KR102624468B1 - Apparatus for irradiating ultraviolet light - Google Patents

Abstract

An example is a heat dissipation block; A first circuit board disposed on one side of the heat dissipation block; a plurality of ultraviolet light-emitting devices disposed on the first circuit board; a cooling fan disposed on the other side of the heat dissipation block; A power connection part disposed between the heat dissipation block and the cooling fan; and a connector electrically connecting the power connection unit and the first circuit board, wherein the heat dissipation block includes a recess disposed at a position corresponding to a pad portion of the first circuit board, and the connector is connected to the first circuit board. Disclosed is an ultraviolet light irradiation device including a first connection part electrically connected to a circuit board, wherein the first connection part is disposed in the recess of the heat dissipation block.

Description

Ultraviolet light irradiation device {APPARATUS FOR IRRADIATING ULTRAVIOLET LIGHT}

The embodiment relates to an ultraviolet light irradiation device.

In general, a device that cures or bonds objects by irradiating ultraviolet rays is called an ultraviolet curing device. At this time, the curing target may be a paint or adhesive that can be cured by ultraviolet rays, or an opaque material.

A mercury ultraviolet lamp, a halogen lamp, etc. may be used as a light source for generating ultraviolet rays in such an ultraviolet curing device, but these lamps have problems of low efficiency and high cost.

The embodiment provides an ultraviolet light irradiation device using a light emitting device.

Additionally, an ultraviolet light irradiation device with excellent heat dissipation performance is provided.

Additionally, an ultraviolet light irradiation device that is easy to assemble is provided.

The problem to be solved in the embodiment is not limited to this, and it will also include means of solving the problem described below and purposes and effects that can be understood from the embodiment.

An ultraviolet light irradiation device according to one aspect of the present invention includes a heat dissipation block; A first circuit board disposed on one side of the heat dissipation block; a plurality of ultraviolet light-emitting devices disposed on the first circuit board; a cooling fan disposed on the other side of the heat dissipation block; A power connection part disposed between the heat dissipation block and the cooling fan; and a connector electrically connecting the power connection unit and the first circuit board, wherein the heat dissipation block includes a recess disposed at a position corresponding to a pad portion of the first circuit board, and the connector is connected to the first circuit board. It includes a first connection part electrically connected to a circuit board, and the first connection part may be disposed in the recess of the heat dissipation block.

The power connection unit includes a second circuit board; a plate spaced apart from the second circuit board; It includes a plurality of support members disposed between the second circuit board and the plate, and the second connection part of the connector can be inserted into the socket part of the second circuit board.

The plate includes a first plate extending in a first direction; And it may include a second plate extending from the first plate in a second direction perpendicular to the first direction.

The plurality of support members include a plurality of first support members disposed between the first plate and the second circuit board, and a plurality of second support members disposed between the second plate and the second circuit board. can do.

a housing accommodating the first circuit board, the heat dissipation block, the power connector, and the cooling fan; and a cover disposed in front of the first circuit board.

The cover may include a first fixing frame, a second fixing frame, and a light transmitting plate disposed between the first fixing frame and the second fixing frame.

The first fixing frame and the second fixing frame may include a first fixing protrusion disposed on a side of the heat dissipation block and a second fixing protrusion disposed on one surface of the first circuit board.

The first circuit board may include a support groove into which the second fixing jaw is inserted.

It may include a light guide unit disposed in front of the cover and controlling the beam angle of light emitted from the ultraviolet light emitting device.

The light guide unit includes a first surface and a second surface facing each other, and a third surface and a fourth surface facing each other, wherein the first surface and the second surface are longer than the third surface and the fourth surface, The gap between the first surface and the second surface may increase in a direction away from the first circuit board, and the gap between the third surface and the fourth surface may be constant in a direction away from the first circuit board. .

According to an embodiment of the present invention, the heat dissipation performance of an ultraviolet light irradiation device can be improved.

Additionally, assembly of the ultraviolet light irradiation device and replacement of the circuit board can be simplified.

The various and beneficial advantages and effects of the present invention are not limited to the above-described content, and may be more easily understood through description of specific embodiments of the present invention.

