDs of the second group (shown as concentric circles 42 in FIG. 5).

  The conductive substrate 32 is a substrate using, for example, copper, and dissipates heat released from the UV-LED. A cut portion 36 and a substrate fixing hole 37 are formed in the conductive substrate 32. A lead wire (shown as a lead wire 34 in FIG. 6 to be described later) joined to the joining pattern 31 passes through the cut portion 36 and is led to the back surface of the component surface of the conductive substrate 32 and to the substrate holder 14.

  The substrate fixing hole 37 is a screw hole for fixing the light source substrate 13 to the substrate holder 14 using the substrate fixing screw 21.

FIG. 6 is a diagram showing the light source substrate 13 in a state where the UV-LED is bonded.
On the concentric circle 42, five UV-LEDs (ultraviolet LED 33A, ultraviolet LED 33B, ultraviolet LED 33C, ultraviolet LED 33D, and ultraviolet LED 33E) are arranged in a star shape. The plurality of UV-LEDs (ultraviolet LED 33A, ultraviolet LED 33B, ultraviolet LED 33C, ultraviolet LED 33D, and ultraviolet LED 33E) constitute a second group of UV-LEDs and are bonded to the bonding pattern 31 by soldering.

  In the conductive substrate 32, an ultraviolet LED 33F is disposed in the vicinity of the central portion 41 to constitute a first group of UV-LEDs. The ultraviolet LED 33F is bonded to the bonding pattern 31 by soldering. As described above, the lead wire 34 to be bonded to the bonding pattern 31 passes through the cut portion 36 shown in FIG.

  The bonding pattern 31 for bonding with the first group of UV-LEDs (ultraviolet LED 33F in FIG. 6) is referred to as a “first bonding pattern”. As shown in FIGS. 5 and 6, the first bonding pattern is a concentric region in which the second group of UV-LEDs (ultraviolet LED 33A, ultraviolet LED 33B, ultraviolet LED 33C, ultraviolet LED 33D, and ultraviolet LED 33E) is disposed. It is formed by being stretched around the outer periphery. The bonding pattern 31 for bonding with the second group of UV-LEDs is referred to as a “second bonding pattern”. Thus, by extending the first bonding pattern, it is not necessary to provide a space for bonding the bonding pattern 31 and the lead wire 34 around the ultraviolet LED 33F. Therefore, as shown in FIG. 6, the lead wire 34 and the bonding pattern 31 can be bonded in the vicinity of the cut portion 36 (in FIG. 6, the cut portion 36 near the ultraviolet LED 33D and the ultraviolet LED 33C). In FIG. 6, this joining portion is shown as a lead wire joining position 43. Thereby, the arrangement | positioning density of UV-LED can be raised in the electroconductive board | substrate 32, and size reduction and the irradiation efficiency improvement of the ultraviolet irradiation head 2 of the ultraviolet irradiation device 100 are implement | achieved.

  Further, as shown in FIGS. 5 and 6, the ultraviolet LED 33F and the ultraviolet LED 33A are connected in series by a first bonding pattern and a second bonding pattern. Compared with the case where each UV-LED is provided with a lead wire, by connecting a plurality of UV-LEDs in series, an area for joining the lead wires by soldering on the component surface of the light source substrate 13 is increased. Can be small.

FIG. 7 is a view showing a cross section of the light source substrate 13.
FIG. 7A shows the light source substrate 13. 7A and 7C are cross-sectional views taken along wavy lines indicated by “P1” in FIG. 7B shows a cross-sectional view in a state where the ultraviolet LED 33F is not bonded to the bonding pattern 31. FIG. FIG. 7C is a cross-sectional view of a state in which the ultraviolet LED 33 </ b> F is bonded to the bonding pattern 31.

  In this embodiment, since the conductive substrate 32 is conductive, an insulating film layer 35 is formed between the bonding pattern 31 and the conductive substrate 32 as shown in FIG. The bonding pattern 31 is bonded to the lead wire 34.

  In addition, a heat-dissipating copper foil 38 is bonded to the conductive substrate 32 at a portion of the light source substrate 13 where the ultraviolet LED 33F is disposed. Thereby, the heat dissipation performance of the light source substrate 13 is improved, and the heat released from the ultraviolet LED 33F is dissipated.

<2 Joining Process of Light Source Substrate 13>
Next, the joining process in the light source substrate 13 will be described with reference to the drawings.

  FIG. 8 is a diagram illustrating a bonding process in the light source substrate 13. 8A to 8D are cross-sectional views of the light source substrate 13. In FIG. 8, a cross-sectional view taken along the wavy line indicated by “P1” in FIG. 7 is taken as an example.

  FIG. 8A shows a cross-sectional view of the light source substrate 13 in a state before the bonding pattern 31 and the like are bonded to the conductive substrate 32. The insulating film layer 35 is soldered to the conductive substrate 32. The bonding pattern 31 and the conductive substrate 32 are bonded with the insulating film layer 35 interposed therebetween.

  FIG. 8B is a cross-sectional view of the light source substrate 13 in a state where the insulating film layer 35 is bonded to the conductive substrate 32 corresponding to the position where the bonding pattern 31 is bonded.