1 is an exploded perspective view of an ultraviolet light irradiation device according to an embodiment of the present invention;
Figure 2 is a perspective view of an ultraviolet light irradiation device according to an embodiment of the present invention;
Figure 3 is a diagram showing the first circuit board and light emitting device;
Figure 4 is a view showing the light guide unit and cover,
Figure 5 is a view of the cover seen from another angle,
Figure 6 is a cross-sectional view of an ultraviolet light irradiation device according to an embodiment of the present invention;
Figure 7 is a view of the heat dissipation block and the power connection from one direction,
Figure 8 is a view of the heat dissipation block and the power connection from another direction,
Figure 9 is a plan view of an ultraviolet light irradiation device according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

However, the technical idea of the present invention is not limited to some of the described embodiments, but may be implemented in various different forms, and as long as it is within the scope of the technical idea of the present invention, one or more of the components may be optionally used between the embodiments. It can be used by combining and replacing.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless specifically defined and described, are generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as meaning, and the meaning of commonly used terms, such as terms defined in a dictionary, can be interpreted by considering the contextual meaning of the related technology.

Additionally, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In this specification, the singular may also include the plural unless specifically stated in the phrase, and when described as "at least one (or more than one) of A and B and C", it is combined with A, B, and C. It can contain one or more of all possible combinations.

Additionally, when describing the components of an embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used.

These terms are only used to distinguish the component from other components, and are not limited to the essence, sequence, or order of the component.

And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to that other component, but also is connected to that component. It can also include cases where other components are 'connected', 'combined', or 'connected' due to another component between them.

Additionally, when described as being formed or disposed "above" or "below" each component, "above" or "below" refers not only to cases in which two components are in direct contact with each other; It also includes cases where one or more other components are formed or disposed between two components. In addition, when expressed as "top (above) or bottom (bottom)", it may include not only the upward direction but also the downward direction based on one component.

Figure 1 is an exploded perspective view of an ultraviolet light irradiation device according to an embodiment of the present invention, and Figure 2 is a perspective view of an ultraviolet light irradiation device according to an embodiment of the present invention.

Referring to FIG. 1, the ultraviolet light irradiation device according to an embodiment of the present invention includes a housing 110, a heat dissipation block 120, a first circuit board 130 disposed on one side of the heat dissipation block 120, and heat dissipation. A cooling fan 170 disposed on the other side of the block 120, a power connector 160 disposed between the heat dissipation block 120 and the cooling fan 170, and a cover disposed in front of the first circuit board 130. (140), and may include a light guide unit 150.

The housing 110 may have a space for accommodating a plurality of components. The material of the housing 110 is not particularly limited. For example, the housing 110 may be made of a metal material with excellent heat dissipation performance. The housing 110 may have four sides 111, 112, 113, and 114, and the rear 117 may have an opening formed so that the cooling fan 170 can discharge air to the outside. The housing 110 may have an overall rectangular shape, but is not necessarily limited thereto.

The heat dissipation block 120 may include a plurality of unit blocks 121. The heat dissipation block 120 may extend in one direction by combining a plurality of unit blocks 121. In the embodiment, two unit blocks are arranged, but the number of unit blocks can be adjusted depending on the size of the curing machine.

A plurality of heat dissipation fins 122 may be disposed on the rear of the heat dissipation block 120. The plurality of heat dissipation fins 122 may be manufactured integrally with the heat dissipation block 120, but are not necessarily limited thereto. The plurality of heat dissipation fins 122 may be manufactured separately and fixed to the rear of the heat dissipation block 120. In this case, there is an advantage that the heat dissipation block 120 is easy to manufacture.

The material of the heat dissipation block 120 is not particularly limited. The heat dissipation block 120 may include a metal material with excellent thermal conductivity. By way of example, the heat dissipation block may be copper or aluminum, but is not limited thereto. The heat dissipation fin 122 may be made of the same material as the heat dissipation block 120, but is not necessarily limited thereto.

A plurality of recesses 121a corresponding to pad portions (not shown) of the first circuit board 130 may be disposed on the side of the heat dissipation block 120. A socket portion (not shown) disposed on the rear side of the first circuit board 130 may be exposed in the recess 121a.

A cooling fan 170 may be disposed on the other side of the heat dissipation block 120. The cooling fan 170 can quickly discharge the heat emitted from the heat dissipation block 120 to the outside. A plurality of cooling fans 170 may be arranged in one direction. The number of cooling fans 170 can be appropriately adjusted depending on the length of the heat dissipation block 120.

A power connection unit 160 may be disposed between the heat dissipation block 120 and the cooling fan 170. The power connection unit 160 includes a second circuit board 161, a plate 162 vertically spaced apart from the second circuit board 161, and a plurality of plates disposed between the second circuit board 161 and the plate 162. It may include two support members 163.

The second circuit board 161 may be electrically connected to the first circuit board 130 by a connector (not shown). The plate 162 may serve to secure the wire of the connector.

According to the embodiment, there is an advantage in that heat is easily dissipated by forming a space between the heat dissipation block 120 and the cooling fan 170, and the interior can be arranged compactly by arranging the power connection 160 in the space. There is an advantage.

Since the second circuit board 161 and the plate 162 of the power connection unit 160 are spaced apart in the vertical direction by a plurality of support members 163, the heat emitted from the heat dissipation block 120 is generated by the cooling fan 170. It may be discharged to the outside. If the power connector 160 is arranged to block the space between the heat dissipation block 120 and the cooling fan 170, it may become difficult for the heat dissipation block 120 to dissipate heat. Additionally, the temperature of the second circuit board 161 may increase, thereby reducing electrical reliability.

The first filter 181 may be placed on the upper part of the heat dissipation block 120, and the second filter 182 may be placed on the lower part of the heat dissipation block 120. A hole 115a may be formed in the housing 110 to expose the heat dissipation fin 122. At this time, the first filter 181 and the second filter 182 can block external dust, etc. from entering through the hole 115a.

The first filter 181 and the second filter 182 may be porous filters, but are not necessarily limited thereto. The first filter 181 and the second filter 182 may include both general dust filters.

The first circuit board 130 may be placed in front of the heat dissipation block 120. The first circuit board 130 may be extended in one direction by combining a plurality of unit boards. A plurality of ultraviolet light-emitting devices 200 may be disposed on each unit substrate. The first circuit board 130 may be a printed circuit board (PCB) or a metal PCB, but is not limited thereto.

The cover 140 may be placed in front of the first circuit board 130. The cover 140 may include a first fixing frame 141, a second fixing frame 142, and a light transmitting plate 143. The light transmitting plate 143 may include a material capable of transmitting ultraviolet light.

The light transmitting plate 143 may be made of light-transmitting glass or quartz, but is not limited thereto. The light transmitting plate 143 may have an ultraviolet light transmittance of 90% to 99%, but is not limited thereto.

The light guide unit 150 is disposed in front of the cover 140 to protect the cover 140 and can control the beam angle of ultraviolet light. While the first and second surfaces 151 and 152 of the light guide unit 150 are inclined, the third and fourth surfaces 153 and 154 may not have an inclination. According to this configuration, the beam angle can be widened in the vertical direction (Z-axis direction), while the beam angle can be relatively narrowed in the horizontal direction (Y-axis direction). However, it is not necessarily limited to this, and the third surface 153 and the fourth surface 154 may also be formed to be inclined.

Figure 3 is a diagram showing a first circuit board and an ultraviolet light emitting device.

Referring to FIG. 3, the first circuit board 130 may be made of a plurality of unit boards. A plurality of ultraviolet light emitting devices 200 may be disposed on a plurality of unit substrates. Additionally, it may include a circuit pattern (not shown) electrically connected to the plurality of ultraviolet light emitting devices 200 and a plurality of pad portions (P1, P2, P3, P4) electrically connected to the circuit pattern. Although not shown, a socket portion (S1) electrically connected to a plurality of pad portions (P1, P2, P3, and P4) may be disposed on the back of the substrate.

In the embodiment, 75 ultraviolet light-emitting devices 200 are illustrated as being arranged on one unit substrate, but the number of light-emitting devices 200 is not limited to this. Each ultraviolet light-emitting device 200 may include a package portion 210 on which a light-emitting diode is disposed and a lens 220 disposed on the package portion 210.

All ultraviolet light-emitting devices 200 can emit ultraviolet light in the same wavelength range, but are not necessarily limited to this. For example, the ultraviolet light-emitting device 200 may include a plurality of first light-emitting devices 201 and a plurality of second light-emitting devices 202 that emit ultraviolet rays of different wavelengths.

For example, the wavelength of light emitted by the plurality of first light emitting devices 201 may be included in a wavelength range of 315 nm or more and less than 375 nm. Additionally, the wavelength of light emitted by the plurality of second light emitting devices 202 may be within a wavelength range of 375 nm or more and 420 nm or less.

Alternatively, the plurality of first light emitting devices 201 may emit light with a wavelength of 365 nm, and the plurality of second light emitting devices 202 may emit light with a wavelength of 385 nm.

The wavelength of light emitted by each of the plurality of first light-emitting devices 201 may be the same, and the wavelength of light emitted by each of the plurality of second light-emitting devices 202 may be the same.