  FIG. 8C is a cross-sectional view of the light source substrate 13 in a state where the bonding pattern 31 is bonded to the insulating film layer 35 by soldering. As shown in FIG. 8C, the heat-dissipating copper foil 38 is joined to the conductive substrate 32 by soldering. The heat radiating copper foil 38 is a member for radiating heat released from the ultraviolet LED 33F as shown in FIG. 8D. FIG. 8D is a diagram illustrating a state in which the ultraviolet LED 33F is bonded to the bonding pattern, and the ultraviolet LED 33F is bonded to the light source substrate 13.

<3 Other forms>
In the description of the above embodiment, in the ultraviolet irradiation head 2 of the ultraviolet irradiation apparatus 100, one UV-LED (first group of UV-LEDs) is arranged near the center of the light source substrate 13, and the surroundings are arranged. It has been described that five UV-LEDs (second group of UV-LEDs) are arranged in a star shape on concentric circles. The number of UV-LEDs in the first group may be plural, and the number of UV-LEDs in the second group is not limited to five.

  In the embodiment of the present invention, the ultraviolet irradiation device 100 has been described with respect to the main body unit 1 including the display unit 8 and the input unit 9, but is not limited to this configuration. That is, by connecting an external personal computer or the like to the ultraviolet irradiation device 100 via the interface unit, data from the ultraviolet irradiation device 100 is displayed on the personal computer, and a command input by the user on the personal computer is irradiated with the ultraviolet light. It is good also as a structure given to the apparatus 100. FIG.

  In the embodiment of the present invention, the ultraviolet irradiation device 100 including the main body 1 and one ultraviolet irradiation head 2 has been described. However, the ultraviolet irradiation device 100 may include a plurality of ultraviolet irradiation heads 2. Good.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention can be used for an ultraviolet irradiation device.

  DESCRIPTION OF SYMBOLS 1 Main-body part, 2 Ultraviolet irradiation head, 8 Display part, 9 Input part, 11 2nd lens holder, 12 1st lens holder, 13 Light source board | substrate, 14 Substrate holder, 15 Radiation holder, 16 Fixing part, 17 Hardware, 18 Cord storage unit, 19 small screw, 20 lens fixing screw, 21 substrate fixing screw, 24 UV curable material, 31 bonding pattern, 32 conductive substrate, 33A, 33B, 33C, 33D, 33E, 33F UV LED, 34 lead Wire, 35 Insulating film layer, 36 Notched portion, 37 Substrate fixing hole, 38 Heat radiation copper foil, 43 Lead wire bonding position, 100 UV irradiation device.

Claims (7)

An ultraviolet irradiation device,
A conductive substrate;
On the component side of the substrate, a conductive bonding pattern bonded with the substrate sandwiching an insulating member;
A plurality of ultraviolet light emitting elements bonded to the bonding pattern,
The bonding pattern is
A first bonding pattern bonded to a first group of light-emitting elements composed of at least one of the plurality of ultraviolet light-emitting elements;
A second bonding pattern composed of a plurality of the ultraviolet light emitting elements and bonded to a second group of light emitting elements disposed substantially concentrically around the first group of light emitting elements;
In the component surface, the first bonding pattern is formed by extending to an outer peripheral portion of a region on the substantially concentric circle in which the light emitting elements of the second group are arranged.   2. The ultraviolet irradiation according to claim 1, wherein the light emitting elements included in the first group and the light emitting elements included in the second group are bonded to the substrate in series by the first and second bonding patterns. apparatus. The first group of light emitting elements comprises one ultraviolet light emitting element,
The substrate is
3. The ultraviolet irradiation apparatus according to claim 1, wherein the second bonding pattern is formed so that the second group of light emitting elements are arranged substantially concentrically around the first ultraviolet light emitting element. . The ultraviolet irradiation device according to claim 3 , wherein the second group of light emitting elements includes five ultraviolet light emitting elements arranged in a star shape on a substantially concentric circle. The ultraviolet irradiation device includes an ultraviolet irradiation head that houses the substrate,
The substrate is formed in a circular shape, and a cut-out portion is formed on the outer peripheral portion of the substrate for passing the lead wire bonded to the first and second bonding patterns to the back surface of the component surface. The ultraviolet irradiation device according to any one of claims 1 to 4 . The substrate is bonded to a heat dissipation member on the component surface,
At least one of the ultraviolet light emitting element, wherein are arranged on the component surface of the substrate to sandwich the heat-radiating member, an ultraviolet irradiation device according to any one of claims 1-5. An ultraviolet irradiation head of an ultraviolet irradiation device,
A conductive substrate mounted on the ultraviolet irradiation head;
On the component side of the substrate, a conductive bonding pattern bonded with the substrate sandwiching an insulating member;
A plurality of ultraviolet light emitting elements bonded to the bonding pattern,
The bonding pattern is
A first bonding pattern bonded to a first group of light-emitting elements composed of at least one of the plurality of ultraviolet light-emitting elements;
A second bonding pattern composed of a plurality of the ultraviolet light emitting elements and bonded to a second group of light emitting elements disposed substantially concentrically around the first group of light emitting elements;
In the component surface, the first bonding pattern is an ultraviolet irradiation head formed by extending to an outer peripheral portion of a region on the substantially concentric circle where the light emitting elements of the second group are arranged.

Images