Since the wavelengths of light emitted by the plurality of first light emitting devices 201 and the wavelengths of light emitted by the plurality of second light emitting devices 202 are different from each other, the light emitting module can implement wavelengths with multiple peaks. According to this configuration, the curing characteristics of UV resin can be improved by implementing multi-wavelengths. In addition to this, light emitting elements 200 that emit light having a wavelength in another wavelength range may be additionally disposed.

The plurality of first light emitting devices 201 and second light emitting devices 202 may be individually driven independently of each other. For example, the plurality of first light emitting devices 201 may be turned on, and at the same time, the plurality of second light emitting devices 202 may be turned off. Alternatively, the plurality of first light emitting devices 201 may be turned off and the plurality of second light emitting devices 202 may be turned on at the same time. Alternatively, the plurality of first and second light emitting devices 201 and 202 may be turned on and off at the same time.

FIG. 4 is a view showing the light guide unit and the cover, FIG. 5 is a view showing the cover seen from another angle, and FIG. 6 is a cross-sectional view of an ultraviolet light irradiation device according to an embodiment of the present invention.

Referring to FIGS. 4 and 5 , the cover 140 may include a first fixing frame 141, a second fixing frame 142, and a light transmitting plate 143. The light transmitting plate 143 may include a material capable of transmitting ultraviolet light. By way of example, the light transmitting plate 143 may be made of glass or quartz, but is not necessarily limited thereto. The first fixing frame 141 and the second fixing frame 142 may be made of a material whose thermal expansion coefficient is superior to that of the light transmitting plate 143.

The first fixing frame 141 and the second fixing frame 142 include first fixing protrusions 141b and 142b disposed on the side of the heat dissipation block 120, and second fixing protrusions 141a disposed on one side of the heat dissipation block 120. , 142a). At this time, the first fixing jaws 141b and 142b may protrude further rearward than the second fixing jaws 141a and 142a. The first fixing jaws 141b and 142b and the second fixing jaws 141a and 142a may extend in the longitudinal direction of the cover 140.

The light guide unit 150 is disposed in front of the cover 140 and can control the beam angle of ultraviolet light. While the first and second surfaces 151 and 152 of the light guide unit 150 are inclined, the third and fourth surfaces 153 and 154 may not have an inclination. That is, the gap between the first side 151 and the second side 152 increases in the direction away from the first circuit board 130, and the gap between the third side 153 and the fourth side 154 increases in the direction away from the first circuit board 130. 1 The direction away from the circuit board 130 may be constant. According to this configuration, the beam angle can be widened in the vertical direction, while the beam angle can be relatively narrowed in the horizontal direction. However, it is not necessarily limited to this, and the third surface 153 and the fourth surface 154 may also be formed to be inclined. At this time, the first side 151 and the second side 152 may be longer than the third side 153 and the fourth side 154.

Referring to FIG. 6, the first circuit board 130 may include a support groove 131 disposed on one surface into which the second fixing protrusions 141a and 142a are inserted. Therefore, since the first fixing frame 141 and the second fixing frame 142 are stably supported on the first circuit board 130, the light transmitting plate 143 fixed to the first fixing frame 141 and the second fixing frame 142 is The problem of damage due to impact can be improved.

The first cover 115 of the housing 110 may be disposed on an upper portion of the first filter 181, and the second cover portion 116 may be disposed on a lower portion of the second filter 182. The housing may include a step portion 110a to which an end of the first cover portion is coupled. A plurality of holes may be formed in the first and second cover portions 115 and 116 to allow heat from the heat dissipation fin 122 to be quickly discharged to the outside.

The power connection unit 160 may be disposed in the separation area (SA) between the heat dissipation block 120 and the cooling fan 170. A plurality of protrusions 114a are disposed on the inside of the fourth surface 114 of the housing 110 to stably support the second circuit board 161. Accordingly, heat generated in the second circuit board 161 can be quickly dissipated to the upper and lower surfaces of the second circuit board 161. The second circuit board 161 may be electrically connected to the power supply unit 169.

Figure 7 is a view of the heat dissipation block and the power connection from one direction, Figure 8 is a view of the heat dissipation block and the power connection from another direction, and Figure 9 is a plan view of an ultraviolet light irradiation device according to an embodiment of the present invention. .

Referring to FIGS. 7 and 8 , a plurality of connectors 164 may electrically connect the first circuit board 130 and the second circuit board 161. That is, the power supplied to the power supply unit 169 may be applied to the first circuit board 130 through the second circuit board 161 and the connector 164.

Each connector 164 includes a first connection portion 164a electrically connected to the first circuit board 130, a second connection portion 164c electrically connected to the second circuit board 161, and a first connection portion ( It may include a wire 164b connecting 164a) and the second connection part 164c.

At this time, the portion where the first circuit board 130 is connected to the first connection portion 164a may be exposed by the recess 121a of the heat dissipation block 120. As an example, the first connection portion 164a of the connector 164 may be inserted into the socket portion exposed through the recess 121a of the heat dissipation block 120 and electrically connected to the socket portion. Accordingly, the first connection portion 164a may be disposed within the recess 121a of the heat dissipation block 120.

However, the method by which the connector 164 is connected to the first circuit board 130 is not necessarily limited to this. For example, the first connection part 164a may be inserted into the side of the first circuit board 130 and electrically connected to the pad part (P1 to P4 in FIG. 3) of the first circuit board 130. At this time, the connection between the first circuit board 130 and the connector 164 can be facilitated by the recess 121a formed in the heat dissipation block 120.

The connector 164 connected to the first circuit board 130 may be electrically connected to the second circuit board 161. Specifically, the second connection part 164c may be inserted into the socket part 161a disposed on the second circuit board 161.

The plate 162 may include a first plate 162a extending in a first direction and a second plate 162b protruding from the first plate 162a in a second direction perpendicular to the first direction.

The plurality of support members 163 are disposed between the first plate 162a and the second circuit board 161, and the second plate 162b and the second circuit board 161. ) may include a plurality of second support members 163 disposed between them.

Referring to FIG. 9, a plurality of holes 162c may be disposed in the plate 162. The wire of the connector 164 may be fixed by a separate fixing member 166 disposed in the plurality of holes 162c. Therefore, it is possible to prevent the wire of the connector 154 from being damaged or the connection part from being disconnected during an external impact. The fixing member 166 may be a plastic clip that secures the wire, but is not necessarily limited thereto.

Additionally, a second connector 165 connected to the cooling fan 170 may be disposed on the second circuit board 161. The wire of the second connector 165 may also be fixed by a separate fixing member 166 disposed in the plurality of holes 162c. Therefore, it is possible to prevent the problem of the wire being damaged or the connection part coming off during an external impact.

The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified and implemented in other embodiments by a person with ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

Claims (10)

heat dissipation block;
A first circuit board disposed on one side of the heat dissipation block;
a plurality of ultraviolet light-emitting devices disposed on the first circuit board;
a cooling fan disposed on the other side of the heat dissipation block;
A power connection part disposed between the heat dissipation block and the cooling fan; and
The power connection part is
A plate spaced apart from the second circuit board;
It includes a plurality of support members disposed between the second circuit board and the plate,
It includes a connector that electrically connects the power connector and the first circuit board,
The heat dissipation block includes a recess disposed at a position corresponding to the pad portion of the first circuit board,
The connector includes a first connection part electrically connected to the first circuit board, and the first connection part is disposed in the recess of the heat dissipation block.
According to paragraph 1,
An ultraviolet light irradiation device in which the second connection part of the connector is inserted into the socket part of the second circuit board.
According to paragraph 1,
The plate includes a first plate extending in a first direction; and
An ultraviolet light irradiation device comprising a second plate extending from the first plate in a second direction perpendicular to the first direction.
According to paragraph 3,
The plurality of support members include a plurality of first support members disposed between the first plate and the second circuit board, and a plurality of second support members disposed between the second plate and the second circuit board. An ultraviolet light irradiation device.
According to paragraph 1,
a housing accommodating the first circuit board, the heat dissipation block, the power connector, and the cooling fan; and
An ultraviolet light irradiation device including a cover disposed in front of the first circuit board.
According to clause 5,
The cover is an ultraviolet light irradiation device including a first fixing frame, a second fixing frame, and a light transmitting plate disposed between the first fixing frame and the second fixing frame.
According to clause 6,
The first fixing frame and the second fixing frame include a first fixing protrusion disposed on a side of the heat dissipation block and a second fixing protrusion disposed on one surface of the first circuit board.
In clause 7,
The first circuit board is an ultraviolet light irradiation device including a support groove into which the second fixing jaw is inserted.
According to clause 5,
An ultraviolet light irradiation device comprising a light guide unit disposed in front of the cover and controlling a beam angle of light emitted from the ultraviolet light emitting device.
According to clause 9,
The light guide unit includes first and second surfaces facing each other, and third and fourth surfaces facing each other,
The first side and the second side are longer than the third side and the fourth side,
The gap between the first surface and the second surface increases in a direction away from the first circuit board,
An ultraviolet light irradiation device wherein a gap between the third surface and the fourth surface is constant in a direction away from the first circuit board.

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